200835738 九、發明說明 【發明所屬之技術領域】 本發明係有關導熱性之樹脂組成物。 【先前技術】 近年來，伴隨機器之高性能化、小型化，由各種電子 機器之內部所產生之熱量年年大增。此等產生之熱乃造成 裝置運作不良之原因，所產生之熱對於效率性，且急速散 熱出現極大問題點。作爲此等散熱對策之手段者，將導熱 性塡料混合於橡膠或樹脂中，廣泛使用各種導熱性材料。 近年，用於此等之散熱構件不僅被要求低熱電阻化，亦期 待散熱構件本身的薄膜化。 作爲先行技術之散熱構件者，有聚矽氧橡膠中塡充導 熱性無機塡料之硬化物所成之散熱薄片、聚矽氧凝膠中塡 入導熱性無機塡料，具柔軟性之硬化物所成散熱隔離片、 液狀聚矽氧中塡入導熱性無機塡料之具流動性之散熱膏、 利用經熱後樹脂相變化之相變化型散熱構件（以下稱相變 化）等例。此等中又以散熱膏及相變化較易薄膜化，而由 作業性面觀之，又以相變化優於散熱膏。 作爲相變化者，如：於發熱性電子零件之運作溫度下 ，相變化之導熱性相變化物質，如：蠟類中，塡入1 0〜80 體積份之平均粒徑2〜100 μιη之氮化硼或氧化鋁粒子爲公知 者（專利文獻1 )惟，此等不具自體黏著性，因此，爲提 昇防止裝置時出現錯位之裝置作業，務必於散熱構件上塗 -4- 200835738 佈糊等黏著劑。因此增加作業步驟等，導致對於生產性造 成不良影響，且降低散熱性之問題存在。 又，爲維持自體黏著性亦被揭示藉由乙烯-乙酸乙烯 酯共聚物等之加熱後進行軟化之樹脂，同時含有合成橡膠 系熱熔融黏著劑，塡充導熱塡料之自體黏著型相變化（專 利文獻2)惟，安裝時之作業性問題上，務必使軟化溫度 爲5 0 °C以上，對於被要求更低溫下相變化之使用條件，存 在無法充份取得散熱特性之問題點。 專利文獻1 :特開200 1 -89756號公報 專利文獻2 :特開平2004- 1 1 5 596號公報 【發明內容】 鑑於上述，本發明之目的爲提供一種具有自體黏著性 ，同時顯示低熱電阻，且於更低溫下軟化，安裝時作業性 亦良好之適於發熱性電子零件之散熱材料之樹脂組成物。 本發明爲解決該課題，進行精密硏討後結果發現具有 下述重點，進而完成本發明。 1·其特徵爲含有（a) 5〜20體積份、較佳者爲5〜15體積份 之乙烯•乙酸乙烯酯共聚物、（b) 2〜20體積份，較佳者 爲4〜20體積份之聚乙烯繼、（c) 1〜20體積份，較佳者爲 10〜20體積份之藩燔•苯酣共聚物，及（d) 40〜75體積份 ，較佳者爲55〜70體積份之導熱性無機粉末所成之樹脂組 成物。 -5- 200835738 2. 更含有（e) 3〜10體積份，較佳者爲3〜6體積份之流動 石鱲所成之申請項1所載之樹脂組成物。 3. 更含有（Ο 〇.〇1〜1〇體積份、較佳者爲〇·〇1〜5體積份之 具80 °C以下熔點之低熔點金屬所成之申請項1所載之樹脂 組成物 4. 進一步含有（e) 3〜10體積份、較佳者爲3〜6體積份之 流動石鱲，及（f) 0·01〜10體積份，較佳者爲0.01〜5體 0 積份之具有80°c以下熔點之低熔點金屬所成之申請項1所 載之樹脂組成物 5. 使用該1項至該4項中任一項之樹脂組成物，厚度爲 0.05〜0.5mm之薄片。 6. 於部份或全部金屬之單側或雙側上具有該1項至該4項 中任一項之樹脂組成物之薄片。 7·於部份或全部金屬表面上具有該1項至該4項中任一項 之樹脂組成物之成形體。 參 本發明樹脂組成物爲具有自體黏著性同時顯示低熱電 阻’於低溫下軟化，且安裝時作業性良好，因此適於發熱 性電子零件之散熱材料。 【實施方式】 [發明實施之最佳形態] 以下，進行本發明之詳細說明。另外，代表本發明所 混合物等配合比之單位來特別指定下以體積爲基準示之。 -6- 200835738 本發明所使用之乙烯•乙酸乙烯酯共聚物較其他熱塑 性樹脂較具橡膠彈性，且改變乙酸乙烯酯含有率後，熔點 改變，可調整柔軟性、黏著性等。乙酸乙烯酯含量爲 10〜40體積份者宜，由聚乙烯躐之互溶性面觀之，更以 15〜3 5體積份爲更佳。當乙酸乙烯酯含量低於1〇體積份時 ，則導熱性無機粉末之塡充性將變差。反之，超出40體 積份則熔融時黏度變高，無法成薄片之成形。作爲該乙烯 •乙酸乙烯酯共聚物例者如：Ultracen (東曹公司商品名 )、「Ultzex」（三井化學公司商品名）、「evaflex」（ 三井 diupon chemical公司商品名）等例。 本發明所使用之聚乙烯蠟之熔點爲4 0〜7 0 °C者宜，考 量減少對於經由導熱性無機粉末之塡充後熔點之影響，更 以使用40〜60 °C之聚乙烯躐的熔點爲更佳。當熔點低於40 °C時，於保管時，運作時，曝露於高溫雰圍下，將使聚乙 烯蠟出現熔融，將無法保持該組成物之薄片狀形態。反之 ，超出70 °C之熔點時，將超出一般發熱性電子零件之運作 溫度，因此使用樹脂組成物時出現無法熔解、不易薄膜化 之現象。聚乙烯蠟之例如「石蠟115」、「HNP_5」、「 EMW-001」（均爲日本精蠟公司製）等例。 用於本發明之藏烯•苯酚共聚物，儘管爲低分子量， 卻顯示極高之黏度，可有效降低具有自體黏著性之樹脂組 成物的軟化溫度。作爲該組成物時之熔點爲2 5〜7 0 °C者宜 ，經由導熱性無機粉末之塡充對於熔點之影響少，因此熔 點爲3 0〜5 0 °C之使用更爲理想。當熔點低於2 5 °C時，則於 200835738 保管時，輸送時曝露於高溫環境下，使蒎烯•苯 熔融，導致該組成物無法保持薄片狀形態。反之 點70 °C時，則超出一般發熱性電子零件之運作溫 樹脂組成物時無法熔解、不易薄膜化。爲該蒎烯 聚物者，如：「YS Polystar T30」（Yasuhara 公司製）等之萜烯•苯酚共聚物之例。 本發明之熔點係利用Seko Instur公司製「 熱量計SSC5 200」，進行測定。測定方式如：將 1 Omg樹脂組成物之樣品置入鋁製容器，上蓋。 料之氧化鋁粉末爲基準。同樣將1 Omg之氧化鋁 鋁製容器，進行上蓋。如此設定裝置上蓋之樣品 之昇溫速度下，由室溫至l〇〇°C之溫度進行昇溫 測定之。標繪掃描溫度與溫度差，顯示所得之曲 作爲熔點。 用於本發明之流動石鱲係使熔融時流動性增 ，促進本組成物之薄膜化，具低熱電阻化之效果 蠟於〇〜5 0 °c之溫度範圍下，爲理想之流動體之石 作爲用於本發明之導熱性無機粉末者如：導 10W/mK以上，特別爲30W/mK以上之無機物， 種或2種以上選自金剛石粉末、銀粉末、銅粉末 、不鏽鋼粉末、鋁粉末、氮化鋁粉末、氮化矽粉 硼粉末、氧化鋅粉末、及氧化鋁粉末之群的粉末 別限定，一般使用高導熱率者，泛用之氧化鋁粉 鋁粉末、鋁粉末、或氧化鋅粉末者宜。 酚共聚物 ，超出熔 度，使用 •苯酚共 Chemical 示差掃描 所測定之 用標準試 粉末置入 ，以 1 0 °c 1分鐘， 線極小値 大，因此 。流動石 蠟。 熱率選自 可使用1 、錫粉末 末、氮化 。並未特 末、氮化 - 8 - 200835738 又，有關其導熱性無機粉末之粒度，依其所製之相變 化層之厚度而異，以雷射繞射式粒度分佈測定裝置SALD-200 (島津製作所公司商品名）所測定之平均粒徑（直徑 )D50値爲0. 