200843868 九、發明說明 【發明所屬之技術領域】 本發明關於抑制供給至基板表面之處理的帶出之液體 處理裝置。 【先前技術】 在製造構成液晶顯示器TFT (Thin Film Transistor) 基板時，對玻璃基板實施感光劑（resist )塗佈、曝光、 顯像、蝕刻、感光劑除去等的處理。各處理由複數個製程 所組成，例如一個處理是由對基板供給處理液之製程、洗 淨基板之製程、及使基板乾燥之製程所組成。各製程以專 用的裝置進行，藉由以搬送基板的搬送手段依次通過各裝 置，對基板進行一個處理。又，受到搬送手段所搬送之基 板，在維持著水平的狀態下被搬送，呈水平狀態載置於搬 送手段之各基板依次通過各裝置，藉此可對基板逐次進行 各種處理。 在此，通過供給處理液的裝置之基板，其次被搬入至 洗淨基板之裝置，此時，處理液也會與基板被洗淨裝置一 同帶出。作爲對維持著水平狀態之基板供給處理液的手段 ，適用下述方法，即，在搬送手段的上部配置用來流動處 理液之噴淋裝置，對基板連續地供給處理液者。由噴淋裝 置所流出之處理液會在基板表面成爲液滴而殘存，成爲此 液滴狀的處理液會被下一個洗淨裝置帶出。由於在洗淨裝 置使用洗淨液，故，當洗淨液混入至被帶出的處理液時， -4- 200843868 則無法進行洗淨液之再利用，需將處理液廢棄。因此，當 大量的處理液被洗淨裝置帶出時，則處理液會大量地被消 耗浪費，造成處理液的利用效率變差之問題產生。 因此，在日本特開平8-2946 7 8號公報揭示有，藉由 液體除去滾子，除去附著於基板之處理液，防止處理液被 帶至下一個裝置之液體除去裝置。在該日本特開平8-294678號公報之液體除去裝置，於從藉由搬送手段所搬送 的基板分離微小的距離之位置，設置液體除去滾子，遮蔽 並停止附著於基板表面之處理液的移動。 【發明內容】 〔發明所欲解決之課題〕 在日本特開平8-2 9467 8號公報之液體除去裝置，由 於藉由液體除去滾子接觸於處理液，使推出力作用於處理 液，故處理液會附著於液體除去滾子。因此，必須定期進 行清掃所附著的處理液，造成維修作業繁雜之問題產生。 另外，使用將基板乾燥之氣刀等的手段，對基板表面 噴吹空氣，藉此以空氣壓吹飛處理液之方法也被提案。由 於若使用氣刀的話，是藉由氣體吹飛處理液，故不需要進 行維修作業。但，若依據以氣刀吹飛處理液之方法時，則 不易使氣刀的空氣壓均等地作用於基板表面，造成基板表 面部分乾燥，在處理液附著與未附著之部分產生乾燥不均 。因此，在作爲最終之液晶顯示器之製品上產生圖像不均 之各種問題。 -5- 200843868 因此，本發明之目的在於不需使用液體除去滾子或空 氣，可抑制處理液之被帶出量。 〔用以解決課題之手段〕 爲了解決以上問題，本發明之發明1的液體處理裝置 ，是對基板表面供給處理液，來進行表面處理之液體處理 裝置，其特徵爲：具有：搬送手段，其是在前述液體處理 裝置，將前述基板朝水平方向搬送；液體供給手段，其是 對藉由前述搬送手段所搬送的前述基板全面，供給前述處 理液；及液體噴射手段，其是配置於前述液體供給手段與 前述液體處理裝置的搬出口之間，藉由對基板，從斜上方 朝前述基板的搬送方向之相反方向噴射前述處理液，來除 去聚集於前述基板表面的液滴。 藉由發明1的液體處理裝置，因由液體供給手段所供 給而在基板表面成爲液滴之處理液，受到由液體噴射手段 所噴射的處理液之液壓，由基板表面推壓流動而除去，故 ，能夠抑制處理液被帶出。進行滯留於基板表面的處理液 之推出，不是使用液體除去滾子或空氣，而是使用同種液 體之處理液，因此，不需要進行維修作業。又，當使用處 理液（非空氣），除去處理液時，則基板表面成爲全面性 形成液體膜之狀態，基板表面不需要進行乾燥，能夠常時 維持濕潤狀態。因此，基板表面不會乾燥，處理液未附著 部分消失，亦不會有斑紋（不均）之問題產生。 又，由於基板的搬送方向與處理液的噴射方向呈相反 -6- 200843868 方向，故，基板的搬送速度之能量會加在處理液的噴射壓 。因此，對成爲液滴狀之處理液，能夠使更強的處理液流 作用。因此可更有效率地除去基板表面的液滴。 在此，相反方向不限於1 8 0度的角度之相反方向，亦 可爲對搬送方向呈傾斜之相反方向。在基板的搬送方向與 處理液的噴射方向呈傾斜之狀態時，比起1 8 0度相反的情 況，作用於處理液之液壓若干低。但，當由對搬送方向呈 傾斜相反方向噴射處理液時，能夠由基板的兩邊推出聚集 的處理液，故能夠有效地除去基板表面的液滴。 又，當以所噴射的處理液之液壓使成爲液滴之處理液 流動時，基板表面成爲形成有液體膜之狀態，但從抑制帶 出量的觀點來看，液體膜的厚度儘可能的薄爲佳。若提高 所噴射的處理液之液壓的話，能夠使強力之推出力作用， 能夠將滯留的處理液除去後之基板表面的液體膜做薄。因 此，處理液的噴射壓儘可能地提高爲佳。 又，作爲液體供給手段，從對基板表面全面供給處理 液來進行表面處理之觀點來看，例如能夠採用下述方法， 即，在液體處理裝置的上部，於複數個部位配置噴淋裝置 ，由此噴淋裝置，對基板表面常時供給處理液。 本發明之發明2的液體處理裝置，是如發明1的液體 處理裝置，其中，將前述液體噴射裝置之噴射前述處理液 的噴出口形成隙縫狀，以此隙縫成爲與前述基板的搬送方 向呈正交的方向之方式配置前述液體噴射手段。 由於藉由將噴射口形成爲隙縫狀，能夠截流所噴射之 200843868 處理液，故，可使高噴射壓作用於滯留在基板表面之處理 液。在由對基板搬送方向呈1 8 0度相反的方向噴射處理液 之情況，隙縫被配置成對基板的搬送方向呈正交，而在如 前述般，由傾斜相反方向噴射處理液之情況，隙縫被配置 成對基板的搬送方向呈傾斜的狀態。 再者，隙縫基本上適用形成有直線狀間隙者。但，亦 可爲非直線狀，而使用形成爲曲線狀的隙縫。例如，使用 作爲曲線狀的隙縫之拋物線上的隙縫，配置成拋物線的頂 點朝向基板的搬送方向之最上游側，亦可從基板的3邊推 出處理液。又，亦可非爲拋物線，能適用圓形或橢圓形等 的曲線狀隙縫。 本發明的發明3之液體處理裝置，是如發明1或2的 液體處理裝置，其中，前述液體供給手段與前述液體噴射 手段配置於前述液體處理裝置的上部，在前述液體處理裝 置的下部設置有用來回收前述處理液之處理液回收手段， 將藉由前述處理液回收手段所回收之前述處理液循環於前 述液體供給手段與前述液體噴射手段，來將前述處理液進 行再利用。 由配置於液體處理裝置的上部之液體供給手段，成爲 大量的處理液常時供給至基板的狀態，除了使用於表面處 理之一部分的處理液外，幾乎所有的處理液朝液體處理裝 置的下部流動。將這樣的處理液再次返回至液體供給手段 與液體噴射手段，使處理液循環，能夠謀求處理液之再利 用。藉此，可消除處理液之浪費，能夠有效率地使用處理 -8- 200843868 液。爲了使處理液循環，在裝置下部設置處理液回收手段 ，將所回收的處理液返回至液體供給手段與液體噴射手段 。作爲用來使處理液循環之手段，可適用例如泵浦。 作爲處理液，適用於用來顯像所曝光的感光劑之顯像 液、用來進行蝕刻處理之蝕刻液、或用來剝離感光劑之感 光劑剝離液等的任意處理液。即，本發明之液體處理裝置 適用於顯像裝置、蝕刻裝置、或感光劑剝離裝置等的任意 裝置。 又，本發明之發明4的液晶顯示器的製造方法，其特 徵爲：使用發明1所記載的液體處理裝置，進行基板表面 的處理，使用進行了此處理之基板，來製造液晶顯示器。 由於液體處理裝置可適用於顯像裝置、蝕刻裝置、感光劑 剝離裝置等，故能夠採用藉由這些各裝置進行了液體處理 之基板來製造液晶顯不器。 〔發明效果〕 本發明，由於對在基板成爲液滴而滯留的處理液噴射 處理液，將所滯留的處理液推出至基板的外部，故，可抑 制處理液的帶出。又，所滯留的處理液是藉由呈液體之相 同的處理液來推出至基板外部，故，不需要進行因處理液 所造成之髒污的維修作業，又能夠將基板常時維持於濕潤 狀態，因此，可防止斑紋產生。 【實施方式】 -9- 200843868 以下，參照圖面說明關於本發明的實施形態。圖1是 顯示液晶顯示器的製造過程中之顯像處理D的一例。在圖 1中’顯像處理D是由顯像製程、水置換製程、洗淨製程 、乾燥製程的4個製程所組成，顯示製程D - 1是藉由圖2 的顯像裝置20來進行，水置換製程D-2是藉由未圖示的 水置換裝置來進行，洗淨製程D-3是藉由未圖示的洗淨裝 置來進行，乾燥製程D-4是藉由未圖示的乾燥裝置來進行 〇 如圖1所示，在顯像處理的前段，實施曝光處理L。 在曝光處理L，對塗佈於基板上的感光劑，使預定圖案潛 像。曝光處理L結束後的基板是在顯像處理D將所潛像的 圖案予以顯像化。然後，顯像處理D結束後的基板被移至 蝕刻處理E，因應顯像化後的圖案，進行蝕刻。 顯示製程D-1爲對基板，供給作爲處理液之顯像液， 將潛像於感光劑之圖案予以顯像化的製程。水置換製程 D-2是對沖洗有顯像液的基板，進行洗淨之製程。乾燥製 程D-4是使進行了洗淨的基板乾燥，除去所附著之水分的 製程。 圖2顯示進行顯示製程D -1的顯像裝置2 0。顯像裝 置20是具有顯像室30與液體回收機構8〇。顯像室30是 具有：搬送基板W，作爲搬送手段之搬送滾子40;配置 於搬送滾子40的上部’作爲液體供給手段之噴淋裝置50 ;用來噴射顯像液，作爲液體噴射手段的狹縫噴嘴6 0 ;及 配置於顯像室30的下部之液體承接部70。 -10- 200843868 在圖2中，顯示設有2個液體承接部70，在2個液體 承接部7 0，分別連結有液體回收用配管7 1。2個液體回收 用配管7 1是在途中會合而連結至液體回收機構80。在液 體回收機構80，連結著噴淋裝置用循環配管8 1與狹縫噴 嘴用循環配管82，噴淋裝置用循環配管8 1連結於噴淋裝 置5 0，狹縫噴嘴用循環配管82連結於狹縫噴嘴60。又， 在噴淋裝置用循環配管8 1與狹縫噴嘴用循環配管82的途 中，分別設有泵浦P1與P2。 顯像室3 0爲用來對基板W供給顯像液後進行顯像之 室。基板W在顯像室3 0的內部朝水平方向被搬送，在表 面W S實施作爲表面處理之顯像處理。因此，設置於顯像 室30的內部之搬送滾子40將基板W朝水平方向搬送。 基板W在被搬入至顯像室30前，在未圖示的曝光裝置實 施曝光處理L。搬送滾子40是由未圖示的曝光裝置連續 設置著，具有在曝光裝置感光了預定圖案之感光劑的基板 在該狀態下，藉由搬送滾子40搬入至顯像室3 0。因此’ 在顯像室30，設置成爲用來搬入基板W的入口之搬入口 41 〇 另外，在顯像室30實施了顯示製程D-1之基板W， 朝下一個製程的水置換製程D-2被搬出。因此’在顯像室 30設置成爲用來搬出基板W的出口之搬出口 42。因此’ 搬送滾子40設置於由搬入口 41至搬出口 42爲止的範圍 ，依次搬送基板W。 噴淋裝置5 0是用來將對潛像於基板W的預定圖案進 -11 - 200843868 行顯像用的顯像液供給至基板W之液體供給手段。 中，由複數個噴淋裝置流出顯像液。當顯像液被供 板表面w S時，顯像的圖案被顯像化。具體而言， 液被供給至基板表面WS時，配合所曝光之圖案， 與顯像液反應而被除去，進行顯像化。藉此，在曝 L所曝光的圖案例如T F T的電路圖案被顯像化。因 要對基板表面 WS全面性地供給顯像液，由噴淋g 常時對基板W供給顯像液。 狹縫噴嘴60是朝基板W，由斜上方噴射顯像 液體噴射手段。在狹縫噴嘴60，由狹縫噴嘴用循 82供給顯像液，藉由泵浦P2的泵浦壓力之作用， 像液。狹縫噴嘴60是在其噴射口形成有間隙，由 噴射出已被截流之顯像液。因此成爲，以高的液壓 W噴射顯像液。再者，泵浦P2，除了使用來噴射 的噴射壓作用之功能以外，亦具有後數的顯像液之 能，但亦可個別獨立設置使噴射壓作用之泵浦與發 功能之泵浦。 如圖2所示，藉由從複數個噴淋裝置5 0所供 像液，對由搬入口 4 1搬入而以搬送滾子40所搬送 W供給充分量的顯像液。此時，因基板 W維持水 ’依次被搬送滾子4 0所搬送，由於基板W具有某 的大小且受到表面張力所作用，故在表面 WS，大 像液成爲液滴而滯留。爲了防止此滯留的顯像液直 置換製程D-2所帶出，而設置了狹縫噴嘴60。 在圖2 給至基 當顯像 感光劑 光處理 此，需 !置 50 液用之 環配管 噴射顯 噴射口 朝基板 顯像液 循環功 揮循環 給之顯 的基板 平狀態 種程度 量的顯 接被水 -12- 200843868 由狹縫噴嘴60所噴射之顯像液會與以預定的液壓滯 留於基板w的顯像液衝突。於是’能量施壓至滯留於基 板W的顯像液而產生流動，與所噴射的顯像液一同被推 出至基板w的外部。在此’由於在基板w僅是噴射顯像 液並使其產生衝突’故’基板w的表面w S可維持經常濕 潤的狀態，而成爲在表面ws形成液體膜之狀態。由於顯 像液爲液體，故，表面W S藉由液體的密接力’常時維持 濕潤性，不會有表面w s乾燥之情事產生。又’由於越提 高噴射壓，則越可除去大量滯留於基板W的顯像液’故 ，能夠將液體膜的厚度做薄，可更進一步抑制顯像液的帶 出。又，由狹縫噴嘴60所噴射的顯像液與從噴淋裝置50 所供給的顯像液是使用相同的顯像液。 液體承接部70爲用來承接從噴淋裝置50供給至基板 W而溢出的顯像液或受到由狹縫噴嘴60所噴射的顯像液 ，從基板W除去的顯像液之承接部。因此，液體承接部 7 0配置於顯像室3 0的下部。液體承接部7 〇呈硏鉢狀，液 體回收用配管7 1連結於硏鉢的頂點。在圖2中，爲了謀 求液體承接部70之緊緻化，配置於2部位，但，液體承 接部70亦可爲1個。連結於2個液體承接部7〇的頂點之 2條液體回收用配管71在途中會合而成爲1個液體回收用 配管7 1，連結至液體回收機構8 〇。 液體回收機構80爲謀求使用完畢之顯像液的再利用 的機構。液體回收機構8 0配置於顯像室3 〇的下部，作爲 用來儲存由液體回收用配管7 1所輸送的顯像液之儲存槽 -13- 200843868 來發揮功能。又，在液體回收機構8 0，連結有噴淋裝置用 循環配管· 8 1與狹縫噴嘴用循環配管8 2的兩個配管。噴淋 裝置用循環配管8 1是經由泵浦Ρ 1連結於噴淋裝置5 0。 因此，當使泵浦Ρ 1的泵浦壓力作用時’儲存於液體回收 機構8 0的顯像液被送至噴淋裝置5 0 ’能作爲再次供給至 基板W的顯像液被再利用。 另外，狹縫噴嘴用循環配管8 2經由泵浦Ρ 2連結於狹 縫噴嘴60。因此，當使泵浦Ρ2的泵浦壓力作用時’儲存 於液體回收機構80的顯像液被送至狹縫噴嘴60 ’能作爲 再次用來除去滯留於基板W的顯像液之顯像液被再利用 〇 在此，基本上，由於基板W在未被不純物附著的狀 態下搬入至顯像室3 0，故，即使使顯像液循環，也不會有 顯像液的純度降低之情事產生。但，由於基板W無法完 全未附著有不純物，故，亦可考量附著有不純物，在液體 回收機構80設置過濾器，使通過此過濾器的顯像液循環 於噴淋裝置5 0或狹縫噴嘴6 0。 如以上所述的方式，排除在基板W成爲液體之顯像 液’表面WS成爲液體膜的狀態之基板w由搬出口 42被 搬出，移行至下一個製程的水置換製程D-2。由於被移行 至水置換製程D-2的基板W除去了液滴，故，可謀求抑 制顯像液的帶出。又，由於不需要使用液體除去滾子，而 可除去液滴’故，也不需要進行維修作業，不需要進行噴 吹空氣’即可除去液滴，因此，基板表面可經常保持濕潤 -14- 200843868 的狀態，不會產生斑紋（不均）。 【圖式簡單說明】 圖1是用來說明各處理的流程之說明圖。 圖2是顯像裝置的說明圖。 【主要元件符號說明】 20 :顯像裝置 3 0 :顯像室 40 :搬送滾子 5 0 :噴淋裝置 60 :狹縫噴嘴 70 :液體承接部 8 0 :液體回收機構 W :基板 -15-BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid handling apparatus for carrying out a process of suppressing supply to a surface of a substrate. [Prior Art] When manufacturing a liquid crystal display TFT (Thin Film Transistor) substrate, the glass substrate is subjected to a treatment such as a resist coating, exposure, development, etching, and sensitizer removal. Each of the reasons is composed of a plurality of processes, for example, one process consists of a process of supplying a processing liquid to a substrate, a process of cleaning the substrate, and a process of drying the substrate. Each of the processes is carried out by a dedicated device, and each of the substrates is sequentially processed by a transfer means for transporting the substrates. Further, the substrate conveyed by the transport means is transported while being horizontally held, and the substrates placed on the transport means in a horizontal state are sequentially passed through the respective devices, whereby the substrates can be subjected to various processes successively. Here, the substrate of the apparatus for supplying the processing liquid is secondarily carried into the apparatus for cleaning the substrate, and