TW200831609A - Coated articles of manufacture made of high Tg polymer blends - Google Patents
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200831609 九、發明說明: 【發明所屬之技術領域】 本發明一般係關於包含聚合物或聚合物摻合物之定形物 件形式之製品物件之領域,其中該定形物件之一或多個表 面中的全部或一些表面經覆蓋材料塗佈,其中該覆蓋材料 具有與該定形物件不同之組成,且其中該定形物件包含如 下物質之一 · a)包括至少一種聚醚醯亞胺之不可混溶聚合 物摻合物,纟具有一個以上玻璃轉移溫度且其中該聚賴 亞胺具有大於217°C之玻璃轉移溫度;…包括至少一種聚 醚醯亞胺之可混溶聚合物摻合物,其具有大於217t:之單 玻璃轉移μ度,或c)具有大於247 °C之玻璃轉移溫度之 單一聚合物。 【先前技術】 對在高溫下具有良好製造及效能特性之聚合物存在持續 需要。例如,將高熱聚合物用於置換"引擎蓋下"汽車應用 中之金屬部分。高熱聚合物能夠與金屬部件經受程度相當 之熱但其重量車父小且因而有助於汽車更有效地利用燃料。 其他汽車用途進一步證實對高熱聚合物之持續需要。 妝明反射器(尤其對於汽車應用而言)需要可經受光源所 產生之高熱、具有優良空間穩定性以將遠處的光聚焦成緊 岔型式及可容易地加工成複雜形狀之材料。該等反射器通 常經金屬(諸如銘)塗佈以提供高反射表面。需要極光滑之 預塗佈表面來達成該具有低濁度之高度反射率。為了始終 達成該光滑預塗佈表面,通常必需在以金屬塗佈模製反射 I18106.doc 200831609 器之前以底漆來底塗該反射器。模製部件之直接金屬化亦 具有挑戰性,因為其引入苴他要求靈 ^ Ή共他要水而要金屬與模製部件 良好黏著且需要經模製之部件具有極光滑表面。 因為錯對環境之有害影響,所以在電子組件中已至少部 分改用無鉛焊料。替代焊料具有比鉛基焊料更高之熔點, 且因而需要能夠經受熔融鉛替代焊料所必需之額外熱的聚 合物來用作(例如)緊鄰於焊接點之基質或塗層。甚至諸如 感知來自噴射引擎洗滌之熱之聚合物部件用途亦造成對具 有比當前市售聚合物更高熱特性之聚合物的持續需求。 在此項技術中已知數種高熱聚合物。聚醚醯亞胺樹脂因 高熱變形溫度及高玻璃轉移溫度而著冑,其高熱變形溫度 及高玻璃轉移溫度使其在需要耐高溫場所用作塗層、模製 物件、複合物及其類似物之用途非常具有吸引力。然而, 因為其高玻璃轉移溫度及高熔融黏度,可能難以將聚醚醯 亞胺加工成產品。必須在高溫下進行模製、擠壓、喷塗及 其類似步驟從而使聚醚醯亞胺樹脂塑化。可能限制聚醚醯 亞胺組合物之用途之兩種特性(尤其在射出成型應用中)為 脫模及熔融流動。 聚颯亦因其在高溫應用中之用途而著稱,聚醚颯及聚苯 醚颯亦如此。參見美國專利第3,634,355號、第4,008,203 號、第4,108,837及第4,175,175號。聚合物領域中之聚矽氧 共聚物亦為热知的,參見美國專利第4,404,350號、第 4,808,686號及第4,690,997號。參見美國專利第5,916,997 號,先前亦已揭示包含以間苯二酚為主之芳基聚酯樹脂之 118106.doc 200831609 樹脂,其中50莫耳%或50莫耳%以上之芳基聚醋鍵為街生 自間笨二酚之芳酯鍵。 仍持續需要展示改良脫模及高溶融流動之聚合物組合 物。對具有允許更易於生產、更易於加工及具有更佳最終 使用特性之新賴及/或改良特性之聚合物、聚合物推合物 及共聚物總是存在需求。對具有與允許改良加工、改良由 間穩定性及低成本之必要其他特性組合之高玻璃 的聚合物存在持續及迫切需要。 【發明内容】 本發明係針對包含聚合物或聚合物摻合物之定形製品物 件,其中該定形物件之一或多個表面中的全部或一些表面 經覆蓋材料塗佈,其中該覆蓋材料具有與該定形物件不同 之組成,且其中定形物件包含如下物質之一:a)包括至少 -種聚醚醯亞胺之不可混溶聚合物摻合物,其具有一個以 上玻璃轉移溫度且其中該聚醚醯亞胺具有大於217。。之玻 离轉移皿度,b)包括至少一種聚醚醯亞胺之可混溶聚合物 摻合物’其具有大於2irc之單一玻璃轉移溫度;或〇具 有大於247°C之玻璃轉移溫度之單一聚合物。 本發明亦係針對該等製品物件,其中覆蓋材料包含一或 多種選自由粉末、薄片、薄膜、纖維、編織材料、非凝固 液體、凝固液體組成之群之組合物及該等覆蓋材料之任何 組合。 【實施方式】 定義 118106.doc 200831609 所使用之”製品物件”與美國專利及商標辦公室⑴此以 States Patent and Trademark 〇ffiee)所使用之該術語一致。 在本發明中,術語"光源,,係指將能量轉換成可見輻射能 之元件(例如,長絲)或材料(例如,氖)及/或該元件或材2 之必需容器(亦即,包括封套基座之光源封套(例如,燈 泡、螢光管))。 對本發明而言 除非另外指明,否則假定光源為點光源。 ,假定諸如,,光單元”、"燈”、,,前燈,,、200831609 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to the field of article articles in the form of shaped articles comprising a polymer or polymer blend, wherein all of one or more of the surfaces of the shaped article Or some surface coated with a cover material, wherein the cover material has a different composition than the shaped article, and wherein the shaped article comprises one of: a) an immiscible polymer blend comprising at least one polyetherimine a compound having more than one glass transition temperature and wherein the polylysine has a glass transition temperature greater than 217 ° C; ... comprising at least one miscible polymer blend of polyether quinone having greater than 217 t : a single glass transfer μ degree, or c) a single polymer having a glass transition temperature greater than 247 °C. [Prior Art] There is a continuing need for polymers having good manufacturing and performance characteristics at high temperatures. For example, a high heat polymer is used to replace the metal portion of the "under the hood" automotive application. The high heat polymer is capable of withstanding a degree of heat comparable to metal parts but its weight is small and thus helps the car to utilize the fuel more efficiently. Other automotive uses further confirm the continuing need for high thermal polymers. Makeup reflectors (especially for automotive applications) require materials that can withstand the high heat generated by the source, have excellent dimensional stability to focus distant light into a compact pattern, and can be easily machined into complex shapes. These reflectors are typically coated with a metal such as the inscription to provide a highly reflective surface. An extremely smooth pre-coated surface is required to achieve this high reflectivity with low haze. In order to achieve this smooth pre-coated surface at all times, it is often necessary to prime the reflector with a primer before it is molded by metal coating to reflect the I18106.doc 200831609. Direct metallization of the molded part is also challenging because it introduces the need for water to be adhered to the molded part and the molded part to have a very smooth surface. Because of the harmful effects of the error on the environment, lead-free solder has been at least partially replaced in electronic components. The replacement solder has a higher melting point than the lead-based solder, and thus requires a polymer capable of withstanding the extra heat necessary to replace the solder with molten lead for use as, for example, a substrate or coating adjacent to the solder joint. Even the use of polymer components, such as sensing heat from jet engine washing, has created a continuing need for polymers having higher thermal properties than currently marketed polymers. Several high thermal polymers are known in the art. Polyether phthalimide resin is characterized by high heat distortion temperature and high glass transition temperature. Its high heat distortion temperature and high glass transition temperature make it suitable for coating, molding objects, composites and the like in places where high temperature resistance is required. The use is very attractive. However, because of its high glass transition temperature and high melt viscosity, it may be difficult to process polyether oximine into a product. Molding, extrusion, spraying, and the like must be carried out at a high temperature to plasticize the polyether oximine resin. Two properties that may limit the use of the polyether oxime composition (especially in injection molding applications) are demolding and melt flow. Polyfluorene is also known for its use in high temperature applications, as are polyether oximes and polyphenylene ether oximes. See U.S. Patent Nos. 3,634,355, 4,008,203, 4,108,837, and 4,175,175. The polyoxo copolymers in the field of polymers are also known. See U.S. Patent Nos. 4,404,350, 4,808,686 and 4,690,997. See U.S. Patent No. 5,916,997, the disclosure of which is hereby incorporated by reference in its entirety the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire disclosure The street is born from the aryl ester bond of stupid phenol. There is still a continuing need to demonstrate polymer compositions that have improved demolding and high melt flow. There is always a need for polymers, polymer conjugates and copolymers having new and/or improved properties that allow for easier production, easier processing, and better end-use characteristics. There is a continuing and urgent need for polymers having high glazing that combines with other properties that allow for improved processing, improved interstitial stability, and low cost. SUMMARY OF THE INVENTION The present invention is directed to a shaped article article comprising a polymer or polymer blend, wherein all or some of one or more surfaces of the shaped article are coated with a cover material, wherein the cover material has The shaped article has a different composition, and wherein the shaped article comprises one of: a) an immiscible polymer blend comprising at least one polyether quinone imine having more than one glass transition temperature and wherein the polyether The quinone imine has a greater than 217. . a glass-to-transfer degree, b) a miscible polymer blend comprising at least one polyether quinone imine having a single glass transition temperature greater than 2 irc; or a single glass transition temperature greater than 247 ° C polymer. The present invention is also directed to such articles, wherein the covering material comprises one or more compositions selected from the group consisting of powders, flakes, films, fibers, woven materials, non-solidified liquids, solidified liquids, and any combination of such covering materials. . [Embodiment] The term "article of article" as used by the definition of 118106.doc 200831609 is consistent with the term used by the United States Patent and Trademark Office (1), which is used by the State Patent and Trademark 〇ffiee). In the present invention, the term "light source" means an element (for example, a filament) or a material (for example, 氖) that converts energy into visible radiant energy and/or a necessary container of the element or material 2 (ie, A light source envelope (eg, a bulb, a fluorescent tube) including an envelope base. For the purposes of the present invention, the source is assumed to be a point source unless otherwise indicated. , assuming, for example, a light unit", a "light",,, a headlight,,,
L.E.D·專之名詞性陳述僅表示光源。 "調節器(modifier)"為所述元件或元件組合,其直接功能 係藉由反射、折射或部分或全部吸收光來改變自光源發出 之光的分佈或組合。 術語"反射器"係指具有如下表面之光修正裝置,該表面 使入射光改向返回至發出其之介f。反射器更通常為不透 明的但也可為透明i人射於透明反射器之改向表面之光 可來自反射器本身之透明材料,在此狀況下其改向返回反 射器之透月材料,或其可自一些其他材料(例如,空氣)到 達改向表面,在此狀況下其改向返回其他材料。 術語"運輸車辅”係用來包含所有可用於運輸人類、哺乳 動物或無論任何類型之貨物之車輛’且旨在包括(例如)所 有種類之有輪車輛,汽車、飛機及所有類別之飛行器、火 車、摩托車、卡車、SUV、小船、貨船等。 對本發明而言" 術^金屬化表面"意謂經包含一或多種 金屬之塗層覆蓋之表面。 、且。係♦日材料之分子組成,藉此,具有不ig分子組合 118106.doc 200831609 或結構之材料為不同組合物。 對本發明而言,L.E.D·為一發光二極體,該術語為普通 熟習此項技術者所知曉。 "局指聚合物具有i8(rc或高於18〇。〇之玻璃轉移溫 度。 術語"氫原子與碳原子之數目比,,為聚合物或組成聚合物 之重複單兀(單體)中氫原子數與碳原子數之比。The L.E.D. special noun statement only represents the light source. "Modifier" is a combination of elements or elements whose direct function is to change the distribution or combination of light emitted from a light source by reflecting, refracting, or partially or fully absorbing light. The term "reflector" refers to a light modifying device having a surface that redirects incident light back to the medium f from which it is emitted. The reflector is more generally opaque but can also be transparent. The light that strikes the redirecting surface of the transparent reflector can come from the transparent material of the reflector itself, in which case it redirects to the moon-reflecting material of the reflector, or It can reach the redirecting surface from some other material (eg, air), in which case it redirects back to other materials. The term "transporter is used to include all vehicles that can be used to transport humans, mammals, or any type of cargo' and is intended to include, for example, all types of wheeled vehicles, automobiles, aircraft, and all types of aircraft. , trains, motorcycles, trucks, SUVs, boats, cargo ships, etc. For the purposes of the present invention, "metallized surface" means a surface covered by a coating comprising one or more metals. The molecular composition, whereby the material having the ig molecular combination 118106.doc 200831609 or the structure is a different composition. For the purposes of the present invention, the LED is a light-emitting diode, the term is known to those skilled in the art. "The term refers to a polymer having i8 (rc or higher than 18 〇. 玻璃 glass transition temperature. The term " the ratio of the number of hydrogen atoms to carbon atoms, is a repeating unit of a polymer or a constituent polymer (monomer The ratio of the number of hydrogen atoms to the number of carbon atoms.
苯甲基質子之定義在此項技術中為吾人所熟知,且對本 發明而言其包含至少一個化學上直接結合於至少一個芳族 環(諸如苯基環或苯環)之脂族碳原子,其中該脂族碳原子 另外具有至少一個直接結合於該碳原子之質子。 2本發明之上下文中,實質上或基本上不含苯甲基質子 意谓諸如聚醯亞胺砜產物之聚合物的約5莫耳%以下之衍 生結構單元(在—些實施例中為約3莫耳%以下之衍生妹構 單元,且在其他實施例中為約1# 』1旲斗/❶以下之衍生結構單 元)含有苯甲基質子。不含 ,田 不3本甲基質子(亦稱為苯甲基氫)竟 衲聚醚醯亞胺物件之零莫耳0/ " --^ ^ ^ '丁生自早體及端帽體之結構 早兀含有苯甲基質子或苯甲其气 傅 丁飞本T基風。基於化學結 化學分析可測定苯曱基質子 再稽田叙 ,::: 表面經覆蓋材料塗佈,其中覆的全部或-些 之組成,且其中定形物件包含如下物;不同 2irc之單一玻璃轉移溫度之可混溶聚合物摻:物有:: 118106.doc 200831609 具有—個以上玻螭轉移溫度之不可混溶聚合物摻合物,且 該等聚合物之—者具有大於刚。c之玻璃轉移溫度。物 •、本I明而s,術語”塗層"意謂施加於稱作基質之美 材料的薄臈或薄層。在本發明中,基質係由一或多種;合 物,聚物及/或聚合物摻合物組成。塗料可包含熟練技 術人員將用其作為聚合基質上之塗層的任何材料,包括 (:一不限於)一或多種金屬、一或多種黏接劑、一或多種油 漆、-或多種合金、一或多種固體-液體懸浮液、一或多 種聚合物(塗層中至少-種聚合物具有與聚合基質不同之 組成)。 對本發明而言,在基質上可存在與達到製品物件之期望 用通所必需一樣多之塗層。如上文所用之術語"薄的"意謂 在物件上塗層最厚點處之塗層厚度小於穿過物件重心及延 伸至但不超過物件最外邊界之直線的長度。 可藉由熟練技術人員已知之任何塗佈方式施加塗層。例 如,可藉由電解、氣相沈積、真空蒸發、濺鍍或諸如刷喷 塗、壓光、過度模製、層壓及滾塗之機械方式來施加塗 層。 本叙明之製〇口物件中之基質或定形物件為工業上生產之 任何聚合材料,其為:a)具有大於217它之單一玻璃轉移溫 度之可混溶聚合物摻合物;或b)包括至少一種聚醚醯亞胺 之不可混溶聚合物摻合物,其具有一個以上玻璃轉移溫度 且其中聚醚醯亞胺具有大於180。〇之玻璃轉移溫度。基質 亦可包含聚合物掺合物,該聚合物摻合物包括至少一種具 118106.doc -11- 200831609 有大於247°C之玻璃轉移溫度之聚醚醯亞胺,或在另一實 施例中基貝為包括至少—種聚鱗醯亞胺之聚合物播合 物,其中該摻合物具有大於217〇(:之玻璃轉移溫度。在另 一實㈣中1形物件包含具有大㈣代之玻璃轉移溫 度之單-聚合物。本發明亦針對包含氫原子數比碳原子數 為 0.45-0.85,或 〇.50_〇.8〇,或〇 55〇 75,或〇 6〇〇 7〇 之聚 / 酸酿亞胺之定形物件。 本發明亦針對包含-或多種基本上不含苯甲基質子之聚 鱗醯亞胺之定形物件。本發明之另一態樣為由聚賴亞胺 或含有聚賴亞胺之摻合物製成之物件,其具有溶融加工 所需之足夠穩定性使得在溶融及部分形成程序期間分子量 改變較小。此要求聚合物不含或實質上不含將在熔融中發 生反應而改變分子量之鐽。聚醚醯亞胺中苯甲基質子之存 在通常促進溶融中改變分子量之反應。歸因於所得聚合物 增加之熔融穩定性,具有衍生自芳族二胺、芳族二酐及封 • 端劑的基本上不含苯甲基質子之結構單元之聚醚醯亞胺在 一些應用(尤其為包括聚合後之熔體分離及熔融加工之 用)中較佳。 ^ 下面列出用於定形物件之基質材料之代表性實例·· Α·颯基聚合物或摻合物、聚矽氧共聚物及間苯二酚衍生 之聚芳酯之高Tg聚合物掺合物。 本文揭示包含聚合物摻合物之製品物件,其中聚合物摻 合物之一個表面的一些或全部係經覆蓋材料塗佈,其中該 覆蓋材料為不同於聚合物摻合物之組合物,且其中聚合物 118106.doc -12- 200831609 摻合物包含:a)選自聚颯(PSu)、聚。、 、 7 1㈤砜)(PES)、聚(伸苯 基醚砜)(PPSU)之群的具有高玻璃轉移溫度(T^i8(rc)之第 -樹脂,b)㈣氧共聚物,例如聚妙氧聚醯亞胺或聚石夕氧 聚石反酸S曰’及c)以間苯二酚為主之聚芳酯,其中摻合物具 有驚人之低放熱值及改良之熔融流動。 1·摻合物之聚砜、聚醚砜及聚苯醚碾組份 本文所述之物件中所用之聚砜、聚(醚颯)及聚(伸苯基醚 颯)為(例如)美國專利第3,634,355號、第4,〇〇8,2〇3號、第 4,108,837號及第4,175,175號中所述之熱塑樹脂。 聚颯、聚(鱗颯)及聚(伸苯基醚礙)為具有許多吸引人的 特徵(諸如耐高溫、良好電學特性及良好水解穩定性)之線 性熱塑聚合物。 聚颯包含具有式I結構之重複單元: 「 ^ 1 丁 3 丁⑴ 其中R為包含碳·碳單鍵、碳-氧-碳鍵或碳碳及碳-氧-碳單 鍵之芳基且單鍵形成一部分聚合物骨架。 聚(醚颯)包含具有如式Η中所示之聚合物骨架中之醚鍵 及砜鍵之重複單元: 〇 --Ar-S-Ar'—0-- ° (II) 其中Ar及Ar*為可相同或不同之芳基。Ar及Ar,可相同或不 同。當Ar及Ar’均為伸苯基時,聚合物稱為聚(伸苯基醚 颯)。當Ar及Ar’均為伸芳基時,聚合物稱為聚(伸芳基醚 118106.doc -13- 200831609 颯)。砜鍵數及醚鍵數可相同或不同。式(III)中顯示一展示 砜鍵數不同於醚鍵數時之例示性結構: ΟThe definition of benzylated protons is well known in the art and, for the purposes of the present invention, comprises at least one aliphatic carbon atom chemically bonded directly to at least one aromatic ring, such as a phenyl ring or a benzene ring, Wherein the aliphatic carbon atom additionally has at least one proton bonded directly to the carbon atom. 2 In the context of the present invention, substantially or substantially free of benzylated protons means about 5 mole percent or less of the derivatized structural units of the polymer such as the polythenimine sulfone product (in some embodiments, about 3 摩尔% of the derivative unit, and in other embodiments, about 1# 』1 旲 ❶ / ❶ below the derived structural unit) contains benzylated protons. Except, Tian not 3 methyl protons (also known as benzyl hydrogen) actually 衲 衲 醯 耳 0 莫 莫 0 / " --^ ^ ^ ' Dingsheng from the body and end cap body The structure of the sputum contains benzylated protons or benzoquinones. Based on chemical chemical analysis, the benzoquinone matrix can be determined by re-examining::: The surface is coated with a covering material, which covers all or some of the constituents, and wherein the shaped article contains the following; different 2irc single glass transition temperature Miscible polymer blends:: 118106.doc 200831609 Immiscible polymer blends having more than one glass transition temperature, and those polymers have greater than just. The glass transition temperature of c. The term "coating" means a thin layer or a thin layer applied to a material called a matrix. In the present invention, the matrix is composed of one or more; a compound, a polymer and/or Or a polymer blend composition. The coating may comprise any material that the skilled artisan will use as a coating on the polymeric substrate, including (i.e., without limitation) one or more metals, one or more binders, one or more Paint, or alloys, one or more solid-liquid suspensions, one or more polymers (at least one of the polymers in the coating has a composition different from the polymeric matrix). For the purposes of the present invention, it may be present on the substrate It is necessary to achieve as many coatings as possible for the article of manufacture. The term "thin" as used above means that the thickness of the coating at the thickest point of the coating on the object is less than the center of gravity of the object and extends to but not The length of the line exceeding the outermost boundary of the object. The coating can be applied by any coating method known to the skilled person. For example, it can be electrolyzed, vapor deposited, vacuum evaporated, sputtered or sprayed, calendered, etc. Overmolding , laminating and roller coating mechanical means to apply the coating. The matrix or shaped article in the mouthpiece of the present invention is any polymeric material produced industrially, which is: a) has a single glass transition temperature greater than 217 a miscible polymer blend; or b) an immiscible polymer blend comprising at least one polyether quinone having more than one glass transition temperature and wherein the polyether quinone has greater than 180. Glass transition temperature. The matrix may also comprise a polymer blend comprising at least one polyether quinone imine having a glass transition temperature greater than 247 ° C with 118106.doc -11- 200831609, or In another embodiment, the kebab is a polymer composition comprising at least one species of polyfluorene imine, wherein the blend has a glass transition temperature greater than 217 Å (in another solid (4)) a mono-polymer having a glass transition temperature of a large (fourth). The present invention is also directed to a hydrogen atom number ratio of 0.45 to 0.85, or 50.50_〇.8〇, or 〇55〇75, or 〇6. 〇〇7〇聚 / acid brewed imine shape The present invention is also directed to shaped articles comprising - or a plurality of polyfluorinated imines substantially free of benzylated protons. Another aspect of the invention is a blend of polylysine or polylysine The finished article has sufficient stability for the melt processing to cause a small change in molecular weight during the melting and partial forming process. This requires that the polymer be free or substantially free of changes in molecular weight that will occur in the melt. The presence of a benzyl group proton in a polyether sulfimine generally promotes a change in molecular weight in the melt. Due to the increased melt stability of the resulting polymer, it has been derived from an aromatic diamine, an aromatic dianhydride, and a capping end. The polyether quinone imine of the structural unit substantially free of benzylated protons is preferred in some applications, especially for melt separation and melt processing after polymerization. ^ Listed below are representative examples of matrix materials for shaped articles. · High Tg polymer blends of ruthenium-based ruthenium polymers or blends, polyfluorene oxide copolymers and resorcinol-derived polyarylates. Things. Disclosed herein are articles of manufacture comprising a polymer blend, wherein some or all of one surface of the polymer blend is coated with a cover material, wherein the cover material is a composition different from the polymer blend, and wherein Polymer 118106.doc -12- 200831609 The blend comprises: a) selected from the group consisting of polyfluorene (PSu), poly. a high glass transition temperature (T^i8(rc)-resin, b) of a group of 7 1 (f)sulfone) (PES), poly(phenylene ether sulfone) (PPSU), (iv) an oxygen copolymer, such as poly The amphoteric polyoxyimide or polyoxetite polyacid anti-acid S曰' and c) resorcinol-based polyaryl esters, wherein the blend has surprisingly low exotherm values and improved melt flow. 1. Blend polysulfone, polyether sulfone and polyphenylene ether mill component The polysulfone, poly(ether oxime) and poly(phenylene ether oxime) used in the articles described herein are, for example, US patents. Thermoplastic resins as described in Nos. 3,634,355, 4, 8, 2, 3, 4, 108, 837 and 4, 175, 175. Polyfluorene, poly (barium) and poly(phenylene) are linear thermoplastic polymers with many attractive characteristics such as high temperature resistance, good electrical properties and good hydrolytic stability. Polyfluorene comprises a repeating unit having the structure of formula I: "^ 1 butyl 3 butyl (1) wherein R is an aryl group containing a carbon-carbon single bond, a carbon-oxygen-carbon bond or a carbon-carbon and a carbon-oxygen-carbon single bond The bond forms part of the polymer backbone. Poly(ether oxime) comprises a repeating unit having an ether bond and a sulfone bond in the polymer backbone as shown in the formula: 〇--Ar-S-Ar'-0-- ° ( II) wherein Ar and Ar* are the same or different aryl groups. Ar and Ar may be the same or different. When both Ar and Ar' are phenyl groups, the polymer is called poly(phenylene ether). When both Ar and Ar' are aryl groups, the polymer is called poly(aryl ether 118106.doc -13- 200831609 飒). The number of sulfone bonds and the number of ether bonds may be the same or different. The formula (III) shows An exemplary structure showing the number of sulfone bonds different from the number of ether bonds: Ο
