200842720 九、發明說明： t 明 屬 3 技術領域 本發明係有關於一種包含儲存有關於物品等之電子資 5訊之1C核心標籤的模内用1C標籤，以及前述1C標籤與熔融 樹脂一起模内成形的附有1C標籤之樹脂成形物品。 c先前技 背景技術 • IC核心標籤之模内成形係指在將IC核心標籤設置於樹 10 脂成形用之模具中的狀態下，射出注入熔融樹脂而將樹脂 成形物品與1C核心標籤一體成形者。由於在模内成形時， 1C核心標籤會接觸到南溫、南壓的溶融樹脂，故1C核心標 鐵必須能夠抵抗溶融樹脂的南溫或南壓。 至今已提出了在樹脂被覆層中埋入1C核心標藏的狀態 15 下進行模内成形而製作餐具類的方法(例如，參照專利文獻 1)，或是在接觸溶融樹脂侧之1C核心標籤之面設置保護 層，以避免直接接觸熔融樹脂的1C標籤(例如，參照專利文 獻2) 〇 在前述先前技術中，雖說是樹脂被覆層或保護層，但 20實際上皆為可說是過度保護1C核心標鐵的堅固構造，且前 1 述稱為樹脂被覆層或保護層的被覆構件都具有相當程度的 厚度’因此所得之1C標籤也具有相當的厚声。 、此外，在前述習知技術中，IC核心標藏雖以密封狀態 被埋入稱為樹脂被覆層或保護層之被覆構件中，但總會有 5 200842720 些許空氣殘存於被覆構件與ic核心標籤間的空隙，另外， 被覆構件本身也會含有些許空氣。當模内成形時之高溫熔 融樹脂接觸到被覆構件時，殘存於間隙的空氣及/或被覆構 件本身含有的空氣會膨脹，而使被覆構件成為所謂的起泡 5 (blister)狀態，最糟的情況係溶融樹脂可能會破壞被覆構件 而侵入1C標籤内部。 本發明之發明人專心一志地研討模内用1C標籤的構 造，結果發現··為了使1C核心標籤之ic晶片具備可抵抗模 内成形溶融樹脂之南溫或南壓的抗熱性，即使不以至今 10認為必要之具有相當厚度的被覆構件包覆1C核心標籤，也 可保護1C核心標籤免於受熱損傷。 專利文獻1 :特開平08-56799號公報 專利文獻2 ··特開2005-332116號公報 【發明内容3 15 發明揭示 發明所欲解決之課題 因此’本發明所欲解決之課題係提供一種ic標籤及附 有1C標籤之樹脂成形物品，可使IC核心標籤之圯晶片不會 口為楔内成形時之溶融樹脂的南溫或南壓而受到損傷。 20 解決課題之手段 為了解決上述課題，本發明之1C標籤及附有IC標籤之 樹脂成形物品具有以下特徵。 亦即，本發明之1C標籤包含有：1C核心標籤，係具有 儲存有也子資訊的1C晶片、及形成有電氣性連接前述1(^晶 6 200842720 片之天線圖形的天線電路基材者；通氣性基材，係載置有 前述ic核心標籤者；熱可塑性樹脂膜，係包覆於載置有前 述1C核心標籤之前述通氣性基材者；及固定構件，係可將 前述熱可塑性樹脂膜固定於前述通氣性基材者，且前述1C 5 核心標籤挾持於前述熱可塑性樹脂膜與前述通氣性基材之 間。 迄今，模内成形時之高溫、高壓熔融樹脂與1C標籤接 觸所產生的熱損傷一向被視為一大問題。不過，本發明之 發明人發現··由於1C標氣暴露於而溫、高壓溶融樹脂為極 10 短暫的瞬間，故藉由中間存在有熱可塑性樹脂膜而對1C標 籤產生熱傳導之時滯（亦即，來自於熔融樹脂的外熱不會立 刻傳至1C標籤之1C晶片），所以對於1C核心標籤之1C晶片帶 來的熱損傷也較之前推測的小。此外，本發明人還發現： 相較於前述有時滯的熱損傷，在以密封狀態埋入IC核心標 15籤的1c標籤中，1C標籤即使是短時間接觸到高溫、高壓的 溶融樹脂’包含在1C標籤之被覆構件中的空氣也會瞬間膨 脹’使被覆構件呈現所謂的起泡狀態，而對IC標籤的抗熱 性帶來極重大的影響。被覆構件變成所謂的起泡狀態係意 味著被覆構件的厚度變薄，而被覆構件厚度薄化又意味著 20容易傳導來自外部的熱、被覆構件容易破損等。 根據上述構造之職籤，藉由在熱可塑性樹脂膜與通 氣性基材間挾持1C核心標籤，在模内成形時之高溫、高壓 ，熔融樹脂與1C標籤接觸時，即使殘存於熱可塑性樹脂膜與 通氣性基材之間隙的空氣膨脹，殘存之空氣也可從通氣性 7 200842720 基材去除，故可防止熱可塑性樹脂膜變成所謂的起泡狀態。 又，本發明之ic標籤包含有：IC核心標籤，係具有儲 存有電子資訊的1C晶片、及形成有電氣性連接前述IC晶片 之天線圖形的天線電路基材者；通氣性基材，係具有載置 5有珂述Ic核心標籤的載置用侧部、及鄰接於前述載置用側 邛且大致呈相同形狀的空載(dummy)用側部者；熱可塑性樹 脂膜，係包覆於前述載置用側部及前述空载用侧部之上 者；及固定構件，係可將前述熱可塑性樹脂膜固定於前述 L氣丨生基材者，又，邊1C標籤形成有預備加工體，該預備 10加工體係將前述1C核心標籤挾持於前述熱可塑性樹脂膜與 前述通氣性基材之間者，且前述熱可塑性樹脂膜係在從IC 曰曰片之非載置側於通氣性基材之載置用侧部及空載用側部 的邊界形成切痕線，並以前述切痕線為基準對折前述預備 加工體後，透過接著層互相接著固定者。 5 根據上述構造之ic標籤，係將預備加工體折成兩半(所 謂的谷摺法）而以通氣性基材將1(:晶片夾層之構造。根據前 述構成，通氣性基材也可發揮屏障功能，阻礙來自於熔融 樹脂之熱透過熱可塑性樹脂膜傳至1C核心標籤之1C晶片。 由於模内成形時之高温、高壓熔融樹脂不會直接接觸到熱 20可塑性樹脂膜，因此保護1C核心標籤之1C晶片不受損傷的 效果也就更大。 又，本發明之1C標籤包含有：1C核心標籤，係具有儲 存有電子資訊的1C晶片、及形成有電氣性連接前述IC晶片 之天線圖形的天線電路基材者；通氣性基材，係具有載置 8 200842720 rjrr載置用侧部、及鄰接於前述載置用側 呈相同形狀的空载用侧部者;熱可塑性樹脂膜， 5200842720 IX. Description of the invention: t genus 3 TECHNICAL FIELD The present invention relates to an in-mold 1C label including a 1C core label storing an electronic article of an article, etc., and the aforementioned 1C label together with a molten resin A molded resin molded article with a 1C label. C. BACKGROUND OF THE INVENTION The in-mold forming of an IC core label refers to a method in which a resin molded article and a 1C core label are integrally molded by injecting a molten resin in a state in which an IC core label is placed in a mold for forming a resin. . Since the 1C core label will contact the molten resin of the south and south pressures during in-mold forming, the 1C core standard must be able to withstand the south or south pressure of the molten resin. In the state in which the 1C core is embedded in the resin coating layer, the in-mold molding is carried out to produce tableware (for example, refer to Patent Document 1), or the 1C core label on the side of the molten resin is contacted. A protective layer is provided on the surface to avoid direct contact with the 1C label of the molten resin (for example, refer to Patent Document 2). In the foregoing prior art, although it is a resin coating layer or a protective layer, 20 is actually said to be excessively protected 1C. The solid construction of the core target iron, and the covering member referred to as the resin coating layer or the protective layer described above has a considerable thickness. Therefore, the obtained 1C label also has a relatively thick sound. In addition, in the prior art, the IC core standard is buried in a sealed state called a resin coating layer or a protective layer in a sealed state, but there will always be 5 200842720. Some air remains in the covering member and the ic core label. In addition, the covering member itself also contains a little air. When the high-temperature molten resin in the in-mold forming is in contact with the covering member, the air remaining in the gap and/or the air contained in the covering member itself expands, and the covering member becomes a so-called blister state, which is the worst. In the case where the molten resin may break the covering member and intrude into the inside of the 1C label. The inventors of the present invention have intensively studied the structure of the 1C label in the mold, and as a result, found that the ic wafer of the 1C core label is resistant to heat of the south or south pressure of the in-mold forming molten resin, even if it is not Up to now, the coated member having a considerable thickness, which is considered to be necessary, covers the 1C core label, and also protects the 1C core label from heat damage. Patent Document 1: JP-A-H08-56799, JP-A-2005-332116, JP-A-2005-332116, SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The object to be solved by the present invention is to provide an ic tag. And the resin molded article with the 1C label can cause the wafer of the IC core label to be damaged by the south temperature or the south pressure of the molten resin in the wedge forming. [Means for Solving the Problem] In order to solve the above problems, the 1C label of the present invention and the resin molded article with the IC label have the following features. That is, the 1C tag of the present invention includes: a 1C core tag having a 1C chip storing the sub-information, and an antenna circuit substrate having an antenna pattern electrically connected to the 1 (the crystal 6 200842720 piece); The air-permeable substrate is provided with the ic core label; the thermoplastic resin film is coated on the air-permeable substrate on which the 1C core label is placed; and the fixing member is the thermoplastic resin. The membrane is fixed to the air-permeable substrate, and the 1C 5 core label is held between the