200843602 • 九、發明說明： .【發明所屬之技術領域】 本發明係關於一種軟性電路板。 【先前技術】 電子行業中，軟性電路板（Flexible Printed Circuit，FPC) 廣泛應用於各類電子產品中，起安裝支撐和電氣連接電子 元件之作用，係電子產品中不可缺少之重要元件。 請一併參閱圖1、圖2及圖3，圖1係一種先前技術所 _揭露之軟性電路板之結構示意圖，圖2係該軟性電路板100 之正面佈線示意圖，圖3係該軟性電路板100之背面佈線 示意圖。該軟性印刷電路板100包括一軟性基板110、一 佈線層120、——保護層130及一引腳層140。該佈線層120 設置於該軟性基板110之一表面。該保護層130覆蓋該佈 線層120，用於隔離該佈線層120之金屬導線且防止其被 氧化。該引腳層140設置於該軟性基板110之另一表面之 端部。 ⑩ 請一併參閱圖4，係圖1所示軟性電路板100沿IV -IV 方向之側視圖。該佈線層120包括複數相互間隔設置之金 屬導線121。每一金屬導線121之二端分別延伸至該軟性 基板110之邊緣，該二端裸露且鍍有一層錫或者錫金合 金，分別形成一第一金手指122及一第二金手指123。該 引腳層140包括複數相互間隔設置之第三金手指124。該 第三金手指124與該第一金手指122相對設置。 每一第一金手指122所在之區域設有一焊接孔125， 6 200843602 125貫穿相對設置之二金手指m、m及夾於其 ⑽基板UG°該焊接孔125之内壁鍍有一金屬層， - 目對之金手指122、124。該第-金手指122 接。=Γ拉方式與外部之第一電路板（圖未示）電連 頭接觸二三指:22與該第-電路板接觸’焊 ^ 曰124 ’熱量熔化該二金手指122、124 通㈣焊接孔125流動，從而使焊 疋且不易溢錫。 人& t第一至手私123 —般藉由異方性導電膜（圖未示）壓 &而料敎帛二電路板（目以）電連接。 p、.％來自該第—電路板之電訊號僅經由該佈線層12 0之金 ^，線傳輸至㈣二電路板。惟，在手拉焊接過程及後繼 程中’由於彎折力之作用，該第—金手指122與該 一蜀¥線121之連接處容易斷裂，導致該軟性電路板工〇〇 热法傳輸訊號，故該軟性電路板⑽之可靠度較低。 【發明内容】 ★有鑑於此，提供-種可靠度較高之軟性電路板實為必 而0 -種軟性電路板，其包括一軟性基板、複數第一金屬 K，複數第二金屬導線。該軟性基板包括相對之第一表 面及，二表面。該第一金屬導線平行間隔設置於該軟性基 板之第表面，該第二金屬導線平行間隔設置於該軟性基 板之第二表面。該第二金料線與該.第—金料線關於該 軟性基板對稱設置。該第一金屬導線之二端分別延伸至該 7 200843602 軟性基板之二端 _ ~ _I濁逢 伸至該軟性基板之中部並藉由軟性基板之-端延 金屬導線電連接。該第二金屬導線構與該對稱之第一 端藉由-焊接孔與對應之第—全屬性基板之一 至屬導線電連接。 相較於先前技術，本發明之軟性電路板之-金屬導線 之一端與其金屬導線之連接處斷0士 、> 饮处辦衣日守，相對設置之 屬導線之一端與該金屬導線仍可伴拉+i i、、. 侏待電連接，使該區域保 持汛號導通功能。故，該軟性電路板之可靠度較高。 【實施方式】 ΧΓ7 請-併蒼閱圖5、圖6及圖7’圖5係本發明軟性電路 板第-實施方式之結構示意圖’圖6係該軟性電路板勘 之正面佈線示意圖，圖7係該軟性電路板2〇〇之背面佈線 示意圖。該軟性印刷電路板200包括一軟性基板21〇、一 第一佈線層220、一第一保護層23〇、一第二佈線層24〇 及一第二保護層250。 該第一佈線層220及該第二佈線層24〇分別設置於該 _軟性基板210之上表面及下表面。該第一保護層23〇、該 苐一保護層250分別覆蓋該第一佈線層220及該第二佈線 層240，用於隔離該二佈線層220、240之金屬導線且防止 其被氧化。 該第一佈線層220包括複數平行間隔設置之第一金屬 導線221，每一第一金屬導線221之二端延伸至該軟性基 板210之邊緣，該二端裸露並鍍有一層錫或者錫金合金， 分別形成一第一金手指222及一第二金手指223。 8 200843602 - 該第二佈線層240包括複數平行間隔設置之第二金屬 . 導線241，該第二金屬導線241與該第一金屬導線221關 於該軟性基板210對稱設置。該第二金屬導線241由該軟 性基板210之一端向中間部份延伸。該第二金屬導線241 之靠近該軟性基板210之一端裸露並鍍有一層錫或者錫金 合金，形成第三金手指242。該第二金屬導線241之延伸 端設有一導通孔226。 該導通孔226貫穿該軟性基板210及該二相對之二金 春屬導線221、241，且其内壁鍍有一金屬層，使得對稱之該 二金屬導線221、241保持電連接。該複數導通孔226排列 呈一直線狀。該複數導通孔226排列所形成之直線區域貼 覆一層帶狀膠帶280,用於防止該區域之金屬導線221、241 由於彎折力作用而斷裂。 請一併參閱圖8，係該軟性電路板200沿Μ 方向之 側視圖。每一第一金手指222所在之區域設有一焊接孔 225，該焊接孔225貫穿對稱設置之二金手指222、242及 _夾於其間之該軟性基板210。該焊接孔225之内壁鍍有一 金屬層，用於電連接該二對稱之金手指222、242。該第一 金手指222 —般藉由手拉焊方式與外部之第一電路板（圖 未示）電連接。該第二金手指223 —般藉由異方性導電膜 (圖未示）與外部之第二電路板（圖未示）電連接。 該第一金手指222接收來自該第一電路板之訊號，該 訊號藉由該第一金屬導線221傳輸至第二金手指223，再 藉由該異方性導電膜傳輸至該第二電路板，進而使該軟性 9 200843602 電路板200實現訊號傳輸之功能。 外部訊號亦可藉由該焊接孔225内壁之金屬層傳輪至 該第三金手指242，再藉由該第二金屬導線241及該^通 孔226内壁之金屬層傳輸至該第一金屬導線221，最終= 由該第一金屬導線221傳輸至該第二金手指223，再藉= 該異方性導電膜傳輸至該第二電路板，進而使該軟性^路 板200實現訊號傳輸之功能。 邊軟性基板210之材料可為聚酯、聚亞酰胺（ρι)或者 其衍生物。該第一金屬導線221、該第二金屬導線241、該 導通孔226内壁金屬層及該焊接孔225内壁金屬層之材料 可為銅箱或者鋁落。該第一保護層23〇及該第二保^層2刈 之材料可為聚酯、聚亞酰胺或者其衍生物。該膠帶2⑽之 材料可為丙稀酸樹脂或者環氧樹脂。’ 相較於先前技術，該軟性電路板2〇〇之第一金屬導線 221可實現訊號傳輸，若彎折力作用導致該第一金手指 與該第一金屬導線221之連接處斷裂，該第二金屬導線241 仍^可經由該焊接孔225及該導通孔226完成訊號之傳遞 功能。故，該軟性電路板2〇〇之可靠度較高。 ，一併參閱圖9、圖10及圖n，圖9係本發明軟性電 路板第二實施方式之結構示意圖，圖1〇係該軟性電路板 300之正面佈線示意圖，圖u係該軟性電路板之背面 佈線示意圖。 邊軟性電路板300與第一實施方式之軟性電路板2〇〇 之主要區別在於：第二佈線層34〇進一步包括複數相互間 200843602 ， 隔設置之第三金屬導線345，該第三金屬導線345與該第 . 二金屬導線341關於該軟性電路板300之垂直於第一金屬 導線321之中軸線對稱設置。該第三金屬導線345之延伸 部份亦各設置一導通孔326，該導通孔326内壁鍍有一金 屬層，電連接該對稱之二金屬導線321、345。該複數導通 孔326呈直線狀排列。該二直線區域各貼覆一膠帶380。 該第三金屬導線345之靠近軟性基板310之一端亦分別形 成第四金手指346。每一第四金手指346亦具有一焊接孔 _ 325。 該軟性電路板300之二端一般均藉由手拉焊接與外部 元件電連接。手拉焊接時或組裝時，若一端之某一金手指 與其金屬導線之連接處斷裂，與其相對設置之另一金手指 與其金屬導線仍可保持電連接，使該區域保持訊號導通功 能。該軟性電路板300之另一端之金手指區域亦然。故， 該軟性電路板300之可靠度亦較高。 請參閱圖12,係本發明軟性電路板之第三實施方式之 ⑩正面示意圖。該軟性電路板400與第一實施方式之軟性電 路板200之主要區別在於：其導通孔426呈鋸齒狀排列， 且該區域無點覆膠帶。 本發明之軟性電路板不限於上述實施方式所述，其亦 具有其它變更設計：如該導通孔可由其它導通結構替代， 如電連接二相對之金屬導線且貫通軟性基板之導線。 綜上所述，本發明確已符合發明之要件，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式， 11 200843602 柄明之範圍並不以上述實施方式為限 蟄之人士援依本發明之精 +凡热習本來 涵蓋於以下申請專利範圍内。