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TW200847467A - Light emitting diode lamp - Google Patents

Light emitting diode lamp Download PDF

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Publication number
TW200847467A
TW200847467A TW096118290A TW96118290A TW200847467A TW 200847467 A TW200847467 A TW 200847467A TW 096118290 A TW096118290 A TW 096118290A TW 96118290 A TW96118290 A TW 96118290A TW 200847467 A TW200847467 A TW 200847467A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
bowl
shaped metal
heat
Prior art date
Application number
TW096118290A
Other languages
English (en)
Inventor
Shun-Tian Lin
Jyun-Wei Huang
Original Assignee
Tysun Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tysun Inc filed Critical Tysun Inc
Priority to TW096118290A priority Critical patent/TW200847467A/zh
Priority to US12/053,619 priority patent/US20080291675A1/en
Priority to JP2008111945A priority patent/JP2008293966A/ja
Publication of TW200847467A publication Critical patent/TW200847467A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Devices (AREA)

Description

200847467 九、發明說明： 【發明所屬之技術領域】 人4發51:!: 一種具有電子基板舰熱模短功能之複 二r? bm5、、、°構具有獨立管理導熱與導電之特性，適用 =光二極體封裝。封裝後之結構體再經由外部導電線路的 ^而接連至舰座嵌合的燈帽f極上。⑽成朗用 泡0 【先前技術】 曰發光二極體具使用壽命長、亮度高、發光效率高及耗電 ^低之特性，且其抗衝擊性高、反應速度快、色彩識別性高、 廣色性佳’具有s代傳統照日肤源，成為絲照$光源主流 之潛能。將發光二極體發光體的外部設計且封裝成可與傳統 k泡座直接做肷合的燈泡，將具有便利性及免更換設備等 點。 、 目剞發光二極體燈泡的封裝設計仍以多層次封裝為基 礎，ie成政熱路徑上有多個封裝界面而產生的界面熱阻了會 因此而降低散熱效率。因為散熱效果不佳的問題影響，發光 二極體的溫度無法有效降低，會減少發光二極體的發光^率 及使用壽命。 上述目前發光二極體封裝遇到的散熱問題，可以藉由改 變封裝方式及設計一種具有特殊高導熱散熱模組來改良，以 達成將發光二極體晶片直接封裝於散熱基板上（chip 〇n heat-dissipating board)，提高散熱效率。 200847467 【發明内容】 本創作「發光二極體燈泡」係提供一碗狀預形之 散熱模組，其外側面可為一平滑結構或具有散、熱裝置之^ 構’在碗狀底部則開有穿透此模組内部結構之導^路及^ ，層，以軸具獨立管理導酸導電概之發光」體燈泡 核組基板。隨後將發光二極體晶片黏結於此基板上，並將發 光二極體晶片之電極與位於碗狀預形内側的導電線路接人: 而另一側的導電線路則經由一個具有電氣絕緣層與電路^ 層的複合結構料電線路匯集，匯紐的導電線路再 與燈座齡祕帽雜上。這驗可獲得具高賴效率 控制熱源散熱方向的發光二極體燈泡。 本發明之目的，在於以發光二極體晶片直接封裝在散熱 ，構上（chip on heat-dissipating board)之方式，製造導熱g 高及穩定性高之發光二極體燈泡模組。其中碗狀預形之g導 熱散熱模組可將發光二極體晶片熱量往基板侧邊或燈泡g緣 散熱排出，而散熱路徑上封裝界面所導致的界面熱阻也可有 =地減少，因而提高散熱效率。因此可有效解決目前在發光 二極體元件構裝上所遭遇的散熱問題。此結構將有助於^顆 或多顆陣列式高功率發光二極體燈泡模組之設計。 【實施方式】 本發明的實施方式詳細說明如下。然而，除了該詳細描 述之外，本發明還可以廣泛地在其他的實施方式實行。亦即， 本發明的範圍不受已提出之實施方式的限制，而應以本發明 提出之申請專利範圍為準。再者，在以下說明當中，各元件 的不同部分並沒有依照尺寸繪圖，某些尺度與其他相關尺度 相比已經被誇張，以提供更清楚的描述和本發明的理解。 200847467 請參閱第Μ至1-6圖，為本發明「發光二極體燈泡模組」 之較佳實施例的工作流程圖與工作示意圖。首先，提供一高 導熱碗狀金屬基材101，其側面可為一平滑結構，或具有侧面 散熱鰭片501，或具有熱管502，可以將金屬反射層1〇3鍍於 碗狀内部周圍以提高光學反射效益；在碗狀底部則開有電路 上下導通用之洞口 102,洞口 102内則有絕緣材料1〇5將金屬 導線104與高導熱碗狀金屬基材ιοί隔離而達成電路由高導 熱碗狀金屬基材101的内部向外部導通。位於高導熱碗狀金 屬基材101外部的金屬導線104與單層或多層線路之電路板 201接合，以匯集導電線路。匯集後的導電線路再外接至與燈 座嵌合的燈帽電極上，如螺旋燈帽401及卡式燈帽仙2以構 成通路，形成具管理導熱與導電特性之發光二極體燈泡模组 基板。 w
最後’在發光二極體燈泡模組基板上，可將發光二極體 晶片301黏著在高導熱碗狀金屬基材ι〇1上，並與金屬導線 104施以鍚銲方式或打線接合3〇2作為電路連接。這樣便可辨 得具高散熱效率且可控制熱源散熱方向的發光二極體燈泡。X 以上所述僅為本發明之較佳實施方式，並非用以限 發明之中請專利範圍。在不麟本發明之實_容$ 仍可予以變化而加以實施，此等變化應仍屬於本發: 圍。因此，本發明之範疇係由下列申請專利範圍所^定。 【圖式簡單說明】 第1-1至1-6圖：本發明實例之工作示意圖。 7 200847467 【主要元件符號說明】 101 —高導熱碗狀金屬基材 103—金屬反射層 105 一絕緣材料 301 —發光二極體晶片 401—螺旋燈帽 501 —侧面散熱鰭片 102 一 洞口 104—金屬導線 201 —電路板 302—打線接合 402—卡式燈帽 502—熱管

