200843054 P060402SBZ1TW 22585twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源組，且特別是有關於一種散 熱效率較佳的光源組及具有此光源組的背光模組 (backlight module)與液晶顯示裝置(liquid crystal display)。 【先前技術】 隨著現代視訊技術的進步，液晶顯示器已被大量地使 用於手機（mobile phone)、筆記型電腦（noteb〇ok computer)、個人電腦(personal computer，PC)及個人數位助 理(personal digital assistant)等消費性電子產品的顯示螢幕 上。然而，由於液晶顯示器之液晶顯示面板 身並不具有發光的功能，因此需要於液晶顯示面板下方配 置背光模組以提供液晶顯示面板所需要之面光源，進而使 液晶顯示面板達到顯示的效果。目前，背光模組比較常見 的有冷陰極螢光燈管（c〇ld cathode fluorescence lamp， CCFL)月光模組以及發光二極體(Ught emitting diode，LED) 背光模纟且等。 立圖1A為一種習知發光二極體背光模組的局部剖面示 思圖，而圖1B為圖1A中所繪示之光源組的立體圖。請參 閱圖1A及圖1B，習知發光二極體背光模組100包括一光 源組 110、一 導光板(light guide plate) 12〇 及一燈罩丨3〇。 光源組110包括一電路板112及配置於電路板in上的多 個表面黏著型（surface mount device，SMD)發光二極體 200843054 P060402SBZ1TW 22585twf.doc/n 114,其中表面黏著型發光二極體114是配置於導光板12〇 的入光面122旁。導光板120之鄰近入光面122的部分以 及光源組110配置於燈罩130中。200843054 P060402SBZ1TW 22585twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a light source group, and particularly to a light source group with better heat dissipation efficiency and a backlight module having the same (backlight module) and liquid crystal display (liquid crystal display). [Prior Art] With the advancement of modern video technology, liquid crystal displays have been widely used in mobile phones, notebook computers (noteb〇ok computers), personal computers (PCs), and personal digital assistants (personal computers). Digital assistant) and other consumer electronic products on the display screen. However, since the liquid crystal display panel of the liquid crystal display does not have the function of emitting light, it is necessary to configure a backlight module under the liquid crystal display panel to provide a surface light source required for the liquid crystal display panel, thereby enabling the liquid crystal display panel to achieve the display effect. At present, the backlight module is more commonly used with a cold cathode fluorescent lamp (CCFL) moonlight module and a light emitting diode (LED) backlight module. Figure 1A is a partial cross-sectional view of a conventional light-emitting diode backlight module, and Figure 1B is a perspective view of the light source group illustrated in Figure 1A. Referring to FIG. 1A and FIG. 1B, the conventional LED backlight module 100 includes a light source group 110, a light guide plate 12A, and a lamp cover 丨3〇. The light source group 110 includes a circuit board 112 and a plurality of surface mount device (SMD) light emitting diodes 200843054 P060402SBZ1TW 22585twf.doc/n 114 disposed on the circuit board in, wherein the surface mount type light emitting diode 114 It is disposed beside the light incident surface 122 of the light guide plate 12A. A portion of the light guide plate 120 adjacent to the light incident surface 122 and the light source group 110 are disposed in the globe 130.
在習知發光二極體背光模組1〇〇中，表面黏著型發光 二極體114除了底部與電路板112接觸外，其餘部分均被 空氣所圍繞。由於空氣的導熱性差，因此發光二極體114 所產生的熱主要是透過配置於其底部的導聊(未繪示）傳遞 至電路板112中，並進一步藉由燈罩13〇散逸至外界。由 於大部分的熱僅能從表面黏著型發光二極體114的底部散 出，所以谷易導致散熱不足而使得表面黏著型發光二極體 114之整體及p_N接面(p_N juncti〇n)的溫度過高，這會造 成表面黏著型發光—極體114的發光效率變差及壽命減 少，並會使其所發出的光產生色偏。如此，將導致發光二 極體背光模組100所提供的顯示光源之品質不佳。 【發明内容】 本發明提供-種光源組，其散熱效率較佳。 本考X明提供種月光模組，其散熱效率較佳。 率較ί發明提供—種液晶顯示裝置，其背光模組的散熱效 f發明提出-縣驗，包括路板、 一 ί，件及—導熱膠。導熱減置於魏板上，並、呈有 =置開口。發光元件配置於容置開口中，麓板^ 性連接。導_連接於發私件與桃板之㈣及發^ 6 200843054 P060402SBZ1TW 22585twf.doc/n 件與導熱框之間。 在本發明之一實施例中，發光元件之一表面具 光區域，而光源㈣更包括—導熱蓋，覆蓋此表面，= 露出此出光區域。其中，導熱蓋的材質可為金屬。亚暴 本發明更提出一種光源組，包括一電路板、一首 框、多個發光元件及多個導熱膠。導熱框配置於電路熱 並具有多健㈣π。