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TW200844019A - Adhesive chuck device - Google Patents

Adhesive chuck device Download PDF

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Publication number
TW200844019A
TW200844019A TW097102249A TW97102249A TW200844019A TW 200844019 A TW200844019 A TW 200844019A TW 097102249 A TW097102249 A TW 097102249A TW 97102249 A TW97102249 A TW 97102249A TW 200844019 A TW200844019 A TW 200844019A
Authority
TW
Taiwan
Prior art keywords
peeling
adhesive
adhesive member
substrate
workpiece
Prior art date
Application number
TW097102249A
Other languages
Chinese (zh)
Other versions
TWI415777B (en
Inventor
Yoshikazu Ohtani
Michiya Yokota
Original Assignee
Shinetsu Eng Co Ltd
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Publication date
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200844019A publication Critical patent/TW200844019A/en
Application granted granted Critical
Publication of TWI415777B publication Critical patent/TWI415777B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • B65G49/069Means for avoiding damage to stacked plate glass, e.g. by interposing paper or powder spacers in the stack
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Hand Tools For Fitting Together And Separating, Or Other Hand Tools (AREA)
  • Working Measures On Existing Buildindgs (AREA)

Abstract

A work is easily peeled off in the peeling direction by a peeling means. An adhesive member (2) is so disposed that the adhesive force per unit area of the adhesive member (2) is increased in the direction of peeling of a work (W) relative to the adhesive member (2) in connection with the operation of the peeling means (3), whereby peeling-off of the work (A) from the adhesive member (2) can be started by a small peeling force in connection with the operation of the peeling means (3), and the peeling can be smoothly advanced. When the work is peeled off in the direction different from the advancement direction of the peeling, a force far larger than the peeling force by the operation of the peeling means (3) is required.

Description

t t200844019 九、發明說明: 【發明所屬之技術領域】 本發明關於一種黏著夾盤裝置,該黏著夾盤裝置在例如 液晶顯示器(LCD)或電漿顯示器(PDP)或可撓性顯示器等平 面顯不器的製造過程中,使用於包含將由CF玻璃或TF丁玻 璃等玻璃製基板或PES(P〇ly-Ether-Sulphone)等的塑膠薄膜 等而成之合成樹脂製基板黏著保持並貼合的基板貼合機之 基板組裝裝置,或者搬運此類基板等的絕緣體、導電體或 半導體晶片等的工件(被處理體)之基板搬運裝置等。 具體而言,關於一種黏著夾盤裝置,其係相對於保持 板,工件經由黏著構件黏著保持,藉由剝離機構將工件強 制性地從該黏著構件剝離並與保持板隔離。 【先前技術】 以往,作為此種黏著夾盤裝置,在上方的保持板(加壓 板)開設多個開口,在這些開口内分別具備旋轉用致動器 和上下驅動用致動器,在從各旋轉用致動器向下方延伸的 旋轉軸的前端安裝有黏著構件,藉由上下驅動用致動器的 作動,在開π内使各黏著構件下降,料些黏著構件和吸 引吸附作用保持上方的工件(基板),邊定位邊進行貼合, 在使黏著構件退回到加壓板内日夺’相對於工件自,藉由旋 轉用致動器扭轉黏著構件的同時、或扭轉後藉由上;驅: 用致動器使其退回’以此將黏著構件從上面的工 (例如,參照專利文獻0。 ’ m 另外,至少在上方的保持板(加壓板)設置黏著構件(黏著 128129.doc 200844019 片材)的同時,設置多個開口,在這些開口内作发 一 h钓剝離機 構,設有由上下驅動用致動器驅動的壓軸,並用悻 4些黏著 構件和吸引吸附作用保持上方的工件(基板),邊定位邊、 行貼合,之後,以壓軸的按壓動作將上方的工件從黏著片 材按壓剝離(例如,參照專利文獻2)。 [專利文獻1]曰本專利公開2003473508號公報(第3 $ 頁,圖2、5) Γ:t t200844019 IX. Description of the Invention: [Technical Field] The present invention relates to an adhesive chuck device which is displayed on a flat surface such as a liquid crystal display (LCD) or a plasma display (PDP) or a flexible display. In the manufacturing process, it is used to adhere and adhere a synthetic resin substrate made of a glass substrate such as CF glass or TF glass, or a plastic film such as PES (P〇ly-Ether-Sulphone). A substrate assembly device of a substrate bonding machine, or a substrate transfer device that transports a workpiece (subject to be processed) such as an insulator, a conductor, or a semiconductor wafer. Specifically, with respect to an adhesive chuck device which is held by an adhesive member with respect to a holding plate, the workpiece is forcibly peeled off from the adhesive member by a peeling mechanism and isolated from the holding plate. [Prior Art] As such an adhesive chuck device, a plurality of openings are formed in the upper holding plate (pressure plate), and the rotation actuator and the vertical drive actuator are provided in the openings, respectively. Each of the rotary actuators has an adhesive member attached to the distal end of the rotary shaft extending downward, and the movable member is lowered in the opening π by the operation of the upper and lower drive actuators, and the adhesive member and the suction adsorption are held upward. The workpiece (substrate) is attached while being positioned, and the adhesive member is retracted into the pressure plate, and the workpiece is rotated from the workpiece by the rotation actuator, or after being twisted. Drive: Retracting with an actuator to thereby move the adhesive member from above (for example, refer to Patent Document 0. ' m In addition, at least the upper retaining plate (pressurizing plate) is provided with an adhesive member (adhesive 128129. Doc 200844019 Sheet) At the same time, a plurality of openings are provided, and a fishing peeling mechanism is provided in these openings, and a pressing shaft driven by an actuator for driving up and down is provided, and four adhesive members are used. The workpiece (substrate) which is held by the suction is held by the positioning and the bonding is performed, and then the upper workpiece is pressed and peeled off from the adhesive sheet by the pressing operation of the pressing shaft (see, for example, Patent Document 2).曰 Patent Publication No. 2003473508 (page 3, page 2, 5)