at this time, the processing liquid is also taken out together with the substrate cleaning apparatus. As means for supplying the processing liquid to the substrate in the horizontal state, a method in which a shower device for flowing the processing liquid is disposed on the upper portion of the conveying means and the processing liquid is continuously supplied to the substrate is applied. The treatment liquid that has flowed out of the shower device remains as droplets on the surface of the substrate, and the liquid droplet-shaped treatment liquid is carried out by the next cleaning device. Since the cleaning liquid is used in the cleaning device, when the cleaning liquid is mixed into the processing liquid to be taken out, the cleaning liquid cannot be reused in -4-200843868, and the processing liquid needs to be discarded. Therefore, when a large amount of the treatment liquid is taken out by the cleaning device, the treatment liquid is largely consumed and wasted, resulting in a problem that the utilization efficiency of the treatment liquid is deteriorated. For this reason, Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the liquid removing device of the Japanese Patent Publication No. 8-294678, a liquid removing roller is provided at a position separated by a small distance from the substrate conveyed by the conveying means, and the movement of the processing liquid adhering to the surface of the substrate is blocked and stopped. . [Problem to be Solved by the Invention] In the liquid removing device of Japanese Laid-Open Patent Publication No. Hei 8-2 9467-8, since the liquid removing roller contacts the processing liquid, the pushing force acts on the processing liquid, so that the treatment is performed. The liquid will adhere to the liquid to remove the rollers. Therefore, it is necessary to clean the attached treatment liquid regularly, which causes a problem of complicated maintenance work. Further, a method of blowing air on the surface of the substrate by means of an air knife or the like which dries the substrate, and blowing the treatment liquid by air pressure has also been proposed. Since the air knife is used, the treatment liquid is blown by the gas, so maintenance work is not required. However, when the treatment liquid is blown by the air knife, it is difficult to uniformly apply the air pressure of the air knife to the surface of the substrate, and the surface of the substrate is partially dried, and unevenness in drying occurs in the portion where the treatment liquid adheres and does not adhere. Therefore, various problems of image unevenness occur in the article as the final liquid crystal display. -5- 200843868 Therefore, the object of the present invention is to suppress the amount of the treatment liquid to be carried out without using a liquid to remove the roller or the air. [Means for Solving the Problems] In order to solve the above problems, the liquid processing apparatus according to the first aspect of the present invention is a liquid processing apparatus that supplies a processing liquid to a surface of a substrate to perform surface treatment, and has a conveying means. In the liquid processing apparatus, the substrate is conveyed in a horizontal direction; the liquid supply means supplies the processing liquid to the entire substrate conveyed by the conveying means, and the liquid ejecting means is disposed in the liquid Between the supply means and the transfer port of the liquid processing apparatus, the processing liquid is ejected from the obliquely upward direction in the opposite direction to the transport direction of the substrate, thereby removing the droplets collected on the surface of the substrate. According to the liquid processing apparatus of the first aspect of the invention, the liquid to be treated on the surface of the substrate by the liquid supply means is