thermoplastic resin film and the air-permeable substrate. Heretofore, a high-temperature, high-pressure molten resin in contact with a 1C label is formed during in-mold molding. The thermal damage has always been regarded as a big problem. However, the inventors of the present invention found that the thermoplastic resin film is present in the middle due to the exposure of the 1C standard gas to the temperature and high pressure melting of the resin for a short moment. The time delay of heat conduction to the 1C tag (that is, the external heat from the molten resin is not immediately transmitted to the 1C chip of the 1C tag), so it is brought to the 1C chip of the 1C core tag. The thermal damage is also smaller than previously estimated. In addition, the inventors have also found that, in comparison with the aforementioned thermal damage of time lag, in the 1c tag embedded in the IC core mark 15 in a sealed state, the 1C tag is even a short time. The molten resin that is exposed to high temperature and high pressure 'the air contained in the coated member of the 1C label also expands instantaneously' causes the coated member to exhibit a so-called foaming state, which has a very significant influence on the heat resistance of the IC tag. The so-called foaming state means that the thickness of the covering member is reduced, and the thickness of the covering member is thinned, which means that 20 is easy to conduct heat from the outside, the covering member is easily broken, etc. According to the above-mentioned configuration, by the heat When the 1C core label is held between the plastic resin film and the air-permeable substrate, the high temperature and high pressure during molding in the mold, and when the molten resin comes into contact with the 1C label, even if the air remaining in the gap between the thermoplastic resin film and the air-permeable substrate expands, The residual air can also be removed from the substrate of the air permeability 7 200842720, so that the thermoplastic resin film can be prevented from becoming a so-called foaming state. The IC core tag includes a 1C chip in which electronic information is stored, and an antenna circuit substrate on which an antenna pattern electrically connected to the IC chip is formed. The air-permeable substrate has a mounting 5 and has an Ic. a side portion for mounting the core label, and a dummy side portion having a substantially identical shape adjacent to the mounting side, and a thermoplastic resin film covering the side portion for mounting And the fixing member is configured to fix the thermoplastic resin film to the L gas twin substrate, and the preliminary processing body is formed on the 1C label. The 1C core label is held between the thermoplastic resin film and the air-permeable substrate, and the thermoplastic resin film is placed on the side of the air-permeable substrate from the non-mounting side of the IC chip. And a cut line is formed on the boundary of the side portion for no-load, and the preliminary processed body is folded in half on the basis of the above-mentioned cut line, and then adhered to each other through the adhesive layer. 5 According to the above-described ic label, the preliminary processed body is folded into two halves (so-called valley-folding method), and the air-permeable substrate is used as a structure of the wafer sandwich layer. According to the above configuration, the air-permeable substrate can also be used. The barrier function prevents the heat from the molten resin from passing through the thermoplastic resin film to the 1C wafer of the 1C core label. Since the high temperature, high pressure molten resin in the in-mold forming does not directly contact the hot 20 plastic resin film, the 1C core is protected. The 1C chip of the label has a greater effect of not being damaged. Moreover, the 1C label of the present invention comprises: a 1C core label having a 1C wafer storing electronic information and an antenna pattern formed by electrically connecting the IC chip. The antenna substrate of the antenna circuit is provided with a side portion for mounting 8 200842720 rjrr and a side portion for no-loading having the same shape adjacent to the mounting side; a thermoplastic resin film, 5
10 =於賴置用側部及前述空载用侧部之上者;及固 ^係可將前述熱可紐樹脂_定於前述通氣性基 材者’又，就標籤形成有職^體，該預備加工體係 將别返IC核心標籤挾持於前述熱可紐樹賴與前述通氣 性基材之間者’且前述通氣性基材係在從ic晶片之載置側 於通氣性基材之載置關部及空载用側部的邊界形成切痕 線，並以前述切痕線為基準對折前述預備加工體後 ，透過 接著層互相接著固定者。10=on the side portion for the upper side and the side portion for the no-loading; and the fixing system for the heat-sensitive resin to be placed on the air-permeable substrate, and the label is formed with a job. The preparatory processing system holds the IC core tag between the heat-sensitive substrate and the air-permeable substrate, and the air-permeable substrate is placed on the air-permeable substrate from the mounting side of the ic chip. A cut line is formed on the boundary between the closed portion and the side portion for no-load, and the preliminary processed body is folded in the above-described cut line, and then adhered to each other through the adhesive layer.
根據上述構造之1c «，係將預備加工體折成兩半(所 謂的山摺法）’使通氣性基材互相接觸，並使用其中一面作 為1C晶片之載置面、另外一面進行印刷等而作為顯示面。 特別地，如後所述，當藉由從1C晶片之非載置側對通氣性 15基材進行真空除氣而使1C核心標籤密合固定於通氣性基材 時’在載置用侧部之非載置面（另一面)上，用以通氣之穿孔 或通氣孔會露出而有損美觀。相對於此，空置用侧部之面 由於不需有用以通氣之穿孔或通氣孔，故可作為具有美觀 機能之面。 20 在上述構成中，宜藉由從前述1C晶片之非載置側對前 述通氣性基材進行真空除氣，熱軟化後之前述熱可塑性樹 脂膜伸展，使前述1C核心標籤密合固定於前述通氣性基材 上述密合固定方法稱為密著包裝(skin pack)方式，可柔 9 200842720 軟地對應於各種形狀的ic核心標籤，並且可藉由熱可塑性 樹脂膜密合於1C核心標籤，而大幅降低殘存於熱可塑性樹 脂膜及/或通氣性基材與1C核心標籤之間隙的空氣。即使稍 微有空氣殘存，也可從通氣性基材將前述空氣除去，而防 5 止熱可塑性樹脂膜成為所謂的起泡狀態。 在上述構成中，熱可塑性樹脂膜也可事先成形為具有 可收納前述1C核心標籤之凹部，且前述ic核心標籤收納於 前述凹部。 上述固定方法稱為氣泡包裝(blister pack)方式，雖然需 10 要用以在熱可塑性樹脂膜形成凹部的模具，但卻極適合對 於同樣形狀之1C核心標籤進行大量模内成形處理。另外， 與植、著包裝方式之成品相較之下，由於在熱可塑性樹脂膜 及/或通氣性基材與1C核心標籤之間具有較多的空隙，故會 殘存較多空氣。不過，由於前述空氣可從通氣性基材去除， 15因此不會有其他特別的問題。 通氣性基材係選自於台紙、不織布、布織物或樹脂片 材者。 即使通氣性基材本身具有通氣性，但其通氣性不夠充 为％，或者通氣性基材本身未具有通氣性時，於前述通氣 20性基材上設置穿孔或通氣孔。 雖可藉由鑲嵌構造、黏貼膠帶或熔接法將熱可塑性樹 脂膜固定於通氣性基材，但從美觀或容易固定的觀點來 看’固定構件以設置於前述熱可塑性樹脂膜及/或前述通氣 性基材之周緣部的熱封材為佳。 10 200842720 為了表現出標戴的顯不特性’宜在通氣性基材之ic晶 片之非載置側的面設有顯示部。 根據本發明，可提供一種附有1C標籤之樹脂成形物 品，係如上述之1C標籤一體地成形於樹脂成形物品内者。 5 為了提高ic標籤與樹脂成形物品之間充分的密著性， 1C標籤之熱可塑性樹脂膜及/或通氣性基材與前述樹脂成 形物品實質上宜為相同材質。 