每-發光元件分觀置於 」 置開口中，亚與電路板電性連接。每_導熱膠分別= 其中-發光元件與電路板之間以及發光元件與導熱框之 間。 、 在本發明之一實施例中，每一發光元件之一表面具有 -出光區域，而光源組可更包括—導熱蓋，覆蓋這些表面， 並暴露出這些出光區域。其中，導熱蓋的材f可為金屬。 以下之實施例可適用於上述兩種光源組。 在本發明之一實施例中，導熱框的材質例如為金屬。 在本發明之一實施例中，導熱膠的材質可包括一電性 絕緣基材及-摻雜物。其巾，電性絕緣基材可包括石夕樹脂 (silicone)、環氧樹脂(epoxy)或其之組合，而摻雜物可包括 氮化蝴(b嶋n nitride)、二氧化發(sm_ di〇xide)、氮化銘 (aluminum nitride)、氧化铭（aiuminum〇xide)或其之組合。 在本發明之一實施例中，發光元件例如為發光二極 體。 本發明再提出一種背光模組，包括上述任一種光源組 及一導光單兀(light guide unit)。導光單元具有一入光面， 200843054 P060402SBZ1TW 22585twf.doc/n 而光源組適於提供光線至入光面。 在本發明之一實施例中，導光單元可為一導光板。 在本發明之一實施例中，導光單元可為一擴散板 (diffuser plate)。In the conventional light-emitting diode backlight module, the surface-adhesive light-emitting diode 114 is surrounded by air except that the bottom is in contact with the circuit board 112. Due to the poor thermal conductivity of the air, the heat generated by the LEDs 114 is mainly transmitted to the circuit board 112 through a guide (not shown) disposed at the bottom thereof, and is further dissipated to the outside by the lamp cover 13. Since most of the heat can only be dissipated from the bottom of the surface-adhesive light-emitting diode 114, the valley is liable to cause insufficient heat dissipation to make the surface-adhesive light-emitting diode 114 and the p_N junction (p_N juncti〇n) If the temperature is too high, this will result in surface-adhesive luminescence - the luminous efficiency of the polar body 114 is deteriorated and the lifetime is reduced, and the emitted light is colored. As a result, the quality of the display light source provided by the LED backlight module 100 is not good. SUMMARY OF THE INVENTION The present invention provides a light source group that has better heat dissipation efficiency. This test X provides a moonlight module, which has better heat dissipation efficiency. The rate is higher than that provided by the invention - a kind of liquid crystal display device, the heat dissipation effect of the backlight module f is proposed - the county inspection, including the road board, a sheet, a piece and a heat conductive glue. The heat conduction is reduced to the Wei plate, and the opening is placed. The light emitting element is disposed in the receiving opening, and the seesaw is connected. The guide _ is connected between the private part and the peach board (4) and the hair piece 6 200843054 P060402SBZ1TW 22585twf.doc/n between the heat conduction frame. In one embodiment of the invention, one of the light-emitting elements has a light-emitting area, and the light source (4) further includes a heat-conducting cover covering the surface to expose the light-emitting region. The material of the heat conductive cover may be metal. Substorm The present invention further provides a light source set including a circuit board, a first frame, a plurality of light emitting elements, and a plurality of thermal conductive adhesives. The thermal block is placed in the circuit heat and has multiple health (four) π. Each of the light-emitting elements is placed in an open position, and is electrically connected to the circuit board. Each _ thermally conductive adhesive = = between - the illuminating element and the circuit board and between the illuminating element and the thermal block. In an embodiment of the invention, one of the surface of each of the light-emitting elements has a light-emitting area, and the light source group further includes a heat-conducting cover covering the surfaces and exposing the light-emitting