-Ar-S-Ar'-O-Ar'^O (III) 〇 其中Ar、Ar•及Ar"為可相同或不同之芳基。Ar、Ar,及Ar,, 可相同或不同,例如心及Ar,可均為伸苯基且Ar"可為雙 (1,4-伸苯基)異丙基。 多種聚砜及聚(醚砜)為市售的,包括二羥基二苯颯與二 氯苯風之聚縮合產物及雙紛_A與二氯二苯硬之聚縮合產 物市α树月曰之實例包括可自8〇1胃,心講得之 R、RADEL A及 UDEL及可自 BASF c〇 購得之 ultras〇n E ° 製備聚颯及聚(_)之方法為廣泛已知的且此項技術中 已充分描述了數種合摘t d .. ^ k方法。兩種方法,碳酸鹽法及鹼金 屬氯氧化物法為熟練技術人員所知。在驗金屬氫氧化物法 中’在實質上無水條件下於雙極、非質子性溶劑存在下使 -經紛之驗金屬複趨盘—^ yri jl ) I 一 一 _本型化合物接觸。此項技術中 (例如美國專利第4,176,222號)亦揭示碳酸鹽法,其中將二 經酴及二i苯型化合物與(例如)碳酸納或碳酸氫鈉及第二 鹼金屬碳酸鹽或碳酸氫赜一 虱鹽起加熱。或者,可藉由此項技 術中已知之多種方法由 任一種來製備聚颯及聚(鱗颯)。 如諸如二氯甲燒、三氯甲燒、N•甲基料㈣或其類似 物之適田冷劑中之減小的黏度資料所顯示,聚砜或聚(醚 石風)之分子量可大於或等於約〇.3 _,或更特定言之,大 118106.doc -14- 200831609 於或等於約0.4 dl/g,且通常不會超過約1·5 dl/g。 在一些實例中,藉由凝膠滲透層析法使用ASTM方法 D5296(ASTM METHOD D5296)測定聚砜或聚(醚砜)之重量 平均分子量可為約10,000至約100,000。在一些實例中,聚 砜及聚(醚砜)可具有約180QC至約250°c之玻璃轉移溫度。 當用高REC共聚物摻合聚砜、聚(醚砜)及聚(伸苯基醚颯) 時,聚砜、聚(醚砜)及聚(伸苯基醚)颯將具有大於或等於 約180°C之玻璃轉移溫度(Tg)。ASTM方法D6394 Standard Specification for Sulfone Plastics 中對聚颯樹脂做進一步描 述。 在一些實例中,聚砜、聚(醚砜)及聚(伸苯基醚砜)及其 摻合物之氫與碳原子比(H/C)將小於或等於約0.85。不受相 對於氫含量具有較高碳含量(亦即,低的氫與碳之比)之理 論聚合物所約束,常展示改良之FR效能。該等聚合物具有 較低之燃料值且當燃燒時可釋放較少能量。藉由在聚合燃 料與點火源之間形成絕緣焦化層之趨勢,其亦可抗燃燒。 獨立於任何特定作用機制或模式,已觀測到該等具有低 H/C比之聚合物具有較高耐燃性。在一些實例中,H/C比 可小於或等於0.75或小於0.65。在其他實例中,為得到具 有充足可撓性鍵之聚合結構以達成可熔融加工性,大於或 等於約0.4之H/C比為較佳的。藉由對獨立於化學重複單元 中存在之任何其他原子之碳及氫原子進行計數,可自給定 聚合物或共聚物化學結構確定其H/C比。 在聚合物摻合物中,以聚合物掺合物總重量計,聚颯、 118106.doc -15- 200831609 聚(鱗硬)及聚(伸苯基醚砜)及其摻合物可以約1至約99重量 %之量存在。在該範圍内,聚砜、聚(醚颯)及聚(伸苯基醚 硬)及其混合物之量可大於或等於約20重量。/❶,更特定言之 大於或等於約50重量%,且甚至更特定言之大於或等於約 70重量❻/。。熟練技術人員應瞭解,以聚合物摻合物總重量 计’聚碗、聚(鱗砜)及聚(伸苯基醚砜)及其混合物可以約1 與約99重量%(且尤其1至7〇重量%)之間的任何實數存在。 2.摻合物之聚矽氧組份 聚矽氧共聚物包含有效於改良組合物之放熱效能之任何 矽氧烷共聚物。在一些實例中,可使用聚醚醯亞胺、聚醚 亞胺砜、聚砜、聚(伸苯基醚砜)、聚(醚砜)或聚(伸苯基 醚)之矽氧烷共聚物。在一些實例中,矽氧烷聚醚醯亞胺 共聚物或矽氧烷聚碳酸酯共聚物可有效降低放熱效能及提 南流動速率效能。本發明亦涵蓋不同類型之矽氧烷共聚物 之混合物。在一實施例中,矽氧烷共聚物相對於共聚物總 重里包含約5至約70重量%(及在其他實例中2〇至約5〇重量 %)石夕氧烧含量。 共聚物之矽氧烷片段之嵌段長度可為任何有效長度。在 一些實例中’嵌段長度可為約2至約7〇個矽氧烷重複單 元。在其他實例中,矽氧烷嵌段長度可為約5至約5〇個重 複單元。在許多實例中,可使用二甲基矽氧烷。 矽氧烷聚醚醯亞胺共聚物為可用於聚合物摻合物中之矽 氧烷共聚物之特定實施例。美國專利第4,4〇4,35〇號、第 4,808,686唬及第4,690,997號展示該等矽氧烷聚醚醯亞胺共 118106.doc -16- 200831609 聚物之貝例。在一實例中,可以類似於用於製備聚醚醯亞 胺之方式製備矽氧烷聚醚醯亞胺共聚物,但其中部分或全 口 P有機一胺反應物係經(例如)式IV胺末端有機梦氧炫取代 外在式1V中g為具有1至約50(或更特定言之,約5至約 3〇)之值的整數且R,為具有2至約2〇個碳原子之芳基、烷基 或芳基貌基。-Ar-S-Ar'-O-Ar'^O (III) 〇 wherein Ar, Ar• and Ar" are the same or different aryl groups. Ar, Ar, and Ar, which may be the same or different, such as a heart and Ar, may all be a phenyl group and Ar" may be a bis(1,4-phenylene) isopropyl group. A variety of polysulfones and poly(ether sulfones) are commercially available, including polycondensation products of dihydroxydiphenyl hydrazine and dichlorobenzene, and polycondensation products of bis-A and dichlorodiphenyl hard. Examples include methods for preparing polyfluorenes and poly(_) from 〇1 stomach, heart R, RADEL A and UDEL, and ultras〇n E ° available from BASF c〇. Several methods for extracting td .. ^ k have been fully described in the technology. Both methods, the carbonate method and the alkali metal oxychloride method are known to the skilled artisan. In the metal hydroxide method, 'substantially under anhydrous conditions in the presence of a bipolar, aprotic solvent - is subjected to a metal-recovery plate - ^ yri jl ) I - a compound of this type is contacted. Also disclosed in the art (e.g., U.S. Pat. The hydroquinone salt is heated. Alternatively, polyfluorene and poly (scale) can be prepared by any of a variety of methods known in the art. The molecular weight of polysulfone or poly(ether stone) can be greater than the reduced viscosity data in the field cold refrigerant such as methylene chloride, trichloromethane, N. methyl (4) or the like. Or equal to about 3.3 _, or more specifically, 118106.doc -14- 200831609 at or equal to about 0.4 dl/g, and usually does not exceed about 1.5 dl/g. In some examples, the polysulfone or poly(ether sulfone) may have a weight average molecular weight of from about 10,000 to about 100,000 as determined by gel permeation chromatography using ASTM method D5296 (ASTM METHOD D5296). In some examples, the polysulfone and poly(ether sulfone) can have a glass transition temperature of from about 180 QC to about 250 °C. When a high REC copolymer is blended with polysulfone, poly(ether sulfone) and poly(phenylene ether), polysulfone, poly(ether sulfone) and poly(phenylene ether) ruthenium will have greater than or equal to about Glass transition temperature (Tg) at 180 °C. The polybenzazole resin is further described in ASTM Method D6394 Standard Specification for Sulfone Plastics. In some examples, the polysulfone, poly(ether sulfone), and poly(phenylene ether sulfone) and blends thereof will have a hydrogen to carbon atomic ratio (H/C) of less than or equal to about 0.85. It is not bound by theoretical polymers that have a higher carbon content relative to the hydrogen content (i.e., a lower hydrogen to carbon ratio) and often exhibit improved FR performance. These polymers have lower fuel values and can release less energy when burned. It is also resistant to combustion by the tendency to form an insulating coking layer between the polymeric fuel and the ignition source. Independent of any particular mechanism of action or mode, it has been observed that such polymers having a low H/C ratio have higher flame resistance. In some examples, the H/C ratio can be less than or equal to 0.75 or less than 0.65. In other examples, an H/C ratio of greater than or equal to about 0.4 is preferred in order to obtain a polymeric structure having sufficient flexible bonds to achieve melt processability. The H/C ratio can be determined from the chemical structure of a given polymer or copolymer by counting the carbon and hydrogen atoms independent of any other atoms present in the chemical repeating unit. In the polymer blend, polyfluorene, 118106.doc -15-200831609 poly(scale hard) and poly(phenylene ether sulfone) and blends thereof may be about 1 based on the total weight of the polymer blend. It is present in an amount of about 99% by weight. Within this range, the amount of polysulfone, poly(ether oxime) and poly(phenylene ether hard) and mixtures thereof may be greater than or equal to about 20 weight. /❶, more specifically greater than or equal to about 50% by weight, and even more specifically greater than or equal to about 70% by weight. . The skilled artisan will appreciate that 'poly bowl, poly(sulfonate) and poly(phenylene ether sulfone) and mixtures thereof may be from about 1 to about 99% by weight (and especially from 1 to 7) based on the total weight of the polymer blend. Any real number between 〇 weight %) exists. 2. Polyoxymethylene component of the blend The polyoxynoxy copolymer comprises any of the oxyalkylene copolymers effective to improve the exothermic performance of the composition. In some examples, a polyoxyalkylene copolymer of polyetherimide, polyetherimide sulfone, polysulfone, poly(phenylene ether sulfone), poly(ether sulfone) or poly(phenylene ether) can be used. . In some instances, a fluorinated polyether oxime copolymer or a decane polycarbonate copolymer is effective in reducing exothermic performance and inducing flow rate performance. The invention also encompasses mixtures of different types of oxane copolymers. In one embodiment, the oxyalkylene copolymer comprises from about 5 to about 70 weight percent (and in other instances from 2 to about 5 weight percent) the agglomerated oxygen content relative to the total weight of the copolymer. The block length of the azide fragment of the copolymer can be any effective length. In some examples, the block length can range from about 2 to about 7 moles of a repeating unit. In other examples, the oxetane block length can range from about 5 to about 5 repeat units. In many instances, dimethyloxane can be used. The decyl alkoxy polyimide copolymer is a specific embodiment of a siloxane copolymer that can be used in a polymer blend. U.S. Patent Nos. 4,4,4,35, 4,808,686 and 4,690,997 show examples of these oxane polyether phthalimides totaling 118106.doc -16-200831609. In one example, the oxoxane polyether oximeimide copolymer can be prepared analogously to the manner used to prepare the polyether quinone imine, but wherein the partial or full-portion P-organic amine reactant is via, for example, an amine of formula IV. The terminal organic oxime substitution in the external formula 1V wherein g is an integer having a value of from 1 to about 50 (or more specifically, from about 5 to about 3 Å) and R is from 2 to about 2 carbon atoms. An aryl, alkyl or aryl group.
H2N—r·—siH2N-r·-si
式IV 可藉由熟習此項技術者熟知之任何方法來製㈣氧烧聚 喊醯亞胺共聚物’包括使式V芳族雙⑽酐)與式νπ有機二 胺反應Formula IV can be prepared by any of the methods well known to those skilled in the art. (IV) Oxygen-fired polyacrylamide copolymers' including the reaction of an aromatic bis(10) anhydride of formula V with a νπ organic diamine.
在式V中,T為_〇-、-S_、_s〇2-或式七_z_〇-基團,其中 二價鍵-0-或_0-Z-0_基團處於3,3,、3,4,、4,3,或4,4,位置, 且其中Z包括(但不限於)經取代或未經取代之二價有機基 團,諸如··⑷具有約6至約2G個碳原子之芳族烴基及其齒 化衍生物;⑻具有約2至約20個碳原子之直鍵或支鍵伸烧 基;(c)具有約3至約20個碳原子之伸環烷基,或(幻通式% 之二價基團In Formula V, T is _〇-, -S_, _s〇2- or a formula _z_〇- group in which the divalent bond-0- or _0-Z-0- group is at 3,3 , 3, 4, 4, 3, or 4, 4, position, and wherein Z includes, but is not limited to, a substituted or unsubstituted divalent organic group, such as (4) having from about 6 to about 2G An aromatic hydrocarbon group of a carbon atom and a dentate derivative thereof; (8) a straight bond or a bond extension group having from about 2 to about 20 carbon atoms; (c) a cycloalkane having from about 3 to about 20 carbon atoms; Base, or (a magical % of a divalent group
118106.doc -17- 200831609 在通式νι中,Q包括(但不限於)選自由_〇_、_s_、 、-SCV、-so·、-CyH2y_(y為1至8之整數)組成之群之二價 基團及其氟化衍生物(包括全氟伸烷基),在式νπ中 H2N-R1-NH2 (VII) 式VII中之基團R包括(但不限於)經取代或未經取代之二價 有機基團,諸如··(a)具有約6至約24個碳原子之芳族烴基 及其齒化衍生物;(b)具有約2至約2〇個碳原子之直鏈或支 鏈伸烷基;(c)具有約3至約2〇個碳原子之伸環烷基,或(幻 通式VI之二價基團。 特疋芳無雙酐及有機二胺之實例揭示於(例如)美國專利 第3,972,902號及第4,455,410號中。式(χΙν)芳族雙酐之說 明性實例包括: 3.3- 雙[4-(3,4-二羧基苯氧基)苯基]丙烧二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯醚二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯硫醚二酐; 馨 4,4’-雙(3,4_二鲮基苯氧基)二苯甲酮二酐; 4,4’-雙(3,4_二羧基苯氧基)二苯砜二酐; 2,2-雙[4-(2,3-二羧基苯氧基)苯基]丙烷二酐; 4.4- 雙(2,3-二羧基苯氧基)二苯醚二酐; 4.4- 雙(2,3-二鲮基苯氧基)二苯硫醚二酐; 4.4- 雙(2,3-二羧基苯氧基)二苯甲酮二酐; 4.4- 雙(2,3-二羧基苯氧基)二苯砜二酐; 4-(2,3<緩基苯氧基)-4,-(3,4-二羧基苯氧基)二苯基_2,2-丙烷二酐; 118106.doc -18 - 200831609 4-(2,3·二羧基苯氧基)·4,_(3,4_二羧基苯氧基)二苯醚二 酐; 4-(2,3-二羧基苯氧基)_4,_(3,4-二羧基苯氧基)二苯硫醚二 酐; 4-(2,3-二羧基苯氧基)_4,_(3,‘二羧基苯氧基)二苯甲酮二 : 酐;及 : 4-(2,3-二羧基苯氧基M,-(3,4-二羧基苯氧基)二苯砜二 酐, 以及其混合物。 除上述石夕氧烷二胺之外,合適二胺之實例包括乙二胺、 丙一胺、三亞甲基二胺、二伸乙基三胺、三伸乙基四胺、 己一胺、庚二胺、辛二胺、壬二胺、癸二胺、ii 2·十二燒 二胺、1,18-十八烷二胺、弘甲基庚二胺、4,扣二甲基庚二 胺、4-曱基壬二胺、%甲基壬二胺、2,5-二甲基己二胺、 2,5·二曱基庚二胺、2,2_二曱基丙二胺、N-甲基-雙胺基 馨 丙基)胺、曱氧基己二胺、1,2-雙(3-胺基丙氧基)乙烷、 雙(3-胺基丙基)硫醚、14-環己二胺、雙彳4_胺基環己基)甲 烧、間苯二胺、對苯二胺、2,4_二胺基甲苯、2,6-二胺基 , 曱苯、間二甲苯二胺、對二甲苯二胺、2-甲基-4,6·二乙基- 1,3_苯二胺、5-甲基-4,6-二乙基-1,3-苯二胺、聯苯胺、 3,3 - —甲基聯苯胺、3,3’ -二曱氧基聯苯胺、1,5 -二胺基 萘、雙(4-胺基苯基)甲烷、雙(2-氯-4-胺基·3,5-二乙基苯 基)曱烷、雙(4-胺基苯基)丙烷、2,4-雙(胺基-第三丁基)甲 苯、雙(對胺基-第三丁基苯基)醚、雙(對曱基-鄰胺基苯基) 118106.doc -19- 200831609 苯、雙(對甲基-鄰胺基戊基)苯、二胺基-4_異丙基苯、 雙(4_胺基苯基)硫醚、雙(‘胺基苯基)颯、雙(‘胺基苯基) 鱗及包含兩種或兩種以上前述物質之組合。矽氧烷二胺之 特疋貝例為1,3-雙(3-胺基丙基)四甲基二石夕氧烧。在一實施 例中’與石夕氧烧二胺聯合使用之二胺基化合物為芳族二 胺’尤其為間苯二胺及對苯二胺、磺醯基二苯胺及其混合 物。 可藉由使式VII有機二胺或二胺混合物與上述式Iv胺末 端有機石夕氧烷反應形成一些矽氧烷聚醚醯亞胺共聚物。使 一胺基組份在與雙酐反應之前物理混合,因此實質上形成 隨機共聚物。或者,可藉由使VH及、IV與二酐(例如式V二 野)選擇性反應製得隨後共同反應之聚醯亞胺嵌段而形成 肷段或交替共聚物。在另一實例中,用於製備聚醚醯亞胺 共聚物之矽氧烷可具有酐而非胺官能端基。 在一實例中,矽氧烷聚醚醯亞胺共聚物可為式νιπ,其 中T、R’及g係如上所述,b具有約5至約100之值,且Ar1為 具有6至約36個碳之芳基或烷基芳基。118106.doc -17- 200831609 In the formula νι, Q includes, but is not limited to, a group selected from _〇_, _s_, , -SCV, -so·, -CyH2y_ (y is an integer from 1 to 8) a divalent group and a fluorinated derivative thereof (including a perfluoroalkylene group), H2N-R1-NH2 (VII) in the formula νπ, the group R in the formula VII includes, but is not limited to, substituted or unsubstituted a substituted divalent organic group such as (a) an aromatic hydrocarbon group having from about 6 to about 24 carbon atoms and a dentate derivative thereof; (b) a linear chain having from about 2 to about 2 carbon atoms Or a branched alkyl group; (c) a cycloalkyl group having from about 3 to about 2 carbon atoms, or (a divalent group of the magic formula VI. An example of a fluorene-free dianhydride and an organic diamine) Illustrative examples of aromatic dianhydrides of the formula (χΙν) include: 3.3-bis[4-(3,4-dicarboxyphenoxy)phenyl]propene, for example, in U.S. Patent Nos. 3,972,902 and 4,455,410. Burning dianhydride; 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl ether dianhydride; 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride ; 4,4'-bis(3,4-diphenylphenoxy)benzophenone dianhydride; 4,4' - bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride; 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride; 4.4-bis (2 , 3-dicarboxyphenoxy)diphenyl ether dianhydride; 4.4-bis(2,3-dimercaptophenoxy)diphenyl sulfide dianhydride; 4.4-bis(2,3-dicarboxyphenoxy) Benzophenone dianhydride; 4.4-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride; 4-(2,3 < thiophenoxy)-4,-(3,4- Dicarboxyphenoxy)diphenyl-2,2-propane dianhydride; 118106.doc -18 - 200831609 4-(2,3·dicarboxyphenoxy)·4,_(3,4-dicarboxybenzene Oxy)diphenylether dianhydride; 4-(2,3-dicarboxyphenoxy)-4,-(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4-(2,3- Dicarboxyphenoxy)_4,_(3,'dicarboxyphenoxy)benzophenone di: anhydride; and: 4-(2,3-dicarboxyphenoxy M,-(3,4-di Carboxyphenoxy)diphenyl sulfone dianhydride, and mixtures thereof. In addition to the above-described alkoxyalkylene diamine, examples of suitable diamines include ethylenediamine, propanamine, trimethylenediamine, diethylidene Triamine, tri-ethyltetramine, hexamethyleneamine, heptanediamine, octanediamine, hydrazine Diamine, decane diamine, ii 2 · dodecapine diamine, 1,18-octadecanediamine, hydroxymethylheptanediamine, 4, dimethylheptanediamine, 4-mercaptodecylamine , % methyl hydrazine diamine, 2,5-dimethylhexamethylenediamine, 2,5·didecylheptanediamine, 2,2-dimercaptopropane diamine, N-methyl-diaminolated Propyl)amine, nonyloxyhexanediamine, 1,2-bis(3-aminopropoxy)ethane, bis(3-aminopropyl) sulfide, 14-cyclohexanediamine, biguanide 4_Aminocyclohexyl)methane, m-phenylenediamine, p-phenylenediamine, 2,4-diaminotoluene, 2,6-diamino, indole, m-xylenediamine, p-xylene Amine, 2-methyl-4,6·diethyl-1,3-phenylenediamine, 5-methyl-4,6-diethyl-1,3-phenylenediamine, benzidine, 3,3 - methylbenzidine, 3,3'-dimethoxyoxybenzidine, 1,5-diaminonaphthalene, bis(4-aminophenyl)methane, bis(2-chloro-4-amino) 3,5-Diethylphenyl)decane, bis(4-aminophenyl)propane, 2,4-bis(amino-t-butyl)toluene, bis(p-amino-t-butyl) Phenyl)ether, bis(p-fluorenyl-o-aminophenyl) 118106.doc -19- 200831609 Benzene, double ( p-Methyl-o-aminopentyl)benzene, diamino-4-isopropylbenzene, bis(4-aminophenyl) sulfide, bis('aminophenyl)anthracene, bis('amino group Phenyl) scales and combinations comprising two or more of the foregoing. An example of a special mussel of a nonoxyldiamine is 1,3-bis(3-aminopropyl)tetramethyldiazepine. In one embodiment, the diamine-based compound used in combination with the sulphuric acid diamine is an aromatic diamine, especially m-phenylenediamine and p-phenylenediamine, sulfonyldiphenylamine, and mixtures thereof. Some of the decyl alkoxy polyether oxime copolymers can be formed by reacting a mixture of an organic diamine or a diamine of formula VII with an amine oxo-oxane of the above formula Iv. The monoamine component is physically mixed prior to reaction with the dianhydride, thus substantially forming a random copolymer. Alternatively, a hydrazine or alternating copolymer can be formed by selectively reacting VH and IV with a dianhydride (e.g., Formula V) to produce a subsequently co-reacted polyimine block. In another example, the decane used to prepare the polyether quinone copolymer can have an anhydride rather than an amine functional end group. In one example, the oxoxane polyether oxime copolymer may be of the formula νιπ, wherein T, R' and g are as described above, b has a value of from about 5 to about 100, and Ar1 has from 6 to about 36. a carbon aryl or alkylaryl group.