為了癌保1C標鐵與樹脂成形物品之間充分的密著性， 當1C標籤之通氣性基材與樹脂成形物品為不同材質時，於 10前述通氣性基材侧設有由實質上與前述樹脂成形物品相同 之材質所構成的保護片材。 為了確保保護片材與樹脂成形物品之間較大的接合面 積’前述保護片材之尺寸係構成為較1C標籤大。 為了發揮1C標籤作為標籤的顯示特性，Ic標鐵於前述 I5 通氣性基材之ic晶片之非載置側具有顯示部，且樹脂成形 物品及/或保護片材係由具有透光性之材料所構成，而前述 1C標籤係配置成使前述K：標籤之顯示部面向外側。 t實施方式3 實施發明之最佳型態 2 〇 以下參照第1圖，詳細說明本發明第一實施型態之J c標 籤1。 如第1圖所示，本發明之1C標籤1係構成為：包含1(：晶 片14之1C核心標籤3載置於通氣性基材10上，並且藉由密著 包裝方式以熱可塑性樹脂膜16被覆、固定1C核心標鐵3。 11 200842720 1C晶片14中儲存有：關於收納對象物品的電子資訊， 前述收納對象物品係收納於摺疊式貨櫃或稱為條板箱 (crate)之輸送用容器（所謂送貨用箱）、使用於採購物流之看 板系統的送貨用箱等樹脂成形容器者；或者是作為標籤而 5安裝於物品（例如制服）、或埋入框體或物品内部之關於物品 的電子資訊。前述電子資訊係例如：製造者特定資訊、使 用者特定資訊、生產管理資訊、貨品編號資訊、製品特性 資訊等、材質資訊或配送目的地資訊等。如上述之IC晶片 14係半導體積體電路之1C晶片或是積體度更為升級之lsi 10 晶片。 天線電路基材12係由具有柔軟性或可撓性的材料（例 如，聚乙烯、聚丙烯、聚酯、聚醯胺等樹脂材料或紙等)所 構成。 在載置有由矽晶片所構成之IC晶片14、天線電路基材 15 12之表面上，形成有未圖示之天線圖形。1C晶片14之接續 子電氣性地連接於天線圖形之中心侧各電極端子。並可 因應所使用之電波波長，而使用具有各種形狀的天線圖 案。天線圖案係使用低電阻糊，藉由印刷或轉印而形成， 而前述低電阻糊係包含具有接近習知所使用之鋼箔導電性 2〇 的導電性填料者。 通氣性基材1〇係由選自於台紙、不織布、布織物或樹 脂片材中的材料所構成，而且，通氣性基材1〇具有不會因 為熱可塑性樹脂膜16熱收縮而產生翹曲的厚度與硬度。使 用作為通氣性基材1〇的台紙係十分乾燥的紙，因而不會因 12 200842720 為紙情包含的水分急速紐㈣喊泡独合成紙為 佳。前述合成紙例如Υυρ〇(株式會社γυρ〇 · CORPORATION的登錄商標)紙，其係於聚丙烯樹脂中加入 添加物’並以雙軸拉伸膜法所形成者。所使用之合成紙 5 (丫则)以·W左右者為佳。另外，由於合成紙(γυρ〇) 本身並不具有通氣性，故設置由孔線刀或前端成尖狀之針 狀體貫通而成的通氣孔，並在如後所述形成有墨水層叫顯 示部）時，在避開墨水層18(顯示部)之處設置通氣孔。 不織布係將纖維以熱、機械性或化學性作用接著或縷 10繞而成的布，本身具有某種程度的通氣性。將捲繞纖維而 成之線編織而成的布織物本身也具有某種程度的通氣性。 但是，當不織布或布織物的通氣性不夠充分時，也與上述 一樣設置由孔線刀或前端成尖狀之針狀體貫通而成的 孔。 “ 15 制樹脂片材作為通氣性基材1G時，可使用延伸處理 過之強韋刃的透明财熱性片材。例如，可使用聚對苯二甲酸 乙一酯樹脂(PET)、聚丙烯(ΡΡ)、聚碳酸酯樹脂、聚萘二甲 酉欠乙二醇酯(PEN)、聚醯胺、硬質的氯乙烯等。由於樹脂片 材本身並不具有通氣性，故可與上述一樣設置由孔線刀或 20前端成尖狀之針狀體貫通而成的通氣孔。 另外，通氣性基材10所需之通氣性係指在模内成形時 之鬲溫、鬲壓熔融樹脂接觸1C標籤1時，包含於ic標籤1内 因熔融樹脂之熱而膨脹的空氣可以通過通氣性基材1〇而脫 離至外部，但熔融樹脂卻不會通過通氣性基材1〇而進入内 13 200842720 部。特別地，在密著包裝方式的情況下，通氣性基材1〇之 通氣孔可用以密著包裝時的真空吸引、與模内成形時熱膨 脹之空氣的去除等。 通氣性基材10通氣孔會因使用於模内成形之熔融樹脂 的黏性而不同，具體之例係如隨機或規則地形成100至 500μηι的貫通通氣孔，隨機或規則地形成25〇至5〇〇叫^的貫 通通氣孔更佳。又，以孔線刀形成貫通之圓孔、細長孔或 虛線狀的切口，而孔線間距係例如切口部分0.5mm、連接 部分〇.5mm〜切口部分h〇nim、連接部分1〇腿，更以切口 10 15 20 部分〇.5随、連接部分〇.5麵〜切口部分〇 —、連接部分 〇.6腿為佳。貫通之通氣孔截面可呈直線形狀，但為了使 内〇之王氣今易除去’並且為了阻止溶融樹脂人侵，貫通 之通氣孔截面宜從IC^ 14之非載置_ic晶片Μ之載置 側逐漸擴展而為尖錐形狀。前述尖錐形狀可藉由從K晶片 14之載置側穿孔而可輕易形成。 熱可塑性樹脂膜可使用適合资 在者包裝的各種熱可塑性 树月曰膜，例如：軟質氯乙烯膜、 f丙烯μ 離子♦合物膜、聚乙烯膜、 膜、及、♦物膜、乙烯-丙烯酸共聚物 膜及乙細-丙烯酸醋膜等。更具體而言，可使用 株式會社之商品名稱為「sy 于 厚度係例如刚μιη。 」的健度聚乙埽，其 熱可塑性樹脂膜16及/或诵气^ * 作為固定構件的熱封材。熱封+ 可=1G的周緣部塗有 的材質而作適當選擇，例如，氣=應熱可塑性樹脂膜16 氣乙烯系樹脂、乙酸乙烯系 14 200842720 ==系樹脂、締煙系樹脂、乙稀-乙酸乙歸共聚物 4礼劑或洛劑型的接著劑。 配合軸於通氣性基材記號_示）或定 位用銷孔而載置1C核心標籤3，以事先加熱軟化之熱可塑性 5樹月曰膜16覆盍1C核心標籤3,並且使用真空吸引裝置從通氣 ^ =基㈣的裏面(與扣核心標籤3相反側之面)排氣，例如真 “ ”氣600mmHg。結果’在熱軟化之熱可塑性樹脂膜μ密 ⑩者於1C士核心標籤3之外形形狀的狀態下，包覆住扣核心標鐵 3—此時’藉由熱軟化之熱可塑性樹脂膜⑽餘熱將作為固 1〇疋構件之熱封材熱融接，可將熱可塑性樹脂膜16接著於通 氣性基材10。 ' 當欲將作為標籤之顯示特性賦予至IC標籤㈣，在以密 著包裝方式將熱可塑性樹脂膜16固定於通氣性基材1〇時， 對於别述通氣性基材1〇的裏面（與ic核心標鐵3相反側之 15面）’藉由印刷墨水形成所需圖帛之墨水層18(顯示部）。墨 % 水層18(顯7^卩)顯7F有標諸記號、所有者之顯*或條碼等。 此外，為了保護墨水層18(顯示部”在墨水層18(顯示部）上 藉由0P(0Verprint :加印)上漆(氧化聚合型)而形成有表面保 護層22。 2〇 接著，參照第2圖及第3圖，詳細說明本發明第二實施 型態之1C標籤1及附有Ic標籤之樹脂成形物品7，並以與前 述第1實施型態之1C標籤1的不同點為中心進行說明。 第二實施型態之1C標籤1的特徵在於：以設置於通氣性 基材10侧之切痕線25為基準，將Ic標籤〗之預備加工體5折 15 200842720 成兩半（即依合摺線彎折)，並使熱可塑性樹脂膜16互相接 合，而可以通氣性基材10夾住扣核心標籤3。 準備具有所需之1C標藏1外形尺寸約兩倍大的預備加 工體5。在此，預備加工體5係以與第一實施型態同樣方法 5所做成者，具有冗核心標籤3、通氣性基材10與熱可塑性樹 脂膜16，並以密著包裝方式在熱可塑性樹脂膜16與通氣性 基材10之間密合挾持住1C核心標籤3。 如第2圖所示，預備加工體5於左側具有載置用侧部 4〇 ’並且於右側具有空載用側部42，位於左側之載置用侧 1〇部4〇者與第一實施型態說明者實質上相同。也可構成為將 預備加工體5大致二等分地設置切痕線25，使右側之空栽用 侧部42與左側之載置用側部4〇為同樣外形尺寸；但為了確 保模内成形時1C核心標籤1與樹脂成形品3〇間的較大接人 面積，右侧之空載用侧部42的尺寸宜構成為大於左侧之栽 15 置用側部40。 預備加工體5中，從通氣性基材10之侧所形成的切痕線 25係對於通氣性基材1〇之厚度方向設置一部分或全部。 又，事先在熱可塑性樹脂膜16表面塗上熱封材，以切痕線 25為基準而摺疊預備加工體5後，藉由將加熱至適溫之熱封 20條抵接於已摺疊之預備加工體5,而使熱可塑性樹脂臈16之 間互相接著結合，可做成如第3圖所示之兩折的1(：標籤j。 由於1C核心標籤3之1C晶片14挾持於摺疊的通氣性基材1〇 之間，故成為以通氣性基材1〇將1C晶片14夾住的構造。 將前述依谷摺線對折之IC標籤1設置於模内成形用模 16 200842720 具的預定位置後，從射出口將溶融樹脂射出注入至模具内 部。使用於射出成形的樹脂係聚丙稀(PP)或聚乙稀(PE)或 AB S等萬用樹脂、聚碳酸酯(PC)或聚烯烴(PA)等萬用工程塑 膠、液晶聚合物(LCD)或聚苯硫醚(PPS)等抗熱性優異的超 5 級工程塑膠。 包含有依谷摺線折曲之1C標籤的樹脂成形物品7之通 氣性基材10也可發揮阻擋來自於熔融樹脂之熱透過熱可塑 性樹脂膜傳至1C晶片的功能。由於模内成形時之高溫、高 熱熔融樹脂未直接接觸熱可塑性樹脂膜16，故可有效避免 10 1C核心標籤3受損。 又’在預備加工體5之通氣性基材1，〇中，對於通氣性基 材10之裏面（與1C核心標籤3相反側之面），藉由印刷墨水形 成所需圖案之墨水層18(顯示部)。藉由在左側之載置用側部 40及右侧之空載用側部42兩者設置墨水層18(顯示部），當摺 15宜預備加工體5時，可在1C標籤1兩侧之面顯示出墨水層 18(顯示部）。因此，將模内成形之樹脂成形品7作為如刻板 等板狀或標籤狀的薄板時，附有1C標籤之樹脂成形物品可 提供較多的顯示部。 接著，參照第4及5圖，詳細說明本發明第三實施型態 20之IC標籤及附有1C標籤之樹脂成形物品7,並以與上述第二 貝知i悲之Id示戴及附有ic標藏之樹脂成形物品不同處為 中心而進行說明。 第三實施型態之1C標籤1的特徵在於：以設置於熱可塑 性樹脂膜16側之切痕線25為基準，將1C標籤1之預備加工體 17 200842720 5折成兩半（即依山摺線彎折），並使接著層24互相接合。 準備具有所需之1C標籤1外形尺寸約兩倍大的預備加 工體5。如第4圖所示，預備加工體5於左侧具有載置用側部 40，並且於右側具有空載用側部42。在通氣性基材1〇之裏 5 面（與1C核心標籤3相反側之面）設置接著層24，此外更於其 上設置分隔紙26 ’分隔紙26可相對於接著層24而裝卸。因 為設置分隔紙26及接著層24，通氣性基材10之裏面（舆ic核 心標籤3相反側之面）會失去通氣性，所以，在左側之載置 • 用側部40侧之分隔紙26及接著層24上，設置以孔線刀或前 10 端尖銳之針狀體所貫通的通氣孔。因此，除了接著層24及 分隔紙26之構成外，位於左側之載置用側部40者與第一實 施型態說明者實質上相同。 與前述第二實施型態一樣，可構成為將預備加工體5 大致二等分地在熱可塑性樹脂膜16側設置切痕線25，使右 15 側之空載用側部42與左侧之載置用側部40為同樣外形尺 寸;但為了確保模内成形時1C核心標籤1與樹脂成形品3〇間 ® 的較大接合面積，右侧之空載用侧部42的尺寸宜構成為大 於左侧之載置用侧部40。 在預備加工體5中，從通氣性基材10側所形成之切痕線 - 20 25係設置於熱可塑性樹脂膜16的全部、與對於通氣性基材 ， 10之厚度方向的一部分。除去位於右側之空載用側部42、 從左侧之載置用側部40部分切離的熱可塑性樹脂膜16。剝 除分隔紙26後，藉由以切痕線25為基準折疊預備加工體5， 使接著層24互相接合，可做成如第5圖所示之兩折的〗。標籤 18 200842720According to the above configuration 1c «, the preliminary processed body is folded into two halves (so-called mountain folding method), and the air-permeable substrates are brought into contact with each other, and one of the surfaces is used as a mounting surface of the 1C wafer, and the other surface is printed. As a display surface. In particular, as will be described later, when the 1C core label is closely adhered to the air-permeable substrate by vacuum degassing the air-permeable 15 substrate from the non-mounting side of the 1C wafer, the side portion is placed on the side. On the non-loading surface (the other side), the perforations or vent holes for ventilation are exposed to impair the appearance. On the other hand, since the surface of the side portion for vacancy does not require a perforation or a vent hole for ventilation, it can be used as a surface having an aesthetic function. In the above configuration, it is preferable that the air-permeable base material is vacuum-deaerated from the non-mounting side of the 1C wafer, and the thermoplastic resin film after thermal softening is stretched to adhere the 1C core label to the aforementioned Air permeable substrate The above-mentioned adhesion fixing method is called a skin pack method, and soft 9 200842720 softly corresponds to various shapes of ic core labels, and can be adhered to the 1C core label by a thermoplastic resin film. The air remaining in the gap between the thermoplastic