areas. Wherein, the material f of the heat conductive cover may be metal. The following embodiments are applicable to the above two light source groups. In an embodiment of the invention, the material of the heat conducting frame is, for example, metal. In an embodiment of the invention, the material of the thermal conductive adhesive may comprise an electrically insulating substrate and a dopant. The towel, the electrically insulating substrate may comprise silicon, epoxy or a combination thereof, and the dopant may include b嶋n nitride and oxidized hair (sm_di) 〇xide), aluminum nitride, aiuminum〇xide, or a combination thereof. In an embodiment of the invention, the illuminating element is, for example, a light emitting diode. The invention further provides a backlight module comprising any of the above light source groups and a light guide unit. The light guiding unit has a light incident surface, 200843054 P060402SBZ1TW 22585twf.doc/n and the light source group is adapted to provide light to the light incident surface. In an embodiment of the invention, the light guiding unit can be a light guide plate. In an embodiment of the invention, the light guiding unit may be a diffuser plate.
在本發明之一實施例中，背光模組可更包括一光學膜 片’配置於導光單元之一出光面旁。其中，光學膜片可包 括一擴散片（diffuser film)、一 增光膜（brightness enhancement film)或其之組合。 本發明又提出-種液晶顯示裝置，包括一液晶顯示面 板(LCD panel)及上述背光模組。#光模組配置於液晶顯示 面板之一側，以提供一光源至液晶顯示面板。 在本發明之光源組中，由於利用两罢 一 :導熱框”熱膠來增加發光元件所產生:熱 徑，所以本發明之光源組的散熱效率較佳。 ^ ^ 件的發光效率便可提升，且其使料命亦 ’發光元 發出的光狀色偏程度亦可被有效抑制。^而其所 源組的背賴組可提供品質較佳的面 ^用此光 裝置能提供品質較佳的顯示書面。 ,、吏液晶顯示 為讓本發明之上述特徵和優 舉較佳實施例，並配合_“ 文特 【實施方式】 〇圖 膠0 泰炸圖，而在圖2B中省略 8 200843054 P060402SBZ1TW 22585twf.doc/n 凊芩閱圖2A與圖2B，本實施例之光源組2〇〇包括一電略 板210、一導熱框22〇、—發光元件23〇及—導熱膠2仙。 導熱框220配置於電路板21〇上，並具有— 發光元件230配置於容置開ϋ 222中，且與電路板21〇電 性連接。導熱膠240連接於發光元件23〇與電路板21〇 間以及發光元件230與導熱框22〇之間。 ，本實施射’發光元件23G例如為發光二極體，发 朴疋It由兩導腳(未繪示）而電性連接至 執 =的材質可為具有高導熱係數的金屬，如铭、鐵二熱 二或ΪΪ金。導熱膠’可包括-電性絕緣基材 環氧樹脂、其他適當絕緣膠 二而^ : 物例如為氮化-、二氧切、氮化以 些材質之組合。此外，導熱膠：；: 性絶緣基材，而不摻雜摻雜物。 Η僅為电 本實施例之光源組利用配置於 的導熱框22〇及導熱膠Μ 、： ^件230周圍 熱之傳導途徑，以使轉了彳，件⑽所產生的 f24°及㈣而傳遞至電路導 件謂的側面經由導^ ”攸發光元 本實施例之光源組200的散熱效率較佳=所以， 而可以在較低的溫度工 么先兀件230因 效率便可提升，且其使用壽么，，發光元件23Θ的發光 線之色偏程度亦可被有效^’。、可延長，而其所發出的光 9 200843054 r uou^fuz 1TW 225 85twf. doc/n 此外’由於導熱膠240具有彈性，因此 件23〇所受到的外力，崎低發光元件23〇被外減壞的 機會’尤其當發光元件230為發光二極體時，更可因而保 遵其中之發光二極體晶粒。再者’導熱膠24〇，亦可用以保 護發光二極體之導腳’以社導腳受濕氣錢而造成短 路，如此便可提升光源組200的可靠度。 在本實施例中，發光元件230之—表面232具有一出 光區域A，而光源組200可更包括一導熱蓋25〇，其覆蓋 此表面232，並暴露出出光區域A。此外，導熱蓋25〇 ^ 可覆蓋導熱框220的頂部。如此一來’發光元件ς3〇所產 生的熱還可從經由導熱蓋25㈣散逸科界，而使光源組 20〇的散熱效果更佳。崎，#熱蓋25〇 &材質例如是上 述可用來作為導熱框220的材質。 雖然光源、组200之發光元件23〇是頂部發光型的發光 ，然而在本發明中，發光元件亦可為側邊發光型的發 =件^參照目3,讀示本發明另—實施例之光源組 生。面不思圖。本發明另一實施例之光源組％㈨的發光元 =30a為側邊發光型的發光元件，其具有出光區域八，之 ” 的法向量例如是平行於電路板210。導熱蓋250a 、设盍，面，2a，且暴露出出光區域A，。 件配的疋’本發明之光源組中，亦可多個發光元 有多實適:r列。™ 10 200843054 P060402SBZ1TW 22585twf.doc/n 圖4A為本發明又一實施例之光源組的剖面示意圖。 圖4B為圖4A之光源組的爆炸圖，而在圖4B中省略導熱 膠。請參閱圖4A與圖4B，光源組200b之導熱框220b具 有多個容置開口 222。此外，光源組200b具有多個發光^ 件230與多個導熱膠240。每一發光元件23〇分別^置於 其中一谷置開口 222中，並與電路板21〇電性連接。每一 V熱膠240分別連接於其中一發光元件230與電路板 之間以及此發光元件230與導熱框240之間。再者，在本 實施例中，可利用一導熱蓋250b覆蓋這些發光元件23〇 的表面232，而此導熱蓋250b具有多個與容置開口 222對 應之開口 252,以暴露出這些發光元件23〇的出光區域a。 上述這些發光元件230可沿一直線排列、呈面陣列排 列或以其他適當方式排列。圖5A與圖5B繪示本發明另二 實施例之光源組的導熱框與導熱蓋。請先參閱圖5A，當發 光元件沿一直線排列時，導熱框220b，具有多個沿一直線 排列的容置開口 222,而導熱蓋250b，亦具有多個沿一直線 排列的開口 252。請參閱圖5B，當發光元件呈面陣列排列 3守’導熱框220b”具有多個呈面陣列排列的容置開口 222， 而導熱蓋250b”亦具有多個呈面陣列排列的開口 252。 雖然上述具有多個發光元件的光源組，其發光元件為 頂部發光型的發光元件，但任何所屬技術領域中具有通常 知識者在參照上文後當可推知，光源組之多個發光元件亦 可為側邊發光型的發光元件，在此將不再贅述。 圖6為本發明一實施例之背光模組的局部剖面示意 200843054 F06U4U2iStiZlTW 22585twf.doc/n 圖。