式 VIII 在一些矽氧烧聚醚醯亞胺共聚物中,石夕氧烧聚醚醯亞胺 共聚物之二胺組份可含有約20至50莫耳%之式IV胺末端有 機石夕氧烧及約50至80莫耳%之式VII有機二胺。在一些矽氧 H8106.doc -20- 200831609 元/、t物中石夕氧燒組份係衍生自約25至約40莫耳%之胺 或酐末端有機矽氧燒。 聚5物摻口物之聚矽氧共聚物組份可以相對於聚合物摻 合物總重量約〇·!至約2〇重量%之量存在。在該範圍内,聚 纟氧,、聚物亦可以〇」至約1〇%(進一步為〇 5至5爲)之量存 在。 3.摻合物之以間苯二酚為主之聚芳酯組份 φ 以間苯一酚為主之聚芳酯為包含芳酯聚酯結構單元之聚 合物’該芳醋聚醋結構單元為二盼與芳族二㈣之反應產 物至;一部分芳酯聚酯結構單元包含1,3-二羥基苯基(如 式I所示)’在說明書全文中通常將其稱為間苯二酚或間苯 :盼基。應瞭解,除非另外明確說明,否則本文所用之間 苯二盼或間苯二紛基既包括未經取代之1,3_二經基苯又包 括經取代之1,3-二羥基苯。 i〇lDr〇iIn some of the anthraquinone polyether oxime imine copolymers, the diamine component of the diarrhea polyether oxime imine copolymer may contain from about 20 to 50 mole % of the amine of the formula IV. Burning about 50 to 80 mole % of the organic amide of formula VII. In some of the helium oxygen H8106.doc -20- 200831609 yuan /, the Shixi oxygen burning component is derived from about 25 to about 40 mole % of the amine or anhydride terminal organic oxime. The polyoxymethylene copolymer component of the poly-5 dope may be present in an amount from about !·! to about 2% by weight based on the total weight of the polymer blend. Within this range, the polyoxo, and the polymer may also be present in an amount of from about 1% by weight (further, from 5 to 5). 3. The resorcinol-based polyarylate component of the blend φ The polyaryl aryl ester based on m-phenylene phenol is a polymer comprising an aryl ester polyester structural unit. The aromatic vinegar polyacetate structural unit The reaction product of the di- and anti-aromatic two (four) to; a portion of the aryl ester polyester structural unit comprising a 1,3-dihydroxyphenyl group (as shown in Formula I) is generally referred to throughout the specification as resorcinol. Or m-benzene: Panki. It is to be understood that, unless otherwise specifically stated, the benzodiazepine or meta-phenylene is used herein to include both the unsubstituted 1,3-di-diphenyl and the substituted 1,3-dihydroxybenzene. i〇lDr〇i
式IX 在式IX中,在每次出現叫獨立為Cii2烧基、c6_c24芳 基C7_C24烷基芳基、烷氧基或鹵素,且11為0_4。 在一實施例中,以間苯二盼為主之聚芳醋樹脂包含大於 或等於約50莫耳%之衍生自間笨二酚與芳基二羧酸或適於 形成芳醋鍵之芳基二羧酸衍生物(例如,羧酸齒化物、羧 酸醋及綾酸鹽)之反應產物的單元。 口適一羧酸包括單%及多環芳族二羧酸。例示性單環二 H8106.doc • 21 - 200831609 叛酸包括間苯二甲酸、對苯二甲酸或間苯二甲酸I對苯二 甲酸之混合物。多環二叛酸包括二苯二甲酸、二苯_二甲 酸及萘二甲酸(例如萘_2,6_二曱酸)。 因此,在一實施例中,聚合物摻合物包含具有如式X所 示之間苯二紛芳賴聚醋單元之熱穩定聚合物,在式x"2 及η如先前所定義··In Formula IX, each occurrence is referred to as Cii2 alkyl, c6_c24 aryl C7_C24 alkylaryl, alkoxy or halogen, and 11 is 0-4. In one embodiment, the polyphenylene vinegar resin based on isophthalic acid comprises greater than or equal to about 50 mole % of an aryl group derived from a strepodiphenol and an aryl dicarboxylic acid or suitable for forming an aromatic vinegar bond. A unit of the reaction product of a dicarboxylic acid derivative (for example, a carboxylic acid dentate, a carboxylic acid vinegar, and a decanoate). Oral monocarboxylic acids include mono- and polycyclic aromatic dicarboxylic acids. Exemplary monocyclic two H8106.doc • 21 - 200831609 The tickic acid includes a mixture of isophthalic acid, terephthalic acid or isophthalic acid terephthalic acid. Polycyclic ditoxanic acid includes dicarboxylic acid, diphenyl-dicarboxylic acid, and naphthalene dicarboxylic acid (e.g., naphthalene-2,6-didecanoic acid). Thus, in one embodiment, the polymer blend comprises a thermally stable polymer having a benzodiazepine unit as shown in Formula X, wherein x"2 and η are as previously defined.
式X .藉由界面聚合方法製成包含間苯二酚芳醋聚酿單元之聚 合物。可利用如下方法來製備包含實f上不含酐鍵之間苯 二酚芳酯聚酯單元之聚合物,其中第一 八τ昂步驟使間苯二酚基 團及催化劑在水及與水實質上不可混 扣,合艾有機溶劑之混合Formula X. A polymer comprising a resorcinol aryl vinegar brewing unit is produced by an interfacial polymerization method. The following method can be used to prepare a polymer comprising a benzenediol aryl ester polyester unit having no anhydride bond on the real f, wherein the first octagonal step causes the resorcinol group and the catalyst to be in water and water essence Non-mixable, Hybrid organic solvent mixture
物中結合。合適間苯二酚化合物為式χι :Binding in matter. Suitable resorcinol compounds are of the formula χι :
式XI 其中,在每次出現時R2獨立為Cl-12烷基、芳基、c _Wherein each occurrence of R2 is independently Cl-12 alkyl, aryl, c _
Cm烧基芳基、烧氧基或鹵素且η為〇-4。若左* Ί 石仔在,則烧基通 常為直鏈烷基、支鏈烷基或環烷基,且儘管涵蓋其他^位 置,但烷基最常位於兩個氧原子之鄰位。合 σL 1 _ 12炫基包 118106.doc -22- 200831609 括(但不限於)甲基、乙基、正丙基、異丙基、丁基、異丁 基、第三丁基、己基、環己基、壬基、癸基及經芳基經取 代之烷基(包括苯甲基卜在一特定實施例中,烷基為甲 基。合適画素基團為溴、氯及氟。不同實施例中n之值可 為0至3,在一些實施例中為〇至2,且在其他實施例中為〇 至1。在-實施例中,間苯二酚基團為2_甲基間苯二酚。 在另一實施例中,間苯二酚基為11為零之未經取代之間苯 二紛基。該方法進-步包含使—種催化劑與反應混合物組 合。以酸氯化物基團之總莫耳數計,在不同實施例中該催 化劑可以(ΜΠ至H)莫耳%之總含量存在,且在—些實施例 中其可以G.2至6莫耳%之總含量存在。合適催化劑包含三 級胺、四級銨鹽、四級鱗鹽、六烧基胍鹽及其混合物。 合適二羧酸二南化物可包含衍生自單環部分之芳族二羧 酸二氣化物’其說明性實例包括間苯二醯基二氯化物、對 苯二醯基二氯化物或間苯二酿基二氯化物與對苯二酿基二 鼠化物之混合物。人搞-絡灸一 σ、一瘦6^二_化物亦可包含衍生自 壞部分之芳族二Μ酸-查几从 躞®"一虱化物,其說明性實例包括二苯二 :酸:氯:物、二苯喊二缓酸二氯化物及萘二缓酸二氯化 二 :6_二羧酸二氣化物);或▼包含衍生自單環與 多壞方族二幾酸-衰於你 文—减物之混合物之芳族二㈣二氯化 物。在一貝施例中二羧酸二 Η ^ ^ . 乳化物包含通常如式XII所說 ::間本一醯基二氯化物及/或對苯二醯基二氯化 合物。 118106.doc -23- 200831609Cm is aryl, alkoxy or halogen and η is 〇-4. If left* Ί石仔, the alkyl group is usually a linear alkyl group, a branched alkyl group or a cycloalkyl group, and although other positions are covered, the alkyl group is most often located ortho to the two oxygen atoms. σL 1 _ 12 炫基包118106.doc -22- 200831609 includes (but not limited to) methyl, ethyl, n-propyl, isopropyl, butyl, isobutyl, tert-butyl, hexyl, ring Alkyl, fluorenyl, fluorenyl and aryl substituted alkyl groups (including benzyl group). In a particular embodiment, the alkyl group is a methyl group. Suitable pixel groups are bromine, chlorine and fluorine. In different embodiments The value of n may range from 0 to 3, in some embodiments from 〇 to 2, and in other embodiments from 〇 to 1. In the embodiment, the resorcinol group is 2-methylisophthalene Phenol. In another embodiment, the resorcinol group is an unsubstituted benzodiazepine having 11 zero. The method further comprises combining the catalyst with the reaction mixture. The total molar amount of the catalyst may be present in various embodiments in a total amount of (ΜΠ to H) mole %, and in some embodiments it may be present in a total amount of from G. 2 to 6 mole %. Suitable catalysts include tertiary amines, quaternary ammonium salts, quaternary scale salts, hexavalent sulfonium salts, and mixtures thereof. Suitable dicarboxylic acid dinansides may comprise derivatives derived from the monocyclic portion. Illustrative examples of the aromatic dicarboxylic acid dihydrates include m-phenylenedifluoride dichloride, p-phenylenedifluoride dichloride or m-phenylenediyl dichloride and p-phenylene dibasic compound. a mixture of humans - moxibustion - σ, a thin 6 ^ _ _ may also contain aromatic bismuth-derivatives derived from the bad part - 几 躞 & ® " a bismuth compound, illustrative examples including diphenyl Two: acid: chlorine: diphenyl, dibenzoic acid dichloride and naphthalene dibasic acid dichloride: 6_dicarboxylic acid dihydrate); or ▼ contains derived from monocyclic and polycyclic A few acids - the aromatic di(tetra) dichloride of a mixture of yours and subtractives. In one embodiment, the dicarboxylic acid dioxime ^ ^ . Emulsion comprises as described in formula XII with the following: a fluorenyl dichloride and/or a p-phenylene dichloride dichloride. 118106.doc -23- 200831609
式XII 〗苯一醯基二氯化物及對苯二醯基二氯化物中之 一者或二者。名— 在 i貝施例中,二羧酸二氯化物包含間苯 二醯基與對笨二酸基之莫耳比為約〇.25-4.〇:1之間苯二醯 基二亂化物與對苯二醯基二氯化物之混合物;在其他實施 例中該莫耳比為約〇·4_2·5:ι;且在其他實施例中該 為約 0.67-1.5:1。 、 、羧夂白&物僅提供一種製備纟文所述之聚合物之方 法亦涵盍(例如)使用二缓酸、二缓㈣(尤其活㈣)或 二缓酸鹽或部分鹽製得間苯m旨鍵之其他途捏。 亦可使用-種鏈終止劑(τ文有時亦稱為封端劑)。添加 鏈終止劑之目的係為了限制包含間苯二时s旨聚醋鍵成員 之聚合物的分子量,從而提供具有受控分子量及有利可加 工性之聚合物。通常當不需要含間苯二酚芳酯之聚合物且 有用於進-步應用之反應性端基時添加鏈終止劑。在不^ 在鏈終止劑時可將含間苯二紛芳酉旨之聚合物用於溶液中或 自溶液中回收以隨後用於(諸如)共聚物形成中,此可能要 求間苯二I芳醋聚醋片段上存在通常為經基之反應性端 基。鏈終止劑可為單盼系化合物、單叛酸氯化物、單氯甲 酸酯或兩種或兩種以上前述物質之纟且人。# 、、、、σ。通吊,在單酚系 化合物之狀況下以間苯二紛計及在單_氯化物及/或單 氯甲酸醋之情況下以酸二氯化物計,鏈終止劑可以0.05至 118106.doc • 24 - 200831609 1 〇莫耳%之量存在。 合適單酚系化合物包括單環酚,諸如酚、經Ci-C22烷基 取代之酚、對異丙苯基酚、對第三丁基酚、羥基二苯基; 一酚之單醚(諸如對曱氧基苯酚)。經烷基取代之酚包括如 美國專利第4,334,053號中所述之具有8至9個碳原子之支鏈 烧基取代基之紛。在一些實施例中單酚繫鏈終止劑為酚、 對異丙苯基酚及間苯二酚單苯甲酸醋。 合適單竣酸氯化物包括單環單羧酸氯化物,諸如苯曱醯 氯、經C^C:22烷基取代之苯甲醯氯、甲苯曱醯氯、經鹵素 取代之笨甲醯氯、溴苯曱醯氯、桂皮醯氯、4-納迪醯亞胺 基苯甲醯氯(4-nadimidobenzoyl chloride)及其混合物;多 %單竣酸氯化物,諸如氯化偏苯三羧酸酐及萘醯氯;及單 環與多環單羧酸氯化物之混合物。具有高達22個碳原子之 脂族單缓酸之氣化物亦合適。官能化脂族單羧酸之氯化物 (諸如丙烯醯氯及甲基丙烯醯氯)亦適合。合適單氯甲酸酯 包括單環單氯甲酸酯,諸如氯甲酸苯酯、經烷基取代之氯 甲酸苯酯、對異丙苯基氯甲酸苯酯、氯甲酸甲苯酯及其混 合物。 鏈終止劑可與間苯二酚組合、可含於二羧酸二氯化物溶 液中或可在預縮合物產生後添加至反應混合物。若將單羧 酸氯化物及/或單氯甲酸酯用作鏈終止劑,則常將其與二 羧酸二氯化物共同引入。亦可在二羧酸之氯化物實質上已 反應或反應完成之時刻將該等鏈終止劑添加於反應混合 物。若將酚系化合物用作鏈終止劑,則在一實施例中其可 118106.doc • 25· 200831609 在反應期間添加至反應混合物,或在另一實施例中其可在 間苯二酚與酸二氯化物之間的反應開始之前添加至反應混 合物。當製備含羥基末端間苯二酚芳酯之預縮合物或寡聚 物時,則可不存在或僅少量存在鏈終止劑以幫助控制寡聚 物分子量。 在另一實施例中,可包括分枝劑,諸如三官能或更高官 能羧酸氯化物及/或三官能或更高官能酚。若包括,則該 等分枝劑分別以所用之二羧酸二氯化物或間苯二酚計,通 苇可以0 · 0 0 5至1莫耳%之量使用。合適分枝劑包括(例如) 二官能或更高官能緩酸氯化物(諸如均苯三竣酸三酸氯化 物、3,3’,4,4’-二苯甲酮四羧酸四氯化物、1,4,5,8_萘四羧酸 四氯化物或苯四羧酸四氯化物)及三官能或更高官能酚(諸 如4,6-二甲基-2,4,6-三-(4-羥基苯基)-2-庚烷、4,6-二曱基- 2,4,6-二-(4-經基苯基)-庚烧、ι,3,5-三-(4-羥基苯基)_苯' 1,1,1-二-(4-羥基苯基)_乙烷、三_(4_羥基苯基)_苯基甲烷、 2,2-雙-[4,4-雙-(4-羥基苯基)_環己基丙烷、2,4-雙气4_羥 基苯基異丙基)-酚、四_(4_羥基苯基>曱烷、2,6_雙_(2-羥 基-5-甲基苯曱基‘甲基酚、2_(4_羥基苯基二羥 基苯基)-丙烷、四-(4-[4-羥基苯基異丙基]_苯氧基)_曱烷、 1,4-雙-[(4,4-二羥基三苯基)甲基]_苯。可首先引入酚系分 枝劑與間苯二驗部分,同時共同引人酸氯化物分枝劑與酸 一氣化物。 在其一實施例中,製品物件包含由所述方法製得及實質 上不含鍵聯聚輯之至少兩個基狀奸鍵的熱穩定性間笨 118106.doc -26- 200831609 二酚芳酯聚酯。在一特定實施例中,該等聚酯包含如式 XIII所不之衍生自間苯二甲酸與對苯二甲酸之混合物之二 羧酸殘基:Formula XII is one or both of phenylmercapto dichloride and p-phenylenediamine dichloride. Name - In the case of i, the dicarboxylic acid dichloride contains a molar ratio of m-benzoic acid to p-dibenzoate of about 25.25-4. 〇:1 between benzodiazepines The mixture of the compound and the terephthaloyl dichloride; in other embodiments the molar ratio is about 〇·4_2·5:ι; and in other embodiments it is about 0.67-1.5:1. , carboxy hydrazine white & only provides a method for preparing the polymer described in the essay, for example, using a sulphuric acid, a second sulphur (four) (especially a live (tetra)) or a sulphonate or a partial salt. The other way around the benzene m key. A chain terminator (also sometimes referred to as a capping agent) can also be used. The purpose of adding a chain terminator is to limit the molecular weight of the polymer comprising the meta-phenylene bond member, which provides a controlled molecular weight and advantageous processability. Chain terminators are typically added when a polymer containing resorcinol arylate is not required and there is a reactive end group for further application. The polymer containing isophthalic acid may be used in solution or recovered from the solution in the absence of a chain terminator for subsequent use in, for example, copolymer formation, which may require isophthalic acid. The reactive end groups, which are typically via groups, are present on the vinegar polyacetate fragment. The chain terminator may be a mono-pane compound, a mono-deoxychloride, a monochloroformate or a combination of two or more of the foregoing. # , , , σ. Hanging, in the case of monophenolic compounds in the case of isophthalic acid and in the case of mono-chloride and / or monochloroformic acid hydrate, the chain terminator can be 0.05 to 118106.doc • 24 - 200831609 1 The amount of 〇mol is present. Suitable monophenolic compounds include monocyclic phenols such as phenol, Ci-C22 alkyl substituted phenol, p-cumyl phenol, p-tert-butyl phenol, hydroxy diphenyl; monophenol monoether (such as Alkoxyphenol). The alkyl-substituted phenol includes a branched alkyl group having 8 to 9 carbon atoms as described in U.S. Patent No. 4,334,053. In some embodiments the monophenolic chain terminators are phenol, p-cumylphenol and resorcinol monobenzoic acid vinegar. Suitable monocapric acid chlorides include monocyclic monocarboxylic acid chlorides such as benzoquinone chloride, benzamidine chloride substituted with C^C:22 alkyl group, toluene chloride, halogenated substituted formazan, Bromobenzoquinone chloride, cinnabarin chloride, 4-nadimidobenzoyl chloride, and mixtures thereof; poly% monocapric acid chloride, such as chlorobenzene trimellitic anhydride and naphthalene醯 chlorine; and a mixture of monocyclic and polycyclic monocarboxylic acid chlorides. A gasification of an aliphatic mono-acid with up to 22 carbon atoms is also suitable. Chlorides of functionalized aliphatic monocarboxylic acids such as acrylonitrile chloride and methacrylium chloride are also suitable. Suitable monochloroformates include monocyclic monochloroformates such as phenyl chloroformate, alkyl substituted phenyl chloroformate, phenyl p-cumyl chloroformate, toluene chloroformate and mixtures thereof. The chain terminator may be combined with resorcinol, may be included in the dicarboxylic acid dichloride solution or may be added to the reaction mixture after the precondensate is produced. If a monocarboxylic acid chloride and/or a monochloroformate is used as the chain terminator, it is often introduced together with the dicarboxylic acid dichloride. The chain terminators may also be added to the reaction mixture at a time when the chloride of the dicarboxylic acid has substantially reacted or the reaction is complete. If a phenolic compound is used as the chain terminator, it may be added to the reaction mixture during the reaction in an embodiment 118106.doc • 25·200831609, or in another embodiment it may be in resorcinol with acid The reaction between the dichlorides is added to the reaction mixture before the start of the reaction. When a precondensate or oligomer containing a hydroxy terminal resorcinol arylate is prepared, a chain terminator may be absent or only present in minor amounts to help control the molecular weight of the oligomer. In another embodiment, a branching agent such as a trifunctional or higher functional carboxylic acid chloride and/or a trifunctional or higher functional phenol may be included. If included, the branching agents can be used in an amount of from 0. 005 to 1 mol%, based on the dicarboxylic acid dichloride or resorcinol used, respectively. Suitable branching agents include, for example, difunctional or higher functional acid chlorinated chlorides such as trimesic acid triacid chloride, 3,3',4,4'-benzophenone tetracarboxylic acid tetrachloride , 1,4,5,8-naphthalenetetracarboxylic acid tetrachloride or benzenetetracarboxylic acid tetrachloride) and trifunctional or higher functional phenols (such as 4,6-dimethyl-2,4,6-three -(4-hydroxyphenyl)-2-heptane, 4,6-dimercapto-2,4,6-di-(4-pyridylphenyl)-heptane, ι,3,5-tri- (4-hydroxyphenyl)-benzene' 1,1,1-di-(4-hydroxyphenyl)-ethane, tris-(4-hydroxyphenyl)-phenylmethane, 2,2-bis-[ 4,4-bis-(4-hydroxyphenyl)-cyclohexylpropane, 2,4-dioxa-4-hydroxyphenylisopropyl)-phenol, tetra-(4-hydroxyphenyl) decane, 2 , 6_bis-(2-hydroxy-5-methylbenzoinyl-methylphenol, 2-(4-hydroxyphenyldihydroxyphenyl)-propane, tetra-(4-[4-hydroxyphenylisopropyl) a phenolic branching agent and an isophthalic acid moiety, which may be first introduced into the phenolic branching agent, 1,4-bis-[(4,4-dihydroxytriphenyl)methyl]-benzene. At the same time, the acid chloride branching agent is co-introduced with the acid monogas. In an embodiment thereof, the article of manufacture comprises The method produces and is substantially free of the thermal stability of at least two of the bond types of the bondage. 118106.doc -26- 200831609 diphenol aryl ester polyester. In a particular embodiment, the polymerization The ester comprises a dicarboxylic acid residue derived from a mixture of isophthalic acid and terephthalic acid as defined by formula XIII:
式ΧΠΙ 其中,在每次出現時R2獨立為Ci u烷基、CpC24芳基、烷 基芳基、烧氧基或自素,,且m大於或等於約5。在 不同實施例中,η為零且m為約10至約3〇〇。間苯二甲酸與 對本一甲g吏之莫耳比在—實施例中為約G ,在另 -實施例中為約〇·4_2·5:1,且在又一實施例中為約Ο·”· 1·5··1。實質上不含野鍵意謂當在約28〇韻。c之溫度下加 熱該聚合物歷時五分鐘時該等聚酯在一實施例中顯示分子 篁降低不到30%且在另一實施例中降低不到。 亦包括包含間苯二酚若酷j£令妒 4 断方®日共I8日之物件,該共聚酯含有 共同擁有美國專利第5,916,997號中所揭示之軟嵌段片段。 如本文所狀㈣㈣縣段係由非芳族 單體單元組成。該等非芳族單體單元—般為脂族的且已知 其賦予含軟嵌段之聚合物以可撓性。共聚物包括 IX、XIV及XV結構單元之彼等共聚物·· -丨。lXf- R2〇Wherein R2 is independently Ciu alkyl, CpC24 aryl, alkylaryl, alkoxy or self at each occurrence, and m is greater than or equal to about 5. In various embodiments, η is zero and m is from about 10 to about 3 Torr. The molar ratio of isophthalic acid to the present invention is about G in the embodiment, about 〇·4_2·5:1 in another embodiment, and about Ο· in another embodiment. "·1·5··1. Substantially free of wild keys means that when the polymer is heated at a temperature of about 28 〇 rh. c for five minutes, the polyesters show an increase in molecular enthalpy in one embodiment. Up to 30% and less than in another embodiment. Also included is an article containing resorcinol, which has a total of US$5,916,997. The soft block fragments disclosed herein. (4) (4) The county segments are composed of non-aromatic monomer units. These non-aromatic monomer units are generally aliphatic and are known to impart soft block-containing The polymer is flexible. The copolymer includes copolymers of IX, XIV and XV structural units. · -丨.lXf- R2〇
式IX 118106.doc •27- 200831609 ο ο ΛΖΛFormula IX 118106.doc •27- 200831609 ο ο ΛΖΛ
式XIV 式XV 其中R2及η係如先前所定義,ζ1為二價芳基,R3為q心直 鏈伸烷基、(:3·1()支鏈伸烷基或C4_1G環或二伸環烷基,且r4 及R係各自獨立表示 〇 人或-ch2-o一, 其中式XV佔聚酯之酯鍵的約1至約45莫耳%。其他實施例 提供一組合物,其中式又¥在不同實施例中佔聚酯之酯鍵 的約5至約40莫耳❶/。,且在其他實施例中佔聚酯之酯鍵的 約5至約20莫耳%。另一實施例提供一組合物,其中在一 實施例中R3表示C^4直鏈伸烷基或cw伸環烷基,且在另 K施例中,R表示Cno直鏈伸烷基或^^-伸環烷基。式 xiv表不芳族二羧酸殘基。式χιν中二價芳基"在不同實 施例中可衍生自如上文所定義之合適二羧酸殘基,且在一 些實施财包含U-伸苯基、认伸苯基或伸蔡基或兩 種或兩種以上前述基團之組合。在不同實施例中,ζ1包含 ^於或等於約40莫耳%之153·伸苯基。在含有軟嵌段鏈成 員之共聚酯之不同實施例中,式ιχ中之n為零。 在其另一實施例中,以間苯二酚為主之聚芳酯可為包含 含間苯二酚芳酯之嵌段片段與有機碳酸酯嵌段片段之組合 的嵌段共聚ί旨碳酸g旨。料共聚物中包含間苯二紛芳醋鍵 118106.doc -28- 200831609 成員之片段實質上不含酐鍵。實質上不含酐鍵意謂當在約 28〇-290°C之溫度下加熱該共聚酯碳酸酯歷時五分鐘時, 該共聚酯碳酸酯在一實施例中顯示分子量減少不到1 〇。/0且 在另一實施例中分子量減少不到5%。 碳酸酯後段片段含有衍生自形成產生聚酯碳酸酯共聚物 之物質(諸如碳醯氯)的雙酚與碳酸酯之反應的碳酸酯鍵。 例如,間苯二酚聚芳酯碳酸酯共聚物可包含間苯二甲酸與 對苯二甲酸、間苯二酚及雙酚A與碳醯氯之反應產物。可 以使雙酚二羧酸酯鍵之數目最小化之方式製得間苯二酚聚 酉曰石反酸酯共聚物,該方式例如藉由使間苯二紛與二缓酸預 反應以形成芳基聚酯嵌段且隨後使該嵌段與雙酚及碳酸酯 反應以形成共聚物之聚碳酸酯部分。 為達到最好效果,間苯二酚聚酯碳酸酯中之間苯二酚酯Formula XV Formula XV wherein R2 and η are as previously defined, ζ1 is a divalent aryl group, R3 is a q-cardo-chain alkylene group, (:3·1() branched alkyl or C4_1G ring or a bi-extension ring Alkyl, and r4 and R each independently represent a human or -ch2-o-, wherein formula XV represents from about 1 to about 45 mole percent of the ester linkage of the polyester. Other embodiments provide a composition wherein the formula In some embodiments, it comprises from about 5 to about 40 moles per mole of the ester linkage of the polyester, and in other embodiments from about 5 to about 20 mole percent of the ester linkage of the polyester. Another embodiment A composition is provided, wherein in one embodiment R3 represents C^4 linear alkyl or cw cycloalkyl, and in another K embodiment, R represents Cno linear alkyl or ^--extension ring Alkyl. Formula xiv represents an aromatic dicarboxylic acid residue. The divalent aryl group of the formula χιν can be derived from a suitable dicarboxylic acid residue as defined above in various embodiments, and is included in some implementations. U-phenylene, phenyl or phenylene or a combination of two or more of the foregoing groups. In various embodiments, ζ1 comprises or is equal to about 40 mole % of 153 phenyl. Containing soft block chains In a different embodiment of the copolyester of the member, n in the formula ι is zero. In another embodiment, the resorcinol-based polyarylate may be embedded with a resorcinol-containing aryl ester. The block copolymerization of the combination of the segment segment and the organic carbonate block segment is intended to be a carbonic acid. The copolymer contains m-phenylene aryl vinegar linkage 118106.doc -28- 200831609 The fragment of the member is substantially free of anhydride linkage. Substantially free of anhydride linkage means that when the copolyestercarbonate is heated at a temperature of about 28 Torr to 290 ° C for five minutes, the copolyestercarbonate exhibits a molecular weight reduction of less than 1 在一 in one embodiment. /0 and in another embodiment the molecular weight is reduced by less than 5%. The carbonate post-stage fragment contains carbonic acid derived from the reaction of a bisphenol with a carbonate which forms a substance which produces a polyestercarbonate copolymer, such as carbonium chloride. For example, the resorcinol polyarylate carbonate copolymer may comprise the reaction product of isophthalic acid with terephthalic acid, resorcinol and bisphenol A with carbon ruthenium chloride. Resorcinol polyphthalate reverse ester copolymer prepared by minimizing the number of acid ester bonds This method forms a aryl polyester block by, for example, pre-reacting isophthalic acid with a bis-acid, and then reacting the block with a bisphenol and a carbonate to form a polycarbonate portion of the copolymer. Best effect, between the resorcinol polyester carbonate
苯二酚之鍵的約75莫耳% ’或者甚至高達約9〇或 100莫耳%之REC。Approximately 75 mole % of the bond of the benzenediol or even up to about 9 〇 or 100 mole % of the REC.
義,且R6為二價有機基團:And R6 is a divalent organic group:
式XVI 118106.doc -29- 200831609 芳酯嵌段具有由m表示之聚合度(Dp),在一實施例中Dp 大於或等於約4,在另-實施例中大Μ等於物,在另 一實施例中大於或等於約2〇,且在又—實㈣中為約Μ至 約150。由ρ表示之有機碳酸酯嵌段之Dp在一實施例中大於 或等於約2,在另一實施例中為約1〇至約2〇,且在又一實 施例中為約2至約200。嵌段分佈可提供具有任何所要芳醋 嵌段與碳酸酯嵌段之重量比之共聚物。一般而言,芳酯嵌 f含量相對於聚合物總重量在一實施例中為約10至約95重 量%且在另一實施例中為約5〇至約95重量%。 儘管式XVI中說明了間苯二醯酯與對苯二醯酯之混合 物,芳酯嵌段中之二羧酸殘基可衍生自任何合適二羧酸殘 基(如上文所所定義)或合適二羧酸殘基之混合物,包括衍 生自I曰族二酸二氯化物之二羧酸殘基(所謂"軟嵌段"片 段)。在不同實施例中,n為零,且芳酯嵌段包含衍生自間 苯二甲酸與對苯二甲酸殘基之混合物之二羧酸殘基,其中 間苯二甲酸酯與對苯二甲酸酯之莫耳比在一實施例中為約 0.25至4.0:1,在另一實施例中為約0.4至2·5:1,且在又一 實施例中為約〇.67至15:1。 在有機碳酸S旨·嵌段中,在每次出現時R6各自獨立為二價 有機基團。在不同實施例中,該基團包含經二羥基取代之 芳族煙’且聚合物中基團總數之大於或等於約60〇/〇為芳 族有機基團’且其餘為脂族、脂環族或芳基。合適R6基團 包括間伸苯基、對伸苯基、4,4,-伸聯苯基、4,4,-二(3,5-二 甲基伸苯基、2,2-雙(4-伸苯基)丙烷、6,6,-(3,3,3,,3,_四甲 118106.doc -30- 200831609 基-1,1,·螺二ΠΗ^滿基似類似基目,諸如對確 利第切⑽號中名稱或化學式(通式或,=國專 經二羥基取代之芳族烴之基團。 飞)所揭不之 在-些實㈣W各自為芳族有機基團且在 中為式XVII基團: /、他實施例 Α1— Υ— a2--Formula XVI 118106.doc -29- 200831609 The arylate block has a degree of polymerization (Dp) represented by m, in one embodiment Dp is greater than or equal to about 4, and in another embodiment, greater than or equal to, in another embodiment In the embodiment, it is greater than or equal to about 2 Torr, and in the re- (4) is about Μ to about 150. The Dp of the organic carbonate block represented by ρ is greater than or equal to about 2 in one embodiment, from about 1 Torr to about 2 Torr in another embodiment, and from about 2 to about 200 in yet another embodiment. . The block distribution can provide a copolymer having any desired ratio of aromatic vinegar blocks to carbonate blocks. In general, the aryl ester embefth content is from about 10 to about 95 weight percent in one embodiment relative to the total weight of the polymer and from about 5 to about 95 weight percent in another embodiment. Although a mixture of isophthalic acid ester and terephthalic acid ester is illustrated in Formula XVI, the dicarboxylic acid residue in the aryl ester block may be derived from any suitable dicarboxylic acid residue (as defined above) or suitable A mixture of dicarboxylic acid residues, including dicarboxylic acid residues derived from I guanidine diacid dichloride (so-called "soft block" fragments). In various embodiments, n is zero and the arylate block comprises a dicarboxylic acid residue derived from a mixture of isophthalic acid and a terephthalic acid residue, wherein the isophthalate and the para-xylene are The molar ratio of the acid ester is from about 0.25 to 4.0:1 in one embodiment, from about 0.4 to 2.5:1 in another embodiment, and from about 〇.67 to 15 in yet another embodiment: 1. In the organic carbonic acid S block, each of R6 is independently a divalent organic group at each occurrence. In various embodiments, the group comprises a dihydroxy-substituted aromatic fumes and the total number of groups in the polymer is greater than or equal to about 60 Å/〇 as an aromatic organic group and the remainder are aliphatic, alicyclic Family or aryl. Suitable R6 groups include the exophenyl, paraphenyl, 4,4,-biphenyl, 4,4,-bis(3,5-dimethylphenyl, 2,2-bis (4) -Phenyl)propane, 6,6,-(3,3,3,,3,_四甲118106.doc -30- 200831609 基-1,1,·螺二ΠΗ^满基如似基目, For example, the name or chemical formula of the formula (10) or the formula (the group of the aromatic hydrocarbons of the dihydroxy-substituted aromatic hydrocarbons of the country) is uncleared - some of the solid (four) W are each an aromatic organic group. And in the formula XVII group: /, his embodiment Α 1 - Υ - a2--
式 XVII 其中Α1及Α2各自為單環二價芳基,且γ為其中 * 原子將Α1與Α2分開之橋基。式χνι中 5固石反 ,s ^ . ^ A , 2 八川甲之自由價鍵相對於γ ^處於及a之間位或對位。r6具有式χνπ之化合物為 雙紛,且為簡潔起見,太+ 士女古 …、 巧門冰起見,本文中有時以術語,,雙酚,,來表示唑 一經基取代之芳族烴。然而,應瞭解適當時亦可利用該類 型之非雙酚化合物。 在式XVII中’ AjA2itf表^未經取代之伸苯基或其經 取代之衍生物’說明性取代基(一或多個)為烷基、烯基及 鹵素(尤其為溴)。在—實施例中,未經取代之伸苯基為較 佳的。A1及W均常為對伸苯基,儘管二者均可為鄰或間伸 苯基,或一者為鄰或間伸苯基而另一者為對伸苯基。 橋基Y為其中一或兩個原子將A1與A2分開之橋基。在一 特定實施例中’-個原子將^與^分開。該類型之說明性 基團為-0-、-S_、_80_或_§〇2·、亞甲基、環己基亞甲基、 2-[2.2.1]-二環庚基亞甲基、伸乙基、亞異丙基、亞新戊 基、亞環己基、亞環十五烧基、亞環十二烧基、亞金剛烧 基及類似基團。 118106.doc -31- 200831609 在一些實施例中,偕伸烷基(通常稱為”亞烷基”)為較佳 的。然而,亦包括不飽和基團。在一些實施例中,雙酚為 2,2-雙(4-羥基苯基)丙烷(雙酚_A或bPA),其中丫為亞異丙 基’且A及A各自為對伸苯基。視反應混合物中存在之莫 耳過畺之間本二齡而定,碳酸酯傲段中之R6可至少部分包 含間苯二酚基團。換言之,在一些實施例中,式X碳酸酯 肷段可包含間苯二酚基團與至少一種其他經二經基取代之 芳族烴之組合。 包括二欲段、三嵌段及多嵌段共聚酯碳酸酯。在包含間 苯二紛芳g旨鏈成員之嵌段與包含有機碳酸酯鏈成員之嵌段 之間的化學鍵可包含以下至少一者: 0)芳_基之合適二綾酸殘基與有機碳酸酯基之_〇_116-〇 基團之間的酯鍵,例如通常如式XVIII中說明,其中尺6係 如先前所定義:Wherein Α1 and Α2 are each a monocyclic divalent aryl group, and γ is a bridging group in which the * atom separates Α1 from Α2. In the formula χνι, 5 固石反, s ^ . ^ A , 2 The free valence bond of Bachuan A is in the position or alignment between γ ^ and a. R6 has the formula χνπ compound is double, and for the sake of brevity, too + 士女古..., Qiaomen ice sees, sometimes used in this article, the term bisphenol, to mean the azole-based substituted aromatic hydrocarbon. However, it should be understood that this type of non-bisphenol compound can also be utilized as appropriate. In the formula XVII, 'AjA2itf is an unsubstituted phenylene group or a substituted derivative thereof'. The illustrative substituent(s) are alkyl, alkenyl and halogen (especially bromine). In the examples, the unsubstituted phenylene group is preferred. Both A1 and W are often p-phenylene, although both may be o- or m-phenyl, or one may be o- or meta-phenyl and the other be p-phenyl. The bridging group Y is a bridging group in which one or two atoms separate A1 from A2. In a particular embodiment, the '- atoms separate ^ from ^. Illustrative groups of this type are -0-, -S_, _80_ or _§〇2·, methylene, cyclohexylmethylene, 2-[2.2.1]-bicycloheptylmethylene, Ethyl, isopropylidene, pentylene, cyclohexylene, cyclopentylene, cyclopentylene, ruthenium, and the like. 118106.doc -31- 200831609 In some embodiments, an alkylene group (commonly referred to as "alkylene") is preferred. However, unsaturated groups are also included. In some embodiments, the bisphenol is 2,2-bis(4-hydroxyphenyl)propane (bisphenol_A or bPA) wherein hydrazine is isopropylidene' and A and A are each a pendant phenyl group. Depending on the age at which the moles present in the reaction mixture are present, the R6 in the carbonate segment can comprise, at least in part, a resorcinol group. In other words, in some embodiments, the carbonate segment of Formula X can comprise a combination of a resorcinol group and at least one other dihydrocarbyl-substituted aromatic hydrocarbon. Including di-segment, triblock and multi-block copolyestercarbonates. The chemical bond between the block comprising the meta-phenylene group and the block comprising the organic carbonate chain member may comprise at least one of the following: 0) an appropriate diterpene acid residue of the aryl group and the organic carbonic acid The ester bond between the oxime-116-oxime groups of the ester group, for example as generally illustrated in formula XVIII, wherein the ruler 6 is as previously defined:
式 XVIII 及 (b)間苯二盼芳醋基之二酚殘基與有機碳酸酯基之气c=〇)-〇-基之間的碳酸酯鍵,如式χιχ所示,其中R2及η係如先前所 定義:a carbonate bond between the diphenyl phenolic residue of formula VIII and (b) and the gas of the organic carbonate group c=〇)-〇-yl group, as shown by the formula χιχ, wherein R2 and η As previously defined:
式XIX 118106.doc -32- 200831609 在一實施例中,共聚酯碳酸酯實質上係由在間苯二酚芳 酉旨喪段與有機碳酸i旨嵌段之間具有碳酸醋鍵之二嵌段共聚 物組成。在另一實施例中共聚酯碳酸酯實質上係由在間苯 二酚芳酯嵌段與有機碳酸酯末端嵌段之間具有碳酸醋鍵之 三嵌段碳酸酯-酯-碳酸酯共聚物組成。 在熱穩定性間苯二酚芳酯嵌段與有機碳酸酯嵌段之間具 有碳酸酯鍵之共聚酯碳酸酯通常係由在一實施例中含有至 _ 少一個羥基末端部分及在另一實施例中含有至少兩個羥基 末端部分的含間苯二酚芳酯之募聚物製備。該等寡聚物之 重篁平均分子量通常在一實施例中為約1〇,〇〇〇至約 40,000,且在另一實施例中為約15,〇〇〇至約3〇,⑽〇。可藉 由在諸如二級胺之催化劑存在下使該含間苯二紛芳酯之募 聚物與碳醯氯、鏈終止劑及經二羥基取代之芳族烴反應來 製備熱穩定共聚酯碳酸酯。 在一實例中,物件可包含選自由聚砜、聚(醚砜)及聚(伸 ❿ 苯基醚砜)及其混合物組成之群之樹脂;聚矽氧共聚物及 以間苯二酚為主之聚芳酯(其中大於或等於5〇莫耳%之芳基 聚酯鍵為衍生自間苯二酚之芳酯鍵)之摻合物。 用於構成物件之聚合物摻合物巾所使用之以間苯二紛為 主之聚芳酯之量可視物件之最終用途而廣泛不同。例如, 當將物件用㈣熱或增大到達放熱峰值之時間》重要因素 之最終用途時,可使含有間苯二盼醋之聚合物的量最大化 以降低放熱及延長到達放熱峰值之時間。在一些實例中, 以間苯二酚為主之聚芳酯可佔聚合物摻合物的約!至約5 〇 118106.doc • 33 - 200831609 重量%。-些重要組合物將具有相對於聚合物摻合物總重 量約10至約50重量%的以間苯二酚為主之聚芳酯。 在另-實施例中,涵蓋包含如下聚合物摻合物之物件: a) 約1至約99重量%之聚石風、聚⑽石風)及聚(伸苯基謎礙) 或其混合物; b) 約0.1至約30重量%之聚矽氧共聚物; c) 、’勺99至約1重罝%之以間苯二酚為主之聚芳酯,其含 有大於或等於約50莫耳%衍生自間苯二酚之鍵; d) 0至約20重量%之金屬氧化物, 其中重量%係相對於聚合物摻合物之總重量。 在其他態樣中,涵蓋包含如下聚合物摻合物之物件: a) 、々50至約99重篁%之聚砜、聚(醚砜)、聚(伸苯基醚 砜)或其混合物; b) 約0·1至約10重量%之聚矽氧共聚物; c) 力1至約50重量%之以間苯二酚為主之聚芳酯樹脂, 其含有大於或等於約50莫耳%衍生自間苯二酚之鍵; d) 〇至約20重量%之金屬氧化物;及 e) 〇至約2重量。/。之含磷穩定劑。 PEI、PI、PEIS及其混合物;聚矽氧共聚物;及以間 苯二酚為主之芳基聚酯樹脂之高Tg摻合物。 例如t梦氧聚_醯亞胺共聚物或聚矽氧聚碳酸酯共聚物 之♦矽氧共聚物與高玻璃轉移溫度(Tg)聚醯亞胺(PI)、聚 喊酿亞胺(PEI)或聚醚醯亞胺砜(PEIS)樹脂及以間苯二酚為 之1芳酿的組合有驚人的低放熱值及改良之耐溶劑性。 118106.doc -34- 200831609 衍生自間苯二酚之芳基聚酯亦可為含有並非以間苯二酚 為主之鍵的共聚物,例如間苯二酚-雙酚_ A共聚酯碳酸 醋。為達最佳效果,間苯二酚酯含量(REC)應佔衍生自間 苯二酚之聚合物鍵的約50莫耳%以上。較高REC可為較佳 的。在一些實例中,需要REC佔衍生自間苯二酚之鍵的75 莫耳%以上,或甚至高達90或1〇〇莫耳%。