[專利文獻2]曰本專利公開2〇〇3_283 185號公報(第3 $ 頁’圖3〜4) 【發明内容】 [發明所欲解決之課題] 。而,在此種以往的黏著夾盤裝置中,因黏著構件的黏 著力不具備方向性’因此’若為了藉由致動器或押轴等 離機構使工件從黏著構件容易地剝離,而將黏著力設定為 弱時’則工件因剝離機構以外的外力而容易地被剝離,不 也確貫地黏著保持’從而存在玉件掉落、或在貼合時發生 位置偏移、導致產品出現不良的問題。 另外’相反的,若將黏著構件的黏著力設定為強時,則 存在工件的剝離性能低下,不能將工件很好地貼合、或在 、曰的真工貼σ中’氣泡殘留在顯示胞部分中,導致產品 出現不良的問題。 在剝離機構的剝離 除第一發明的目的 本發明中的第-發明,其目的在於 進行方向,容易地剝離工件。 第二發明及第三發明,其目的在於 128129.doc 200844019 之外,還以簡單的結構使黏著構件的黏著力具有方向性。 第四發明,其目的在於,在第一發明、第二發明或第三 發明所述的發明目的之外,還以簡單的結構確實地進行工 件的剝離開放。 [用於解決課題之手段] 為了達到上述目的,本發明甲第一發明,其特徵在於: 將黏著構件配置為使得每單位面積的黏著力向隨剝離機構 的作動的剝離進行方向增加。 % 這裡所述的“隨剝離機構的作動的剝離進行方向,,係 指,剝離機構作動時,工件從其作用點開始剝離後逐步擴 散,本發明將此方向稱為剝離進行方向。 定::;:月’其特徵在於:在第一發明的構成中,作為設 軍位面積的黏著力向隨上述剥離機構的作動的 工:=向增加之機構,增加了向對於上述黏著構件的 之構成的剝離進行方向增大對於工件的毒占著構件的黏著面積 第三發明,其特徵在於·· 定為使得每單位“ 的構成中’作為設 剥離進行方 、者力向隨上述剝離機構的作動的 工件的制離進二:機構,增加了向對於上述黏著構件的 量之構成。 ;牛的黏著構件的彈性變形 第四發明,其特徵在於 的構成令,增加了 : X明、第二或第三發明 這此夕 9 ;上述黏著構件和韌離趟拔a 。…固組相對於保持板 :構,·且成,、且,將 甘週田間隔分散配置之構 128129.doc 200844019 成。 [發明效果] 本發明中的第-發明’將黏著構件配置為使得每單位面 :的黏者力向隨剝離機構的作動之 剝離進行方向增加,由此,隨剝離機構的作動冓件 :剝離力,開始從黏著構件剝離,其剝離順若 機構的作動所引起的剝離力大很多的力。要比娜 件因此’在剝離機構的剝離進行方向,可容易地剝離工 =果,與黏著構件的黏著力不㈣方向性的以往的裝 相比,可用較弱力的剝離力不費力地剝離工件, 難以發生工件掉落等製作上的問題。 據此,在用於液晶面板顯示器的基板組裝裝置時,相對 於因處入面板内或間隔件的廢碎等而發生不均勾等門 題,可獲得很大的限度。 9寺問 另外’即使在黏著構件和卫件之間,因異物的卡入等導 致:部性的黏著力低下,由於除剝離開始端部的大部分的 工件。 …剝離的連鎖’可確實地黏著保持 作為設定為使得每單 的剝離進行方向增加 工件的剝離進行方向 ,而使黏著力被設定 第二發明除第一發明的效果之外, 位面積的黏著力向隨剝離機構的作動 之機構,藉由向對於上述黏著構件的 增大對於工件的黏著構件的黏著面積 128129.doc 200844019 為從對於勒菩播I /l 變強。者構件的工件的剝離開始位置向剝離終了位置 因此,能夠以簡單的結構使 性。 傅彳史黏者構件的黏著力具有方向 ”、口果因可將整個裝置的έ士槿銬留儿 求製造的低成本化。 I、。構間早化,所以’也可謀 第三發明除第一發明的效果 位面積的黏荖* A ,左々 作為叹疋為使传母單 、一 向卩現剝離機構的作動的剝縫、# — 士 ^、 之機構,藉由向對;^、+、^ 到離進仃方向增加 增大對於工件的㈣❹ 的件的剝離進行方向 的Ά者構件的彈性轡旦 定為從對於黏著構侔的. ^里,而使剝離力被設 置變強。 、工的剝離開始位置向剝離終7位 因此,能夠以簡單的結 性。 稱件的黏著力具有方向 其結果,因可將整個裝置的結構 求製造的低成本化。 所以,也可謀 弟四發明除第一發明、第二發 外,將黏著構件和剝離機構組成組 ^明的效果之 保持板以每適當間隔分散配置,以此,·^夕個組相對於 者構件,工件被部分性地黏著保持曰分散配置的黏 各剝離機構的作動,無需對整個 二這些黏著藉由 因此,以簡單的結構,可確實地進…力就能剝離。 其結果,因可將整個裝:工件的剥離開放。 求製造的低成本化。 構間早化,所以,也可謀 128129.doc -10- 200844019 【實施方式】 本發明的黏著夾盤裝置D,表 用於、凌曰链_印 y、作為工件A、B配備有使 用於,夜日日顯不夯(LCD)或電漿顯+即 认 m“_p)或可撓性顯示器 的面扳上的玻璃基板、或裝舎 ^ 如地保持並貼合塑膠薄膜 基板的基板貼合機的情況。 此基板貼合機,如圖1⑷〜⑷或圖朴⑷所示,配置例 如由以金屬或陶瓷等剛體來 、 /成為不歪曲(彎曲)變形的厚度 的平板狀的基準平/Λ而占& μ 半十〇而成的上下—對保持板1、1,,在這些 上下保持板1、Γ的平行相對的平滑保持面U、U,上,使 兩片基板A、B分別裝卸自如地保持,劃分形成於此等之 周圍的封閉空間S内達到規定真空度後,將上下保持板卜 1向ΧΥΘ方向(圖面為水平方向)相對地調整移動,進行基 B彼此的疋位,之後,至少使基板A、B中的任一方 從上下保持板1、Γ的保持面h、U,剝離重合後,進行封 閉空間s内的真空破壞,以產生於兩基板a、b的内外的氣 壓差,將兩基板A、B之間加壓至規定的間隙。 右砰細地進行說明,如圖1(a)或圖7(a)的實線所示,上 下保持板1、1,以升降機構(未圖示)向2方向(圖中的上下方 向)可相對移動地被支撐,在大氣壓環境中,以將這些上 /、持板1 1向上下方向放開的狀態,相對於各保持面 la將用搬運機器人(未圖示)運送的基板A、B分成組 分別保持。 之後’如圖1(a)或圖7(a)的雙點鏈線所示,藉由上述升 降機構的作動使上下保持板!、j,接近移冑,在此二者間劃 128129.doc 200844019 分形成封閉空間S。 拙:!:在藉由吸氣機構(未圖示)的作動從此封閉空間s 抽取二氣並達到規定真空度時, 示)的作動,使上下伴持板移動機構(未圖 卜保捋板1 1中的任-方相對於另—方 朝ΧΥΘ方向調整移動,以此,作為保持於該等的基板A、B 彼此的位置調整(調整),依次進行粗調整和微調整。[Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 3-283 185 (No. 3, pp. 3 to 4) [Explanation] [Problems to be solved by the Invention] However, in such a conventional adhesive chuck device, since the adhesive force of the adhesive member does not have directionality, "in order to easily peel the workpiece from the adhesive member by the actuator or the yoke-off mechanism, When the adhesive force is set to be weak, the workpiece is easily peeled off due to an external force other than the peeling mechanism, and is not surely adhered and held. Thus, the jade member is dropped, or the positional displacement occurs during the bonding, resulting in a defective product. The problem. In addition, if the adhesive force of the adhesive member is set to be strong, the peeling performance of the workpiece is low, and the workpiece cannot be attached well, or the bubble remains in the display cell. In the part, the product has a bad problem. Peeling of the peeling mechanism In addition to the object of the first invention, the object of the invention is to perform the direction and to easily peel the workpiece. The second invention and the third invention have the object of making the adhesion of the adhesive member directional with a simple structure in addition to 128129.doc 200844019. According to a fourth aspect of the invention, in addition to the object of the invention of the first invention, the second invention or the third invention, the separation and opening of the workpiece are reliably performed with a simple configuration. [Means for Solving the Problems] In order to achieve the above object, a first invention of the present invention is characterized in that the adhesive member is disposed such that the adhesive force per unit area increases in the direction of peeling with the operation of the peeling mechanism. % As described herein, "the direction of peeling with the action of the peeling mechanism means that when the peeling mechanism is actuated, the workpiece is gradually dispersed after being peeled off from the point of action, and the direction of the present invention is referred to as the direction of peeling. ;: month' is characterized in that, in the configuration of the first invention, the adhesion force to the armor area is increased to the mechanism for the above-mentioned adhesive member: The third invention of the adhesion of the workpiece to the adhesion area of the member is characterized in that the per-unit "in the configuration" is set as the peeling side, and the force is moved in accordance with the peeling mechanism. The separation of the workpieces into two: the mechanism increases the amount of the composition to the above-mentioned adhesive members. The elastic deformation of the adhesive member of the cattle The fourth invention is characterized by the addition of the following: X, second or third invention. This eve 9; the above-mentioned adhesive member and the toughness 趟 a. ... solid group relative to the holding plate: structure, · and, and, will be arranged in the arrangement of Gan Zhoutian interval 128129.doc 200844019. [Effect of the Invention] In the first invention of the present invention, the adhesive member is disposed such that the adhesive force per unit surface increases in the direction of peeling with the action of the peeling mechanism, whereby the peeling mechanism is activated by the peeling mechanism: peeling The force starts to peel off from the adhesive