resin film and/or the air permeable substrate and the 1C core label is drastically reduced. Even if a little air remains, the air can be removed from the air-permeable substrate, and the thermoplastic resin film can be prevented from becoming a so-called foaming state. In the above configuration, the thermoplastic resin film may be previously formed into a concave portion that can accommodate the 1C core label, and the ic core label may be housed in the concave portion. The above fixing method is called a blister pack method, and although it is required to form a mold for forming a concave portion in a thermoplastic resin film, it is highly suitable for performing a large amount of in-mold forming treatment on a 1C core label of the same shape. Further, compared with the finished product of the planting and packaging method, since there are many voids between the thermoplastic resin film and/or the air permeable substrate and the 1C core label, a large amount of air remains. However, since the aforementioned air can be removed from the air permeable substrate, 15 there are no other particular problems. The air permeable substrate is selected from the group consisting of table paper, non-woven fabric, cloth fabric or resin sheet. Even if the air-permeable base material itself has air permeability, the air permeability is not sufficiently increased, or when the air-permeable base material itself is not air-permeable, a perforation or a vent hole is provided in the ventilating substrate. Although the thermoplastic resin film can be fixed to the air-permeable substrate by a damascene structure, an adhesive tape, or a fusion bonding method, the fixing member is provided on the thermoplastic resin film and/or the aeration described above from the viewpoint of aesthetics or ease of fixation. The heat sealing material of the peripheral portion of the substrate is preferred. 10 200842720 In order to express the characteristic characteristics of the marking, it is preferable to provide a display portion on the non-loading side surface of the ic wafer of the air-permeable substrate. According to the present invention, there is provided a resin molded article having a 1C label which is integrally molded into a resin molded article as described above. 5 In order to improve the sufficient adhesion between the ic label and the resin molded article, the 1C label thermoplastic resin film and/or the air permeable substrate and the resin molded article are preferably substantially the same material. When the air-permeable base material of the 1C label and the resin molded article are made of different materials, the air-permeable base material of the 1C label is substantially different from the foregoing. A protective sheet made of the same material as the resin molded article. In order to secure a large joint area between the protective sheet and the resin molded article, the size of the protective sheet is larger than that of the 1C label. In order to exhibit the display characteristics of the 1C label as the label, the Ic standard has a display portion on the non-mounting side of the ic wafer of the I5 permeable substrate, and the resin molded article and/or the protective sheet are made of a light transmissive material. In the above configuration, the 1C label is arranged such that the display portion of the K: label faces outward. t. Embodiment 3 BEST MODE FOR CARRYING OUT THE INVENTION 2 〇 The J c label 1 according to the first embodiment of the present invention will be described in detail below with reference to Fig. 1. As shown in Fig. 1, the 1C label 1 of the present invention is configured to include 1 (the 1C core label 3 of the wafer 14 is placed on the air-permeable substrate 10, and the thermoplastic resin film is sealed by a close-pack method. 16 coating and fixing the 1C core standard 3. 11 200842720 The 1C wafer 14 stores electronic information about the object to be stored, and the storage object is stored in a folding container or a transport container called a crate. (a so-called delivery box), a resin-formed container used in a delivery box for a kanban system for purchasing logistics, or a label (5) attached to an article (for example, a uniform) or embedded in a frame or article. Electronic information of articles such as manufacturer-specific information, user-specific information, production management information, article number information, product feature information, material information or delivery destination information, etc. The 1C chip of the semiconductor integrated circuit is a lsi 10 wafer with a more integrated body. The antenna circuit substrate 12 is made of a material having flexibility or flexibility (for example, poly B) And a resin material such as polypropylene, polyester, or polyimide, or paper, etc., on the surface of the IC wafer 14 and the antenna circuit substrate 15 12 which are formed of a germanium wafer, are formed on the surface The antenna pattern is electrically connected to the electrode terminals on the center side of the antenna pattern. The antenna pattern having various shapes can be used depending on the wavelength of the radio wave used. The antenna pattern is a low resistance paste. It is formed by printing or transfer, and the low-resistance paste includes a conductive filler having a conductivity close to that of a conventional steel foil. The air-permeable substrate 1 is selected from the group consisting of Taiwanese paper, non-woven fabric, and cloth. The woven fabric or the resin sheet is composed of a material, and the air permeable base material 1 〇 has a thickness and hardness that does not cause warpage due to heat shrinkage of the thermoplastic resin film 16. The use of a paper substrate as a ventilating substrate 1 〇 The paper is very dry, so it is not necessary for the 12, 2008, 20, 720, s, s, s, s, s, s, s, s, s, s, Standard paper, which is added to the polypropylene resin and added by the biaxial stretching film method. The synthetic paper 5 (丫 )) used is preferably about W. In addition, due to the synthetic paper (γυρ〇) does not have air permeability. Therefore, when a vent hole is formed by a hole cutter or a needle-shaped needle having a tip end, and an ink layer is