Formula XIX 118106.doc -32- 200831609 In one embodiment, the copolyestercarbonate is substantially composed of a carbonated vinegar bond between the resorcinol aryl group and the organic carbonate block. Segment copolymer composition. In another embodiment, the copolyestercarbonate consists essentially of a triblock carbonate-ester-carbonate copolymer having a carbonate linkage between the resorcinol arylate block and the organic carbonate endblock. . Copolyestercarbonates having a carbonate linkage between the thermally stable resorcinol arylate block and the organic carbonate block are typically comprised of one to one less hydroxyl end moiety and one in another in one embodiment In the examples, a resorcinol aryl ester-containing polymer containing at least two hydroxyl terminal moieties was prepared. The average molecular weight of the oligomers is generally from about 1 Torr to about 40,000 in one embodiment, and from about 15, 〇〇〇 to about 3 Å, (10) 〇 in another embodiment. The thermostable copolyester can be prepared by reacting the stilbene-containing aryl ester-promoting polymer with carbon ruthenium chloride, a chain terminator, and a dihydroxy-substituted aromatic hydrocarbon in the presence of a catalyst such as a secondary amine. Carbonate. In one example, the article may comprise a resin selected from the group consisting of polysulfone, poly(ether sulfone), and poly(ether phenyl ether sulfone), and mixtures thereof; polyoxyxylene copolymers and resorcinol-based A blend of a polyarylate (wherein greater than or equal to 5 mole % of the aryl polyester linkage is derived from an aryl ester linkage of resorcinol). The amount of meta-phenylene-based polyarylate used in the polymer blends used to make up the article varies widely depending on the end use of the article. For example, when the article is used for the end use of (iv) heat or increasing the time to reach the exothermic peak, the amount of polymer containing isophthalic acid vinegar can be maximized to reduce the exotherm and prolong the time to reach the exothermic peak. In some instances, resorcinol-based polyaryl esters can be included in the polymer blend! To approximately 5 〇 118106.doc • 33 - 200831609 wt%. Some important compositions will have from about 10 to about 50% by weight, based on the total weight of the polymer blend, of a resorcinol-based polyarylate. In another embodiment, an article comprising a polymer blend comprising: a) from about 1 to about 99% by weight of polylithic wind, poly(10) stone wind), and poly(phenylene) or mixtures thereof; b) from about 0.1 to about 30% by weight of the polyoxyloxy copolymer; c), 'spoon 99 to about 1% by weight of resorcinol-based polyarylate containing greater than or equal to about 50 moles % derived from the resorcinol linkage; d) from 0 to about 20% by weight metal oxide, wherein the weight percent is relative to the total weight of the polymer blend. In other aspects, the article comprising the following polymer blends is encompassed: a) 々50 to about 99% by weight of polysulfone, poly(ether sulfone), poly(phenylene ether sulfone) or mixtures thereof; b) from about 0.1 to about 10% by weight of the polyoxyloxy copolymer; c) from 1 to about 50% by weight of resorcinol-based polyarylate resin containing greater than or equal to about 50 moles % derived from the resorcinol linkage; d) 〇 to about 20% by weight metal oxide; and e) 〇 to about 2 weight. /. A phosphorus-containing stabilizer. PEI, PI, PEIS and mixtures thereof; polyoxyalkylene copolymers; and high Tg blends of aryl polyester resins based on resorcinol. For example, t-oxygen poly- s-imine copolymer or poly-xyloxy polycarbonate copolymer ♦ 矽 oxy-copolymer with high glass transition temperature (Tg) polyimine (PI), poly-imine (PEI) The combination of polyether sulfoxide (PEIS) resin and resorcinol has a surprisingly low exotherm and improved solvent resistance. 118106.doc -34- 200831609 The aryl polyester derived from resorcinol may also be a copolymer containing a bond other than resorcinol, such as resorcinol-bisphenol-A copolyester carbonic acid vinegar. For best results, the resorcinol ester content (REC) should be greater than about 50 mole percent of the polymer bond derived from resorcinol. Higher REC may be preferred. In some instances, REC is required to account for more than 75 mole percent of the bond derived from resorcinol, or even up to 90 or 1 mole percent.
使用任何有效減少放熱、增加到達放熱峰值之時間或改 良耐溶劑性之量,阻燃摻合物中所用之含間苯二酚酯之聚 合物之量可大幅改變。在一些實例中,含間苯二酚酯之聚 合物可佔聚合物摻合物之約i重量%至約80重量%。一些重 要組合物將具有1G-5()%之以間苯二紛為主之聚酯。在其他 實例中,聚醚醯亞胺或聚醚醯亞胺砜與高REC共聚物之摻 口物將具有約150-2 10°C之單一玻璃轉移溫度(Tg)。 以間苯二酚為主之聚芳醋樹脂應含有大於或等於約50莫 之㈣苯二m能化間苯4與適於形成芳醋鍵之 方基二羧酸或二羧酸衍生物(例如,羧酸齒化物、羧酸妒 及綾酸鹽)之反應產物衍生的單元。 曰 對於其他聚合物 發明使用之以間苯二酚為主之聚芳酯 在熱穩定間苯二盼芳醋嵌段與有機碳酸醋嵌段之門且 個碳酸醋鍵之共聚醋碳酸醋通常係由:明 不同實施例製備之在一實施例中含有至少一 …另-實施例中含有至少兩個經 二紛芳醋之寡聚物製備。該等寡聚物之重量平::::: 118106.doc •35- 200831609 常在—實施例中為約! 〇,〇〇〇至約4〇,_,且在另一實施例 為勺15,GGG至約3G,GGG。可藉由於諸如三級胺之催化劑 存在下使該等含間苯二酴芳醋之寡聚物與《氯、至少— 鏈、、止d及至少一種經二羥基取代之芳族烴反應來製備 熱穩定共聚酯碳酸酯。 在-實例中’具有改良阻燃性之聚合物摻合物包含選自 由聚醯亞胺、聚醚醯亞胺、聚醚醯亞胺砜及其混合物組成 ,群之樹脂, ·聚矽氧共聚物及以間苯二酚為主之芳基聚醋 科脂(其中大於或等於5〇莫耳%之芳基聚賴杨生自間苯 之芳西曰鍵)將術語’’聚合物鍵"或"一聚合物鍵”定義為 形成聚合物之至少兩個單體的反應產物。 在一些實例中,將具有小於或等於約㈣之氫原子與碳 原子之比(H/C)的聚酿亞胺、聚龍亞胺、聚賴亞胺石風 及其混合物為重要的。具有相對於氫含量較高之碳含量 (亦即’氫原子與碳原子之比低)之聚合物常顯示改良之的 FR效能。該等聚合物具有低燃料值且當燃燒時可釋放較少 能量。藉由在聚合燃料與點火源之間形成絕緣焦化層之趨 勢其亦可对燃燒。與任何作用機制或模式無關,已觀測到 該等具有低H/C比之聚合物具有較高耐燃性。在一些實例 中’ H/C比可小於〇·85。在其他實例中,為得到具有足夠 可撓性鍵之聚合結構以達成熔融可加工性,大於約之 H/C比較佳。藉由對獨立於化學重複單元中存在之任何其 他原子之碳及氫原子進行計數可自化學結構確定給定聚合 物或共聚物之H/C比。 σ 118106.doc -36 - 200831609 在-些狀況下,阻燃聚合物掺合物及由其製得之物件將 具有少於約65 kW_min/mk2分鐘放熱。在其他實例中, 放熱峰值將小於約65 kW/m2e到達放熱峰值之時間大於約^ 分鐘亦為某些組合物及由其製得之物件的有益態樣。在其 他實财’可達m約4分鐘之料放熱峰值之時間。 在—些組合物中,聚醯亞胺、聚醚醯亞胺、聚鍵醯亞胺 ; :風或其混合物與聚矽氧共聚物及含有大於或等於約50莫耳 φ /〇何生自間苯二齡之鍵之芳基聚醋樹脂的摻合物將為透明 的^在一實施例中,藉由ASTM方法m〇〇3量測之推合物 之2毫米厚度處的透光率%大於約5〇%。在其他實例中,藉 由ASTM方法D1G()3量測之該等透明組合物之濁度%將小於 約25。/。。在其他實施例中,透光率%將大於約6〇%,且濁 度%將小於約20%。在又一實例中,組合物及由其製得之 物件之透光率將大於約50%且濁度值低於約25%,放熱峰 值小於或等於50 kW/m2。 • 在阻燃摻合物中,以組合物總重量計,聚醯亞胺、聚_ 醯亞胺、聚醚醯亞胺砜或其混合物可以約i至約99重量% 之量存在。在該範圍内,聚醯亞胺、聚醚醯亞胺、聚醚醯 亞胺砜或其混合物之量可大於或等於約2〇重量%,更特定 言之大於或等於約50重量%,或甚至更特定言之大於或等 於約70重量%。 在另一實施例中,組合物包含如下阻燃聚合物摻合物: a)約1至約99重量。/。之聚醚醯亞胺、聚醚醯亞胺碾及其 混合物, H8106.doc -37- 200831609 b)約99至約1重量。/❶之芳基聚酯樹脂,其含有大於或等 於約50莫耳%之衍生自間苯二酚之鍵, e)約0·1至約30重量%之聚矽氧共聚物, d)約〇至約20重量%之金屬氧化物, 其中重量%係就組合物總重量而言。 V* 在其他態樣中,涵蓋包含如下阻燃聚合物摻合物之組合 a) 約50至約99重量%之聚醚醯亞胺或聚醚醯亞胺砜樹 脂, b) 約1至約50重量。/。之以間苯二酚為主之聚芳酯,其含 有大於或等於約50莫耳%之衍生自間苯二酚之鍵, c) 約0.1至約1〇重量%之聚矽氧共聚物, d) 約0至約20重量。/。之金屬氧化物,及 e) 0至約2重量%之含鱗穩定劑。 聚醯亞胺具有通式(XX):The amount of the resorcinol-containing polymer used in the flame retardant blend can vary widely, using any amount effective to reduce exotherm, increase the time to peak exotherm, or improve solvent resistance. In some examples, the resorcinol containing polymer can comprise from about i% by weight to about 80% by weight of the polymer blend. Some of the important compositions will have 1 G-5 (%) of the predominantly meta-phenylene polyester. In other examples, the polyether quinone or polyether oxime sulfone admixture with the high REC copolymer will have a single glass transition temperature (Tg) of from about 150 to about 10 °C. The resorcinol-based polyaryl vinegar resin should contain greater than or equal to about 50 moles of (tetra)benzene di-energy benzene 4 and a aryl carboxylic acid or dicarboxylic acid derivative suitable for forming an aromatic vinegar bond ( For example, a unit derived from the reaction product of a carboxylic acid dentate, a carboxylic acid hydrazine, and a cerium hydride.曰For other polymer inventions, the resorcinol-based polyarylate is used in the thermally stable meta-phenylene aryl vinegar block and the organic vinegar block and the carbonated vinegar-bonded vinegar carbonate is usually It is prepared by using an oligomer of at least one other embodiment containing at least two di- aryl vinegars in an embodiment. The weight of these oligomers is: ::::: 118106.doc •35- 200831609 Often in the embodiment - about! 〇, 〇〇〇 to about 4 〇, _, and in another embodiment is scoop 15, GGG to about 3G, GGG. The oligomers containing isophthalic aryl vinegar can be prepared by reacting the chloro, at least-chain, and the at least one dihydroxy-substituted aromatic hydrocarbon in the presence of a catalyst such as a tertiary amine. Thermally stable copolyestercarbonate. In the example - the polymer blend having improved flame retardancy comprises a resin selected from the group consisting of polyimine, polyether oximine, polyether sulfoxide, and mixtures thereof, a group of resins, polyoxyl copolymer And the resorcinol-based aryl polyester (wherein greater than or equal to 5 〇 mol% of the aryl poly Lacang sheng from the benzoin oxime bond) will be the term ''polymer bond' Or a "polymer bond" is defined as the reaction product of at least two monomers forming a polymer. In some examples, a hydrogen atom to carbon atom ratio (H/C) of less than or equal to about (d) is used. Poly-imine, poly-longine, polylysine, and mixtures thereof are important. Polymers with a higher hydrogen content (ie, a lower ratio of hydrogen to carbon) are often used. Shows improved FR performance. These polymers have low fuel values and can release less energy when burned. They can also be burned by the tendency to form an insulating coking layer between the polymerized fuel and the ignition source. Irrespective of mechanism or mode, it has been observed that these polymers with low H/C ratio have High flame resistance. In some examples, the 'H/C ratio may be less than 〇85. In other examples, in order to obtain a polymeric structure having sufficient flexible bonds to achieve melt processability, H/C greater than about is preferred. The H/C ratio of a given polymer or copolymer can be determined from the chemical structure by counting carbon and hydrogen atoms independently of any other atom present in the chemical repeating unit. σ 118106.doc -36 - 200831609 In some cases, the flame retardant polymer blend and articles made therefrom will have an exotherm of less than about 65 kW_min/mk for 2 minutes. In other examples, the exothermic peak will be less than about 65 kW/m2e to reach the exothermic peak for greater than the time. Approximately ^ minutes is also a beneficial aspect of certain compositions and articles made therefrom. In other compositions, the peak of the exothermic peak of about 4 minutes. In some compositions, polyimine , polyether quinone imine, poly bond quinone imine; : wind or a mixture thereof with polyoxyl oxy-copolymer and aryl glyceride containing greater than or equal to about 50 moles φ / 生 from the bond of benzodiazepine The blend of resins will be transparent. In one embodiment, by ASTM method m The % transmittance at a thickness of 2 mm of the conjugate of the 〇〇3 measurement is greater than about 5%. In other examples, the turbidity % of the transparent compositions measured by ASTM method D1G()3 Will be less than about 25. In other embodiments, the % transmittance will be greater than about 6% and the % haze will be less than about 20%. In yet another example, the composition and articles made therefrom The light transmittance will be greater than about 50% and the haze value is less than about 25%, and the exothermic peak is less than or equal to 50 kW/m2. • In the flame retardant blend, based on the total weight of the composition, the polyimine, The poly-imine, the polyether sulfoxide or a mixture thereof may be present in an amount of from about i to about 99% by weight. Within this range, polyimine, polyetherimine, polyether sulfoxide or The amount of the mixture may be greater than or equal to about 2% by weight, more specifically greater than or equal to about 50% by weight, or even more specifically greater than or equal to about 70% by weight. In another embodiment, the composition comprises a flame retardant polymer blend as follows: a) from about 1 to about 99 weight. /. The polyether oximine, polyether oxime imide mill and mixtures thereof, H8106.doc -37- 200831609 b) from about 99 to about 1 by weight. / ❶ aryl polyester resin containing greater than or equal to about 50 mole % of a bond derived from resorcinol, e) from about 0.1 to about 30 weight percent of a polyoxyloxy copolymer, d) about Up to about 20% by weight of the metal oxide, wherein % by weight is based on the total weight of the composition. V* In other aspects, a combination comprising the following flame retardant polymer blends a) from about 50 to about 99% by weight of a polyether quinone imine or a polyether quinone sulfoxide resin, b) from about 1 to about 50 weight. /. a resorcinol-based polyarylate containing greater than or equal to about 50 mole % of a resorcinol-derived linkage, c) from about 0.1 to about 1 weight percent of a polyoxyloxy copolymer, d) from about 0 to about 20 by weight. /. a metal oxide, and e) from 0 to about 2% by weight of a scaly stabilizer. Polyimine has the general formula (XX):
(式 XX), 其中a大於1, 大,或更特定言之(Form XX), where a is greater than 1, large, or more specific
118106.doc 其中a大於1,通常為約10至約1〇〇〇或更大 為約10至約500 ;且其中v為四價鍵聯體, 礙聚醯亞胺之合成或使用則對其無限制。 (但不限於):(a)具有約5至約50個碳原子 -38- 200831609 較佳連接體包括(但不限於)式 不飽和烷基;或其組合 (XXI)四價芳基,諸如 )〇c,»〇c, (式 XXI) 其中 W為選自由-〇-、-s-、-c(0)-、S〇2-、-so…-cyH2y_(y118106.doc wherein a is greater than 1, typically from about 10 to about 1 Torr or greater from about 10 to about 500; and wherein v is a tetravalent bond, which hinders the synthesis or use of the polyimine No limit. (but not limited to): (a) having from about 5 to about 50 carbon atoms -38 to 200831609 Preferred linkers include, but are not limited to, an unsaturated alkyl group; or a combination thereof (XXI) a tetravalent aryl group, such as )〇c,»〇c, (Formula XXI) where W is selected from -〇-, -s-, -c(0)-, S〇2-, -so...-cyH2y_(y
為具有1至約8之值之整數)組成之群之二價基團及其氟化 衍生物(包括全氟伸烧基),或式-0-Z-0-基團,其中二價 鍵或_〇·Ζ-0-基處於3,3,、3,4·、4,3·或4,4’位置上,且其 中Ζ係如上文所定義。Ζ可包含式(ΧχΐΊ)之例示性二價基a divalent group of a group having an integer of from 1 to about 8 and a fluorinated derivative thereof (including a perfluoroalkylene group), or a group of the formula -0-Z-0-, wherein a divalent bond Or _〇·Ζ-0-base is at the 3, 3, 3, 4, 4, 3 or 4, 4' position, and wherein the lanthanide is as defined above. Ζ can include an exemplary divalent group of formula (ΧχΐΊ)
c(ch3)2 h3cc(ch3)2 h3c
(式 XXII) 118106.doc -39- 200831609 式(XX)中之R7包括(但不限於)經取代或未經取代之二價 有機基團,諸如··(a)具有約6至約24個碳原子之芳族烴基 及其鹵化衍生物;(b)具有約2至約20個碳原子之直鏈或支 鏈伸烷基;(c)具有約3至約24個碳原子之伸環烷基,或者 (d)通式(VI)二價基團:(Formula XXII) 118106.doc -39- 200831609 R7 in formula (XX) includes, but is not limited to, substituted or unsubstituted divalent organic groups, such as (a) having from about 6 to about 24 An aromatic hydrocarbon group of a carbon atom and a halogenated derivative thereof; (b) a linear or branched alkylene group having from about 2 to about 20 carbon atoms; (c) a cycloalkane having from about 3 to about 24 carbon atoms a base, or (d) a divalent group of the formula (VI):
其中Q係如上文所定義。 (式 VI) 一些類別之聚醯亞胺包括聚醯胺醯亞胺、聚醚醯亞胺砜 及聚醚醯亞胺,尤其此項技術中已知之具有熔融可加工性 之彼等聚醚醯亞胺,諸如其製備及特性在美國專利第 3,803,085號及第3,905,942號中經描述之聚醚醯亞胺。 聚醚醯亞胺樹脂可包含i個以上,通常約1〇至約1〇〇〇或 者更多,或更特定言之約1〇至約5〇〇個式(χχιπ)結構單 元:Where Q is as defined above. (Formula VI) Some classes of polyamidiamines include polyamidoximines, polyetherimine sulfones, and polyetherimines, especially those having melt processability known in the art. Imines, such as the polyether oximines described in U.S. Patent Nos. 3,803,085 and 3,905,942. The polyetherimide resin may comprise more than one, typically from about 1 Torr to about 1 Torr or more, or, more specifically, from about 1 Torr to about 5 Å (结构ιπ) structural units:
(式 XXIII) 其中Τ為-〇-或式-0_Ζ-0_基團,其中二價鍵或_〇_ζ_〇-基 團處於3,3,、3,4,、4,3,或者4,4,位置,且其中2;係如上文所 定義。在一實施例中,聚醯亞胺、聚醚醯亞胺或聚醚醯亞 胺礙可為共聚物。料利用聚醯亞胺、聚醚醯亞胺或聚鱗 蕴亞胺礙之混合物。 藉由热習此項技術者熟知之任何方法可製備聚醚醯亞 118106.doc -40- 200831609 胺,包括使式(XVIII)芳族雙(醚酐)(Formula XXIII) wherein Τ is a -〇- or a formula -0_Ζ-0_ group, wherein the divalent bond or the _〇_ζ_〇- group is at 3,3,3,4,4,3, or 4, 4, position, and 2 of them; as defined above. In one embodiment, the polyimine, polyetherimide or polyether amide may be a copolymer. The mixture is made of a mixture of polyimine, polyetherimide or polyimine. The polyether can be prepared by any method well known to those skilled in the art. 118106.doc -40- 200831609 Amine, including an aromatic bis(ether anhydride) of formula (XVIII)
與式(VII)有機二胺反應, η2ν_ρΛνη2 (式 VII), 其中Τ及R1係如上述所定義。Reaction with an organic diamine of formula (VII), η2ν_ρΛνη2 (formula VII), wherein hydrazine and R1 are as defined above.