subjected to the hydraulic pressure of the treatment liquid sprayed by the liquid ejecting means, and is removed by the surface of the substrate to be removed. It is possible to suppress the treatment liquid from being taken out. The introduction of the treatment liquid retained on the surface of the substrate does not require the use of a liquid to remove the roller or the air, but the treatment liquid of the same liquid is used, so that maintenance work is not required. Further, when the treatment liquid (non-air) is used and the treatment liquid is removed, the surface of the substrate is in a state of forming a liquid film in a comprehensive manner, and the surface of the substrate does not need to be dried, and the wet state can be maintained at all times. Therefore, the surface of the substrate is not dried, the unattached portion of the treatment liquid disappears, and there is no problem of streaks (unevenness). Further, since the transport direction of the substrate and the ejecting direction of the processing liquid are opposite to each other in the direction of -6 - 200843868, the energy of the transport speed of the substrate is added to the ejection pressure of the processing liquid. Therefore, a stronger treatment liquid flow can be applied to the treatment liquid which is in the form of droplets. Therefore, the droplets on the surface of the substrate can be removed more efficiently. Here, the opposite direction is not limited to the opposite direction of the angle of 180 degrees, and may be the opposite direction to the direction of the conveyance. When the conveying direction of the substrate is inclined to the direction in which the processing liquid is ejected, the hydraulic pressure acting on the processing liquid is somewhat lower than in the case of the opposite of 180 degrees. However, when the processing liquid is ejected in the opposite direction to the conveying direction, the collected processing liquid can be pushed out from both sides of the substrate, so that the droplets on the surface of the substrate can be effectively removed. In addition, when the liquid to be treated is caused to flow by the hydraulic pressure of the liquid to be sprayed, the surface of the substrate is in a state in which a liquid film is formed. However, the thickness of the liquid film is as thin as possible from the viewpoint of suppressing the amount of the liquid to be discharged. It is better. When the hydraulic pressure of the sprayed processing liquid is increased, a strong pushing force can be applied, and the liquid film on the surface of the substrate after the retained processing liquid can be removed can be made thin. Therefore, it is preferable that the ejection pressure of the treatment liquid is as high as possible. Moreover, as a liquid supply means, from the viewpoint of performing surface treatment by supplying a treatment liquid to the entire surface of the substrate, for example, a shower device can be disposed in a plurality of places on the upper portion of the liquid processing apparatus. This shower device supplies a processing liquid to the surface of the substrate at all times. According to a second aspect of the invention, in the liquid processing apparatus of the first aspect of the invention, the liquid ejecting apparatus ejects the ejection opening of the processing liquid into a slit shape, whereby the slit is positive in the direction in which the substrate is conveyed. The liquid ejecting means described above is disposed in such a manner as to intersect. Since the injection port is formed into a slit shape, the injection of the 200843868 treatment liquid can be blocked, so that the high injection pressure can be applied to the treatment liquid remaining on the surface of the substrate. When the processing liquid is ejected in a direction opposite to the substrate transport direction of 180 