formed as a display portion as will be described later, A vent hole is provided away from the ink layer 18 (display portion). A non-woven fabric is a cloth in which the fibers are thermally, mechanically or chemically bonded or entangled, and has a certain degree of air permeability. The fabric itself woven by winding the fibers has a certain degree of air permeability. However, when the air permeability of the non-woven fabric or the woven fabric is insufficient, a hole formed by a hole thread cutter or a needle-shaped needle having a tip end is formed in the same manner as described above. "When a resin sheet is used as the air-permeable substrate 1G, a transparent heat-preserving sheet which has been subjected to the treatment of the strong weir may be used. For example, polyethylene terephthalate resin (PET) or polypropylene (ΡΡ) may be used. ), polycarbonate resin, polyethylene naphthalene oxime glycol ester (PEN), polyamide, hard vinyl chloride, etc. Since the resin sheet itself is not ventilated, it can be provided as described above. The wire knives or the vent holes formed by the needle-shaped needles having the tip end of the tip of the needle 20 are formed. The air permeability required for the air-permeable base material 10 means that the temperature of the molten base resin is in contact with the 1C label 1 during the molding. At this time, the air which is expanded by the heat of the molten resin contained in the ic label 1 can be released to the outside through the air permeable base material, but the molten resin does not pass through the air permeable base material 1 and enters the inner portion 13 200842720. In the case of the close-packing method, the vent hole of the air-permeable base material may be vacuum suction at the time of packaging, and removal of air which is thermally expanded during molding in the mold. Due to the use of molten resin for in-mold forming The viscosity is different, and the specific example is such that a through hole of 100 to 500 μm is formed randomly or regularly, and a through hole of 25 to 5 is randomly or regularly formed. Further, a hole knife is formed. a circular hole, an elongated hole or a dotted-shaped slit, and the hole spacing is, for example, a slit portion of 0.5 mm, a connecting portion 〇.5 mm to a slit portion h〇nim, a connecting portion 1 〇 leg, and a slit 10 15 20 portion 〇 .5 with, connecting part 〇.5 face ~ slit part 〇 -, connecting part 〇. 6 legs are better. The vent hole through the cross section can be straight, but in order to make the inner scorpion king easy to remove 'and in order to prevent molten resin The cross section of the vent hole which is penetrated by the human is gradually expanded from the mounting side of the non-mounted _ic wafer IC of the IC 14 to a tapered shape. The shape of the tapered cone can be perforated from the mounting side of the K wafer 14 It can be easily formed. The thermoplastic resin film can be made of various thermoplastic tree mooncakes suitable for packaging, such as: soft vinyl chloride film, f-acrylic ion film, polyethylene film, film, and Membrane, ethylene-acrylic acid copolymer And a acetaminophen film, etc., more specifically, a thermoplastic polyethylene film having a trade name of "sy in a thickness system such as just μιη.", a thermoplastic resin film 16 and/or a helium gas. ^ * Heat seal material as a fixing member. Heat seal + can be appropriately selected from the material coated on the peripheral portion of =1G. For example, gas = thermoplastic resin film 16 gas-ethylene resin, vinyl acetate 14 200842720 == resin, cigarette-smoke resin, ethylene - an ethylene glycol copolymer 4 remedy or an adhesive for the tablet type. The 1C core label 3 is placed by the matching shaft in the air-permeable substrate mark or the positioning pin hole, and the softened plasticity 5 tree moon film 16 is covered with the 1C core label 3 in advance, and the vacuum suction device is used. Ventilation ^ = base (four) inside (on the opposite side of the buckle core label 3) exhaust, such as true "" gas 600mmHg. As a result, in the state in which the thermosoftened thermoplastic resin film is 10 in the shape of the outer core of the 1C core label 3, the core of the buckle core is covered 3 - at this time, the heat of the thermoplastic resin film (10) by heat softening The heat-sealing material as a solid member is thermally fused, and the thermoplastic resin film 16 can be attached to the air-permeable substrate 10. When the thermoplastic resin film 16 is fixed to the air-permeable substrate 1 in a close-packed manner, the display property of the label is applied to the IC label (4). The 15th side of the opposite side of the ic core target metal 3' forms an ink layer 18 (display portion) of a desired pattern by printing ink. Ink % Water layer 18 (display 7^卩) shows that 7F has marked marks, owner's display * or bar code. Further, in order to protect the ink layer 18 (display portion), a surface protective layer 22 is formed on the ink layer 18 (display portion) by tempering (oxidation polymerization type) of 0P (0Verprint: 2). 2 and 3, the 1C label 1 and the resin molded article 7 with the Ic label according to the second embodiment of the present invention are described in detail, and the difference from the 1C label 1 of the first embodiment is described. The 1C label 1 of the second embodiment is characterized in that the preliminary processed body of the Ic label is folded by 15 200842720 in two halves based on the cut line 25 provided on the side of the air-permeable base material 10 (ie, The folding line is bent, and the thermoplastic resin film 16 is bonded to each other, and the wicking substrate 10 can be clamped to the buckle core label 3. The preliminary processed body 5 having a required size of the 1C mark 1 is prepared to be about twice as large. Here, the preliminary processed body 5 is made of the same method as the first embodiment 5, and has the redundant core label 3, the air permeable base material 10, and the thermoplastic resin film 16, and is heat-sealed in a close-packed manner. The plastic resin film 16 and the air permeable substrate 10 are tightly held together to hold the 1C core mark 3. As shown in Fig. 2, the