1〜8 0μπι者宜。其中所使用之平均粒徑D50 値係以雷射繞射式粒度分佈測定裝置，經由傳感器所檢出 之粒子，由繞射/散射光之光強度分佈數據算出粒度分佈 ，所測定粒徑之値加上相對粒子量（差分％ )，被相對粒 子量合計（100%)相除後求取之。 本發明所使用之低熔點金屬以具有80 °C以下，較佳者 爲3 0〜7 0 °C之熔點的金屬或合金者宜。當熔點超出8(TC時 ，則難以寄望對於樹脂組成物所期待之較低軟化溫度條件 下之散熱特性之提昇。低熔點金屬之含量爲0.01〜10體積 份者宜，特別以〇·〇1〜5體積份爲最佳。當低熔點金屬含 量未達〇·〇1體積份則其提昇散熱特性之效果極小，反之 超出1 〇體積份則不易均勻混合之。 理想之低熔點金屬例如：In系、Bi系、或Sn系等合 金等。 本發明藉由使（a)乙烯·乙酸乙烯酯共聚物、（b) 聚乙烯蠟、（c )蒎烯•苯酚共聚物、及（d )導熱性無機 粉末經由最適配合後，其樹脂組成物之軟化溫度爲5 0 °C以 下，較佳者爲30〜50°C，可於低溫下進行相變化，50°C以 下之低溫，仍可充份取得散熱特性。 更藉由加入（e)流動石躐，及/或（f)具有80 °C以 下之熔點的低熔點金屬後，可提昇其特性。 -9- 200835738 可使用配合於熱熔融黏著劑等所使用之熱塑性樹脂之 樹脂改質劑、可塑劑、抗老化劑、偶合劑等作爲任意成份 。如：作爲樹脂改質劑者有：苯乙烯-乙烯/丁烯-苯乙烯之 三嵌段共聚物（SEBS )、苯乙烯-乙烯/丙烯-苯乙烯之三 嵌段共聚物（SEPS )等例。 本發明中，將該成份利用可加熱之加壓揑合器、熱揑 合器、行星混合器等混煉器，於可熔觸聚乙烯蠟之溫度下 ’與導熱性無機粉末均勻混合。如此取得之混合物可藉由 如：擠壓成形、壓延成形、滾輥成形、加壓成形作成薄片 狀樹脂組成物之成形。又，此時，同時混合溶劑等，進行 塗料化、塗佈後乾燥仍可呈薄膜化。進一步亦可具有所定 之形狀，如：於金屬對進行塗佈，亦可作成薄膜化。 本發明薄片化之樹脂組成物厚度爲〇 · 〇 5〜0.5 m m者宜 ’更佳者爲0·1〜0.4mm。當薄片厚度未達〇.〇5mm時，則 不易使用，反之超出0 · 5 mm，則即使相變化，仍無法有效 薄膜化，未能取得充份之散熱特性。 本發明樹脂組成物進行薄片化或塗料化後，黏合於部 份或全部金屬之箔，如：鋁箔之單側或雙側，或進行塗佈 後，進一步提昇使用性，更可重覆使用。 [實施例] 以下列舉實施例進行說明本發明，惟本發明未受限於 此等實施例。 -10- 200835738 (實施例1〜9、比較例1〜5 ) 依表1及表2所示比例進行配合熔點爲45t之聚乙燒 蠟（日本精躐公司製商品名「EMW-0003」）、乙烯、乙 酸乙烯酯共聚物（東曲公司製商品名「Ultracen」、藏嫌 •苯醋共聚物（yasuhara chemical 公司製 YS p〇iyStar T30、熔點 30 °C )、流動石躐（松村石油硏究所製 mole sco white )、平均粒徑爲2μπι (雷射繞射法所測定之 D50値）之氧化鋁粉末（住友化學公司製商品名：ΑΑ-2、 導熱率30W/mK )、低熔點金屬（大阪朝日金屬公司製 UAroi 60、熔點60°C )以如表1及表2所示比率下添加， 利用可加熱處理之熱揑合器，於80 °C之溫度下進行加熱混 合處理1 〇分鐘。將該取得組成物於熔解狀態下，利用本 公司製之刮刀混合器，以PET分離器挾住兩面之狀態下， 製作各厚度之薄片。各特性依下述方法求取之。 (1 )熱電阻 於埋入加熱器之直立銅製機架（頂端爲100mm2)與 裝置冷卻散熱片之直立銅製機架（頂端爲100mm2)之間 挾住厚度0 · 1 5 mm之試料（樹脂組成物薄片），每一平方 公分載重4kg，使試料與銅製機架進行密合。試料量作成 埋入全體密合面之狀態。於加熱器加入電力20W，保持 3 〇分鐘，測定銅製機架相互之溫度差（°C )，依下式算出 〇 熱電阻（°C /W) ={溫度差（°c ) /電力（W) }、 -11 - 200835738 (2 )使用性 作爲使用性者，對於作爲散熱片使用之普通的鋁材（ 1 05 0材）之複製性依以下評定其兩面。 X…未黏合，黏合時薄片受損。 〇…薄片未受損，黏合者。 (3 )軟化溫度 利用黏彈性分光計（Auton Paar公司製MCR301)， 測定黏彈性光譜，使出現急速減少貯存彈性率時之貯存彈 性率曲傾斜爲最大之點作成軟化溫度計測之。 (實施例1 0 ) 進行製作以層合器黏合實施例1所製作之樹脂組成物 薄片與錦箱（福田金屬箔公司製、厚度3 0 μ m )。此於測 定熱電阻後，由測定裝置取出，可再次測定，且熱電阻値 仍相同。 -12- 200835738200835738 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a resin composition relating to thermal conductivity. [Prior Art] In recent years, with the high performance and miniaturization of machines, the amount of heat generated by the inside of various electronic devices has increased year by year. The heat generated is responsible for the poor operation of the device, and the heat generated is extremely problematic for efficiency and rapid heat dissipation. As a means of such heat dissipation measures, a thermal conductive material is mixed in a rubber or a resin, and various thermally conductive materials are widely used. In recent years, the heat dissipating members used for such heat are not only required to have low thermal resistance, but also to be thinned by the heat dissipating member itself. As a heat-dissipating member of the prior art, there is a heat-dissipating sheet made of a hardened material of a heat-conductive inorganic material in a polyoxyxene rubber, a thermally conductive