特定芳族雙酐及有機二胺之實例揭示於(例如)美國專利 第3,972,9〇2號及第4,455,410號中。芳族雙酐之說明性實例 包括: 3.3- 雙[4-(3,4-二羧基苯氧基)苯基]丙烷二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯醚二酐; 4,4匕雙(3,4-二竣基苯氧基)二苯硫鱗二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯曱酮二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯砜二酐; 2,2-雙[4-(2,3-二羧基苯氧基)苯基]丙烷二酐; 4,4’-雙(2,3-二羧基苯氧基)二苯醚二酐; 4,4’-雙P,3-二羧基苯氧基)二苯硫醚二酐; 4.4- 雙(2,3-二護基苯氧基)二苯甲酮二肝; 4,4’-雙(2,3-二羧基苯氧基)二苯砜二酐; 4-(2,3-二羧基苯氧基)_4,_(3,4_二羧基苯氧基)二笨,孓丙 烷二酐; 4-(2,3-二羧基苯氧基)-4,_(3,4_二羧基苯氧基)二苯醚二 酐; 118106.doc •41 - 200831609 4-(2,3-二魏基苯氧基)-4、3,4. 酐 基苯氧基)二苯琉醚 4-(2,3-二羧基苯氧基)_4,_(3,心二羧基苯氧基)二苯甲鋼二 野;及4-(2,3-二幾基苯氧基Μ·_(3,4_二缓基苯氧基)二苯石風 二酐,以及其多種混合物。 上述式(XVIII)所包括之另一類芳族雙㈤酐)包括(但不 限於)其中Τ為式(XXIV):Examples of specific aromatic dianhydrides and organic diamines are disclosed in, for example, U.S. Patent Nos. 3,972,9, 2 and 4,455,410. Illustrative examples of aromatic dianhydrides include: 3.3-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride; 4,4'-bis(3,4-dicarboxyphenoxy) Diphenyl ether dianhydride; 4,4 bis(3,4-dimercaptophenoxy)diphenyl sulphate; 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl Anthrone ketone dianhydride; 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride; 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl] Propane dianhydride; 4,4'-bis(2,3-dicarboxyphenoxy)diphenyl ether dianhydride; 4,4'-bis-P,3-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4.4-bis(2,3-diprotective phenoxy)benzophenone di-hepatic; 4,4'-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride; 4-(2, 3-dicarboxyphenoxy)_4,_(3,4-dicarboxyphenoxy)diphenyl, hydrazine propane dianhydride; 4-(2,3-dicarboxyphenoxy)-4,_(3, 4_Dicarboxyphenoxy)diphenyl ether dianhydride; 118106.doc •41 - 200831609 4-(2,3-diweiphenoxy)-4,3,4. Anhydride phenoxy)diphenyl Ether ether 4-(2,3-dicarboxyphenoxy)_4,_(3, cardiodicarboxyphenoxy)dibenzoic acid dimium; and 4-(2,3-diphenylbenzene Μ·_(3,4-dico-phenoxy)diphenyl phenolic dianhydride, and various mixtures thereof. Another type of aromatic bis(pentahydride) included in the above formula (XVIII) includes (but is not limited to) Where Τ is the formula (XXIV):
-0~〇~(Η〇>~〇- (式 XXIV) 且醚鍵(例如)較佳處於3,3,、3,4,、4,3,或4,4,位置之化合物 及其混合物,且其中Q係如上文所定義。-0~〇~(Η〇>~〇- (Formula XXIV) and the ether bond (for example) is preferably a compound at a position of 3, 3, 3, 4, 4, 3, or 4, 4, and a mixture, and wherein the Q system is as defined above.
可利用任何二胺基化合物。合適化合物之實例為乙二 胺、丙二胺、三亞甲基二胺、二伸乙基三胺、三伸乙基四 胺、己二胺、庚二胺、辛二胺、壬二胺、癸二胺、丨^之-十 二烷二胺、1,18-十八烷二胺、3·甲基庚二胺、4,4-二甲基 庚二胺、4-甲基壬二胺、5_甲基壬二胺、2,5_二甲基己二 胺、2,5_二甲基庚二胺、2,2-二甲基丙二胺、Ν-曱基-雙(3· 胺基丙基)胺、3-甲氧基己二胺、1,2-雙(3-胺基丙氧基)乙 烷、雙(3-胺基丙基)硫醚、ι,4-環己二胺、雙-(4-胺基環己 基)甲烷、間苯二胺、對苯二胺、2,4-二胺基甲苯、2,6·二 胺基甲苯、間二曱苯二胺、對二曱苯二胺、2-甲基-4,6-二 乙基-1,3-苯二胺、5-甲基·4,6-二乙基-1,3-苯二胺、聯苯 胺、3,3’-二甲基聯苯胺、3,3’-二甲氧基聯苯胺、1,5·二胺 基萘、雙(4-胺基苯基)甲烷、雙(2-氯-4-胺基-3,5-二乙基苯 118106.doc -42- 200831609 基)甲烷、雙(4-胺基苯基)丙烷、2,4-雙(對胺基_第三丁基) 甲苯、雙(對胺基_第三丁基苯基)醚、雙(對甲基_鄰胺基苯 基)苯、雙(對甲基-鄰胺基戊基)苯、1,3-二胺基_4_異丙基 苯、雙(4-胺基苯基)硫醚、雙(4-胺基苯基)砜及雙(4_胺基 苯基)峻。亦可使用該等化合物之混合物。較佳二胺基化 合物為芳族二胺,尤其為間苯二胺及對苯二胺、續醯基二 苯胺及其混合物。Any diamine based compound can be utilized. Examples of suitable compounds are ethylenediamine, propylenediamine, trimethylenediamine, diethylidenetriamine, triethylidenetetramine, hexamethylenediamine, heptanediamine, octanediamine, decanediamine, hydrazine. Diamine, oxime-dodecanediamine, 1,18-octadecanediamine, 3·methylheptanediamine, 4,4-dimethylheptanediamine, 4-methylnonanediamine, 5_Methylguanidine diamine, 2,5-dimethylhexamethylenediamine, 2,5-dimethylheptanediamine, 2,2-dimethylpropanediamine, fluorenyl-fluorenyl-bis (3· Aminopropyl)amine, 3-methoxyhexamethylenediamine, 1,2-bis(3-aminopropoxy)ethane, bis(3-aminopropyl) sulfide, ι,4-ring Hexamethylenediamine, bis-(4-aminocyclohexyl)methane, m-phenylenediamine, p-phenylenediamine, 2,4-diaminotoluene, 2,6-diaminotoluene, m-diphenylene diamine , p-diphenylene diamine, 2-methyl-4,6-diethyl-1,3-phenylenediamine, 5-methyl·4,6-diethyl-1,3-phenylenediamine, Benzidine, 3,3'-dimethylbenzidine, 3,3'-dimethoxybenzidine, 1,5-diaminonaphthalene, bis(4-aminophenyl)methane, bis(2- Chloro-4-amino-3,5-diethylbenzene 118106.doc -42- 200831609 base) methane, double (4- Aminophenyl)propane, 2,4-bis(p-amino-t-butyl) toluene, bis(p-amino-t-butylphenyl)ether, bis(p-methyl-o-aminophenyl) Benzene, bis(p-methyl-o-aminopentyl)benzene, 1,3-diamino-4-phenylpropene, bis(4-aminophenyl) sulfide, bis(4-amine Phenyl)sulfone and bis(4-aminophenyl). Mixtures of such compounds can also be used. Preferred diamine compounds are aromatic diamines, especially m-phenylenediamine and p-phenylenediamine, decyldiphenylamine and mixtures thereof.
在一實施例中,聚鱗醯亞胺樹脂包含根據式(XVII)之結 構單元’其中R各自獨立為對伸苯基或間伸苯基或其混合 物,且Τ為式(XXV)之二價基團:In one embodiment, the polysinoin resin comprises a structural unit according to formula (XVII) wherein R is each independently a para-phenyl or an exo-phenyl or a mixture thereof, and hydrazine is a divalent formula (XXV) Group:
美國專利第 3,847,867號、第 3,852,242號、第 3,803,085 號、第39〇5,942號、第3,983,093號及第4,443,591號中揭示 許多製備尤其為聚醚醯亞胺之聚醯亞胺之方法。所提及之 該等專利係用於以說明方式示教製備聚醯亞胺之一般及特 定方法。 如由 American Society for Testing Materials,(ASTM) D1238於340-370°C下、使用6·6千克(kg)重量量測,聚醯亞 胺、聚醚醯亞胺及聚醚醯亞胺砜之熔融指數可為約0」至 約10公克/分鐘(g/min)。在一實施例中,如藉由凝膠渗透 層析法使用聚苯乙烯標準量測,聚醚醯亞胺樹脂之重量平 均分子量(“^¥)為約1〇,〇〇〇至約150,000公克/莫耳化/111〇卜)。 在另一實施例中,聚醚醯亞胺之Mw為20,000至60,000。如 118106.doc -43· 200831609 於25°C下在間曱酚中量測,該等聚醚醯亞胺樹脂之固有黏 度通常大於約〇·2分升/公克(dl/g),或更特定言之,約0.35 至約 0.7 dl/g。ASTM D5205nStandard Classification System for Polyetherimide (PEI) Materials"中列出本文所述之摻合 物中所使用的一些聚醚醯亞胺之實例。 共聚物碎氧烧片段之喪段長度可為任何有效長度。在一 些實例中,其可為2至70個矽氧烷重複單元。在其他實例 中,矽氧烷嵌段長度可為約5至約30個重複單元。在許多 實例中,可使用二甲基矽氧烷。 矽氧烷聚醚醯亞胺共聚物為可使用之矽氧烷共聚物之特 定實施例。美國專利第4,404,350號、第4,8〇8,686號及第 4,690,997號中顯示該等矽氧烷聚醚醯亞胺之實例。在一實 例中,可以類似於用以製備聚醚醯亞胺之方法來製備聚醚 醯亞胺矽氧烷,但有機二胺反應物之部分或全部經(例如) 式XXII胺末端有機石夕氧烧取代,其中g為具有1至約別之值 之整數,在一些其他實例中,g可為約5至約30,且汉,為具 有约2至約20個碳原子之芳基、烧基或芳基烧基。A number of processes for preparing polyimines, especially polyetherimine, are disclosed in U.S. Patent Nos. 3,847,867, 3,852,242, 3,803,085, the disclosures of which are incorporated herein by reference. The patents mentioned are used to teach the general and specific methods of preparing polyimine in an illustrative manner. As measured by American Society for Testing Materials, (ASTM) D1238 at 340-370 ° C, using a weight of 6.6 kg (kg), polyimine, polyether quinone and polyether sulfoxide The melt index can range from about 0" to about 10 grams per minute (g/min). In one embodiment, the polyether quinone imine resin has a weight average molecular weight ("¥¥) of about 1 〇, 〇〇〇 to about 150,000 gram, as measured by gel permeation chromatography using polystyrene standards. In another embodiment, the polyether quinone imine has a Mw of from 20,000 to 60,000. As measured at 19,106.doc -43 · 200831609 at 25 ° C in m-nonylphenol, The intrinsic viscosity of the polyetherimide resins is typically greater than about 0.2 liters per gram (dl/g) or, more specifically, from about 0.35 to about 0.7 dl/g. ASTM D5205n Standard Classification System for Polyetherimide (PEI) An example of some of the polyetherimine used in the blends described herein is listed in Materials". The length of the fragment of the fragment of the copolymer can be any effective length. In some instances, it can be 2 to 70 oxoxane repeating units. In other examples, the oxoxane block length can be from about 5 to about 30 repeating units. In many instances, dimethyl methoxy oxane can be used. The ether quinone imine copolymer is a specific example of a usable alkane copolymer. US patent Examples of such fluorinated polyether oximines are shown in U.S. Patent Nos. 4,404,350, 4,8,8,686, and 4,690,997. In one example, they can be prepared analogously to the process for preparing polyetherimine. a polyether oxime oxane, but a part or all of the organic diamine reactant is substituted, for example, by an amine-terminated organoxanthene of formula XXII, wherein g is an integer having from 1 to about another value, in some other In one embodiment, g can be from about 5 to about 30, and Han, an aryl, alkyl or arylalkyl group having from about 2 to about 20 carbon atoms.
(式 XXII) 可藉由使式XIX有機二胺或二胺混合物及式χχπ胺末端 有機梦氧烧與一或多種式XVIII二酐反應形成一些聚醚醯 亞胺矽氧烷。可使二胺基組份在與雙酐反應之前物理混 118106.doc -44· 200831609 合’因此形成實質上無規共聚物。或者可藉由使χΐχ及 XXII與二酐選擇性反應以製備隨後共同反應之聚醯亞胺傲 段而形成嵌段或交替共聚物。在另一實例中,用於製備聚 驗醯亞胺共聚物之矽氧烷可具有酐而非胺官能端基,例如 如美國專利第4,404,350號中所述。 在一實例中,矽氧烷聚醚醯亞胺共聚物可為式ΧΧΠΙ, 其中T、R’及g係如上所述,η具有約5至約1〇〇之值,且Ar 為具有6至約36個碳之芳基或烷基芳基。(Formula XXII) Some polyether quinone imine oxiranes can be formed by reacting a mixture of an organic diamine or a diamine of the formula XIX with a hydrazine π amine end organic oxyhydrogenation with one or more dianhydrides of the formula XVIII. The diamine component can be physically mixed before reacting with the dianhydride 118106.doc -44·200831609' thus forming a substantially random copolymer. Alternatively, a block or alternating copolymer can be formed by selectively reacting hydrazine and XXII with a dianhydride to prepare a subsequent co-reacting polyimine. In another example, the oxime used to prepare the phthalimide copolymer can have an anhydride rather than an amine functional end group, as described, for example, in U.S. Patent No. 4,404,350. In one example, the oxoxane polyether oxime copolymer may be of the formula wherein T, R' and g are as described above, η has a value of from about 5 to about 1 Torr, and Ar has from 6 to Approximately 36 carbon aryl or alkyl aryl groups.