乍之寺效修飾或變化，皆應 【圖式簡單說明】 ^係-種先前技術所揭露之軟性 圖2係圖1所示軟性電 之…構不忌Ώ 扳之正面佈線示意圖。 ;3係圖1所示軟性電路板之背面佈線示意圖。 圖4係圖i所示軟性電路板沿m 側 電路板之第-實施方式之二意圖。 係圖5所7F軟性電路板之正面佈線示意圖。 圖7係圖5所示軟性電路板之背面佈線示意圖。 圖δ係圖5所示軟性電路板沿m-Vffl方向之側視圖。 圖9係本發明軟性電路板第：實施方式之結構示意圖。 圖10係圖.9所示軟性電路板之正面佈線示意圖。 圖11係圖9所示軟性電路板之正面佈線示意圖。 圖12係本發明軟性電路板之第三實施方式之正面示意圖。 【主要元件符號說明】 第一保護層 第二佈線層 第二金屬導線 第三金手指 第三金屬導線 第四金手指 第二保護層 230 340 341 242 345 346 250 軟性基板 第一佈線層 第一金屬導線 第一金手指 弟一金手指 焊接孔 軟性電路板 200、300、400 240 241 210 、 310 220 221 、 321 222 223 225 、 325 12 200843602 380 - 導通孔 226、326、426 膠帶 280200843602 • Nine, invention description: . [Technical field to which the invention pertains] The present invention relates to a flexible circuit board. [Prior Art] In the electronics industry, Flexible Printed Circuit (FPC) is widely used in various electronic products. It functions as an installation support and electrical connection electronic components, and is an indispensable important component in electronic products. Referring to FIG. 1 , FIG. 2 and FIG. 3 , FIG. 1 is a schematic structural diagram of a flexible circuit board disclosed in the prior art, FIG. 2 is a schematic diagram of front wiring of the flexible circuit board 100, and FIG. 3 is a flexible circuit board. Schematic diagram of the back side wiring of 100. The flexible printed circuit board 100 includes a flexible substrate 110, a wiring layer 120, a protective layer 130, and a pin layer 140. The wiring layer 120 is disposed on one surface of the flexible substrate 110. The protective layer 130 covers the wiring layer 120 for isolating the metal wires of the wiring layer 120 and preventing them from being oxidized. The pin layer 140 is disposed at an end of the other surface of the flexible substrate 110. 10 Referring to FIG. 4 together, a side view of the flexible circuit board 100 shown in FIG. 1 along the IV-IV direction is shown. The wiring layer 120 includes a plurality of metal wires 121 spaced apart from each other. The two ends of each of the metal wires 121 extend to the edge of the flexible substrate 110, and the two ends are exposed and plated with a tin or tin-gold alloy to form a first gold finger 122 and a second gold finger 123, respectively. The pin layer 140 includes a plurality of third gold fingers 124 spaced apart from each other. The third gold finger 124 is disposed opposite to the first gold finger 122. Each of the first gold fingers 122 is provided with a soldering hole 125, 6 200843602 125 penetrating through the oppositely disposed gold fingers m, m and sandwiching the (10) substrate UG. The inner wall of the soldering hole 125 is plated with a metal layer, - Pair of gold fingers 122, 124. The first gold finger 122 is connected. = Γ pull mode and the external first circuit board (not shown) electrical contact head two or three fingers: 22 contact with the first circuit board 'welding ^ 曰 124 'heat melting the two gold fingers 122, 124 pass (four) welding The holes 125 flow, so that the solder is not soldered. The person & t first to the private 123 is generally electrically connected by an anisotropic conductive film (not shown) and the second circuit board (for the purpose). p, .