inorganic material in a polysiloxane gel, and a softened hardened material. Examples of the heat-dissipating separator, the fluid-based heat-dissipating paste in which the thermally conductive inorganic mash is introduced into the liquid polyfluorene, and the phase-change heat-dissipating member (hereinafter referred to as phase change) which is changed by the heat-treated resin phase. In this case, the heat-dissipating paste and the phase change are more easily thinned, and the workability is superior to that of the heat-dissipating paste. As a phase changer, for example, a phase change thermal conductivity phase change substance at a working temperature of a heat-generating electronic component, such as a wax, which contains 10 to 80 parts by volume of an average particle diameter of 2 to 100 μm of nitrogen. Boron or alumina particles are known (Patent Document 1). However, these are not self-adhesive. Therefore, in order to improve the device during the prevention of the device, it is necessary to apply the adhesive to the heat-dissipating member. Agent. Therefore, an increase in work steps and the like causes a problem that adversely affects productivity and reduces heat dissipation. Further, in order to maintain the self-adhesiveness, a resin which is softened by heating with an ethylene-vinyl acetate copolymer or the like, and a synthetic rubber-based hot-melt adhesive, and a self-adhesive phase of a heat-conductive conductive material are also disclosed. In the case of the workability at the time of installation, the softening temperature is required to be 50 ° C or more, and there is a problem that the heat dissipation characteristics cannot be sufficiently obtained for the use conditions in which the phase change is required at a lower temperature. In the light of the above, it is an object of the present invention to provide a self-adhesive property while exhibiting a low thermal resistance. And it is a resin composition which is softened at a lower temperature and is excellent in workability at the time of mounting, and is suitable for a heat dissipating material of a heat-generating electronic component. In order to solve this problem, the present invention has been found to have the following points, and the present invention has been completed. 1) characterized by containing (a) 5 to 20 parts by volume, preferably 5 to 15 parts by volume of the ethylene-vinyl acetate copolymer, (b) 2 to 20 parts by volume, preferably 4 to 20 parts by volume. a portion of the polyethylene, (c) 1 to 20 parts by volume, preferably 10 to 20 parts by volume of the hydrazine benzoquinone copolymer, and (d) 40 to 75 parts by volume, preferably 55 to 70 parts by weight. A resin composition of a volume of thermally conductive inorganic powder. -5- 200835738 2. More preferably, it contains (e) 3 to 10 parts by volume, preferably 3 to 6 parts by volume of the resin composition of the invention. 