member, and the peeling force caused by the action of the mechanism is much larger. Therefore, it is easy to peel off the work in the direction of peeling of the peeling mechanism, and it is easy to peel off with a weak force peeling force compared with the conventional one in which the adhesive force of the adhesive member is not (four) directional. For the workpiece, it is difficult to cause problems such as the falling of the workpiece. According to this, in the case of a substrate assembly apparatus for a liquid crystal panel display, a problem such as unevenness or the like may occur due to breakage of the inside of the panel or the spacer, and the like, and a large limit can be obtained. In the case of the sticking of the foreign matter, the adhesion of the foreign matter is low, and the part of the workpiece at the beginning of the peeling is removed. ...the peeling interlocking' can be reliably adhered as the setting so that the peeling progress direction of each sheet increases the peeling direction of the workpiece, and the adhesive force is set. The second invention is in addition to the effect of the first invention, the adhesion of the bit area The mechanism for actuating with the peeling mechanism is enhanced by the adhesion area to the adhesive member of the workpiece by 128129.doc 200844019, which is increased to the above-mentioned adhesive member. The peeling start position of the workpiece of the member is at the end position of the peeling off. Therefore, the structure can be made simple. The adhesive force of Fu Shishi's adhesive component has a direction, and the fruit can be used to reduce the cost of the whole device's gentleman's retention. I. The early interfacialization, so I can also seek the third invention. In addition to the effect of the first invention, the adhesion of the area is *A, and the left side is used as the sigh to make the mother-in-law, the peeling of the action of the peeling mechanism, and the mechanism of the #^士^, by the pair; , +, ^ to increase from the direction of the advancement of the workpiece, the elasticity of the member of the (four) 剥离 of the workpiece is determined by the direction of the elastic structure of the member, and the peeling force is set to be strong. The peeling start position of the work is 7 positions at the end of the peeling, so that the knot can be formed with a simple knot. The adhesive force of the weighed member has a direction, and the structure of the entire device can be reduced in cost. In addition to the first invention and the second invention, the holding plate of the effect of forming the adhesive member and the peeling mechanism is disposed at an appropriate interval, so that the group is opposed to the member, and the workpiece is Partially adhered to maintain the viscous dispersing configuration Since the movement of the mechanism does not require the adhesion of the entire two, it is possible to peel off the force with a simple structure. As a result, the entire assembly: the peeling of the workpiece can be opened. The premature interfacialization is also possible. Therefore, it is also possible to use 128129.doc -10- 200844019. [Embodiment] The adhesive chuck device D of the present invention is used for the use of the 曰 曰 y, as the workpieces A and B. The glass substrate on the surface of the flexible display or the substrate on which the plastic film substrate is held and attached is mounted on the surface of the flexible display (LCD) or the plasma display. The situation of the laminating machine. As shown in Fig. 1 (4) to (4) or Fig. 4 (4), the substrate bonding machine is disposed, for example, by a flat-shaped reference flat/Λ which is a rigid body such as a metal or ceramic or a thickness which is not warped (bent). μ 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半After the predetermined degree of vacuum is reached in the closed space S which is formed around the circumference, the upper and lower holding plates are relatively moved in the direction of the ( (the horizontal direction in the drawing), and the bases B are clamped. At least one of the substrates A and B is peeled off from the holding surfaces h and U of the upper and lower holding plates 1 and 重, and then the vacuum is broken in the closed space s to generate air pressure inside and outside the substrates a and b. Poor, the two substrates A and B are pressurized to a predetermined gap. The right side is described in detail, and as shown by the solid line in Fig. 1 (a) or Fig. 7 (a), the upper and lower holding plates 1 and 1 are moved in the two directions by the elevating mechanism (not shown) (vertical direction in the drawing) The substrate A that is transported by a transport robot (not shown) is placed on each of the holding surfaces 1a in a state in which the upper/left holding plates 1 1 are moved upward and downward in an atmospheric pressure environment. B is divided into groups to maintain separately. Thereafter, as shown by the double-dot chain line of Fig. 1 (a) or Fig. 7 (a), the upper and lower holding plates are held by the action of the above-described raising and lowering mechanism! , j, close to moving, between the two 128129.doc 200844019 points to form a closed space S. clumsy:! : when the second air is extracted from the closed space s by the operation of the suction mechanism (not shown) and the predetermined degree of vacuum is reached, the upper and lower supporting plates are moved (not shown in the protective plate 1 1). The arbitrarily-adjusted movement is adjusted in the direction of the other side, and the position adjustment (adjustment) of the substrates A and B held in the same direction is performed, and coarse adjustment and fine adjustment are sequentially performed.