請參閱圖6，本實施例之背光模組300包括一導光單 元310及一光源組320。其中，導光單元310例如為一導 光板，其具有一出光面312、一背面314及一連接出光面 312與背面314的一入光面316,而光源組320適於提供光 線至入光面316。此光線由入光面316進入導光單元31〇 後，會被引導至出光面312，並由出光面312出射，以形 成一面光源。 上述之光源組320例如由多個圖3之光源組2〇〇a沿 一直線排列而成。此外，這些光源組2〇%可共用一塊電路 板，導熱框220a可整合為一體，而導熱蓋25〇a亦可整合 為一體。值得注意的是，應用於背光模組3〇〇中的光源組 320亦可以是上述其他實施例之光源組。In an embodiment of the invention, the backlight module may further include an optical film disposed at a light emitting surface of one of the light guiding units. Wherein, the optical film may comprise a diffuser film, a brightness enhancement film or a combination thereof. The present invention further provides a liquid crystal display device comprising a liquid crystal display panel (LCD panel) and the above backlight module. #光模块 is disposed on one side of the liquid crystal display panel to provide a light source to the liquid crystal display panel. In the light source group of the present invention, the heat dissipation efficiency of the light source group of the present invention is better because the heat conduction frame "hot glue" is used to increase the heat path generated by the light-emitting element. And the light color shift degree emitted by the illuminating element can also be effectively suppressed. The source group of the source group can provide a better quality surface. The optical device can provide better quality. The display of the . . . , 吏 liquid crystal display is the preferred embodiment of the present invention and the preferred embodiment of the present invention, and cooperates with _ "Vent [Embodiment] 〇 胶 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P060402SBZ1TW 22585twf.doc/n Referring to FIG. 2A and FIG. 2B, the light source group 2 of the present embodiment includes an electrical board 210, a heat conducting frame 22, a light-emitting element 23, and a heat-conductive adhesive. The heat conducting frame 220 is disposed on the circuit board 21 and has a light emitting element 230 disposed in the receiving opening 222 and electrically connected to the circuit board 21 . The thermal conductive paste 240 is connected between the light-emitting element 23 and the circuit board 21 and between the light-emitting element 230 and the heat-conducting frame 22A. The light-emitting element 23G is, for example, a light-emitting diode, and the material is electrically connected to the metal by two lead pins (not shown), and the material can be a metal having a high thermal conductivity, such as Ming and iron. Two hot two or sheet metal. The thermal conductive rubber' may include an electrically insulating substrate epoxy resin, other suitable insulating rubber, and the like, for example, a combination of nitriding, dioxing, and nitriding. In addition, the thermal conductive adhesive::: an insulating substrate, without doping dopants. Η Only the light source group of the embodiment of the present invention utilizes the heat conduction frame 22 disposed on the heat conducting frame 22 and the thermal conductive glue, and the heat conduction path around the member 230 to transmit the f24° and (4) generated by the member (10). The heat dissipation efficiency of the light source group 200 of the embodiment of the present invention is better than that of the light guide group of the present embodiment. Therefore, the workpiece 230 can be improved at a lower temperature due to efficiency, and With the use of life, the color shift of the illuminating line of