3. A resin composition as set forth in claim 1 which has a low melting point metal having a melting point of 80 ° C or less, preferably 1 to 1 part by volume, preferably 1 to 5 parts by volume. Further, (e) 3 to 10 parts by volume, preferably 3 to 6 parts by volume of the mobile sarcophagus, and (f) 0. 01 to 10 parts by volume, preferably 0.01 to 5 body 0 product. A resin composition as set forth in claim 1 which has a low melting point metal having a melting point of 80 ° C or less. 5. The resin composition according to any one of the items 1 to 4, having a thickness of 0.05 to 0.5 mm. 6. A sheet having a resin composition of any one of the items 1 to 4 on one or both sides of a part or all of the metal. 7· having the item on a part or all of the metal surface The molded article of the resin composition according to any one of the above items. The resin composition of the present invention has self-adhesiveness and exhibits low thermal resistance, softens at low temperature, and has good workability during mounting, and is therefore suitable for heat generation. [Embodiment] [Best Mode for Carrying Out the Invention] Hereinafter, the present invention will be described in detail. The ethylene/vinyl acetate copolymer used in the present invention is more rubber-elastic than other thermoplastic resins, and the acetic acid is changed, on the basis of the unit of the mixture ratio of the mixture of the present invention and the like. -6- 200835738 After the vinyl ester content rate, the melting point is changed, and the flexibility, adhesiveness, etc. can be adjusted. The vinyl acetate content is preferably 10 to 40 parts by volume, and the mutual solubility of the polyethylene oxime is more than 15 to 35 parts by volume. More preferably, when the vinyl acetate content is less than 1 part by volume, the thermal conductivity of the inorganic powder will be deteriorated. Conversely, if it exceeds 40 parts by volume, the viscosity will become high upon melting, and it will not be formed into a sheet. Examples of the ethylene-vinyl acetate copolymer include Ultren (trade name of Tosoh Corporation), "Ultzex" (trade name of Mitsui Chemicals Co., Ltd.), and "evaflex" (trade name of Mitsui Diupon Chemical Co., Ltd.). The melting point of the polyethylene wax is preferably from 40 to 70 ° C. The effect of reducing the melting point on the melting point after the thermal conductive inorganic powder is further increased by using a polyethylene crucible of 40 to 60 ° C. The melting point is more preferable. When the melting point is lower than 40 ° C, when it is stored, during operation, exposure to a high temperature atmosphere will cause the polyethylene wax to melt, and the sheet-like form of the composition will not be maintained. When the melting point of °C exceeds the operating temperature of the general heat-generating electronic component, the resin composition cannot be melted and is not easily thinned. For example, "paraffin 115", "HNP_5", "EMW-" 001" (all manufactured by Nippon Seiko Co., Ltd.), etc. The