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TW200833579A - Vacuum suction apparatus - Google Patents

Vacuum suction apparatus

Info

Publication number
TW200833579A
TW200833579A TW096133530A TW96133530A TW200833579A TW 200833579 A TW200833579 A TW 200833579A TW 096133530 A TW096133530 A TW 096133530A TW 96133530 A TW96133530 A TW 96133530A TW 200833579 A TW200833579 A TW 200833579A
Authority
TW
Taiwan
Prior art keywords
substrate
vacuum
suctioned
suction apparatus
vacuum suction
Prior art date
Application number
TW096133530A
Other languages
Chinese (zh)
Inventor
Yoshiaki Masu
Hidenori Miyamoto
Kenji Yoshizawa
Tsuneo Tanimoto
Yasuhiro Sone
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tazmo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200833579A publication Critical patent/TW200833579A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manipulator (AREA)

Abstract

To provide a vacuum suction apparatus capable of certainly detecting whether a substrate is suctioned by vacuum or not in short time. When partially having a portion which is not suctioned by vacuum, a substrate W is somewhat off from the upper surface of a substrate installation table 5 at this portion. When the substrate W is off therefrom, pressure detected in a vacuum detection hole 8 which opens at this portion or a portion which is individually adjacent to this portion becomes high because of the entrance of air from the outside. Thus, etermination that the substrate W is certainly suctioned to the upper surface of the substrate installation table 5 can be made when all of a plurality of pressure sensors 11 provided sense vacuum.
TW096133530A 2006-09-11 2007-09-07 Vacuum suction apparatus TW200833579A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006244923A JP2008066607A (en) 2006-09-11 2006-09-11 Vacuum suction apparatus

Publications (1)

Publication Number Publication Date
TW200833579A true TW200833579A (en) 2008-08-16

Family

ID=39207942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096133530A TW200833579A (en) 2006-09-11 2007-09-07 Vacuum suction apparatus

Country Status (4)

Country Link
JP (1) JP2008066607A (en)
KR (1) KR20080023642A (en)
CN (1) CN101145536A (en)
TW (1) TW200833579A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5126091B2 (en) * 2009-02-02 2013-01-23 ウシオ電機株式会社 Work stage and exposure apparatus using the work stage
JP5280242B2 (en) * 2009-02-12 2013-09-04 日置電機株式会社 Adsorption device, inspection device, and mounting state determination method
DE102009018434B4 (en) * 2009-04-22 2023-11-30 Ev Group Gmbh Receiving device for holding semiconductor substrates
CN102096116A (en) * 2010-12-03 2011-06-15 惠州市赛能电池有限公司 Pole piece detecting device of battery lamination machine
CN102323452A (en) * 2011-05-30 2012-01-18 天津必利优科技发展有限公司 Air sucking assembly for adsorbing minute objects
KR101672779B1 (en) * 2014-08-29 2016-11-07 주식회사 태성기연 Tempered glass panel touch sensor processing equipment and the processing method
KR20170050658A (en) * 2015-10-30 2017-05-11 주식회사 프로텍 Flowrate Measuring Type Viscous Liquid Dispenser and Dispending Method
CN106950485A (en) * 2017-03-24 2017-07-14 京东方科技集团股份有限公司 A kind of tester substrate microscope carrier and substrate test equipment
CN107081676A (en) * 2017-06-27 2017-08-22 盐城市宁润玻璃制品有限公司 A kind of production fixing device of glassware
CN108489992A (en) * 2018-05-25 2018-09-04 江苏亿可得电子科技有限公司 A kind of chip gold thread detection device
CN109483429B (en) * 2018-10-18 2020-10-16 武汉华星光电半导体显示技术有限公司 Bearing device and bearing method
KR102287439B1 (en) * 2019-04-23 2021-08-09 주식회사 탑 엔지니어링 Coating device with pressure unit and coating method using the same
CN110369936A (en) * 2019-07-19 2019-10-25 晶澳（邢台）太阳能有限公司 Adsorbent equipment and photovoltaic string welding machine
CN113001202A (en) * 2021-04-28 2021-06-22 亿铨机械(嘉兴)有限公司 Workbench exchange structure of vertical machining center
CN113211316B (en) * 2021-05-24 2022-03-11 大连理工大学 A wireless detection platform and detection method for self-rotation grinding of semiconductor wafers

Also Published As

Publication number Publication date
CN101145536A (en) 2008-03-19
KR20080023642A (en) 2008-03-14
JP2008066607A (en) 2008-03-21

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