the illuminating element 23 亦可 can also be effectively ^'. It can be extended, and the light emitted by it 9 200843054 r uou^fuz 1TW 225 85twf. doc/n 240 has elasticity, so the external force received by the member 23〇, the low-light-emitting element 23〇 is externally damaged. In particular, when the light-emitting element 230 is a light-emitting diode, the light-emitting diode crystal can be further protected. In addition, the 'thermal conductive adhesive 24 〇 can also be used to protect the guide leg of the light-emitting diode' to cause a short circuit caused by the moisture of the social guide foot, so that the reliability of the light source group 200 can be improved. The surface 232 of the light-emitting element 230 has a light-emitting area A The light source group 200 can further include a heat-conducting cover 25 覆盖 covering the surface 232 and exposing the light-emitting area A. In addition, the heat-dissipating cover 25 can cover the top of the heat-conducting frame 220. Thus, the light-emitting element ς3〇 The generated heat can also be dissipated from the thermal conduction cover 25 (4) to make the heat dissipation effect of the light source group 20 更 better. The heat cover 25 〇 & material is, for example, the above-mentioned material that can be used as the heat conduction frame 220. The light-emitting element 23A of the group 200 is a top-emission type light-emitting type. However, in the present invention, the light-emitting element may also be a side-emitting type of the light-emitting element, refer to the object 3, and the light source group of the other embodiment of the present invention is read. The illuminating element=30a of the light source group %(9) according to another embodiment of the present invention is a side-emitting type illuminating element having a light-emitting area VIII, the normal vector of which is, for example, parallel to the circuit board 210. . The heat-conducting cover 250a is provided with a surface, 2a, and the light-emitting area A is exposed. In the light source group of the present invention, it is also possible to have a plurality of light-emitting elements: r columns. TM 10 200843054 P060402SBZ1TW 22585twf.doc/n FIG. 4A is a cross-sectional view of a light source group according to still another embodiment of the present invention. Fig. 4B is an exploded view of the light source group of Fig. 4A, and the thermal conductive adhesive is omitted in Fig. 4B. Referring to FIG. 4A and FIG. 4B, the heat conducting frame 220b of the light source group 200b has a plurality of receiving openings 222. Further, the light source group 200b has a plurality of light emitting elements 230 and a plurality of heat conductive pastes 240. Each of the light-emitting elements 23 is placed in one of the valley openings 222 and electrically connected to the circuit board 21 . Each V hot glue 240 is connected between one of the light emitting elements 230 and the circuit board and between the light emitting element 230 and the heat conducting frame 240. Furthermore, in the present embodiment, the surface 232 of the light-emitting elements 23A can be covered by a heat-conducting cover 250b having a plurality of openings 252 corresponding to the receiving openings 222 to expose the light-emitting elements 23 The light exit area a of the raft. The light-emitting elements 230 described above may be arranged in a line, arranged in a planar array, or arranged in other suitable manners. 