% of the electrical signals from the first circuit board are transmitted to the (four) two circuit boards only via the gold of the wiring layer 120. However, in the hand-welding process and the subsequent process, the connection between the first gold finger 122 and the one-touch wire 121 is easily broken due to the bending force, resulting in the flexible circuit board heat transfer signal. Therefore, the reliability of the flexible circuit board (10) is low. SUMMARY OF THE INVENTION ★ In view of the above, it is a must-have for a flexible circuit board having a high reliability, which comprises a flexible substrate, a plurality of first metals K, and a plurality of second metal wires. The flexible substrate includes a first surface and a second surface opposite to each other. The first metal wires are disposed in parallel on the first surface of the flexible substrate, and the second metal wires are spaced apart from each other on the second surface of the flexible substrate. The second gold wire is symmetrically disposed with the first gold wire about the flexible substrate. The two ends of the first metal wire respectively extend to the two ends of the flexible substrate of the 7 200843602 _ _ _I diverge to the middle of the flexible substrate and are electrically connected by the end-to-end metal wires of the flexible substrate. The second metal wire structure and the first end of the symmetry are electrically connected to the genus wire by one of the corresponding first full attribute substrate by the soldering hole. Compared with the prior art, the connection between one end of the metal wire and the metal wire of the flexible circuit board of the present invention is broken, and the drinking device is kept on the side of the wire, and the opposite end of the wire and the metal wire are still available. With the pull +ii,,. Wait for the electrical connection, so that the area maintains the nickname conduction function. Therefore, the reliability of the flexible circuit board is high. [Embodiment] ΧΓ7 Please - and ascending FIG. 5, FIG. 6 and FIG. 7' FIG. 5 is a schematic structural view of the first embodiment of the flexible circuit board of the present invention. FIG. 6 is a schematic diagram of the front wiring of the flexible circuit board, FIG. It is a schematic diagram of the back wiring of the flexible circuit board. The flexible printed circuit board 200 includes a flexible substrate 21A, a first wiring layer 220, a first protective layer 23A, a second wiring layer 24A, and a second protective layer 250. The first wiring layer 220 and the second wiring layer 24 are respectively disposed on the upper surface and the lower surface of the flexible substrate 210. The first protective layer 23, the first protective layer 250 covers the first wiring layer 220 and the second wiring layer 240, respectively, for isolating the metal wires of the two wiring layers 220, 240 and preventing them from being oxidized. The first wiring layer 220 includes a plurality of first metal wires 221 arranged in parallel, and two ends of each of the first metal wires 221 extend to an edge of the flexible substrate 210, and the two ends are exposed and plated with a tin or tin-gold alloy. A first gold finger 222 and a second gold finger 223 are formed respectively. 8 200843602 - The second wiring layer 240 includes a plurality of second metal strips arranged in parallel. The wires 241 are symmetrically disposed with the first metal wires 221 about the flexible substrate 210. The second metal wire 241 extends from one end of the flexible substrate 210 toward the intermediate portion. The second metal wire 241 is exposed to one end of the flexible substrate 210 and is plated with a tin or tin-gold alloy to form a third gold finger 242. The extending end of the second metal wire 241 is provided with a through hole 226. The via hole 226 extends through the flexible substrate 210 and the two opposite spring wires 221 and 241, and the inner wall thereof is plated with a metal layer so that the symmetrical metal wires 221 and 241 remain electrically connected. The plurality of