(式 XXIII) 在一些矽氧烧聚醚醯亞胺中,矽氧烷聚醚醯亞胺共聚物 之一胺組份可含有約20莫耳%至約50莫耳%之式χχπ胺末 端有機石夕氧烷及約50至約80莫耳%之式XIX有機二胺。在 一些石夕氧烧共聚物中,矽氧烷組份含有約25至約40莫耳% 之胺或酐末端有機矽氧烷。 c· 高Tg相分離聚合物摻合物。 本文亦揭示相分離聚合物摻合物,其包含·· a)選自包含 聚芳醚酮、聚芳基酮、聚醚酮及聚醚醚酮及其組合之群的 聚芳醚酮(PAEK),與b)具有大於或等於5〇莫耳%之含有芳 基砜基之鍵的聚醚醯亞胺砜(PEIS)的混合物。 相分離意謂PAEK及PEIS作為獨立化學實體混雜存在, 可使用標準分析技術(例如顯微法、差示掃描熱量測定或 118106.doc -45- 200831609 動態力學分析)將該等獨立 徊截妙τ A 予實體區分開以顯示至少兩 個截Λ、>不同之聚合物相,复 ^ ^ 其中一者包含ΡΑΕΚ樹脂且其中 一者包含PEIS樹脂。在一此眚 二實例中,各相將含有約80重量 %以上之各別樹脂。在发他眚 /、實例中,摻合物將形成獨立的 截然不同之區域,大小盔认Λ, 大小為約0.1至約50微米,在其他情況 下區域大小為約(U至約2G微米。區域大小係指如顯微法 所:之最長線尺寸。相分離摻合物可完全不可混溶,或可(Formula XXIII) In some of the anthraquinone polyether oximines, the amine component of one of the oxoxane polyether oxime copolymers may contain from about 20 mole % to about 50 mole % of the χχ 胺 amine end organic A oxetane and from about 50 to about 80 mole percent of the formula XIX organic diamine. In some of the oxy-oxygenated copolymers, the oxane component contains from about 25 to about 40 mole percent of the amine or anhydride terminal organooxane. c. High Tg phase separated polymer blend. Also disclosed herein are phase separated polymer blends comprising: a) a polyaryletherketone (PAEK) selected from the group consisting of polyaryletherketones, polyarylketones, polyetherketones, and polyetheretherketones, and combinations thereof. And b) a mixture of polyether sulfoximine sulfone (PEIS) having a aryl sulfone group-containing bond of greater than or equal to 5 〇 mol%. Phase separation means that PAEK and PEIS are intermixed as independent chemical entities, which can be separated using standard analytical techniques (eg microscopy, differential scanning calorimetry or 118106.doc -45-200831609 dynamic mechanical analysis). A is physically separated to show at least two paraplegia, > different polymer phases, one of which comprises an anthraquinone resin and one of which comprises a PEIS resin. In one such example, each phase will contain greater than about 80% by weight of the respective resin. In the case of 发/, the blend will form separate distinct regions, sized and helmeted, having a size of from about 0.1 to about 50 microns, and in other cases the size of the region is about (U to about 2G microns). The size of the area refers to the longest line size as in the microscopic method: the phase separation blend may be completely immiscible, or
顯示部分混溶性但一定如下矣 · 一 心邻卜表現·摻合物顯示兩個或兩個 以上至少為固態之截然不同之聚合物相。 PAEK與PEIS之比可為導致摻合物與任何單獨樹脂相比 具有改良特性(亦即,視最終用途應用而定更好或更差)之 任何比。以重量份表示之比可為,此視最終用 途應用及待改良之所要特性而定。比率範圍亦可為15:85 至85:15或甚至25:75至75:25。視應用而定,比率亦可為 40:60至60:40。熟練技術人員應瞭解,改變pAEK與pEIS2 比可視所要結果而定降至所述範圍内之任何實數比。 可藉由改變成份比來調節之最終摻合物之特性包括熱變 形溫度及負載能力。例如在一實施例中,聚醚醯亞胺颯樹 脂可以任何有效於改變(亦即藉由增加而改良)PAEK摻合物 對其個別組份之負載能力之量存在。在一些實例中, PAEK可以全部混合物之約30至約70重量%之量存在,而 PEIS之量可為約70至約30重量%,其中重量%係相對於 PAEK及PEIS之組合重量。 在一些實施例中,用ASTM方法D5418於〇·46 Mpa(66 118106.doc -46 - 200831609 psi)下以3.2 mm桿體量測,相分離聚合物摻合物之熱變形 溫度(HDT)為大於或等於約170°C。在其他實例中,在0.46 MPA(66 psi)下,HDT將為大於或等於200°C。在其他實例 中,藉由ASTM方法D1525於50牛頓(N)下量測,PAEK -PEIS之負載能力將顯示為大於或等於約200它之維卡溫度 (Vicat temperature) 〇 在其他實例中,(例如)如藉由ASTM方法D5418於200°C 下以3.2 mm桿體量測之大於或等於約200兆帕(MPa)之撓曲 模數顯示相分離聚合物摻合物之負載能力。 可藉由在熔融狀態下將一定量PAEK與一定量PEIS混合 來製備相分離聚合物摻合物。可藉由熟練技術人員已知之 將導致相分離摻合物之任何方法混合該兩種組份。該等方 法包括擠壓、燒結等。 如本文所用之術語聚芳醚酮(PAEK)包含數種含有主要藉 由酮及醚基以不同序列鍵聯之芳族環(通常為苯環)之聚合 物類型。PAEK樹脂之實例包括聚醚酮(PEK)、聚醚醚酮 (PEEK)、聚醚酮醚酮酮(PEKEKK)及聚醚酮酮(PEKK)及含 有該等基團及其摻合物之共聚物。PAEK聚合物可包含含 有任何序列之芳族環(通常為苯環)、酮基及醚基之單體單 元。只要不根本上改變PAEK樹脂之特性,則可存在低含 量(例如少於10莫耳%)之其他鍵聯基團。 例如,可將數種高度結晶、熔點高於300°C之聚芳醚酮 用於相分離摻合物中。結構XXVI、XXVII、XXVIII、 XXIX及XXX中顯示該等結晶聚芳醚酮之實例。 118106.doc -47- (XXVII) (XXVI)200831609Partial miscibility is shown but must be as follows: • One-to-one performance • The blend shows two or more distinct polymer phases that are at least solid. The ratio of PAEK to PEIS can be any ratio that results in improved properties of the blend compared to any individual resin (i.e., better or worse depending on the end use application). The ratio expressed in parts by weight may be determined depending on the final application and the desired characteristics to be improved. The ratio can range from 15:85 to 85:15 or even 25:75 to 75:25. Depending on the application, the ratio can range from 40:60 to 60:40. The skilled artisan will appreciate that changing pAEK to pEIS2 is any real ratio that falls within the stated range, depending on the desired result. The characteristics of the final blend can be adjusted by varying the composition ratio including thermal deformation temperature and load capacity. For example, in one embodiment, the polyetherimine sulfonate may be present in any amount effective to modify (i.e., improve by increasing) the PAEK blend to its individual component loading capacity. In some examples, the PAEK may be present in an amount from about 30 to about 70% by weight of the total mixture, and the amount of PEIS may be from about 70 to about 30% by weight, wherein the weight percent is relative to the combined weight of PAEK and PEIS. In some embodiments, the heat distortion temperature (HDT) of the phase separated polymer blend is measured by ASTM method D5418 at 3.2 Mpa (66 118106.doc -46 - 200831609 psi) with a 3.2 mm rod. Greater than or equal to about 170 ° C. In other examples, at 0.46 MPA (66 psi), the HDT will be greater than or equal to 200 °C. In other examples, the load capacity of PAEK-PEIS will be shown to be greater than or equal to about 200 of its Vicat temperature by ASTM method D1525 at 50 Newtons (N). In other instances, For example, the load capacity of the phase separated polymer blend is shown as a flexural modulus greater than or equal to about 200 megapascals (MPa) as measured by ASTM method D5418 at 3.2 ° C with a 3.2 mm rod. The phase separated polymer blend can be prepared by mixing a quantity of PAEK with a quantity of PEIS in a molten state. The two components can be mixed by any method known to the skilled person to result in a phase separation blend. Such methods include extrusion, sintering, and the like. The term polyaryletherketone (PAEK) as used herein encompasses several types of polymers containing an aromatic ring (usually a benzene ring) which is primarily bonded by a different sequence of a ketone and an ether group. Examples of the PAEK resin include polyether ketone (PEK), polyetheretherketone (PEEK), polyether ketone ether ketone ketone (PEKEKK), and polyether ketone ketone (PEKK), and copolymerization containing the same and a blend thereof Things. The PAEK polymer may comprise a monomer unit containing an aromatic ring (usually a benzene ring), a keto group and an ether group in any sequence. Other linkage groups may be present at low levels (e.g., less than 10 mole percent) as long as the properties of the PAEK resin are not fundamentally altered. For example, several highly crystalline polyaryletherketones having a melting point above 300 °C can be used in the phase separation blend. Examples of such crystalline polyaryletherketones are shown in structures XXVI, XXVII, XXVIII, XXIX and XXX. 118106.doc -47- (XXVII) (XXVI)200831609
(Χχνίΐι) (XXIX)(Χχνίΐι) (XXIX)
(XXX) 般特徵為含 之 適用於本女 > 么士 Β ¥5t 4 人ι、、、ο日日聚方醚酮之其他實例 有下式(XXXI)重複單元:(XXX) The general characteristics are included. Applicable to this woman > Moss Β ¥5t 4 people ι,,, ο Other examples of daily polyetheretherketone There are repeating units of the following formula (XXXI):
(XXXI) 其中Ar2獨立為選自伸苯基、伸聯苯基或伸萘基之二價芳 基,L獨立為 …/(ο)…_〇-ΑΓ_ε(〇ν、_s_ _s〇2·或直 接鍵,且h為具有ο至約10之值之整數。 熟練技術人員應瞭解針對聚芳醚酮之形成及特性存在良 好發展的及充分的專利主體及其他文獻。例如,_也早期 著作(諸如美國專利第3,065,205號)包括芳族二釀基^化物 與未經取代之芳族化合物(諸如二苯醚)之親電子芳族取代 (例如,經催化之Friedel_Crafts)反應。美國專利第 4,175,175號中達成該類別之進展,其顯示(例如)藉由活化 118106.doc -48- 200831609 一醇或其鹽之親核芳族取代反應可形(XXXI) wherein Ar2 is independently a divalent aryl group selected from the group consisting of phenyl, phenyl or anthranyl, and L is independently .../(ο)..._〇-ΑΓ_ε(〇ν, _s_ _s〇2· or Direct key, and h is an integer having a value from ο to about 10. The skilled artisan should be aware of well-developed and sufficient patent subjects and other literature for the formation and properties of polyaryletherketones. For example, _ also early works ( For example, U.S. Patent No. 3,065,205, the disclosure of which is incorporated herein by reference to U.S. Pat. No. 3, 065, 205, which is incorporated herein by reference. Progress in this category is reached in 175,175, which is shown, for example, by activation of 118106.doc -48- 200831609, a nucleophilic aromatic substitution reaction of an alcohol or a salt thereof
:種製備聚芳基酮之該方法包含加熱實質上等莫耳之雙 朌(常以其雙齡鹽形式進行反應)與二_苯型化合物(或在其 他狀況下’齒紛化合物)之混合物。在其他實例中,可使 用該?化合物之混合物。例如可使氫,與二齒芳基_(諸 氯一苯甲酮或—氟二苯甲酮)反應以形成聚芳醚酮。 在其他狀況下’可使諸如二經基二笨甲_之二經基芳基酉同 與諸如二氯苯之芳基二幽化物聚合以形成PAEK樹脂。在 其他實例中’可使諸如二減二苯醚之:祕芳基喊與諸 如二氟二苯甲酮之二㈣基酮反應。在其他變體中,可使 不具有醚鍵之二羥基化合物(諸如二羥基聯苯或氫醌)與可The method for preparing a polyaryl ketone comprises heating a mixture of a substantially homologous bismuth (usually in the form of its double-aged salt) with a bis-benzene type compound (or in other cases, a dentate compound). . In other instances, can I use this? a mixture of compounds. For example, hydrogen can be reacted with a bidentate aryl (chloro benzophenone or - fluorobenzophenone) to form a polyaryl ether ketone. Under other conditions, it is possible to polymerize, for example, a diaryl benzoyl group with an aryl cleavage such as dichlorobenzene to form a PAEK resin. In other instances, it is possible to react, for example, di-diphenyl ether: a secret aryl group with a bis(tetra) ketone such as difluorobenzophenone. In other variants, a dihydroxy compound (such as dihydroxybiphenyl or hydroquinone) having no ether linkage can be used.
芳族二函化物與芳族 成廣範圍之樹脂。 具有醚及酮鍵之二鹵化合物(例如雙_(二氯苯基)二苯甲酮〕 反應。在#他實你j中,彳使^芳基㈣酸或缓酸齒化物聚 合以形成聚芳醚酮。該等化合物之實例為二苯醚羧酸、二 苯醚羧酸氯化物、苯氧基-苯氧基苯甲酸或其混合物。在 其他實例中,可使二羧酸或二羧酸鹵化物與二芳醚縮合, 例如,可使間苯二醯基氯化物或對苯二醯基氯化物(或其 混合物)與二苯醚反應以形成pAEK樹脂。 該方法描述於(例如)美國專利第4,176,222號。該方法包 含在100至400°C之溫度範圍内加熱⑴實質上等莫耳之(^雙 紛與(b.i)二鹵苯型化合物及/或(b ii)鹵酚之混合物(其中在 一幽苯型化合物或_紛中,鹵素原子係經其鄰位或對位上 之-C=〇-基團活化)及碳酸鈉或碳酸氫鈉與第二鹼金屬碳酸 118106.doc -49- 200831609 風或%I酸氫鹽之混合物(該第二驗金屬碳酸鹽或碳酸氫鹽 之鹼金屬的原子數高於鈉原子數,該第二鹼金屬碳酸鹽或 石反酸氫鹽之量為··每公克鈉原子存在〇〇〇1至〇2公克之具 有車父局原子數之該鹼金屬原子,鹼金屬碳酸鹽或碳酸氫鹽 之總ΐ為··對於所存在之各酚基而言存在至少一個鹼金屬 原子)’及隨後將聚合物自鹼金屬鹵化物分離。Aromatic ditellites and aromatics A wide range of resins. a dihalogen compound having an ether and a ketone bond (for example, bis-(dichlorophenyl)benzophenone) is reacted. In #其实j, 彳 ^ aryl (tetra) acid or a slow acid dentate polymerizes to form a poly An aryl ether ketone. Examples of such compounds are diphenyl ether carboxylic acid, diphenyl ether carboxylic acid chloride, phenoxy-phenoxy benzoic acid or mixtures thereof. In other examples, dicarboxylic acids or dicarboxylic acids may be employed. The acid halide is condensed with a diaryl ether, for example, by reacting meta-phenylenedifluoride chloride or terephthaloyl chloride (or a mixture thereof) with diphenyl ether to form a pAEK resin. The method is described, for example, in U.S. Patent No. 4,176,222. The method comprises heating (1) substantially equimolar (^) and (bi) dihalobenzene type compound and/or (b ii) halogen in a temperature range of from 100 to 400 °C. a mixture of phenols (in which a halogen-based compound or a halogen atom is activated by a -C=〇-group at its ortho or para position) and sodium carbonate or sodium hydrogencarbonate and a second alkali metal carbonate 118106.doc -49- 200831609 Mixture of wind or %I hydrogen hydride (the second metal carbonate or bicarbonate of bicarbonate) The number of atoms is higher than the number of sodium atoms, and the amount of the second alkali metal carbonate or the stone acid hydrogenate is ·1 to 〇2 gram per gram of sodium atom, and the base having the number of atoms of the parent's office The total atom of the metal atom, the alkali metal carbonate or the hydrogencarbonate is at least one alkali metal atom for each phenol group present) and the polymer is subsequently separated from the alkali metal halide.
然而根據如(例如)美國專利第4,396,755號中所述之方法 亦可製備其他聚芳醚酮。在該等方法中,於氟烷磺酸(尤 八為一氟甲烧石頁酸)存在下使諸如:(a)二緩酸;(b)二價芳 基及單芳族二羧酸;及(c)(a)與組合之反應物反應。 根據(例如)美國專利第4,398,〇20號中所述之方法可製備 其他聚芳醚酮,其中使彳芳族二醯基化合物與芳族化合物及 單醯基_化物聚合。 如於2 5 C下在濃硫酸中所量測,聚芳醚酮具有大於或等 於約0.4至約5.0 dl/g之低黏度。PAEK重量平均分子量(Mw) 可為約5,000至約15〇,〇〇〇 g/m〇ie。在其他實例中mw可為約 10,000至約 80,〇〇〇 g/mole。 第二樹脂組份為聚醚醯亞胺颯(PEIS)樹脂。如本文所 用,PEIS包含具有通式(VII)之結構單元,其中大於或等於 約50莫耳%之聚合物鍵具有芳基礙基,且Other polyaryletherketones can also be prepared according to the methods described in, for example, U.S. Patent No. 4,396,755. In such processes, in the presence of a fluoroalkanesulfonic acid (especially a fluorofibrate), such as: (a) a bis-acid; (b) a divalent aryl group and a mono-aromatic dicarboxylic acid; And (c) (a) reacting with the combined reactants. Other polyaryletherketones can be prepared according to the process described in, for example, U.S. Patent No. 4,398, the disclosure of which is incorporated herein by reference. The polyaryletherketone has a low viscosity of greater than or equal to about 0.4 to about 5.0 dl/g as measured in concentrated sulfuric acid at 2 5 C. The PAEK may have a weight average molecular weight (Mw) of from about 5,000 to about 15 Å, 〇〇〇 g/m〇ie. In other examples mw can be from about 10,000 to about 80, 〇〇〇 g/mole. The second resin component is a polyether phthalimide (PEIS) resin. As used herein, PEIS comprises a structural unit having the formula (VII) wherein greater than or equal to about 50 mole % of the polymer bond has an aryl group, and
其中a大於1,通常為約1 〇至約1 〇〇〇或更大,或更特定+ 118106.doc -50- 200831609 為約10至約500,且V為四價鍵聯濟 P m ,、要鍵聯體不 砜醚醯亞胺之合成或使用,則對盆益阳& 卜巧礙聚 “、、(制。合適 括(但不限於)··(a)具有約5至約5〇個 1體包 人原子之經取 經取代之飽和、不飽和或芳族單環或多環美團〜^未 至約30個碳原子之經取代或未經取代之直武(b)具有1 项取支鍵、餘知 或不飽和烷基;或(c)其組合。較佳鍵 P體包括(但不限於) 式(VIII)四價芳基,諸如: ) »;,道 (VIII) 及) 其中,在一些實施例中,W為選自由_8〇”、、 s 、 -C(〇)-、CyH2y-(y為具有丨至5之值之整數)組成之群之二價 基團及其自化衍生物(包括全氟伸烷基)或式_〇_D_〇_基團。 基團D可包含雙酚化合物之殘基。例如,D可為式ιχ中所 示之任何分子。Where a is greater than 1, typically from about 1 Torr to about 1 Torr or greater, or more specifically + 118106.doc -50- 200831609 is from about 10 to about 500, and V is a tetravalent bond, P m , In order to synthesize or use the conjugated sulfone ether quinone imine, it is about 5 to about 5 盆 盆 阳 阳 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A substituted, unsaturated or aromatic monocyclic or polycyclic melon group substituted by a human body, a substituted or unsubstituted direct martial art (b) having less than about 30 carbon atoms a bond, a known or an unsaturated alkyl group; or (c) a combination thereof. Preferred bond P forms include, but are not limited to, a tetravalent aryl group of the formula (VIII), such as: ) »;, (VIII) and Wherein, in some embodiments, W is a divalent group selected from the group consisting of _8〇", s, -C(〇)-, CyH2y- (y is an integer having a value of 丨 to 5) Its self-derivative derivative (including perfluoroalkylene) or the formula _〇_D_〇_ group. The group D may comprise a residue of a bisphenol compound. For example, D can be any of the molecules shown in the formula ιχ.
令 q 合,Let q combine,
‘ch3, H3c Br Br CH3,及 118106.doc -51 · (IX) 200831609‘ch3, H3c Br Br CH3, and 118106.doc -51 · (IX) 200831609
c(ch3)2c(ch3)2
一秘鍵-W-或-O-D-O-基團可處於3,3,、3,4,、4,3,或4,4,之 位置。亦可使用前述化合物之混合物。對於優良炼融穩定 性而έ ’不含苯甲基質子之基團通常較佳。其中w為卻2_ 之基團_確提示’因為其係_種將芳基颯鍵引人聚硬鍵 醯亞胺樹脂之方法。The first key-W- or -O-D-O- group can be in the position of 3, 3, 3, 4, 4, 3, or 4, 4. Mixtures of the foregoing compounds can also be used. Groups which do not contain benzylic protons are generally preferred for good smelting stability. The group in which w is 2_ is indeed suggested because it is a method of introducing an aryl hydrazone bond into a polyhard quinone imine resin.
如本文所用之術語"聚合物鍵"或"一聚合物鍵”定義為至 少兩個形成聚合物之單體之反應產物,其中至少_個單體 為二酐或化學等效物,中第二單體為I少一種二胺或 化學等效物。聚合物由1〇〇莫耳%之該等鍵組成。例如, 具有50莫耳%芳基砜鍵之聚合物中其鍵之一半(以莫耳計) ι έ具有至少一種芳基颯基之衍生自二酐或二胺之鍵。 用作_0-D-〇-基團之前驅體的合適經二羥基取代之芳族 烴亦包括式(X)之化合物:The term "polymer bond" or "a polymer bond" as used herein is defined as the reaction product of at least two monomers forming a polymer, wherein at least one monomer is a dianhydride or a chemical equivalent, The second monomer is one less than one diamine or chemical equivalent. The polymer consists of 1% by mole of such bonds. For example, a bond having a 50 mol% aryl sulfone bond Half (in moles) ι έ having at least one aryl fluorenyl group derived from a dianhydride or a diamine. Suitable dihydroxy-substituted aromatics used as a precursor to the _0-D-fluorene-group Hydrocarbons also include compounds of formula (X):