完成該等之位置調整之後,如圖1(b)或圖7(b)所示,將 被保持,上下保持板卜Γ的基板A、B的任—方朝另—方 移動’藉由夾住下基板B上的環狀黏著劑(After the position adjustment is completed, as shown in FIG. 1(b) or FIG. 7(b), the substrate A and B of the upper and lower holding plates are moved to the other side by the folder. Retaining the annular adhesive on the substrate B (

間壓接,使二者間密封重合。 便,、W 之後’如® 1(c)或圖7(c)所示,藉由上述升降機構的作 動,使上下保持板iΓ向相互隔離的方向移冑,與此大致 同一時間,使上述吸氣機構反作動或用其它機構向封閉空 間s内供給空氣或氮氣,藉由使該封閉空間S内的環境返回 大氣壓,以產生於兩基板A、Β内外的氣壓差均等加壓, 在液晶被封入的狀態下,完成擠壓貼合至規定間隙的工 程0 亚且,本發明的黏著夾盤裝置D,由上述剛體而成的上 下保持板1、1,,和將基板Α、Β黏著保持的黏著構件2,和 將基板A、Β強制性地從此黏著構件2剝離的剝離機構3構 成’相對於上下保持板丨、丨,的保持面la、la,,以黏著構 件2黏著保持上下基板A、B,藉由剝離機構3的作動,將 上下基板A、B強制性地從該黏著構件2剝離,與上下保持 板1、1,的保持面la、u,隔離。 128129.doc -12- 200844019 在圖不例中,表示本發明的黏著夾盤裝置d只相對於上 保持板1的保持面la,向與其交又的2方向(上下方向)往返 自如地設置剝離機構3,藉由此_機構3的上下作動,將 上基板A強制性地從黏著構件2剝離,與上保持板i的保持 面13隔離,與保持於下保持板1,的下基板A重合的情況, 以下’按照圖示例進行說明。 上述黏著構件2為由例如丁基橡膠、氟橡膠、感光性樹 脂、㈣酸系或石圭系等黏著材料而成之黏著片#,將其背 面固疋在上保持板丨的保持面“或下述的剝離機構3的基板 側表面。 此黏著構件2和下述的剝離機構3,優選單元化為使得該 者成、、且’相對於上保持板i以每適當間隔分散配置,在 圖1⑷〜(e)或® 7⑷〜⑷所示的例巾,因空間的關係,只配 置了 2組’但對應於上基板A的大小,只配置了可將其懸掛 的數。 在上保持板1的保持面1 a,開設有多個開口部 心在此等開口部1b的内部分別向上下方向往③自如地配 設有剝離機構3。 作為此剝離機構3的具體例,如圖1⑷〜⑷或圖7⑷〜⑷ 所,:例如’ W由以不銹鋼等金屬製的可彈性變形的膜或 ::或工塑膠等的合成樹脂成形為薄板狀的隔膜板而成 的彈性膜3a,向上下方+ „ 下方向往返自如地支撐在上保持板1的 開口部1 b内,因夾住士 任此焯性膜3a並劃分形成在其一次側 (月後)的空壓室3b與割合 刀形成在二次側的封閉空間s間的 128129.doc 200844019 壓力差,彈性變形並向上下方向往返作 1巡作動,或以致動器等 驅動源(未圖示)向上下方向往返作動。 在圖示例中,用配借在上保拉4 j 川杜上保符扳I的開口部“的夾持構 件1C夾住並不能脫落地固定彈性膜“的外周部分,但也可 以用其它支樓機構固定,另外,在該彈性膜的中心部分 連設了不能變形的剛體部3c,但也可以例如,國際公開第 2005/嶋22號手冊所記載,只用由無剛體部⑽隔膜板 而成的彈性膜3a,從黏著構件2強制性地剝離上基板A,與 上保持板I的保持面la隔離。 使此種彈性膜3a或驅動源向上下方向作動時,以黏著構 件2黏著保持的上基板a變形,黏著構件2對應於此變形歪 曲而彈性變形,在其黏著力達到屈服值時,產生剝離。 因此,將上述黏著構件2配置為,使每單位面積的黏著 力,向上基板A隨上述剝離機構3的作動對於該黏著構件2 剝離的方向增加,使剝離力的強弱具有平面内的方向性。 即,隨上述剝離機構3的作動,在上基板a的變形歪曲傳 播的方向配置上述黏著構件2,使得在各地點,剝離所需 力(黏著構件2的黏著屈服力)整體大致增加。 並且’本發明將如上所述的上基板A的變形歪曲傳播的 方向稱之為”剝離進行方向,,。 作為設定為使得每單位面積的黏著力向隨此剝離機構3 的作動的對黏著構件2的上基板A的剝離進行方向增加之方 法’使相對於上基板A的該黏著構件2的黏著面積向相對於 上述黏著構件2的上基板A的剝離進行方向增大或使相對於 I28l29.doc -14- 200844019 上基板A的該黏著構件2的彈性變形量向相對於上述黏著構 件2的工件八的剝離進行方向增大等,使剝離力的強弱具有 平面内的方向性。 [實施例之詳細說明] 以下,根據附圖說明本發明的各實施例。 實施例1 實也例1如圖1〜圖6所示,相對於上述上保持板1的保 持面1a,黏著構件2被固定為包圍上述剝離機構3,藉由將 此初離機構3向上移動,使其向上保持板i的開口部^内呈 凹狀埋入,上基板八的表面A1接觸在該黏著構件2的黏著 面〜而被黏著保持,另外,藉由將剝離機構3向下移動, 吏’、向—人側工間⑼閉空間突出,上基板A的表面Μ從 該黏著構件2的黏著面2碰強制性地擠壓剝離。 作為上述黏著構件2的設置例,藉由將沿上保持板!的各 開一 lb的開口邊緣被固定的黏著構件2的形狀向上保持 板1的剝離進行方向改變,使有助於追隨根據各開口料 内的剝離機構3的上下作動的、剝離時的上基板A的上下方 向(垂直)k位變化的黏著構件2的橫截面或每單位面積 著力增減。 、 圖2(b)所不例中’沿在上保持板1以圓形被開設的各 開口㈣的開口邊緣’向周方向以每適當間隔配置固定多 :黏著構件2’將該等黏著構件2的黏著面形狀分別設為大 射=:從各開口部16的開口中心向面向開口邊緣的放 方向外側,逐漸增大該黏著構件2的橫截面積。 128129.d〇( 15 200844019 作為其它例子,如圖3所示,配置固定沿上保持板丨的各 開口部lb的開口邊緣向周方向連續的環狀的黏著構件2, 使得從其内側部分的周方向適當部分到面向各開口部“的 開口中心消尖為大致山形狀或梯形狀等,也可從各開口部 lb的開口中心向面向開口邊緣的放射方向外側,逐漸增大 該黏著構件2的橫截面積。 這些黏著構件2的形狀不局限於圖示的大致三角形或大 致山形或梯形,可取而代之變更為梯形等類似的形狀。 並且,如圖4所示,將上述黏著構件2以多數點狀分散配 置,藉由變化這些點狀黏著構件2的數或密度或大小等, 也可使有助於追隨根據各開口部lb内的剝離機構3的上下 作動的、剝離時的上基板A的上下方向(垂直)變位變化的 黏著構件2的每單位面積的黏著力逐漸增減。 另外,作為除其以外的黏著構件2的設置例,藉由將沿 保持板1的各開口部丨b内的開口邊緣被固定的黏著構件2 、 白上保持板1的剝離進行方向改變或將相對於上保 持板1的保持面1a的霉占著構件2的固定部分向上保持板!的 '進行方向改變,來增減有助於追隨根據各開口部1 b内 的剝離機構3的上下作動的、剝離時的上基板a的上下方向 (垂直)虻位變化的黏著構件2的彈性變形量。 口圖所不例中,沿上保持板丨的各開口部b的開口邊緣, °周方向以每適當間隔配置固定多個黏著構件2,或以向 ::向連續的環狀配置固定,將這些黏著構件2的厚度尺 ' 開口 "卩lb的開口中心向面向開口邊緣的放射方向外 128129.doc 16 200844019 側加厚,使該黏著 使剝離力向同方:的彈性變形量逐漸增大,由此, ’ J々句變強。 在上保持^的黏著構件2經由黏著保持板2b被固定 不同的黏著構件2 接固定。 但也可不使用黏著保持板2b而直 其它例如圖6(avM# 一 開口邊緣,向月,斤…上保持板1的各開口部lb的 肖以每適當間隔配置固定多個黏著構件 成乂向周方向連續的環狀配置固定, 件2的放射方向外側部八 一钻者構 刀口疋在上保持板1的保持面1 a,從 各開口口 [U b的開口中 甲心向面向開口邊緣的放射方向外 使该黏著構件2的彈性變彡詈 向同方向變強。…逐漸增大’由此,使剝離力 —圖不例沿該黏著構件2的背面設置黏著保持板2b, 精由二將其放射方向外側部分2c相對於上保持板】的保持 面la等。p刀固定’黏著構件2的拉伸強度變高較佳,但也 可不使用黏著保持板2b而直接固定。 一 另外也可以適當組合如圖2〜圖6所示的設置例,使每 單位面積的黏著力向隨剝離機構3的向下移動的、向相對 於黏著構件2的上基板八的剝離進行方向(從各開口部_ 開口中心面向開口邊緣的放射方向外側)增加。 一方面,在面對於上述剝離機構3的上基板A的部分連設 由不可變形材料而成的剛體部3c,藉由此剝離機構3的I 下作動,在保持板丨的開口部lb内使該剛體部“向上下方 128129.doc -17- 200844019 向平行移動。 圖示例t,在藉由剝離機構3的彈性心的向上移動而 使剛體部3c埋入於開口部lb内的狀態下,使上基板A接觸 在上保持板1的黏著構件2而黏著保持,另外,藉由彈性膜 h的向下移動使剛體部3c向二欠側空間(封閉空叩,突出 變形於下方,向從黏著構件2的黏著面㈣開的方向㈣ 上基板A的表面A1。 另外,將上述剛體部3〇的形狀對應於保持板㈣開口部 ib設為圓形’但也可將這些剛體部3c和開口部㈣形狀設 為例如矩形或多角形等角形或其它形狀。 接下來’關於此種黏著夾盤裝置D的作動進行說明。 首先,如圖2⑷的實線、圖5的實線及圖6⑷所示,若藉 由上述剝離機構3的向下移動,擠壓黏著保持於黏著構件曰2 的黏著面2a的上基的表面A1 ’則如圖2⑷的雙點鍵 線、圖5的雙關線及圖6(b)所示,上基板A的擠廢部分發 生口 p刀.k形,對應於此變形歪曲,黏著構件2的黏著力達 到屈服值並產生剝離。 在此剝離中,由於黏著構件2被配置為,每單位面積的 ^者力向上基板简剝離進行方向1,本實施例中的從 開口部lb的開口中心向放射方向外側增加,因此,因小 甘;!離力上基板A的表面A1首先從内側開始被剝離,且 /、剝離順利地進行。 、然而’即使其它外力向不同於依靠該剝離機構3的剥離 、丁方向的方向’對此上基板A起作用,但因對於黏著構 128J29.doc 200844019 件2的剝離力變得非常大,所以很難剝離。 據此,因剝離機構3的作動,確實地達成了上基板a由黏 著構件2的剝離,對除其以外的方向的干擾力,可使其具 有剝離的耐性,可確實地防止上基板A的剝離下落。 實施例2 此實施例2如圖7〜圖8(a)所示,藉由將上述黏著構件2的 口疋位置從上保持板1的保持面1 a替代為剝離機構3的前端 面的同時,將此剝離機構3向下移動,使固定在其前端面 的黏著構件2的黏著面2a與上述上保持板丨的保持面卜以大 致面狀或若干(1〇0μΐΏ左右)凸狀突出’據此,上基板八的表 面Α1接觸在該黏著構件2的黏著面以 外,藉由剝離她上移動,使固定在其前=黏: 構件2的黏著面2&向上保持板丨的開口部^内以凹狀埋入, 據此’將該黏著構件2的黏著面以從上基板八的表面⑽ 制性地剝下的構成不同於上述圖】〜圖5所示的實施例i,除 其以外的構成與圖1〜圖5所示的實施例丨相同。 圖示例的情況,係在面對剥離機構3的上基板八的部分連 設剛體部3C,在此剛體部3,前端面固定黏著構件2。 作為此實施例2中的上述黏著構件2的設置例,同於上述 ^例由向上保持板1的剝離進行方向改變該黏著構 件2的形狀或黏著構件2的 面的黏著構件2的固定·,來_3的㈣ 口部__構3的上下作動的、=各二 上下方向(垂直)變位變化的黏著構物橫截面積或每單: 128129.doc 200844019 面積的黏著力或彈性變形量。 义:如圖8(b)所不,沿連設在剝離機構3的剛體部3c的 多:的外周邊緣,向周方向以每適當間隔配置固定多個 :占者構件2,將這些黏著構件2的黏著面形狀分別設為大致 ^使孩黏著構件2的横截面積從各開口部1 b的開口 邊緣向面向開口中心的放射方向内側逐漸增大。 乍為-匕例子,雖未圖示,但也可將圖2〜圖6所示的設 置例中的黏著構件2的固定位置從上保持…的保持面㈣ 換為剝離機構3的前端面的同時’設為那些黏著構件2的反 方向,從各開口部lb的開口邊緣向面向開口中心的放射方 向内側,逐漸增大該黏著構件2的橫截面積。 2且,也可以適當組合這樣的設置例,使每單位面積的 黏者力向隨剝離機構3的向上移動的、相對於黏著構件㈣ 上基板A的剝離進行方向(從各開口料的開口邊緣面向開 口中心的放射方向内側)增加。 若說明此實施例2的作動’藉由剝離機構3的向上移動, 固定在其前端面的黏著構件2凹進、從上基板八的表面 拉開時,由此相對於上基板A的黏著部分發生部分變形, 對應於此變形歪曲,黏著構件2的黏著力達到屈服值並產 生剝離’從而由上基板A的表面A1不費力地剝離。 在此剝離中,由於將黏著構件2配置為,使每單位面積 的黏著力向上基板A的剝離進行方向、即,本實施例中的 從各開口部lb的開口邊緣向放射方向内側增加,因此,因 小的剝離力,上基板A的表面训始剝離,且其剝離順利 128129.doc -20- 200844019 地進行。 然而’即使其它外力對於此上基板A,向不同於依靠該 剝離機構3的剝離進行方向的方向起作用,但由於對於黏 著構件2的剝離力變得非常大,因此,很難剝離。 據此,如圖7〜圖8所示的實施例2也和上述實施例i同 樣,藉由剝離機構3的作動,確實地達成上基板a從黏著構 件2的剝# ’除其以外的方向的干擾力可使得具有剝離的 耐性,可確實地防止上基板A的剝離下落。 另外,本發明的黏著夾盤裝置D,表示作為工件A、6配 備有使用於液晶顯示器(LCD)或電漿顯示器(pDp)或可撓性 顯不器的面板的玻璃基板、或裝卸自如地保持並貼合塑膠 薄膜基板的基板貼合機的情況,但不僅限於此,也可以配 備在此基板貼合機以外的基板組裝裝置或搬運基板的基板 搬運裝置,也可以黏著保持LCD面板用玻璃基板以外的基 板。 並且,說明了在真空中貼合兩片基板A、B的基板貼合 機’但不僅限於此’也可以係在大氣中貼合基板A、b的 基板貼合機,這種情況,也可以獲得與上述真空貼合機同 樣的作用效果。 