via holes 226 are arranged in a line shape. The linear region formed by the arrangement of the plurality of via holes 226 is attached with a strip of tape 280 for preventing the metal wires 221, 241 of the region from being broken due to the bending force. Please refer to FIG. 8 together, which is a side view of the flexible circuit board 200 in the Μ direction. Each of the first gold fingers 222 is provided with a soldering hole 225 extending through the symmetrically disposed two gold fingers 222, 242 and the flexible substrate 210 sandwiched therebetween. The inner wall of the soldering hole 225 is plated with a metal layer for electrically connecting the two symmetrical gold fingers 222, 242. The first gold finger 222 is electrically connected to an external first circuit board (not shown) by hand soldering. The second gold finger 223 is electrically connected to an external second circuit board (not shown) by an anisotropic conductive film (not shown). The first gold finger 222 receives the signal from the first circuit board, and the signal is transmitted to the second gold finger 223 by the first metal wire 221, and then transmitted to the second circuit board by the anisotropic conductive film. In turn, the soft 9 200843602 circuit board 200 realizes the function of signal transmission. The external signal can also be transmitted to the third gold finger 242 through the metal layer of the inner wall of the soldering hole 225, and then transmitted to the first metal wire through the metal layer of the second metal wire 241 and the inner wall of the through hole 226. 221, finally = transmitted from the first metal wire 221 to the second gold finger 223, and then transferred to the second circuit board by the anisotropic conductive film, thereby enabling the flexible circuit board 200 to realize the function of signal transmission . The material of the edge flexible substrate 210 may be polyester, polyimide (ρι) or a derivative thereof. The material of the first metal wire 221, the second metal wire 241, the metal layer of the inner wall of the via hole 226, and the metal layer of the inner wall of the soldering hole 225 may be a copper box or an aluminum drop. The material of the first protective layer 23 and the second layer 2 can be polyester, polyimide or a derivative thereof. The material of the tape 2 (10) may be acrylic resin or epoxy resin. Compared with the prior art, the first metal wire 221 of the flexible circuit board 2 can realize signal transmission, and if the bending force acts to break the connection between the first gold finger and the first metal wire 221, the first The two metal wires 241 can still complete the signal transmission function through the soldering holes 225 and the via holes 226. Therefore, the reliability of the flexible circuit board 2 is high. Referring to FIG. 9 , FIG. 10 and FIG. 9 , FIG. 9 is a schematic structural view of a second embodiment of the flexible circuit board of the present invention, FIG. 1 is a schematic diagram of the front wiring of the flexible circuit board 300, and FIG. 9 is the flexible circuit board. Schematic diagram of the back wiring. The main difference between the edge flexible circuit board 300 and the flexible circuit board 2 of the first embodiment is that the second wiring layer 34 further includes a plurality of mutually adjacent 200843602, and a third metal wire 345 disposed therebetween, the third metal wire 345 The second metal wire 341 is symmetrically disposed about an axis of the flexible circuit board 300 perpendicular to the first metal wire 321 . Each of the extension portions of the third metal