preliminary processed body 5 has a mounting side portion 4' on the left side and a no-load side portion 42 on the right side, and a mounting side 1 side portion 4 on the left side. The embodiment of the embodiment is substantially the same. The pre-processed body 5 may be provided with the scribe line 25 in substantially two equal divisions, and the right side of the empty planting side portion 42 and the left side of the mounting side portion 4 may be The outer dimensions are the same; however, in order to ensure a large access area between the 1C core label 1 and the resin molded product 3 in the in-mold forming, the size of the no-load side portion 42 on the right side is preferably larger than the left side. The side portion 40. The cut line 25 formed on the side of the air-permeable base material 10 in the preliminary processed body 5 is partially or entirely provided in the thickness direction of the air-permeable base material 1 。. Further, the thermoplastic resin film is previously used. The surface of the 16 is coated with a heat-sealing material, and after the preliminary processed body 5 is folded with reference to the cut line 25, the heat-plasticity is obtained by abutting the heat-sealed heat-resistant 20 strips against the folded preliminary processed body 5. The resin crucibles 16 are bonded to each other to form a two-folded 1 (: label j) as shown in Fig. 3. Since the 1C wafer 14 of the 1C core tag 3 is held between the folded air-permeable substrates 1〇, the 1C wafer 14 is sandwiched by the air-permeable substrate 1〇. The IC tag 1 in which the above-mentioned valley fold line is folded in half is used. After being placed at a predetermined position in the in-mold forming die 16 200842720, the molten resin is injected from the ejection port into the inside of the mold, and is used for injection molding of resin-based polypropylene (PP), polyethylene (PE) or AB S, etc. Ultra-grade engineering plastics such as versatile resin, polycarbonate (PC) or polyolefin (PA), such as engineering plastics, liquid crystal polymer (LCD) or polyphenylene sulfide (PPS), which are excellent in heat resistance. The air-permeable base material 10 of the resin molded article 7 of the 1C label in which the valley fold line is bent can also function to block the heat-transmissive thermoplastic resin film from the molten resin from being transferred to the 1C wafer. Since the high-temperature, high-heat molten resin at the time of in-mold forming does not directly contact the thermoplastic resin film 16, the 10 1C core label 3 can be effectively prevented from being damaged. Further, in the air-permeable substrate 1 of the preliminary processed body 5, the inside of the air-permeable substrate 10 (the surface opposite to the 1C core label 3) is formed by printing ink to form the ink layer 18 of a desired pattern ( Display section). The ink layer 18 (display portion) is provided on both the mounting side portion 40 on the left side and the no-load side portion 42 on the right side. When the folded portion 15 is to be prepared, the workpiece 5 can be prepared on both sides of the 1C label 1. The ink layer 18 (display portion) is displayed on the surface. Therefore, when the in-mold molded resin molded article 7 is a plate-like or label-like thin plate such as a plate, a resin molded article having a 1C label can provide a large number of display portions. Next, the IC tag of the third embodiment of the present invention and the resin molded article 7 with the 1C tag according to the third embodiment of the present invention will be described in detail with reference to FIGS. 4 and 5, and are attached and attached with the above-mentioned second The resin molded article of the ic standard is described in the center of the difference. The 1C label 1 of the third embodiment is characterized in that the preliminary processed body 17 200842720 5 of the 1C label 1 is folded into two halves based on the cut line 25 provided on the side of the thermoplastic resin film 16 (i.e., the Yishan fold line) Bending) and joining the adhesive layers 24 to each other. Prepare the preparatory workpiece 5 having about twice the outer dimensions of the desired 1C label 1. As shown in Fig. 4, the preliminary processed body 5 has a mounting side portion 40 on the left side and a no-load side portion 42 on the right side. The adhesive layer 24 is provided on the surface of the air-permeable substrate 1 (the surface opposite to the 1C core label 3), and the separator paper 26 is further provided. The separator paper 26 can be attached and detached with respect to the adhesive layer 24. Since the separator paper 26 and the adhesive layer 24 are provided, the inside of the air-permeable base material 10 (the surface opposite to the 舆ic core label 3) loses air permeability, so the separator paper 26 on the side of the side portion 40 is placed on the left side. On the subsequent layer 24, a vent hole through which a hole cutter or a sharp needle-shaped body of the front end 10 is passed is provided. Therefore, in addition to the configuration of the adhesive layer 24 and the separation paper 26, the side portion 40 for placement on the left side is substantially the same as that of the first embodiment. In the same manner as in the second embodiment, the pre-processed body 5 may be provided with the scribe line 25 on the side of the thermoplastic resin film 16 substantially halved, and the side portion 42 on the right side 15 and the left side side may be configured. The mounting side portion 40 has the same outer dimensions. However, in order to secure a large joint area between the 1C core label 1 and the resin molded product 3 between the in-mold forming, the size of the right-hand side portion 42 on the right side is preferably configured to be It is larger than the mounting side portion 40 on the left side. In the preliminary processed body 5, the cut line - 20 25 formed from the side of the air-permeable base material 10 is provided on all of the thermoplastic resin film 16 and a part in the thickness direction of the air-permeable base material 10 . The free-loading side portion 42 located on the right side and the thermoplastic resin film 16 partially cut away from the mounting side portion 40 on the left side are removed. After the separation paper 26 is peeled off, the preliminary processed body 5 is folded with reference to the cut line 25, and the adhesive layer 24 is joined to each other to obtain a two-folded shape as shown in Fig. 5. Label 18 200842720