5A and 5B illustrate a heat conducting frame and a heat conducting cover of a light source group according to another embodiment of the present invention. Referring to FIG. 5A, when the light-emitting elements are arranged along a straight line, the heat-conducting frame 220b has a plurality of accommodating openings 222 arranged in a line, and the heat-conducting cover 250b also has a plurality of openings 252 arranged in a line. Referring to FIG. 5B, when the light-emitting elements are arranged in an array of planes, the heat-conducting frame 220b has a plurality of receiving openings 222 arranged in an array, and the heat-conducting cover 250b" also has a plurality of openings 252 arranged in an array. Although the above-mentioned light source group having a plurality of light-emitting elements is a top-emission type light-emitting element, any one of ordinary skill in the art can refer to the above, and it can be inferred that a plurality of light-emitting elements of the light source group can also be used. The light-emitting elements of the side-emitting type will not be described again here. FIG. 6 is a partial cross-sectional view of a backlight module according to an embodiment of the present invention. 200843054 F06U4U2iStiZlTW 22585twf.doc/n. Referring to FIG. 6, the backlight module 300 of the embodiment includes a light guiding unit 310 and a light source group 320. The light guiding unit 310 is, for example, a light guide plate having a light emitting surface 312, a back surface 314, and a light incident surface 316 connecting the light emitting surface 312 and the back surface 314, and the light source group 320 is adapted to provide light to the light incident surface. 316. After entering the light guiding unit 31, the light entering the light guiding surface 31 will be guided to the light emitting surface 312 and emitted from the light emitting surface 312 to form a light source. The above-described light source group 320 is formed, for example, by a plurality of light source groups 2A of Fig. 3 arranged in a line. In addition, these light source groups 2% can share a circuit board, the heat conductive frame 220a can be integrated, and the heat conductive cover 25A can be integrated. It should be noted that the light source group 320 applied to the backlight module 3 can also be the light source group of the other embodiments described above.
此外，背光模組300可更包括一光學膜片33〇，配 元310之出光面312上方。光學膜片330例如為 &政片、一增光膜、其他適當之光學膜片或這些膜片之 ，合。再者’背光模組300可更包括—背框34及 背框用《承載導光單元㈣與光源組32〇二 ==〇用以固定導光單元31G與光學膜片33G 出出光面312。 i恭路 請炎明另—實施例之背光模組的剖面示意圖。 。月 > 閱圖7，本貫施例之背光模組4〇〇 及—光源組·。其中，光源組42〇例 仙 散板，其4相:Γ !導光單元410例如為-擴 、有相對之一入光面412及—出光面414，而光 12 200843054 -^U0U4uzi>jrfZlTW 22585twf.doc/n 源組420適於提供光線至入光面412。光線由入光面412 進入導光單元410後會均勻地擴散開來，並從出光面414 出射’以形成一面光源。 此外’在本實施例之背光模組4〇〇中，可在出光面414 上方配置如上述背光模組300(請參閱圖6)的光學膜片 330。再者，为光模組4〇〇可更包括一背框430以及一前框 440。背框430用以承載導光單元41〇與光源組42〇,而前 框440用以固定導光單元41〇與光學膜片33〇,並暴露出 出光面414。值得注意的是，應用於背光模組4〇〇中的光 源組420亦可以是上述其他實施例之光源組。 由於兔光模組300及400的光源組320及420具有較 佳的散熱效率，所以發光效率較高且其所發出的光線之色 偏程度較小，因此背光模組3〇〇及4〇〇可提供品質較佳的 面光源。 圖8為本發明一實施例之液晶顯示裝置的爆炸圖。請 參閱圖8，本實施例之液晶顯示裝置5〇〇包括一液晶顯示 面板510及一背光模組52〇，其中背光模組52Q例如為上 述任一實施例之背光模組。背光模組52〇配置於液晶顯示 面板510之一側，以提供面光源至液晶顯示面板51〇。由 於背光模組520能提供品質較佳的面光源，所以本實施例 之液晶顯示裝置500的顯示品質較佳。 鉍上所述，在本發明之光源組中，由於利用配置於發 光元件周圍的導熱框及導熱膠來增加發光元件所產生的熱 之傳導途徑，所以本發明之光源組的散熱效率較佳。如此， c 200843054 ruuu^+u^ojjfZlTW 22585twf.doc/n 發光元件的發光效率便可提升，且其 人而其所發出的光線之色偏程度村被=亦可延長，用此光源組的背光模組可提供品質較佳的卩* °因此，使 發明之液晶顯示裝置能提供品質較i的先源’ 以使本 F 口口貝孕父佳的顯千金Z 亚可避免其用以電性遠桩帝取裘的機會， 此，本發明之絲板料腳遭濕氣所侵餘。