另外’在圖示例中’只對於上保持板1的保持面丨a往返 作動自如地設置剝離機構3,藉由此剝離機構3的上下作 動,從黏著構件2強制性地剝離上基板a,但不僅限於此, 雖未圖示,但對於下保持板Γ的保持面la,也可以同樣地往 返作動自如地設置剝離機構’ It由此剝離機構的上下作 128129.doc -21 - 200844019The pressure is crimped so that the seals overlap. Then, after W, as shown in Fig. 1(c) or Fig. 7(c), the upper and lower holding plates i 胄 are moved in a direction separating from each other by the operation of the lifting mechanism, and at substantially the same time, The suction mechanism is reversely actuated or supplied with air or nitrogen into the enclosed space s by other means, and the atmosphere in the closed space S is returned to the atmospheric pressure, so that the pressure difference between the two substrates A and the inside and outside of the crucible is uniformly pressurized, in the liquid crystal In the sealed state, the bonding and bonding to the predetermined gap is completed, and the adhesive chuck device D of the present invention, the upper and lower holding plates 1, 1 formed of the rigid body, and the substrate Α and Β are adhered. The adhesive member 2 to be held and the peeling mechanism 3 for forcibly peeling the substrate A and the crucible from the adhesive member 2 constitute a holding surface la, la with respect to the upper and lower holding plates 丨 and ,, and are adhered to the upper and lower sides by the adhesive member 2 The substrates A and B are forcibly peeled off from the adhesive member 2 by the operation of the peeling mechanism 3, and are separated from the holding faces la and u of the upper and lower holding plates 1 and 1. 128129.doc -12-200844019 In the example of the drawing, the adhesive chuck device d of the present invention is provided with respect to the holding surface 1a of the upper holding plate 1 and is detachably provided in two directions (up and down direction) which are in contact with each other. The mechanism 3 is forcibly peeled off from the adhesive member 2 by the up-and-down operation of the mechanism 3, and is separated from the holding surface 13 of the upper holding plate i, and overlaps with the lower substrate A held by the lower holding plate 1. In the case of the following, the description will be made according to the example of the figure. The adhesive member 2 is an adhesive sheet # made of an adhesive material such as butyl rubber, fluororubber, photosensitive resin, (iv) acid or stone, and the back surface thereof is fixed to the holding surface of the upper holding plate “" The substrate side surface of the peeling mechanism 3 described below. The adhesive member 2 and the peeling mechanism 3 described below are preferably unitized such that they are disposed in a distributed manner with respect to the upper holding plate i at an appropriate interval. In the case shown in 1(4) to (e) or ® 7(4) to (4), only two sets are arranged due to the space relationship. However, depending on the size of the upper substrate A, only the number that can be suspended is arranged. The holding surface 1 a of the first opening is provided with a plurality of opening portions, and the peeling mechanism 3 is disposed in the upper and lower directions of the opening portion 1b. The specific example of the peeling mechanism 3 is as shown in Figs. 1 (4) to (4). 7(4) to (4), for example, 'W is an elastic film 3a formed of an elastically deformable film made of a metal such as stainless steel or a synthetic resin such as a plastic or a plastic sheet, which is formed into a thin plate-shaped diaphragm plate, up and down + „ Supporting the upper retaining plate 1 freely in the downward direction In the mouth portion 1b, the air pressure chamber 3b formed on the primary side (after the month) and the cutting knife are formed in the closed space s on the secondary side due to the sandwiching of the inert film 3a. 128129.doc 200844019 The pressure difference is elastically deformed, and the vehicle is oscillated in the up and down direction, or is driven up and down by a driving source (not shown) such as an actuator. In the example of the figure, the outer peripheral portion of the elastic film "which is clamped by the holding member 1C of the opening portion of the upper armor" is attached, but other parts may be used. In addition, the rigid body portion 3c which is not deformable is connected to the center portion of the elastic film, but it may be described, for example, in the manual of International Publication No. 2005/22, only by the diaphragm plate without the rigid body portion (10). The elastic film 3a is forcibly peeled off from the adhesive member 2, and is separated from the holding surface la of the upper holding plate 1. When the elastic film 3a or the driving source is actuated in the vertical direction, the upper substrate a adhered and held by the adhesive member 2 is deformed, and the adhesive member 2 is elastically deformed in accordance with the distortion of the deformation, and peeling occurs when the adhesive force reaches the yield value. . Therefore, the adhesive member 2 is disposed such that the adhesive force per unit area increases in the direction in which the upper substrate A is peeled off from the movement of the adhesive member 2 in accordance with the action of the peeling mechanism 3, and the strength of the peeling force has an in-plane directivity. In other words, in accordance with the operation of the peeling mechanism 3, the adhesive member 2 is placed in the direction in which the deformation of the upper substrate a is distorted, so that the force required for peeling (the adhesive yielding force of the adhesive member 2) is substantially increased at each point. Further, the present invention refers to the direction in which the deformation distortion of the upper substrate A as described above is propagated as the "peeling progress direction" as the pair of adhesive members set so that the adhesive force per unit area is moved toward the peeling mechanism 3 accordingly. The method of increasing the peeling direction of the upper substrate A of 2 is such that the adhesion area of the adhesive member 2 with respect to the upper substrate A is increased in the direction of peeling with respect to the upper substrate A of the above-mentioned adhesive member 2 or relative to I28l29. Doc -14- 200844019 The amount of elastic deformation of the adhesive member 2 of the upper substrate A increases in the direction of peeling of the workpiece 8 with respect to the adhesive member 2, and the strength of the peeling force has the in-plane directivity. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. Embodiment 1 As shown in FIGS. 1 to 6, the adhesive member 2 is fixed to the holding surface 1a of the upper holding plate 1. In order to surround the peeling mechanism 3, the initial separation mechanism 3 is moved upward to be recessed in the opening portion of the upper holding plate i, and the surface A1 of the upper substrate 8 is in contact with the adhesive surface of the adhesive member 2. And being held by the adhesive, and by moving the peeling mechanism 3 downward, the 吏', the human-side work space (9) is closed, and the surface Μ of the upper substrate A is compulsory from the adhesive surface 2 of the adhesive member 2 As an example of the arrangement of the above-mentioned adhesive member 2, the shape of the adhesive member 2 which is fixed along the opening edge of the upper holding plate! It is possible to follow the increase or decrease in the cross-section or the force per unit area of the adhesive member 2 which changes in the vertical direction (vertical) k-position of the upper substrate A at the time of peeling in accordance with the up-and-down operation of the peeling mechanism 3 in each opening material. (b) In the other example, 'the opening edge of each opening (four) which is opened in a circular shape along the upper holding plate 1 is fixed in the circumferential direction at every appropriate interval: the adhesive member 2' adheres the adhesive members 2 The surface shapes are respectively set to be large shots =: the cross-sectional area of the adhesive member 2 is gradually increased from the opening center of each opening portion 16 toward the outer side facing the opening edge. 128129.d〇 (15 200844019 As another example, Figure 3, configuration fixed edge The annular adhesive member 2 in which the opening edge of each of the opening portions 1b of the upper plate slab is continuous in the circumferential direction is formed such that the center of the opening from the appropriate portion in the circumferential direction of the inner portion to the opening portion of the opening portion is substantially mountain-shaped or The cross-sectional area of the adhesive member 2 may be gradually increased from the center of the opening of each opening portion 1b to the outer side in the radial direction facing the opening edge, etc. The shape of these adhesive members 2 is not limited to the substantially triangular shape shown in the figure or The shape is substantially a mountain shape or a trapezoid shape, and may be changed to a trapezoidal shape or the like. Further, as shown in FIG. 4, the adhesive member 2 is dispersed in a plurality of dots, and the number or density or size of the dot-shaped adhesive members 2 is changed. In addition, it is also possible to contribute to the adhesion of the adhesive member 2 per unit area which changes in the vertical direction (vertical) of the upper substrate A during peeling in accordance with the vertical movement of the peeling mechanism 3 in each opening lb. Gradually increase or decrease. In addition, as an example of the arrangement of the adhesive member 2 other than the above, the direction of peeling of the adhesive member 2 and the white holding plate 1 which are fixed along the opening edge in each opening portion 丨b of the holding plate 1 is changed or The mold holding the holding surface of the holding plate 1 with respect to the upper holding plate 1 holds the plate up to the fixed portion of the member 2! The change in the direction of the direction is to increase or decrease the elasticity of the adhesive member 2 which helps to follow the vertical direction (vertical) change of the upper substrate a at the time of peeling according to the vertical movement of the peeling mechanism 3 in each opening 1b. The amount of deformation. In the example of the mouthpiece, the plurality of adhesive members 2 are disposed at an appropriate interval in the circumferential direction along the opening edge of each opening b of the upper holding plate, or are arranged in a continuous annular shape. The thickness of the opening of the adhesive member 2 'opening' 卩 lb is thickened toward the side of the opening toward the opening edge 128129.doc 16 200844019, so that the adhesion gradually increases the amount of elastic deformation of the peeling force to the same side: Thus, the 'J 々 sentence becomes stronger. The adhesive member 2 held on the upper side is fixed by fixing the different adhesive members 2 via the adhesive holding plate 2b. However, instead of using the adhesive holding plate 2b, for example, the opening of each of the opening portions 1b of the holding plate 1 of the avM#, such as the opening edge of the avM#, may be arranged at a proper interval to fix the plurality of adhesive members. The circumferential direction is continuous and fixed in an annular configuration, and the outer side of the radial direction of the member 2 is formed by the holder of the upper retaining surface 1a of the upper retaining plate 1 from the opening of each opening [the opening of the Ub toward the open edge The radial direction of the adhesive member 2 becomes stronger in the same direction. The gradual increase Second, the radial direction outer portion 2c is fixed with respect to the holding surface 1a of the upper holding plate. The p-knive fixing 'the tensile strength of the adhesive member 2 is preferably increased, but it may be directly fixed without using the adhesive holding plate 2b. It is also possible to appropriately combine the installation examples shown in FIGS. 2 to 6 so that the adhesion per unit area is directed to the peeling of the upper substrate 8 with respect to the adhesive member 2 toward the downward movement of the peeling mechanism 3 (from Each opening portion _ opening center surface On the one hand, a rigid body portion 3c made of a non-deformable material is connected to a portion of the upper substrate A of the peeling mechanism 3, and the lower portion of the peeling mechanism 3 is actuated. In the opening portion 1b of the holding plate, the rigid body portion is moved in parallel upward and downward by 128129.doc -17-200844019. In the example t, the rigid body portion 3c is buried by the upward movement of the elastic core of the peeling mechanism 3. In the state in the opening portion 1b, the upper substrate A is brought into contact with the adhesive member 2 of the upper holding plate 1 to be adhered and held, and the rigid body portion 3c is moved downward to the lower side space by the downward movement of the elastic film h (closed space)叩, the protrusion is protruded downward, and the surface A1 of the upper substrate A is directed in the direction (4) from the adhesive surface (4) of the adhesive member 2. Further, the shape of the rigid body portion 3 is