olefinic phenol copolymer used in the present invention exhibits an extremely high viscosity despite being low molecular weight, and can effectively reduce the resin composition having self-adhesiveness. Softening temperature. The melting point of the composition is preferably from 25 to 70 ° C. The effect of the thermal conductive inorganic powder on the melting point is small. Therefore, the melting point is preferably from 30 to 50 ° C. When the melting point is lower than 25 °C, it is exposed to a high temperature environment during transportation at 200835738, and the terpene and benzene are melted, so that the composition cannot maintain the flaky form. On the other hand, when the temperature is 70 °C, it will not melt and will not be thinned when it exceeds the operating temperature of the general heat-generating electronic component. Examples of the terpene phenol copolymer such as "YS Polystar T30" (manufactured by Yasuhara Co., Ltd.). The melting point of the present invention was measured by a "calorimeter SSC5 200" manufactured by Seko Instur Co., Ltd. For the measurement method, a sample of 1 Omg of the resin composition is placed in an aluminum container, and the upper cover is placed. The alumina powder is based on the material. A 1 Omg alumina aluminum container was also placed on the top cover. The temperature of the sample on the upper cover of the apparatus was set to be measured by the temperature rise from room temperature to l〇〇 °C. Plot the scan temperature to the temperature difference and display the resulting curve as the melting point. The mobile sarcophagus used in the present invention increases the fluidity during melting, promotes the thinning of the composition, and has the effect of low thermal resistance. The wax is an ideal fluid in the temperature range of 〇~50 °c. As the thermally conductive inorganic powder used in the present invention, for example, an inorganic material having a conductivity of 10 W/mK or more, particularly 30 W/mK or more, or two or more kinds selected from the group consisting of diamond powder, silver powder, copper powder, stainless steel powder, aluminum powder, The powder of the aluminum nitride powder, the cerium nitride powder, the zinc oxide powder, and the alumina powder is not limited, and generally, a high thermal conductivity, a general-purpose alumina powder aluminum powder, an aluminum powder, or a zinc oxide powder is generally used. Suitable. The phenolic copolymer, beyond the melting point, was measured using a standard test powder using a phenol co-chemical differential scanning. At 1 0 °c for 1 minute, the line was extremely small and large. Flowing paraffin. The heat rate is selected from the use of 1, tin powder, and nitriding. It is not the end, nitriding - 8 - 200835738 In addition, the particle size of the thermally conductive inorganic powder varies depending on the thickness of the phase change layer produced by it, and the laser diffraction type particle size distribution measuring device SALD-200 (Shimadzu The average particle diameter (diameter) D50 measured by the manufacturer's product name is 0. 