degrees, the slits are arranged to be orthogonal to the transport direction of the substrate, and as described above, the processing liquid is ejected in the opposite direction of the tilt, and the slit is formed. It is arranged in a state in which the conveyance direction of the substrate is inclined. Furthermore, the slit is basically suitable for forming a linear gap. However, it may be non-linear, and a slit formed in a curved shape may be used. For example, the slit on the parabola which is a curved slit is arranged such that the apex of the parabola is directed to the most upstream side in the transport direction of the substrate, and the processing liquid can be pushed out from the three sides of the substrate. Further, it may be a parabola, and a curved slit such as a circle or an ellipse may be applied. The liquid processing apparatus according to the invention of claim 1 or 2, wherein the liquid supply means and the liquid ejecting means are disposed on an upper portion of the liquid processing apparatus, and is provided in a lower portion of the liquid processing apparatus. The treatment liquid recovery means for recovering the treatment liquid, and the treatment liquid recovered by the treatment liquid recovery means is circulated to the liquid supply means and the liquid ejecting means to reuse the treatment liquid. The liquid supply means disposed in the upper portion of the liquid processing apparatus is in a state in which a large amount of the processing liquid is constantly supplied to the substrate, and almost all of the processing liquid flows toward the lower portion of the liquid processing apparatus except for the processing liquid used for one of the surface treatments. By returning such a treatment liquid to the liquid supply means and the liquid ejecting means again, the treatment liquid is circulated, and the treatment liquid can be reused. Thereby, the waste of the treatment liquid can be eliminated, and the treatment -8-200843868 can be used efficiently. In order to circulate the treatment liquid, a treatment liquid recovery means is provided in the lower portion of the apparatus, and the recovered treatment liquid is returned to the liquid supply means and the liquid injection means. As means for circulating the treatment liquid, for example, pumping can be applied. The treatment liquid is suitably used for any development liquid for developing a development liquid for a photosensitive agent to be exposed, an etching liquid for performing an etching treatment, or a photosensitive liquid stripping liquid for removing a photosensitive agent. That is, the liquid processing apparatus of the present invention is applied to any of a developing device, an etching device, or a sensitizer peeling device. Further, in the method for producing a liquid crystal display according to the invention of the fourth aspect of the invention, the liquid crystal display is manufactured by using the liquid processing apparatus according to the first aspect of the invention, and processing the surface of the substrate. Since the liquid processing apparatus can be applied to a developing device, an etching device, a sensitizer peeling device, etc., it is possible to manufacture a liquid crystal display device using a substrate which has been subjected to liquid treatment by these respective devices. [Effect of the Invention] In the present invention, the treatment liquid sprayed on the substrate is discharged, and the retained treatment liquid is pushed out to the outside of the substrate. Therefore, the discharge of the treatment liquid can be suppressed. Further, since the remaining treatment liquid is pushed out to the outside of the substrate by the same treatment liquid as the liquid, it is not necessary to perform maintenance work due to contamination by the treatment liquid, and the substrate can be maintained in a wet