corresponding to the holding plate (four), and the opening portion ib is rounded. However, the shape of the rigid body portion 3c and the opening portion (four) may be, for example, a rectangular or polygonal equiangular shape or the like. Next, the operation of the adhesive chuck device D will be described. First, the solid line as shown in Fig. 2 (4) , the solid line of Figure 5 and As shown in Fig. 6 (4), by the downward movement of the peeling mechanism 3, the surface A1' which is adhered and held to the upper surface of the adhesive surface 2a of the adhesive member 2a is as shown in Fig. 2 (4), the double-point key line, and the pun of Fig. 5 As shown in Fig. 6(b), the squeezing portion of the upper substrate A has a mouth p-knife shape, which is distorted in response to this deformation, and the adhesive force of the adhesive member 2 reaches the yield value and peeling occurs. The adhesive member 2 is disposed such that the force per unit area is substantially equal to the direction in which the substrate is peeled off, and the direction from the center of the opening of the opening portion 1b to the outer side in the radial direction is increased in this embodiment, and therefore, the force is small; The surface A1 of the substrate A is peeled off from the inside first, and/or the peeling is smoothly performed. However, 'even if the other external force acts on the upper substrate A different from the direction of the peeling and the twisting direction of the peeling mechanism 3, However, since the peeling force for the adhesive structure 128J29.doc 200844019 item 2 becomes very large, it is difficult to peel off. According to this, the peeling mechanism 3 is surely achieved that the upper substrate a is peeled off by the adhesive member 2, and the interference force in the other direction can be provided with peeling resistance, and the upper substrate A can be surely prevented. Peel off the drop. [Embodiment 2] In the second embodiment, as shown in Fig. 7 to Fig. 8(a), the position of the opening of the adhesive member 2 is replaced by the holding surface 1a of the upper holding plate 1 as the front end surface of the peeling mechanism 3 The peeling mechanism 3 is moved downward so that the adhesive surface 2a of the adhesive member 2 fixed to the front end surface thereof and the holding surface of the upper holding plate 凸 are protruded in a substantially planar shape or a plurality of (1 〇 0 μΐΏ) convex protrusions. According to this, the surface Α1 of the upper substrate 八 is in contact with the adhesive surface of the adhesive member 2, and is detached from the upper surface of the adhesive member 2 to be fixed to the front surface of the adhesive member 2& The inside is recessed in a concave shape, whereby the configuration in which the adhesive surface of the adhesive member 2 is peeled off from the surface (10) of the upper substrate VIII is different from the embodiment i shown in the above-mentioned FIG. The configuration other than that of the embodiment shown in FIGS. 1 to 5 is the same. In the case of the illustrated example, the rigid body portion 3C is connected to the portion of the upper substrate 8 facing the peeling mechanism 3, and the rigid body portion 3 is fixed to the front end surface of the rigid body portion 3. As an example of the arrangement of the above-described adhesive member 2 in the second embodiment, the fixing of the adhesive member 2 in the direction of the peeling of the upward holding plate 1 or the surface of the adhesive member 2 is changed, The cross-sectional area of the adhesive structure of the (4) mouth __ structure 3, which is changed by the upper and lower directions (vertical) of each of the two sides: 128129.doc 200844019 Area of adhesion or elastic deformation . As shown in Fig. 8 (b), a plurality of outer peripheral edges of the rigid body portion 3c of the peeling mechanism 3 are disposed so as to be fixed at a plurality of intervals in the circumferential direction: the occupant member 2, and these adhesive members are attached. The shape of the adhesive surface of each of the two is gradually increased so that the cross-sectional area of the child-adhesive member 2 gradually increases from the opening edge of each opening portion 1 b toward the inner side in the radial direction facing the center of the opening. In the example of the first embodiment, the fixing position of the adhesive member 2 in the installation example shown in FIGS. 2 to 6 may be changed from the holding surface (four) of the upper holding member to the front end surface of the peeling mechanism 3. At the same time, 'the opposite direction of the adhesive member 2 is set, and the cross-sectional area of the adhesive member 2 is gradually increased from the opening edge of each opening portion 1b to the inner side in the radial direction facing the center of the opening. 2, it is also possible to appropriately combine such an arrangement such that the adhesive force per unit area is directed toward the peeling of the substrate A with respect to the upward movement of the peeling mechanism 3 (from the opening edge of each opening material) The inner side of the radial direction facing the center of the opening is increased. If the operation of the second embodiment is described as 'the upward movement of the peeling mechanism 3, the adhesive member 2 fixed to the front end face thereof is recessed and pulled away from the surface of the upper substrate eight, thereby the adhesive portion with respect to the upper substrate A Partial deformation occurs, and the adhesive force of the adhesive member 2 reaches the yield value and peels off corresponding to this deformation, so that the surface A1 of the upper substrate A is peeled off effortlessly. In this peeling, the adhesive member 2 is disposed such that the adhesive force per unit area is increased toward the direction in which the substrate A is peeled off, that is, in the present embodiment, from the opening edge of each opening portion 1b to the radially inner side. Due to the small peeling force, the surface of the upper substrate A was peeled off, and the peeling was smoothly performed 128129.doc -20-200844019. However, even if the other external force acts on the upper substrate A in a direction different from the direction in which the peeling mechanism 3 is peeled off, since the peeling force with respect to the