wires 345 is also provided with a via hole 326. The inner wall of the via hole 326 is plated with a metal layer electrically connected to the symmetrical metal wires 321, 345. The plurality of via holes 326 are arranged in a straight line. The two straight regions are each covered with a tape 380. One end of the third metal wire 345 adjacent to the flexible substrate 310 also forms a fourth gold finger 346, respectively. Each of the fourth gold fingers 346 also has a weld hole _ 325. Both ends of the flexible circuit board 300 are generally electrically connected to external components by hand soldering. When the hand is welded or assembled, if the connection between one of the gold fingers at one end and the metal wire is broken, the other gold finger opposite to the metal finger and the metal wire can remain electrically connected, so that the area maintains the signal conduction function. The gold finger area at the other end of the flexible circuit board 300 is also the same. Therefore, the reliability of the flexible circuit board 300 is also high. Referring to Figure 12, there is shown a front elevational view of a third embodiment of a flexible circuit board of the present invention. The main difference between the flexible circuit board 400 and the flexible circuit board 200 of the first embodiment is that the through holes 426 are arranged in a zigzag manner, and the area is not covered with a tape. The flexible circuit board of the present invention is not limited to the above embodiments, and has other modified designs: the via holes may be replaced by other conductive structures, such as electrically connecting two opposite metal wires and passing through the flexible substrate. In summary, the present invention has indeed met the requirements of the invention, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the invention is not limited to those of the above embodiments, and the following is applicable to the following patents. . The modification or change of the temple of the temple should be [simplified description of the diagram] ^ The softness revealed by the prior art Fig. 2 is the schematic diagram of the front wiring of the soft electric circuit shown in Fig. 1. 3 is a schematic diagram of the back wiring of the flexible circuit board shown in FIG. Figure 4 is a schematic view of the second embodiment of the flexible circuit board shown in Figure i along the m-side circuit board. Figure 5 is a schematic diagram of the front wiring of the 7F flexible circuit board. Figure 7 is a schematic view showing the back wiring of the flexible circuit board shown in Figure 5. Figure δ is a side view of the flexible circuit board shown in Figure 5 along the m-Vff1 direction. 9 is a schematic structural view of a flexible circuit board of the present invention: an embodiment. Fig. 10 is a schematic view showing the front wiring of the flexible circuit board shown in Fig. 9. Figure 11 is a schematic view showing the front wiring of the flexible circuit board shown in Figure 9. Figure 12 is a front elevational view showing a third embodiment of the flexible circuit board of the present invention. [Description of main component symbols] First protective layer Second wiring layer Second metal wire Third gold finger Third metal wire Fourth gold finger Second protective layer 230 340 341 242 345 346 250 Flexible substrate First wiring layer First metal Wire first gold finger-one gold finger soldering hole flexible circuit board 200, 300, 400 240 241 210, 310 220 221, 321 222 223 225, 325 12 200843602 380 - via 226, 326, 426 tape 280
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