因 本發明之光源組的可靠度較高。 雖然本發W已喻佳實施例揭露如 限定本發明 上 ’任何所屬技術領域令具有通常知 ’然其並非用以 脫離本發明之精神 …、π %币知識者，在不因此本發明之保i t ，§可作些許之更動與潤飾， 為準。 4關當視後附之”專·圍所界=者 【圖式簡單說明】 圖1A為一蘇羽 意圖。 $ α發光一極體背光模組的局部剖面示=1Α所緣示之光源組的立體圖。 二，本發明—實施例之光源組的 圖2Β為圖2Α之光源組的爆炸圖。 〜圖。 另—實關之光驗㈣面示意圖。 圖犯為圖4\明又一實施例之光源經的剖面示意圖。 ^圖4A之光源組的爆炸圖。 框與示本發㈣二實施例之光源組的導熱 14 Z1TW 22585twf.doc/n 200843054 圖6為本發明一實施例之背光模組的局部剖面示意 圖。 圖7為本發明另一實施例之背光模組的剖面示意圖。 圖8為本發明一實施例之液晶顯示裝置的爆炸圖。 【主要元件符號說明】 100 ··發光二極體背光模組 110、200、200a、200b、320、420 :光源組 112、210 :電路板 114 :表面黏著型發光二極體 120 :導光板 122、316、412 :入光面 130 :燈罩 220、220a、220b、220b，、220b，，：導熱框 222 :容置開口 230、230a ··發光元件 232、232a :表面 240 ··導熱膠 250、250a、250b、250b，、250b” ：導熱蓋 252 :開口 300、400、520 :背光模組 310、410 ··導光單元 312、414 :出光面 314 ··背面 15 200843054 ruouHuzoriZITW 22585twf.doc/n 330 :光學膜片 340、430 :背框 350、440 :前框 500 :液晶顯示裝置 510 ·液晶顯不面板 A、A’ ：出光區域In addition, the backlight module 300 can further include an optical film 33A above the light exit surface 312 of the component 310. The optical film 330 is, for example, a & political film, a brightness enhancing film, other suitable optical film or a combination of these films. Furthermore, the backlight module 300 can further include a back frame 34 and a back frame for carrying the light guiding unit (4) and the light source group 32〇==〇 for fixing the light guiding unit 31G and the optical film 33G to the light emitting surface 312. i Gong Lu, please take a cross-sectional view of the backlight module of the embodiment. . Month > Read Figure 7, the backlight module 4〇〇 and the light source group of the present embodiment. Wherein, the light source group 42 is exemplified by a diffuser plate, and the four phases of the light guide unit 410 are, for example, -expanded, have a light incident surface 412 and a light exit surface 414, and the light 12 200843054 -^U0U4uzi>jrfZlTW 22585twf The .doc/n source set 420 is adapted to provide light to the light incident surface 412. When the light enters the light guiding unit 410 from the light incident surface 412, it spreads evenly and exits from the light emitting surface 414 to form a light source. Further, in the backlight module 4 of the present embodiment, the optical film 330 of the backlight module 300 (see FIG. 6) can be disposed above the light-emitting surface 414. Furthermore, the optical module 4 can further include a back frame 430 and a front frame 440. The back frame 430 is configured to carry the light guiding unit 41 and the light source group 42A, and the front frame 440 is configured to fix the light guiding unit 41〇 and the optical film 33〇, and expose the light emitting surface 414. It should be noted that the light source group 420 applied to the backlight module 4 can also be the light source group of the other embodiments described above. Since the light source groups 320 and 420 of the rabbit optical modules 300 and 400 have better heat dissipation efficiency, the luminous efficiency is higher and the color deviation of the emitted light is smaller, so the backlight module 3〇〇 and 4〇〇 A surface light source of better quality can be provided. Fig. 8 is an exploded view of a liquid crystal display device according to an embodiment of the present invention. Referring to FIG. 8, the liquid crystal display device 5 of the present embodiment includes a liquid crystal display panel 510 and a backlight module 52, wherein the backlight module 52Q is, for example, the backlight