adhesive member 2 becomes very large, peeling is difficult. Accordingly, in the second embodiment shown in FIGS. 7 to 8, as in the above-described embodiment i, the peeling mechanism 3 is actuated to surely obtain the direction in which the upper substrate a is peeled from the adhesive member 2 The interference force can be made to have peeling resistance, and the peeling of the upper substrate A can be surely prevented. Further, the adhesive chuck device D of the present invention is a glass substrate provided with a panel for use in a liquid crystal display (LCD) or a plasma display (pDp) or a flexible display as the workpieces A and 6, or is detachably mounted. In the case of the substrate bonding machine that holds and bonds the plastic film substrate, the substrate bonding apparatus other than the substrate bonding machine or the substrate conveying device that transports the substrate may be provided, or the glass for the LCD panel may be adhered and held. A substrate other than the substrate. Further, the substrate bonding machine in which the two substrates A and B are bonded in a vacuum is described, but the substrate bonding machine for bonding the substrates A and b in the air may be used. The same effects as those of the vacuum laminator described above were obtained. Further, in the example of the drawing, the peeling mechanism 3 is provided to the holding surface 丨 a of the upper holding plate 1 in a reciprocating manner, and the upper substrate a is forcibly peeled off from the adhesive member 2 by the vertical movement of the peeling mechanism 3, However, the present invention is not limited to this. However, the holding surface la of the lower holding plate 也 can also be provided with the peeling mechanism erectably in the same manner as the holding surface la of the lower holding plate It. The upper and lower parts of the peeling mechanism are 128129.doc -21 - 200844019

動,從黏著構件強制性地剝離下基板B 保持面la'隔離。 卜保持板1,的 【圖式簡單說明】 圖1係表示本發明的黏著夾盤 ^ ^ 衣置的實施例1的縱向剖面 月θ ,將配備在基板貼合機時的作動牛^ ⑷〜(C)。 才扪作動步驟表示於 圖2係將實施例1部分撼士主— 同、 表不的圖’⑷為縱向剖面前指 圖’(b)為橫向剖面仰視圖。 圖3係表示黏著構件變形例的擴大橫向剖面仰視圖。 圖4係表示黏著構件變形例的擴大橫向剖面仰視圖。 (a) 圖5係表示黏著構件變形例的擴大縱向剖面前視圖 圖6係表示黏著構件變形例的擴大縱向剖面前視圖 表示剥離前的狀態,(b)表示剝離進行時的狀態。° 係表示本發明的黏著夾盤裝置的實施例2的縱向 月Η圖’配備在基板貼合機時的作動步驟表示於 圖:係將實施例2部分擴大表示的圖’⑽ 圖 (b)為橫向剖面仰視圖。 【主要元件符號說明】 1 保持板(上保持板) 1, 保持板(下保持板) la 保持面 la, 保持面 lb 開口部 1 c 夾持構件 128129.doc -22- 200844019 2 黏著構件 2a 黏著面 2b 黏著保持板 2c 放射方向外側部分 3 剝離機構 3a 彈性膜 3b 空壓室(一次側空間) 3c 剛體部 A 工件(上基板) A1 表面 B 工件(下基板) C 環狀黏著劑 D 黏著夾盤裝置 S 封閉空間(二次側空間) ί 128129.doc -23-Move, forcibly peel off the lower substrate B from the adhesive member to keep the face la' isolated. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal section θ of the first embodiment of the adhesive chuck of the present invention, which is provided in the substrate laminating machine. (C). The operation steps are shown in Fig. 2, which is a schematic view of a part of the gentleman in the first embodiment, and the figure (4) is a longitudinal section front view (b) is a transverse section bottom view. Fig. 3 is an enlarged transverse cross-sectional bottom view showing a modified example of the adhesive member. Fig. 4 is an enlarged lateral cross-sectional bottom view showing a modified example of the adhesive member. (a) Fig. 5 is an enlarged longitudinal cross-sectional front view showing a modified example of the adhesive member. Fig. 6 is an enlarged longitudinal cross-sectional front view showing a modified example of the adhesive member, showing a state before peeling, and (b) showing a state at the time of peeling. ° shows the longitudinal flow diagram of the second embodiment of the adhesive chuck device of the present invention. The operation step when the substrate is attached to the substrate bonding machine is shown in the figure: the figure which is partially enlarged in the embodiment 2 (10) (b) For the lateral section bottom view. [Main component symbol description] 1 Holding plate (upper holding plate) 1, holding plate (lower holding plate) la Holding surface la, holding surface lb Opening portion 1 c Holding member 128129.doc -22- 200844019 2 Adhesive member 2a adhered Face 2b Adhesive holding plate 2c Radial direction outer portion 3 Peeling mechanism 3a Elastic film 3b Air pressure chamber (primary side space) 3c Rigid body A Work piece (upper substrate) A1 Surface B Work piece (lower substrate) C Ring adhesive D Adhesive clip Disk device S enclosed space (secondary space) 128 128129.doc -23-

Claims (1)

200844019 十、申請專利範圍: 1· -種黏著夹盤裝置,相對於保持板⑴ 著構件⑺而被黏著保持,藉由剝離機構⑽該黏著構 件(2)強制性地㈣卫件⑷,並與保持板⑴隔離,其特 徵在於: 、將黏著構件(2)配置為,使每單位面積的黏著力向隨上 述剝離機構(3)的作動的剝離進行方向增加。 2·如請求項丨之黏著夾盤裝置,其中,作為設定為使每單 位面積的黏著力向隨上述剝離機構(3)的作動的剝離進行 方向增加的機構,將對於工件(A)的黏著構件(2)的黏著 面積向對於上述黏著構件(2)的工件(A)的剝離進行方向 增大。 3·如請求項丨之黏著夾盤裝置,其中,作為設定為使每單 位面積的黏著力向隨上述剝離機構(3)的作動的剝離進行 方向增加的機構,將對於工件(A)的黏著構件(2)的彈性 變形量向對於上述黏著構件(2)的工件(A)的剝離進行方 向增大。 4·如請求項1、2或3之黏著夾盤裝置,其中,將上述黏著 構件(2)和剝離機構(3)組成組,將這些多個組對於保持 板(1)以每適當間隔分散配置。 128129.doc200844019 X. Patent application scope: 1. A kind of adhesive chuck device is adhered and held relative to the holding plate (1) member (7), and the adhesive member (2) is forcibly (four) guard (4) by the peeling mechanism (10), and The holding plate (1) is isolated, and is characterized in that the adhesive member (2) is disposed such that the adhesive force per unit area increases in the direction of peeling in accordance with the action of the peeling mechanism (3). 2. The adhesive chuck device of the present invention, wherein the adhesion to the workpiece (A) is set as a mechanism for increasing the adhesion per unit area toward the peeling operation of the peeling mechanism (3). The adhesion area of the member (2) increases in the direction of peeling off the workpiece (A) to the above-mentioned adhesive member (2). 3. The adhesive chuck device of the present invention, wherein the adhesion to the workpiece (A) is set as a mechanism for increasing the adhesion per unit area toward the peeling of the peeling mechanism (3). The amount of elastic deformation of the member (2) increases in the direction of peeling off the workpiece (A) to the above-described adhesive member (2). 4. The adhesive chuck device of claim 1, 2 or 3, wherein the adhesive member (2) and the peeling mechanism (3) are grouped, and the plurality of groups are dispersed for the holding plate (1) at appropriate intervals Configuration. 128129.doc
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