1~8 0μπι. The average particle diameter D50 used therein is a laser diffraction type particle size distribution measuring device, and the particle size distribution is calculated from the light intensity distribution data of the diffracted/scattered light by the particles detected by the sensor, and the particle size is determined. The amount of relative particles (% difference) is obtained by dividing the total amount of particles (100%). The low melting point metal used in the present invention is preferably a metal or an alloy having a melting point of 80 ° C or lower, preferably 30 ° to 70 ° C. When the melting point exceeds 8 (TC), it is difficult to expect an improvement in the heat dissipation characteristics under the lower softening temperature conditions expected for the resin composition. The content of the low melting point metal is preferably 0.01 to 10 parts by volume, particularly 〇·〇 1 to 5 parts by volume is optimal. When the content of the low-melting-point metal is less than 1 part by volume, the effect of improving the heat-dissipating property is extremely small, and if it exceeds 1 part by volume, it is not easy to uniformly mix. The ideal low melting point metal is, for example: An alloy such as an In-based, Bi-based or Sn-based alloy. The present invention is achieved by (a) an ethylene-vinyl acetate copolymer, (b) a polyethylene wax, (c) a decene-phenol copolymer, and (d) After the thermally conductive inorganic powder is optimally blended, the softening temperature of the resin composition is 50 ° C or lower, preferably 30 to 50 ° C, and the phase change can be carried out at a low temperature, and the low temperature at 50 ° C or lower can still be used. The heat dissipation characteristics can be fully obtained. Further, by adding (e) flowing sarcophagus, and/or (f) a low melting point metal having a melting point of 80 ° C or lower, the characteristics can be improved. -9- 200835738 can be used in combination with heat Resin modification of thermoplastic resin used for melt adhesives, etc. Agents, plasticizers, anti-aging agents, coupling agents, etc. as optional components. For example, as a resin modifier: styrene-ethylene/butylene-styrene triblock copolymer (SEBS), styrene-ethylene / propylene-styrene triblock copolymer (SEPS) and the like. In the present invention, the composition is heated by a pressure kneader, a hot kneader, a planetary mixer or the like, in a fusible contact. The temperature of the vinyl wax is uniformly mixed with the thermally conductive inorganic powder. The mixture thus obtained can be formed into a sheet-like resin composition by, for example, extrusion molding, calender molding, roll forming, or pressure molding. At the same time, the solvent is mixed, the coating is applied, and the coating is dried, and the film may be formed into a film. Further, it may have a predetermined shape, for example, coating the metal pair or forming a film. The thickness of the material is 〇· 〇5~0.5 mm, which is better than 0·1~0.4mm. When the thickness of the sheet is less than 〇.