將刚述折疊之i c標籤安裝於模内成形用模具之預定位 置後攸射出口將、熔融樹脂射出注入模具内部，然後’從 权内成形用模具取出熔融樹脂硬化後的附有圯標籤之樹脂 成形物品7。如第5圖所示，附有IC標籤之樹脂成形物品7係 構成為在樹脂成形體3〇内部包含有依山摺線折疊之IC標籤 又’在預備加工體5之通氣性基材1〇中，對於通氣性基 材10之表面（與1C核心標籤3相同側之面），藉由印刷墨水形 10成所需圖案之墨水層18(顯示部）。藉由在左侧之載置用側部 40及右側之空載用側部42兩者設置墨水層18(顯示部），當摺 疊預備加工體5時，可在IC標籤！之裏面侧（與冗核心標籤相 反側之面）顯示出墨水層18(顯示部）。 接著，參照第6圖，詳細說明本發明第四實施型態之IC 15標籤及附有1C標籤之樹脂成形物品7。 在第6圖所不之第四實施型態之IC標籤及附有IC標籤 之樹脂成形物品7中，ic標籤〗與第一實施型態相同，而使 用透明保護片材32此點與到目前為止所說明之實施型態相 異。又，透明保瘦片材32係構成為大於ic標籤的外形尺寸， 20以包覆住1C標籤1，當通氣性基材10與樹脂成形體30為不同 材質時特別有效。 如前所述，通氣性基材10係由選自於台紙、不織布、 布織物或樹脂片材等各種材料所構成。在通氣性基材10係 與樹脂成形體30不同材質所構成的情況下，當進行模内成 19 200842720 形妗’通氣性基材10與樹脂成形體3〇間之封合性容易產生 問題。因此，宜如第6圖所示，在通氣性基材1〇側設置由實 質上與樹脂成形體30相同材質所構成之透明保護片材32。 藉由使透明保護片材32實質上與樹脂成形體為相同材 5質，除了可得到良好的封合性之外，也可解決模内成形後 之翹曲問題。例如，當樹脂成形體3〇為聚丙烯時，可使用 大阪樹脂加工株式會社製之無延伸聚丙烯（CPp)<E_〇6的 〇-5mm厚。透明保護片材32在與樹脂成形體3〇相對之熱封 面雖必須由同樣材質之樹脂所構成，但不一定需為單層， 10也可使用將藉由延伸而增加強韌性之膜材乾疊合後的積層 膜0 當樹脂成形體30為聚丙烯時，積層膜可使用雙軸延伸 聚丙浠膜(OPP)/無延伸聚丙稀膜(CPP)、尼龍(〇Ny)/無延伸 聚丙烯膜(CPP)、YUPO/無延伸聚丙烯膜(CPP)或聚對苯二 15甲酸乙二酯(PET)/無延伸聚丙烯膜(CPP)等。又，當樹脂成 形體30為聚乙浠時，積層膜可使用雙軸延伸聚丙烯膜 (OPP)/低密度聚乙烯膜（LDPE)、聚對苯二甲酸乙二酯臈 (PET)/低密度聚乙烯膜(LDPE)等。 當樹脂成形體30為聚丙烯，且使用雙軸延伸聚丙浠膜 2〇 (〇pp)/無延伸聚丙烯膜(CPP)作為積層膜之透明保護片材32 時，配置為雙軸延伸聚丙烯膜(OPP)露出表面，且無延伸聚 丙烯膜(CPP)位於内側。由於透明保護片材32係構成為可包 覆1C標籤1之較大外形尺寸，因此在模内成形於樹脂成形體 30内之IC&戴1的周緣部，會存在由聚丙稀所構成之樹脂成 20 200842720 10 15 20 形體30的部分。換言之，會於樹脂成形體30形成階段部。 因此’透明保護片材32可藉由其側面部與底部周緣部，對 於由聚丙烯所構成之樹脂成形體3〇的階段部進行熱封，並 且可確保充分的封合性。相對於此，當配置成雙軸延伸聚 丙烯膜(OPP)位於内側、且無延伸聚丙烯膜(cpp)露出表面 %，由於僅側面部可進行熱封，故無法確保充分的封合性。 另外，使用單層之無延伸聚丙烯膜(CPP)時，由於可藉由其 側面部與底部周緣部對於由聚丙烯所構成之樹脂成形體邛 進行熱封，故與配置成雙軸延伸聚丙浠膜(〇pp)露出表面 且無延伸聚丙烯膜(CPP)位於内側之情況具有相同的機能。 1C標籤1與透明保護片材32間之貼合可使用可耐声 加熱之無基材兩面接著帶（例如，曰東電工株式會社製的 版591刪）。另外’使用聚對苯二曱酸乙：_(ρΕτ)等作為 基材之接著帶，會因為熱伸縮而起皺，無法進行具有美觀 的成形。X，無耐熱性之廉價接著帶會因為熱而產生膨騰 現象，於樹脂成形品3G表面產生凹凸不平。使用不適當的 接著帶會減低商品價值，因此較不適宜。 田、 上述任-實施型態皆使用所謂的密著包裝方式，將忙 核心標籤m躲熱可雖樹賴16與通氣性構件1〇之 間’但也可使用所謂的氣泡包裝方式來挟持忙核心標氧3。 氣泡包裝方式係指將熱可雜樹脂膜i 6 (氯乙歸 浠腈)進行片狀成形，以具有可接受保持對象之物品的凹 部，並將物品插入前述凹部，再以台紙等進行密封之包壯 方法。由於需要用以成形熱可塑性樹脂片材之模具，該= 21 200842720 分之費用會反映於製造成本，但當大量生產同樣形狀之IC 標籤1時’具有可減低全體製造成本的可能性。氣泡包裝方 式中’不需要密著包裝方式中所需的真空吸引裝置，且在 氣泡包裝方式中，通氣性構件10的通氣孔係設置為用以使 • 5模内成形時熱膨脹之空氣除氣。因此，在氣泡包裝方式中， • 在事先成形之熱可塑性樹脂膜16的凹部中插入1C標籤3 後，藉由以通氣性構件1〇進行加蓋，可將IC標籤3挾持於熱 φ 可塑性樹脂膜16與通氣性構件1〇之間。藉由在熱可塑性樹 月曰膜16與通氣性構件1〇之間塗上熱封材而作為固定構件， 10可接著固定兩者。 另外，藉由上述密著包裝方式或氣泡包裝方式將熱可 ㈣樹賴测定於通氣性構件時，從美觀或容易進行固 疋的觀點來看，且使用塗上之熱封材，但也可以鑲嵌構造、 肘釘或溶接等方法將熱可塑性樹月旨膜1ό固定於通氣性基材 b 10 〇 22 200842720 【圓式簡單說明】 第1圖係本發明第一實施型態之ic標籤的截面圖。 第2圖係構成本發明第二實施型態之IC標籤的冗標籤 預備加工體的戴面圖。 第3圖係將第2圖所示之1C標籤預備加工體奪折為二 (依谷摺線彎折）而製作之1C標籤的截面圖。 第4圖係構成本發明第三實施型態之ic標籤的1C標籤 預備加工體的截面圖。After the folded ic label is attached to a predetermined position of the in-mold forming mold, the ejection port is ejected, and the molten resin is injected into the inside of the mold, and then the resin with the ruthenium label hardened by the molten resin is taken out from the mold for forming the inside. Shaped article 7. As shown in Fig. 5, the resin-molded article 7 with the IC tag is configured to include an IC tag folded in the inside of the resin molded body 3, and in the air-permeable substrate 1 of the preliminary processed body 5. The surface of the air-permeable substrate 10 (the surface on the same side as the 1C core label 3) is printed with an ink layer 10 into a desired pattern of the ink layer 18 (display portion). The ink layer 18 (display portion) is provided by both the mounting side portion 40 on the left side and the no-load side portion 42 on the right side, and when the preliminary processed body 5 is folded, it can be placed on the IC tag! The inner side (the side opposite to the redundant core label) shows the ink layer 18 (display portion). Next, an IC 15 label according to a fourth embodiment of the present invention and a resin molded article 7 with a 1C label will be described in detail with reference to Fig. 6. In the IC tag of the fourth embodiment and the resin-molded article 7 with the IC tag, which are not shown in Fig. 6, the ic tag is the same as the first embodiment, and the transparent protective sheet 32 is used. The implementations described so far differ. Further, the transparent thinned sheet 32 is configured to be larger than the outer dimensions of the ic label, and 20 is used to cover the 1C label 1, and is particularly effective when the air-permeable base material 10 and the resin molded body 30 are made of different materials. As described above, the air-permeable base material 10 is composed of various materials selected from the group consisting of table paper, non-woven fabric, cloth fabric, and resin sheet. When the air-permeable base material 10 is made of a different material from the resin molded body 30, the sealing property between the air-permeable base material 10 and the resin molded body 3 is likely to occur. Therefore, as shown in Fig. 6, it is preferable to provide a transparent protective sheet 32 which is substantially made of the same material as the resin molded body 30 on the side of the air-permeable base material. By making the transparent protective sheet 32 substantially the same as the resin molded body, in addition to obtaining good sealing properties, the problem of warpage after in-mold forming can be solved. For example, when the resin molded body 3 is made of polypropylene, 〇-5 mm thick of non-stretched polypropylene (CPp) <E_〇6 manufactured by Osaka Resin Processing Co., Ltd. can be used. The transparent protective sheet 32 must be made of a resin of the same material as the thermal cover opposite to the resin molded body 3, but it does not necessarily need to be a single layer, and 10 can also be used to increase the toughness of the film by extension. Laminated laminated film 0 When the resin formed body 30 is polypropylene, the laminated film may be a biaxially oriented polypropylene film (OPP) / a non-extended polypropylene film (CPP), a nylon (〇Ny) / a non-stretched polypropylene. Film (CPP), YUPO/non-stretch polypropylene film (CPP) or polyethylene terephthalate (PET) / non-stretch polypropylene film (CPP), and the like. Further, when the resin molded