state at all times. Therefore, the generation of streaks can be prevented. [Embodiment] -9- 200843868 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a view showing an example of development processing D in the manufacturing process of a liquid crystal display. In FIG. 1, the 'development processing D is composed of four processes of a development process, a water replacement process, a cleaning process, and a drying process, and the display process D-1 is performed by the developing device 20 of FIG. The water replacement process D-2 is performed by a water replacement device (not shown), the cleaning process D-3 is performed by a cleaning device (not shown), and the drying process D-4 is performed by a not-shown device. The drying apparatus performs the exposure process L as shown in Fig. 1 in the front stage of the development process. In the exposure process L, the sensitizer applied to the substrate is subjected to a predetermined pattern latent image. The substrate after the end of the exposure process L is used to develop a pattern of the latent image in the development process D. Then, the substrate after the completion of the development process D is moved to the etching process E, and etching is performed in accordance with the pattern after the development. The display process D-1 is a process for supplying a developing solution as a processing liquid to a substrate, and developing a latent image on a pattern of a photosensitive agent. Water Displacement Process D-2 is a process for washing a substrate on which a developing solution is washed. The drying process D-4 is a process for drying the washed substrate to remove the adhered moisture. Fig. 2 shows a developing device 20 that performs a display process D-1. The developing device 20 has a developing chamber 30 and a liquid recovery mechanism 8A. The developing chamber 30 is provided with a transporting substrate W as a transporting means, a transporting roller 40 as a transporting means, a showering device 50 disposed as an upper portion of the transporting roller 40 as a liquid supply means, and a liquid ejecting means for ejecting the developing liquid. The slit nozzle 60; and the liquid receiving portion 70 disposed at the lower portion of the developing chamber 30. -10- 200843868 In Fig. 2, two liquid receiving portions 70 are provided, and liquid collecting pipes 7 1 are connected to the two liquid receiving portions 70. The two liquid collecting pipes 7 1 are joined in the middle. It is connected to the liquid recovery mechanism 80. In the liquid recovery mechanism 80, the circulation pipe 8 1 for the shower device and the circulation pipe 82 for the slit nozzle are connected, the circulation pipe 8 1 for the shower device is connected to the shower device 50, and the circulation pipe 82 for the slit nozzle is connected to Slit nozzle 60. Further, in the middle of the circulation pipe 8 1 for the shower device and the circulation pipe 82 for the slit nozzle, pumps P1 and P2 are provided, respectively. The developing chamber 30 is a chamber for developing a developing liquid for the substrate W. The substrate W is conveyed in the horizontal direction inside the developing chamber 30, and the developing process as a surface treatment is performed on the surface W S . Therefore, the transport roller 40 provided inside the developing chamber 30 transports the substrate W in the horizontal direction. The substrate W is subjected to exposure processing L by an exposure device (not shown) before being carried into the developing chamber 30. The transport roller 40 is continuously provided by an exposure device (not shown), and the substrate having the photosensitive agent that has received a predetermined pattern in the exposure device is carried into the developing chamber 30 by the transport roller 40 in this state. Therefore, in the developing chamber 30, the inlet 41 for the inlet of the substrate W is provided, and the substrate W of the display process D-1 is applied to the development chamber 30, and the water replacement process D- of the next process is performed. 