Claims (1)

  1. 200847467 十、申請專利範圍： 1. 一種發光二極體燈泡之材料、結構與製作方法，包含·· 提供一高導熱碗狀金屬基材，其底部開出電路導通之洞口； 洞口内則有絕緣材料將金屬導線與高導熱碗狀金屬基材隔 離，以達成電路由高導熱碗狀金屬基材的内部向外部導通； 位於高導熱碗狀金屬基材外部的金屬導線接著與電路板接 合，以匯集導電線路； 匯集後的導電線路再外接至與燈絲合的燈帽電極上，因而形 成具官理導熱與導電特性之發光二極體燈泡模組基板； ΐί苎ΐί體燈泡模組基板上，電路連接並_發光二極體晶 片於尚導熱碗狀金屬基材上； 以此形成發光二極體燈泡。 2’ 圍第1項所述之—種發光二極體燈泡之材料、結 導熱碗狀金屬基材可為銅或銅合金，鋁 料 卿朗複合觀，喊齡金所形成 3. $申請專利麵第丨項所述之—種發光二贿燈泡 士 ，與，作方法’其中高導熱碗狀金屬基以I 4 f，、不_、或鎳等金屬臈鍍而形成光學錢上 .圍ί二述之一種發光二極體燈泡“料、結 滑^右二j熱碗狀金屬基材的外部側面可為一平 id鉉有侧面散熱則結構，或具有熱管結構，或其ί 5· 燈泡之材料、結 或以上材料卿成可為卿料、玻璃、陶究、 構圍^^^所述之一種發光二極»泡之材料“士 構4作方法，其中電路板可具有單層或多層線路。材抖m 9 200847467 7. 如申請專利範圍第1項所述之一種發光二極體燈泡之材料、結 構與製作方法，其中燈帽可為螺旋燈帽或卡式燈帽。 8. 如申請專利範圍第1項所述之一種發光二極體燈泡之材料、結 構與製作方法，其中電路連接發光二極體晶片於高導熱碗狀金 屬基材上的方法可為打線接合或錫銲。
TW096118290A 2007-05-23 2007-05-23 Light emitting diode lamp TW200847467A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW096118290A TW200847467A (en) 2007-05-23 2007-05-23 Light emitting diode lamp
US12/053,619 US20080291675A1 (en) 2007-05-23 2008-03-23 Light emitting diode lamp
JP2008111945A JP2008293966A (ja) 2007-05-23 2008-04-23 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096118290A TW200847467A (en) 2007-05-23 2007-05-23 Light emitting diode lamp

Publications (1)

Publication Number Publication Date
TW200847467A true TW200847467A (en) 2008-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW096118290A TW200847467A (en) 2007-05-23 2007-05-23 Light emitting diode lamp

Country Status (3)

Country Link
US (1) US20080291675A1 (zh)
JP (1) JP2008293966A (zh)
TW (1) TW200847467A (zh)

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