〇5mm, it is not easy to use, and if it exceeds 0 · 5 mm, even if the phase changes Still unable to effectively thin, not It can obtain sufficient heat dissipation characteristics. After the resin composition of the present invention is flaky or coated, it is adhered to a part or all of the metal foil, such as one side or both sides of the aluminum foil, or further coated after being coated. The present invention will be described below by way of examples, but the present invention is not limited to the examples. -10- 200835738 (Examples 1 to 9 and Comparative Examples 1 to 5) According to the ratios shown in Table 1 and Table 2, a polyb-baked wax (trade name "EMW-0003" manufactured by Nippon Seiki Co., Ltd.) and ethylene and a vinyl acetate copolymer (product name "Ultracen" manufactured by Dongqu Corporation) were blended at a melting point of 45t. , Benzene vinegar copolymer (YS p〇iyStar T30, yasuhara chemical company, melting point 30 °C), mobile sarcophagus (mole sco white made by Matsumura Oil Research Institute), average particle size 2μπι (laser winding) Alumina powder (product name: ΑΑ-2, thermal conductivity: 30 W/mK manufactured by Sumitomo Chemical Co., Ltd.) and low melting point metal (UAroi 60 manufactured by Osaka Asahi Metal Co., Ltd., melting point: 60 ° C) Added in the ratios shown in Table 1 and Table 2, Heat treatment of heating kneader, heated at a temperature of 80 ° C mixing for 1 minute square. The obtained composition was melted, and a sheet of each thickness was produced in a state in which the PET separator was used to hold both sides by a doctor blade mixer. Each characteristic is obtained by the following method. (1) The thermal resistance is between the upright copper frame (100 mm2 at the top) embedded in the heater and the upright copper frame (100 mm2 at the top) of the device cooling fins. The sample with a thickness of 0 · 15 mm (resin composition) The sheet is 4 kg per square centimeter, so that the sample is tightly bonded to the copper frame. The sample amount is made into a state in which the entire adhesion surface is buried. Add 20W of power to the heater for 3 〇 minutes, measure the temperature difference (°C) between the copper frames, and calculate the thermal resistance (°C /W) = {temperature difference (°c) / power (W) }, -11 - 200835738 (2) Usability as a usability, the two sides of the ordinary aluminum material (100 0) used as a heat sink are evaluated as follows. X...Unbonded, the sheet is damaged when bonded. 〇...The flakes are not damaged, and they stick. (3) Softening temperature The viscoelastic spectrum was measured by a viscoelastic spectrometer (MCR301 manufactured by Auton Paar Co., Ltd.), and the softness of the storage elastic rate when the storage elastic modulus was rapidly reduced was made to be the softening thermometer. (Example 10) A resin composition sheet produced in Example 1 and a box (manufactured by Fukuda Metal Foil Co., Ltd., thickness: 30 μm) were bonded by a laminator. After measuring the thermal resistance, it is taken out by the measuring device and can be measured again, and the thermal resistance 値 is still the same. -12- 200835738