2 was moved out. Therefore, the developing chamber 30 is provided as an outlet 42 for carrying out the outlet of the substrate W. Therefore, the transport roller 40 is disposed in a range from the carry-in port 41 to the carry-out port 42, and the substrate W is sequentially transferred. The shower device 50 is a liquid supply means for supplying a developing liquid for developing a latent image on a predetermined pattern of the substrate W to the substrate W. In the middle, the imaging liquid flows out from a plurality of shower devices. When the developing liquid is applied to the surface w s of the board, the developed pattern is developed. Specifically, when the liquid is supplied to the substrate surface WS, it is removed by reaction with the developing solution in accordance with the exposed pattern, and development is performed. Thereby, the circuit pattern of the pattern exposed by exposure L, for example, TF T is developed. Since the developer liquid is supplied to the substrate surface WS in a comprehensive manner, the developer liquid is always supplied to the substrate W by the shower g. The slit nozzle 60 is directed toward the substrate W, and the developing liquid ejecting means is ejected obliquely upward. In the slit nozzle 60, the developing liquid is supplied from the slit nozzle 82, and the liquid is pumped by the pumping pressure of the pump P2. The slit nozzle 60 has a gap formed in the ejection opening, and ejects the developing liquid that has been blocked. Therefore, the developing liquid is ejected with a high hydraulic pressure W. Further, the pump P2 has the function of the number of development liquids in addition to the function of the injection pressure applied to the injection, but the pumping and the pumping function of the injection pressure can be independently set independently. As shown in Fig. 2, a sufficient amount of the developing liquid is supplied by the transporting roller 40 by the image feeding liquid from the plurality of shower devices 50. At this time, since the substrate W is maintained in the water ‘order by the transport roller 40, the substrate W has a certain size and is subjected to surface tension. Therefore, on the surface WS, the image liquid becomes a droplet and stays. In order to prevent the retained developer liquid displacement process D-2 from being carried out, a slit nozzle 60 is provided. In Figure 2, the photo-sensing agent is applied to the photo-sensitizing agent. It is necessary to set the 50-liquid ring pipe to spray the display port to the substrate to display the liquid circulation cycle. The developing liquid sprayed by the slit nozzle 60 by the water -12-200843868 collides with the developing liquid which is retained on the substrate w by a predetermined hydraulic pressure. Then, the energy is applied to the developing liquid retained on the substrate W to cause a flow, and is pushed out to the outside of the substrate w together with the ejected developing liquid. Here, the surface w S of the substrate w is maintained in a state of being constantly wetted by the ejection of the developing liquid on the substrate w, and the liquid film is formed on the surface ws. Since the developing liquid is a liquid, the surface W S constantly maintains wettability by the close contact force of the liquid, and the surface w s does not dry. Further, the higher the ejection pressure, the more the developer liquid remaining on the substrate W can be removed, so that the thickness of the liquid film can be made thinner, and the discharge of the developing liquid can be further suppressed. Further, the same liquid is used for the developing liquid sprayed from