body 30 is polyethylene oxide, the laminated film may be a biaxially oriented polypropylene film (OPP) / a low density polyethylene film (LDPE), polyethylene terephthalate (PET) / low. Density polyethylene film (LDPE), etc. When the resin molded body 30 is polypropylene and a biaxially oriented polypropylene film 2 〇 (pp) / non-stretch polypropylene film (CPP) is used as the transparent protective sheet 32 of the laminated film, it is configured as a biaxially oriented polypropylene. The film (OPP) is exposed on the surface and the unstretched polypropylene film (CPP) is on the inside. Since the transparent protective sheet 32 is configured to cover a large outer dimension of the 1C label 1, a resin composed of polypropylene may be present in the peripheral portion of the IC& wear 1 molded in the resin molded body 30 in the mold. 20 200842720 10 15 20 Part of the body 30. In other words, the step portion is formed in the resin molded body 30. Therefore, the transparent protective sheet 32 can be heat-sealed to the step portion of the resin molded body 3 made of polypropylene by the side surface portion and the bottom peripheral portion thereof, and sufficient sealing property can be ensured. On the other hand, when the biaxially stretched polypropylene film (OPP) is disposed on the inner side and the unextended polypropylene film (cpp) is exposed on the surface %, since only the side surface portion can be heat-sealed, sufficient sealing property cannot be ensured. Further, when a single-layer non-stretched polypropylene film (CPP) is used, since the resin molded body made of polypropylene can be heat-sealed by the side surface portion and the bottom peripheral portion thereof, it is configured to be biaxially stretched polypropylene. The enamel film (〇pp) has the same function when the surface is exposed and the non-stretched polypropylene film (CPP) is located inside. For the bonding between the 1C label 1 and the transparent protective sheet 32, a substrate-free double-sided tape which is resistant to sound heating can be used (for example, 591 manufactured by Nippon Denshi Co., Ltd.). Further, the use of polyethylene terephthalic acid B: _(ρΕτ) or the like as a base tape of the substrate causes wrinkles due to thermal expansion and contraction, and aesthetic molding cannot be performed. X, which is inexpensive without heat resistance, causes a phenomenon of swelling due to heat, and causes unevenness on the surface of the resin molded article 3G. Inappropriate use of the belt will reduce the value of the commodity and is therefore less suitable. Tian, the above-mentioned arbitrary-implementation mode uses the so-called close-packing method, and the busy core label m can be kept hot between the tree 16 and the air permeable member 1 'but it can also be used by the so-called bubble packing method. Core standard oxygen 3. The bubble encapsulation method refers to a sheet-like molding of a thermo-resistible resin film i 6 (chloroacetonitrile) to have a concave portion that can receive an object to be held, and insert the article into the concave portion, and then seal it with a sheet of paper or the like. Package method. Since the mold for forming the thermoplastic resin sheet is required, the cost of the = 21 200842720 will be reflected in the manufacturing cost, but when the IC tag 1 of the same shape is mass-produced, there is a possibility that the overall manufacturing cost can be reduced. In the bubble packing method, the vacuum suction device required in the close-packing method is not required, and in the bubble packing mode, the vent hole of the air permeable member 10 is set to degas the air which is thermally expanded during the forming of the mold. . Therefore, in the bubble packing method, the 1C label 3 is inserted into the concave portion of the thermoplastic resin film 16 which has been formed in advance, and the IC label 3 can be held by the heat φ plastic resin by capping with the air permeable member 1A. The membrane 16 is interposed between the air permeable member 1A. By applying a heat seal material between the thermoplastic tree meniscus film 16 and the air permeable member 1A as a fixing member, 10 can be fixed both. Further, when the heat-reducible member is measured by the above-described close-packing method or bubble packing method, the heat-sealing material may be applied from the viewpoint of aesthetics or ease of solidification, but it may be used. The method of inserting a structure, nailing or welding to fix the thermoplastic resin film 1 于 to the air permeable substrate b 10 〇 22 200842720 [Circular brief description] Fig. 1 is a cross section of the ic label of the first embodiment of the present invention Figure. Fig. 2 is a front view showing a redundant label preparation body of an IC tag of a second embodiment of the present invention. Fig. 3 is a cross-sectional view showing a 1C label produced by folding the 1C label preparation body shown in Fig. 2 into two (bending according to the valley fold line). Fig. 4 is a cross-sectional view showing a 1C-label preparatory processed body constituting the ic label of the third embodiment of the present invention.
第5圖係將第4圖所示之冗標籤預備加工體彎折為二 (依山摺線彎折）而製作之1C標籤的截面圖。 第6圖係本發明第四實施型態之附有1C標籤之樹脂成 形物品的截面圖。 【主要元件符號說明】 1 · · .1C標籤 22…表面保護層 3· "1C核心標籤 24.··接著層 5...預備加工體 25…切痕線 7· ··附有1C標籤之樹脂成形物品 26…分隔紙 10.. •通氣性基材 12.. .天線電路基材 14. .«1C 晶片 16.. .熱可塑性樹脂膜 18.. .墨7乂層(顯示部） 30…樹脂成形品 32···透明保護片材 40···載置用側部 42…空置用侧部 23Fig. 5 is a cross-sectional view showing a 1C label produced by bending the redundant label preparation body shown in Fig. 4 into two (bending the mountain fold line). Fig. 6 is a cross-sectional view showing a resin molded article with a 1C label according to a fourth embodiment of the present invention. [Explanation of main component symbols] 1 · · .1C tag 22...Surface protection layer 3· "1C core tag 24.··Next layer 5...Prepared processed body 25...Cut line 7···With 1C tag Resin molded article 26... separator paper 10: • air permeable substrate 12: antenna circuit substrate 14. .1 1C wafer 16.. thermoplastic resin film 18: ink 7 layer (display portion) 30...Resin molded article 32···Transparent protective sheet 40···mounting side portion 42...empty side portion 23