實施例9 卜 〇〇 vn ο 0.15 0.08 〇 實施例8 〇 CN (N vo ο 0.01 寸 ο 0.08 〇 實施例7 〇〇 寸 ο ο 寸 ο 0.08 〇 實施例6 ON 〇 ι—Η 0.10 [ 0.07 〇 實施例5 (N ο Ο 0.15 0.07 〇 實施例4 〇 〇 m (Ν 0.15 0.07 〇 實施例3 ο 0.15 0.06 〇 實施例2 〇〇 ο r-H 0.15 0.08 〇 實施例1 〇 t—Η * 0.15 0.08 〇 材料類別 乙烯•乙酸乙烯酯共聚物 聚乙烯蠘 蒎烯•苯酚共聚物 流動石蠘 氧化鋁粉末 低熔點金屬 厚度(mm) 熱電阻(°c/w) 使用性 軟化溫度(°c) 配合 (體積份） 物性 -13- 200835738 ·· <N撇 比較例5 〇〇 00 00 00 〇〇 m ο ^Τ) r*H ο ο <Ν Ο 〇 寸 鎰 ON (N 〇 (N 卜 卜 ο 1? κ- 比較例3 m ο r-H Ο 卜 ο ο X 寸 寸 (N 鎰 ΛΛ ο (Ν 〇 〇〇 ο νο y^i in τ-Η Ο (Ν r—Η Ο 〇 比較例1 寸 〇 Ο ^-Η r-H Ο 00 ο ο X OO 材料類別 餾 N3 m N3 賴 苯酚共聚物 长 國 /^Ν S Ρ /^v Ρ 鲁 • ηη <Η^ m S a _ 叢 N3 裝 limiV ΠΠΓΓι m 姻 ϋ 昍 KI 權 嫔 祕 1ft ig Τ〇ΓΓ <〇 m. 15 m i^zn 物性 -14- 200835738 本發明之樹脂組成物爲具 阻，於5 (TC以下之低溫下進行 好。 [產業上可利用性] 本發明樹脂組成物，可適戶 外，對於所有發熱物而言，使g 另外，其中引用2006年1 利申請2006-28 807 1號之明細1 內容，作成本發明說明書之揭元 自體黏著性與顯示低熱電 化，且安裝時之作業性良 於電子零件之散熱材料之 :熱傳至另一材料。 〇月23日所申請之日本專 I ’專利申請範圍及摘要全 :記入者。Example 9 Divination vn ο 0.15 0.08 〇Example 8 〇CN (N vo ο 0.01 inch ο 0.08 〇Example 7 〇〇 inch ο ο inch ο 0.08 〇Example 6 ON 〇ι—Η 0.10 [ 0.07 〇Implementation Example 5 (N ο Ο 0.15 0.07 〇 Example 4 〇〇m (Ν 0.15 0.07 〇Example 3 ο 0.15 0.06 〇Example 2 〇〇ο rH 0.15 0.08 〇Example 1 〇t—Η * 0.15 0.08 〇Materials category Ethylene Vinyl Acetate Copolymer Polyethylene Terpene • Phenol Copolymer Mobile Dendrobium Alumina Powder Low Melting Point Metal Thickness (mm) Thermal Resistance (°c/w) Usability Softening Temperature (°c) Coordination (Volume Parts) Physical property-13- 200835738 ·· <N撇Comparative example 5 〇〇00 00 00 〇〇m ο ^Τ) r*H ο ο <Ν Ο 〇 inch镒ON (N 〇(N 卜卜ο 1? κ - Comparative Example 3 m ο rH Ο ο ο ο X inch inch (N 镒ΛΛ ο (Ν 〇〇〇ο νο y^i in τ-Η Ο (Ν r—Η Ο 〇 Comparative example 1 inch 〇Ο ^-Η rH Ο 00 ο ο X OO Material Category Distillation N3 m N3 Lai Phenol Copolymer Long Country /^Ν S Ρ /^v鲁鲁•ηη <Η^ m S a _ 丛 N3 装 limiV ΠΠΓΓι m ϋ ϋ 嫔 right 1ft ig Τ〇ΓΓ <〇m. 15 mi^zn physical property-14- 200835738 resin composition of the invention For the resistance, it is good at a low temperature of TC or less. [Industrial Applicability] The resin composition of the present invention can be used outdoors, and for all the heat-generating materials, g is additionally used, and the application for 2006 is cited. Details of the details of No. 1 of 2006-28 807 1 is the self-adhesiveness of the invention and the low-heating of the display, and the workability during installation is better than the heat-dissipating material of the electronic parts: heat transfer to another material. The scope and summary of the Japanese patent application filed on the 23rd of the month is full: the creditor.
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