module of any of the above embodiments. The backlight module 52 is disposed on one side of the liquid crystal display panel 510 to provide a surface light source to the liquid crystal display panel 51A. Since the backlight module 520 can provide a surface light source of better quality, the display quality of the liquid crystal display device 500 of the present embodiment is better. As described above, in the light source group of the present invention, since the heat conduction path generated by the light-emitting element is increased by the heat conduction frame and the thermal conductive paste disposed around the light-emitting element, the heat radiation efficiency of the light source group of the present invention is preferable. Thus, c 200843054 ruuu^+u^ojjfZlTW 22585twf.doc/n The luminous efficiency of the illuminating element can be improved, and the degree of color deviation of the light emitted by the person can also be extended, and the backlight of the light source group can be used. The module can provide better quality °* °, so that the liquid crystal display device of the invention can provide the quality of the i-source of the original one, so that the F-portion can be avoided. The opportunity of taking the scorpion from the far pile is that the foot of the wire sheet of the present invention is invaded by moisture. The reliability of the light source group of the present invention is high. Although the present invention has been disclosed as a preferred embodiment of the present invention, it is not intended to depart from the spirit of the present invention. It, § can make some changes and refinements, whichever is. 4 Guanxie attached to the "special and surrounding boundaries = [simplified description of the schema] Figure 1A is a Su Yu intention. Partial profile of the alpha light-emitting one-pole backlight module = 1 Α 2, the present invention - the light source group of the embodiment of FIG. 2A is an exploded view of the light source group of FIG. 2 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Schematic diagram of the light source passing through. ^Explosion diagram of the light source group of Fig. 4A. Frame and heat conduction of the light source group of the embodiment (4) and the second embodiment. Z1TW 22585twf.doc/n 200843054 FIG. 6 is a backlight module according to an embodiment of the invention. Figure 7 is a cross-sectional view of a backlight module according to another embodiment of the present invention. Figure 8 is an exploded view of a liquid crystal display device according to an embodiment of the present invention. [Description of main components] 100 · · LED Body backlight module 110, 200, 200a, 200b, 320, 420: light source group 112, 210: circuit board 114: surface-adhesive light-emitting diode 120: light guide plate 122, 316, 412: light-incident surface 130: lamp cover 220 , 220a, 220b, 220b, 220b,,: heat conduction frame 222: accommodation Ports 230, 230a · Light-emitting elements 232, 232a: surface 240 · · Thermal pastes 250, 250a, 250b, 250b, 250b": heat-conducting cover 252: openings 300, 400, 520: backlight modules 310, 410 · · Light unit 312, 414: light-emitting surface 314 · · back surface 15 200843054 ruouHuzoriZITW 22585twf.doc / n 330 : optical film 340, 430: back frame 350, 440: front frame 500: liquid crystal display device 510 · liquid crystal display panel A, A' : light exit area
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