the slit nozzle 60 and the developing liquid supplied from the shower device 50. The liquid receiving portion 70 is a receiving portion for receiving a developing liquid that is supplied from the shower device 50 to the substrate W and overflows, or a developing liquid that is ejected from the substrate W by the developing liquid that is ejected from the slit nozzle 60. Therefore, the liquid receiving portion 70 is disposed at a lower portion of the developing chamber 30. The liquid receiving portion 7 is formed in a meandering shape, and the liquid collecting pipe 7 1 is connected to the apex of the crucible. In Fig. 2, in order to achieve the tightening of the liquid receiving portion 70, the liquid receiving portion 70 is disposed at two locations, but the liquid receiving portion 70 may be one. The two liquid recovery pipes 71 connected to the apex of the two liquid receiving portions 7 are joined in the middle to form one liquid recovery pipe 171, and are connected to the liquid recovery mechanism 8A. The liquid recovery mechanism 80 is a mechanism for reusing the used developing solution. The liquid recovery mechanism 80 is disposed in the lower portion of the developing chamber 3, and functions as a storage tank -13-200843868 for storing the developing liquid conveyed by the liquid recovery pipe 71. Further, in the liquid recovery mechanism 80, two pipes of the shower device circulation pipe 81 and the slit nozzle circulation pipe 8 2 are connected. The circulation pipe 8 1 for the shower device is connected to the shower device 50 via the pump port 1 . Therefore, when the pumping pressure of the pump Ρ 1 is applied, the developing liquid stored in the liquid recovery mechanism 80 is sent to the shower device 50', and the developing liquid supplied to the substrate W again can be reused. Further, the slit nozzle circulation pipe 8 2 is coupled to the slit nozzle 60 via the pump port 2 . Therefore, when the pumping pressure of the pump Ρ2 is applied, the 'the developing liquid stored in the liquid recovery mechanism 80 is sent to the slit nozzle 60' can be used as a developing liquid for re-using the developing liquid retained on the substrate W. In this case, basically, since the substrate W is carried into the developing chamber 30 without being attached to the impurity, even if the developing liquid is circulated, the purity of the developing liquid is not lowered. produce. However, since the substrate W cannot be completely free of impurities, it is also possible to measure the adhesion of impurities, and a filter is provided in the liquid recovery mechanism 80 to circulate the developing liquid passing through the filter to the shower device 50 or the slit nozzle. 6 0. In the above-described manner, the substrate w in which the surface WS of the liquid crystal image forming liquid WS becomes the liquid film is removed from the transfer port 42 and is transferred to the water replacement process D-2 of the next process. Since the substrate W which has been transferred to the water replacement process D-2 has been removed from the liquid droplets, it is possible to suppress the carry-out of the developing liquid. Moreover, since it is not necessary to use a liquid to remove the roller, the droplet can be removed, so that it is not necessary to perform maintenance work, and the droplet can be removed without blowing the air, so that the surface of the substrate can be kept moist. The state of 200843868 does not produce streaks (unevenness). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory diagram for explaining the flow of each process. Fig. 2 is an explanatory view of a developing device. [Description of main component symbols] 20 : Developing device 3 0 : Developing room 40 : Transporting roller 5 0 : Spraying device 60 : Slit nozzle 70 : Liquid receiving part 8 0 : Liquid recovery mechanism W : Substrate -15-