OH (X); 其中R各自獨立為氫、氯、填、、燒氧基、芳基氧基或Cl。。 單價烴或烴氧基’且R8及立為氩、芳基、烷基氟基或 Cl-3G烴基。 可用作-0-D-0-基團之前驅體的經二羥基取代之芳族烴 包括美國專利第2,991,273號、第2,999,835號、第3,〇28,365 118106.doc -52· 200831609 號、第 3,148,172號、第 3,153,008 號、第 3,271,367號、第 3,271,368號及第4,217,438號中之名稱或化學式所揭示之化 合物。可使用之經二羥基取代之芳族烴之特定實例包括 (但不限於)雙(4-經基苯基)砜、雙(4-羥基苯基)硫醚、雙(4_ 羥基苯基)醚、雙(4-羥基苯基)亞砜、ι,4-二經基苯、4,4,_ 乳基一^紛、2,2 -雙(4 -經基本基)六氣丙烧、4,4·_(3 3 5_三甲 基亞環己基)二紛、4,4’-雙(3,5-二甲基)二紛、1,1_雙(4_經 基-3-甲基苯基)環己烷、4,4-雙(4-羥基苯基)庚烧、2,4'_二 羥基二苯甲烷、雙(2-羥基苯基)甲烷、雙(4_經基苯基)甲 烧、雙(4-經基-5-确基苯基)甲烧、雙(4-經基_2,6_立甲基― 3 -曱氧基苯基)甲烧、1,1-雙(4-經基苯基)乙烧、雙(4_ 羥基苯基)乙烷、1,1-雙(4-羥基-2-氯苯基)乙烧、2,2-雙(3-苯基-4-羥基苯基)丙烷、2,2·雙(4-羥基-3-甲基苯基)丙烷、 2,2-雙(4-經基-3-乙基苯基)丙烧、2,2-雙(4-經基-3-異丙基 苯基)丙烷、2,2-雙(4-羥基-3,5-二甲基苯基)丙烷、 3,5,3’,5’-四氯-4,4,-二羥基苯基)丙烷、雙(4-羥基苯基)環己 基甲烧;2,2-雙(4-羥基苯基)-1-苯基丙烷、2,4,-二羥基苯 基石風、二备基萘、2,6-二經基萘、氫藏、間苯二紛、經Cw 烧基取代之間苯二盼、甲基間苯二紛、1,4-二經基—3 -甲基 苯、2,2_雙(4·羥基苯基)丁烷、2,2-雙(4-羥基苯基)-2-甲基 丁烧、1,1-雙(4-羥基苯基)環己烷、4,4,-二羥基二苯基、2-(3-曱基-4-羥基苯基_2_(4_羥基苯基)丙烷、2_(3,5_二甲基_ 4-經基笨基)-2-(4-羥基苯基)丙烷、2-(3-甲基-4-羥基苯基)-2-(3,5-二甲基_4_羥基苯基)丙烷、雙(3,5_二甲基苯基_4_羥 118106.doc -53- 200831609 基苯基)曱烷、1,1-雙(3,5-二甲基苯基_4_羥基苯基)乙烷、 2,2-雙(3,5-二甲基苯基-4-羥基苯基)丙烷、2,‘雙(3,5-二甲 基苯基-4-羥基苯基)-2-甲基丁烷、3,3_雙(3,5-二甲基苯基_ 4_羥基苯基)戊烷、1,1-雙(3,5_二曱基苯基_4_羥基苯基)環 戊烷、1,1-雙(3,5 -二甲基苯基-4-羥基苯基)環己烷、雙 (3,5-二甲基羥基苯基)亞砜、雙(3,5-二曱基_4_羥基苯基) 砜及雙(3,5-二甲基苯基-4·羥基苯基)硫醚。亦可利用包含 任何前述經二羥基取代之芳族烴之混合物。 在一特定實施例中,包含雙酚與砜鍵之經二羥基取代之 芳族烴為重要的,因為其係將芳基砜鍵引入聚砜醚醯亞胺 樹脂之另一途徑。在其他實例中,不含苯甲基質子之雙酚 化合物對製備具有較高熔融穩定性之聚醚醯亞胺颯而言為 較佳的。 " 在式(VII)中’R基團為二胺基化合物或化學等效物之殘 基,其包括(但不限於)經取代或未經取代之二價有機基 團諸如.(a)具有約6至約24個碳原子之芳族烴基及其鹵 化衍生物,·(b)具有約2至約2〇個碳原子之直鏈或支鍵伸烧 基;(c)具有約3至約24個碳原子之伸環烷基,或(d)通式 (XI)之二價基團: ^OH (X); wherein each R is independently hydrogen, chloro, hydrazine, alkoxy, aryloxy or Cl. . The monovalent hydrocarbon or hydrocarbyloxy group and R8 and the argon, aryl, alkylfluoro or Cl-3G hydrocarbyl group. Dihydroxy-substituted aromatic hydrocarbons useful as precursors to the -0-D-0- group include U.S. Patent Nos. 2,991,273, 2,999,835, 3, 〇28,365 118106.doc-52.200831609 And the compounds disclosed in the names or chemical formulas of Nos. 3, 148, 172, 3, 153, 008, 3, 271, 367, 3, 271, 368 and 4, 217, 438. Specific examples of dihydroxy-substituted aromatic hydrocarbons that may be used include, but are not limited to, bis(4-phenylphenyl)sulfone, bis(4-hydroxyphenyl) sulfide, bis(4-hydroxyphenyl)ether , bis(4-hydroxyphenyl) sulfoxide, iota, di-diphenyl, 4,4, _, aryl, 2,2-bis(4-based) hexafluoropropanone, 4 , 4·_(3 3 5_trimethylcyclohexylidene) di-, 4,4'-bis(3,5-dimethyl) di-, 1,1-bis (4-cyto-3- Methylphenyl)cyclohexane, 4,4-bis(4-hydroxyphenyl)heptane, 2,4'-dihydroxydiphenylmethane, bis(2-hydroxyphenyl)methane, double (4_jing Methyl phenyl)methane, bis(4-carbyl-5-decylphenyl)methane, bis(4-carbazino-2,6-li-methyl-3-methoxyphenyl)-methyl, 1,1-bis(4-pyridylphenyl)ethene, bis(4-hydroxyphenyl)ethane, 1,1-bis(4-hydroxy-2-chlorophenyl)ethene, 2,2-double (3-phenyl-4-hydroxyphenyl)propane, 2,2·bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-carbo-3-ethylphenyl) )propane, 2,2-bis(4-carbyl-3-isopropylphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl) Propane, 3,5,3',5'-tetrachloro-4,4,-dihydroxyphenyl)propane, bis(4-hydroxyphenyl)cyclohexylmethyl; 2,2-bis(4-hydroxyl) Phenyl)-1-phenylpropane, 2,4,-dihydroxyphenyl zephyr, diprenylnaphthalene, 2,6-dipyridyl naphthalene, hydrogen storage, isophthalic acid, substituted by Cw alkyl Benzene, methyl-m-phenylene, 1,4-di-propyl-3-methylbenzene, 2,2-bis(4-hydroxyphenyl)butane, 2,2-bis(4-hydroxybenzene) 2-methylbutyring, 1,1-bis(4-hydroxyphenyl)cyclohexane, 4,4,-dihydroxydiphenyl, 2-(3-indolyl-4-hydroxyphenyl _2_(4-hydroxyphenyl)propane, 2-(3,5-dimethyl-4-trans-phenyl)-2-(4-hydroxyphenyl)propane, 2-(3-methyl-4- Hydroxyphenyl)-2-(3,5-dimethyl-4-hydroxyphenyl)propane, bis(3,5-dimethylphenyl-4-hydroxyl 118106.doc-53-200831609 phenyl) Decane, 1,1-bis(3,5-dimethylphenyl-4-hydroxyphenyl)ethane, 2,2-bis(3,5-dimethylphenyl-4-hydroxyphenyl) Propane, 2, 'bis(3,5-dimethylphenyl-4-hydroxyphenyl)-2-methylbutane, 3,3_bis(3,5-dimethylphenyl-4-hydroxyl) Phenyl)pentane, 1,1-bis(3,5-didecylphenyl-4-hydroxyphenyl)cyclopentane, 1,1-bis(3,5-dimethylphenyl-4-hydroxyphenyl)cyclohexane Alkane, bis(3,5-dimethylhydroxyphenyl) sulfoxide, bis(3,5-diindenyl-4-hydroxyphenyl) sulfone and bis(3,5-dimethylphenyl-4) Hydroxyphenyl) sulfide. Mixtures comprising any of the foregoing dihydroxy-substituted aromatic hydrocarbons may also be utilized. In a particular embodiment, a dihydroxy-substituted aromatic hydrocarbon comprising a bisphenol and a sulfone linkage is important because it is another route for introducing an aryl sulfone linkage into the polysulfone ether oxime imide resin. In other examples, bisphenol compounds free of benzyl protons are preferred for the preparation of polyether oxime oximes having higher melt stability. " In the formula (VII), the 'R group is a residue of a diamine compound or a chemical equivalent including, but not limited to, a substituted or unsubstituted divalent organic group such as (a) An aromatic hydrocarbon group having from about 6 to about 24 carbon atoms and a halogenated derivative thereof, (b) a linear or branched bond group having from about 2 to about 2 carbon atoms; (c) having about 3 to a cycloalkyl group of about 24 carbon atoms, or (d) a divalent group of the formula (XI): ^
(XI) 其中Q包括(但不限於)選自由_s〇2·、_〇、_s 、、(XI) wherein Q includes, but is not limited to, selected from _s〇2·, _〇, _s,
Cyil2y-(y為具有1至約5之值之整數)組成之群的二價基團及 其齒化衍生物(包括全氟伸烧基)。在特定實施例中,&基 118106.doc .54 _ 200831609 本上不含苯甲基氫。可自化學結構推論出苯甲基質子之存 在。 在一些特定實施例中,合適芳族二胺包含間苯二胺、對 苯二胺、間苯二胺與對苯二胺之混合物、異構體2_曱基_及 5-甲基-4,6-二乙基-1,3-苯二胺或其混合物、雙(4-胺基苯 基)-2,2-丙烷、雙(2-氯_4_胺基·3,5-二乙基苯基)甲烷、4,4,-二胺基二苯、3,4’-二胺基二苯、4,4,-二胺基二苯醚(有時稱 作4,4’-氧基二苯胺)、3,4,-二胺基二苯醚、3,3,-二胺基二苯 鱗、4,4’-二胺基二苯砜、3,4,_二胺基二苯砜、3,3匕二胺基 二苯砜、4,4’-二胺基二苯硫醚、3,4,-二胺基二苯硫醚、 4,4’-二胺基二苯酮、3,4’-二胺基二苯酮、4,4,-二胺基二苯 甲烧(通常稱為4,4’-亞甲基二苯胺)、4,4,-雙(4-胺基苯氧基) 聯苯基、4,4»-雙(3-胺基苯氧基)聯苯基、i,%二胺基萘、 3,3-二甲基聯苯胺、3,3-二甲氧基聯苯胺、聯苯胺、間二 曱苯二胺、雙(胺基苯氧基)苐、雙(胺基苯氧基)苯、1>3_雙 (3-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、1,4-雙(4-胺 基苯氧基)苯、雙(胺基苯氧基)苯基颯、雙(4-(4-胺基苯氧 基)苯基)砜、雙(4-(3-胺基苯氧基)苯基)砜、二胺基苯曱醯 苯胺、3,3’-二胺基二苯甲酮、4,4'·二胺基二苯甲酮、2,2,-雙(4-(4-胺基苯氧基)苯基)丙烷、2,2-雙[4-(4-胺基苯氧基) 苯基]六氟丙烷、4,4^雙(胺基苯基)六氟丙烷、1,3-二胺基-4-異丙基苯、1,2-雙(3-胺基苯氧基)乙烷、2,4-雙(β胺基-第 三丁基)甲苯、雙(對β曱基-鄰胺基苯基)苯、雙(對β胺基-第 三丁基苯基)醚及2,4-甲苯二胺。亦可利用兩種或兩種以上 118106.doc -55- 200831609 胺 混合物 一胺基一苯石風(DDS)、 基)颯(BAPS)及其混合物為較佳芳族二胺 雙(胺基笨氧基苯 本文所述之熱塑聚砜醚醯亞胺可衍生自包含—或多種芳 族二胺或其化學等效衍生物及一或多種芳族四_環二針 (下文有時稱作芳族二野)、芳族四缓酸或其能夠形成環酐 之衍生物之反應物。另外,包含芳族二胺及芳族二酐之反 應物中之一者或另—者之至少一部分或每一者之至少一部Cyil2y-(y is a group of divalent groups having an integer of from 1 to about 5) and a dentate derivative thereof (including a perfluoroalkylene group). In a particular embodiment, & base 118106.doc .54 _ 200831609 does not contain benzyl hydrogen. The existence of benzylated protons can be deduced from the chemical structure. In some specific embodiments, suitable aromatic diamines comprise m-phenylenediamine, p-phenylenediamine, a mixture of m-phenylenediamine and p-phenylenediamine, isomers 2-mercapto- and 5-methyl-4 ,6-diethyl-1,3-phenylenediamine or a mixture thereof, bis(4-aminophenyl)-2,2-propane, bis(2-chloro-4-isoamine·3,5-di Ethylphenyl)methane, 4,4,-diaminodiphenyl, 3,4'-diaminodiphenyl, 4,4,-diaminodiphenyl ether (sometimes referred to as 4,4'- Oxydiphenylamine), 3,4,-diaminodiphenyl ether, 3,3,-diaminodiphenyl scale, 4,4'-diaminodiphenyl sulfone, 3,4,-diamino group Diphenyl sulfone, 3,3 匕diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 3,4,-diaminodiphenyl sulfide, 4,4'-diaminodi Benzophenone, 3,4'-diaminobenzophenone, 4,4,-diaminobenzophenone (commonly known as 4,4'-methylenediphenylamine), 4,4,-bis ( 4-aminophenoxy)biphenyl, 4,4»-bis(3-aminophenoxy)biphenyl, i,% diaminonaphthalene, 3,3-dimethylbenzidine, 3 , 3-dimethoxybenzidine, benzidine, m-diphenylene diamine, bis(aminophenoxy)anthracene, bis(aminophenoxy) Benzene, 1>3_bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, Bis(aminophenoxy)phenylhydrazine, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, diamine Benzobenzidine, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 2,2,-bis(4-(4-aminophenoxy) Phenyl)propane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 4,4^bis(aminophenyl)hexafluoropropane, 1,3-diamine 4-isopropylbenzene, 1,2-bis(3-aminophenoxy)ethane, 2,4-bis(β-amino-t-butyl)toluene, bis(p-β-yl- O-aminophenyl)benzene, bis(p-amino-t-butylphenyl)ether and 2,4-toluenediamine. It is also possible to use two or more kinds of 118106.doc -55-200831609 amine mixture monoamine monoterpene (DDS), hydrazine (BAPS) and mixtures thereof as preferred aromatic diamine bis (amine stupid The oxybenzenes described herein may be derived from one or more aromatic diamines or chemically equivalent derivatives thereof and one or more aromatic tetra-rings (hereinafter sometimes referred to as a reactant of an aromatic tetrakisole or an aromatic tetrazoic acid or a derivative thereof capable of forming a cyclic anhydride. In addition, at least a part of one or the other of the reactants containing the aromatic diamine and the aromatic dianhydride Or at least one of each
分包含芳基砜鍵,使得所得聚合物鍵的至少5〇莫耳%含有 至少-個芳基砜基團。在一特定實施例中,包含芳族二胺 及芳族二酐之反應物中之一者或另一者之全部或每一者之 王。卩具有至少一個砜鍵。反應物聚合以形成包含環醯亞胺 鍵及颯鍵之聚合物。 芳族二酐之說明性實例包括: 4,4’-雙(3,4-二羧基苯氧基)二苯硬二酐; 4,4’-雙(2,3-二羧基苯氧基)二苯硬二酐; 4-(2,3-二羧基苯氧基)_4,_(3,4_二羧基苯氧基)二苯砜二酐 及其混合物。 其他可使用之芳族二酐包含: 2,2_雙(4-(3,4-二致基苯氧基)苯基)丙烧二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯醚二酐; 4,4L雙(3,4-二羧基苯氧基)二苯硫醚二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯甲酮二酐; 2,2-雙([心(2,3·二羧基苯氧基)苯基]丙烷二酐; 4,4f-雙(2,3-二羧基苯氧基)二苯醚二酐; 118106.doc -56- 200831609 4,4’-雙(2,3-二羧基苯氡基)二苯硫醚二酐; 雙(2,3-二羧基苯氧基)二苯甲酮二酐; 2-[4-(3,4-二羧基笨氧基)苯基]_2_[4_(2,3_二羧基苯氧基) 本基]丙燒二野; 4-(2,3-二羧基苯氧基)_4,_(3,‘二羧基苯氧基)二苯醚二 酐; 4-(2,3-_羧基笨氧基)-4’_(3,4_二羧基苯氧基)二苯硫醚二 酐;The fraction comprises an aryl sulfone linkage such that at least 5 mole percent of the resulting polymer linkage contains at least one aryl sulfone group. In a particular embodiment, one or the other of the reactants comprising the aromatic diamine and the aromatic dianhydride is the king of all or each of the other. The hydrazine has at least one sulfone bond. The reactants are polymerized to form a polymer comprising a cyclic quinone bond and a hydrazone bond. Illustrative examples of aromatic dianhydrides include: 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl succinic anhydride; 4,4'-bis(2,3-dicarboxyphenoxy) Diphenyl succinic anhydride; 4-(2,3-dicarboxyphenoxy)-4,-(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride and mixtures thereof. Other aromatic dianhydrides which may be used include: 2,2_bis(4-(3,4-diphenylphenoxy)phenyl)propane dianhydride; 4,4'-bis(3,4-di Carboxyphenoxy)diphenyl ether dianhydride; 4,4L bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,4'-bis(3,4-dicarboxyphenoxy) Benzophenone dianhydride; 2,2-bis([heart (2,3·dicarboxyphenoxy)phenyl]propane dianhydride; 4,4f-bis(2,3-dicarboxyphenoxy)di Phenyl ether dianhydride; 118106.doc -56- 200831609 4,4'-bis(2,3-dicarboxyphenylhydrazyl)diphenyl sulfide dianhydride; bis(2,3-dicarboxyphenoxy)diphenyl Methyl ketone dianhydride; 2-[4-(3,4-dicarboxyloxy)phenyl]_2_[4_(2,3-dicarboxyphenoxy) benzyl] propyl sulphide; 4-(2 ,3-dicarboxyphenoxy)_4,_(3,'dicarboxyphenoxy)diphenyl ether dianhydride; 4-(2,3-carboxyloxy)-4'_(3,4_ Dicarboxyphenoxy)diphenyl sulfide dianhydride;
4-(2,3-二羧基苯氧基)_4,_(3,4_二羧基苯氧基)二苯甲酮二 酐; 1,4,5,8-萘四羧酸二酐; 3.4.3、 4f-二苯甲酮四敌酸二野; 2.3.3、 4·_二苯曱酮四羧酸二酐; 3,4,3f,4^氧雙鄰苯二甲酸酐; 2,3,3’,4’-氧雙鄰苯二甲酸野; 3,3’,4,4* -聯苯基四甲酸二野; 2,3,3’,4f -聯苯基四甲酸二酐; 2,3,2·,3· -聯苯基四甲酸二軒; 苯四甲酸二酐; 3,4,3,4 -,一苯石風四甲酸二酐; 2,3,3 ’,4f - 一·苯石風四甲酸二酐; 1,4-雙(3,4-二羧基苯氧基)笨二酐,·及 2,2-雙(3,4-二甲酸苯基)六氟丙烷二酐。 亦涵蓋具有衍生自 包含兩個或兩個以.上項之混合物的 118106.doc -57- 200831609 結構單元之聚砜醚醯亞胺。 在其他實例中’聚_醯亞胺具有大於或等於約50莫耳 %衍生自芳族醚肝(亦即氧雙鄰苯二甲酸軒)之醯亞胺鍵, 在:替代性實施例中,具有約6〇莫耳%至約1〇〇莫耳%衍生 自氧雙鄰苯二甲酸肝之醯亞胺鍵。在—替代性實施例中, 約7〇莫耳%至約99莫耳贿亞胺鍵係衍生自氧雙鄰苯 酸酐或化學等效物。 一4-(2,3-dicarboxyphenoxy)_4,_(3,4-dicarboxyphenoxy)benzophenone dianhydride; 1,4,5,8-naphthalenetetracarboxylic dianhydride; 3.4 .3, 4f-benzophenone tetrahydro acid di-field; 2.3.3, 4·-dibenzophenone tetracarboxylic dianhydride; 3,4,3f,4^oxydiphthalic anhydride; 3,3',4'-oxydiphthalic acid field; 3,3',4,4*-biphenyltetracarboxylic acid diano; 2,3,3',4f-biphenyltetracarboxylic dianhydride ; 2,3,2·,3·-biphenyltetracarboxylic acid dixanthene; pyromellitic dianhydride; 3,4,3,4 -, benzotriene tetracarboxylic dianhydride; 2,3,3 ', 4f - benzophenan tetracarboxylic dianhydride; 1,4-bis(3,4-dicarboxyphenoxy) dianhydride, and 2,2-bis(3,4-dicarboxylic acid phenyl) Fluoropropane dianhydride. Polysulfone ether imines having a structural unit derived from a mixture of two or two of the above items, 118106.doc -57 - 200831609, are also contemplated. In other examples, the poly-indenimide has greater than or equal to about 50 mole percent of the quinone imine linkage derived from the aromatic ether liver (ie, oxydiphthalate), in an alternative embodiment, There is a bismuth imine bond derived from the liver of oxydiphthalic acid of from about 6 〇 mol% to about 1 〇〇 mol %. In an alternative embodiment, from about 7 mole percent to about 99 moles of imide linkage is derived from oxydiphthalic anhydride or a chemical equivalent. One
術語”氧雙鄰苯二甲酸酐"意謂式(ΧΙΙ)之氧雙鄰笨二甲酸軒The term "oxydiphthalic anhydride" means the oxygen double-adjacent benzoic acid
-(XII) 及其衍生物,如下文進一步之定義。 式(ΧΠ)氧雙鄰苯二甲酸酐包括4,4,_氧基雙鄰苯二甲酸 酐、3,4’-氧基雙鄰苯二甲酸酐、3,3,_氧基雙鄰苯二甲酸酐 及其任何混合物。例如,含有大於或等於約5〇莫耳%衍生 自氧雙鄰苯二甲酸酐之醯亞胺鍵的聚砜醚醯亞胺可衍生自 式(XIII)之4,4'-氧基雙鄰苯二甲酸酐結構單元 硬- (XII) and its derivatives, as further defined below. The formula (ΧΠ) oxydiphthalic anhydride includes 4,4,-oxydiphthalic anhydride, 3,4'-oxydiphthalic anhydride, 3,3,-oxybis phthalic acid Dicarboxylic anhydride and any mixture thereof. For example, a polysulfone ether iodide containing greater than or equal to about 5 mole percent of a quinone imine bond derived from oxydiphthalic anhydride can be derived from a 4,4'-oxy double neighbor of formula (XIII). Phthalic anhydride structural unit hard
(XIII) _醯亞胺。可在醯亞胺形成反應中充當氧雙鄰笨二甲 酸 酐之化學等效物的衍生酐基團之實例包括式(XIV)之氧雙 鄰苯二甲酸if衍生物 118106.doc -58- (XIV) 200831609(XIII) _ 醯 imine. Examples of the derivatized anhydride group which can serve as a chemical equivalent of oxydi-homoic acid anhydride in the quinone imine formation reaction include the oxydiphthalic acid if derivative of the formula (XIV) 118106.doc -58- ( XIV) 200831609
其中式VII之R!及R2可為任何下述物質:氫、烷基、芳 基。1^及112可相同或不同以產生氧雙鄰苯二甲酸酐酸、氧 雙鄰苯二甲酸酐酯及氧雙鄰苯二甲酸酐酸酯。Wherein R! and R2 of the formula VII can be any of the following: hydrogen, an alkyl group, an aryl group. 1 and 112 may be the same or different to produce oxydiphthalic anhydride, oxydiphthalic anhydride and oxydiphthalic anhydride.
本文中聚石風醚酿亞胺可包括衍生自具有兩個衍生肝基團 之氧雙鄰苯二甲酸酐衍生物之醯亞胺鍵,例如,其中氧雙 鄰苯二甲酸酐衍生物為式(XV)The polyphenolic ether-enamines herein may include a quinone imine bond derived from an oxydiphthalic anhydride derivative having two derived hepatic groups, for example, wherein the oxydiphthalic anhydride derivative is a formula (XV)
其中式(XV)之R〗、R2、Rs及R4可為任何如下物質:氫、烧 基、芳基。Ri、R2、R3及R4可相同或不同以產生氧雙鄰苯 一甲酸、氧雙鄰苯二甲酯及氧雙鄰苯二甲酸酯。Wherein R, R2, Rs and R4 of the formula (XV) may be any of the following: hydrogen, alkyl, aryl. Ri, R2, R3 and R4 may be the same or different to produce oxybisphthalic acid, oxydiphthalate and oxydiphthalate.
亦涵蓋包括衍生自上文所列之具有兩個、三個或三個以 上不同二酐之氧雙鄰苯二甲酸酐之混合物與差不多等莫耳 篁之具有可撓性鍵之有冑二胺的亞胺化反應之結構單元的 聚砜醚醯亞胺共聚物 莫 生 另外’涵蓋具有大於或等於約5〇 曱酸酐(包括其衍 耳%衍生自上文所定義之氧雙鄰苯二 物)之酿亞胺鍵及至多約5G莫耳%與氧雙鄰苯二甲酸肝截然 不同之替代二酐之共聚物。亦即’在一些實例中,需要使 共聚物除具有大於或等於約50莫耳%衍生自氧雙鄰苯二甲 i酐之鍵外亦包括何生自如下不同於氧雙鄰苯二甲酸酐之 118106.doc -59- 200831609 芳族二酐之醯亞胺鍵:例如雙酚A二酐(BPADA)、二颯二 野、二苯曱酮二酐、雙(碳苯氧基苯基)、六氟丙烷二酐、 雙紛二酐、苯四曱酸二酐(PMDA)、聯苯基二酐、硫二 酐、磺酸基二酐及其混合物。 在另一實施例中,使如上文所定義之二酐與具有砜鍵之 芳基二胺反應。在一實施例中,聚砜醚醯亞胺包括衍生自 式(XVI)芳基二胺基砜之結構單元Also included are mixtures of oxydiphthalic anhydrides derived from two, three or more different dianhydrides listed above with a flexible bond having almost the same molarity as the oxime The polysulfide ether quinone imine copolymer of the imidization reaction unit further comprises 'having greater than or equal to about 5 phthalic anhydride (including its derivatized % derived from the oxygen bis-o-benzene compound as defined above) a brewing imine bond and a copolymer of up to about 5 G mol% of an alternative dianhydride distinct from oxydiphthalate liver. That is, 'in some instances, it is desirable to have the copolymer in addition to having a bond derived from oxydiphthaloic anhydride of greater than or equal to about 50 mole percent, including what is different from oxydiphthalic anhydride as follows. 118106.doc -59- 200831609 The quinone imine bond of an aromatic dianhydride: for example, bisphenol A dianhydride (BPADA), diterpene, benzophenone dianhydride, bis(carbonphenoxyphenyl), Hexafluoropropane dianhydride, di-di- dianhydride, pyromellitic dianhydride (PMDA), biphenyl dianhydride, sulphur dianhydride, sulfonic dianhydride, and mixtures thereof. In another embodiment, a dianhydride as defined above is reacted with an aryl diamine having a sulfone linkage. In one embodiment, the polysulfone ether imide comprises a structural unit derived from an aryldiamine sulfone of formula (XVI).
H2N—Ar^s〇2-Ar-NH2 (χγΐ) 其中Ar可為含有單環或多環之芳基物質。數個芳環可經 (例如)醚鍵、砜鍵或一個以上砜鍵鍵聯在一起。芳環亦可 經稠合。 在替代性實施財,芳基二胺基狀胺基可處於賴之 間位或對位,例如式(XVII)中H2N-Ar^s〇2-Ar-NH2 (χγΐ) wherein Ar may be an aryl group containing a monocyclic or polycyclic ring. A plurality of aromatic rings may be bonded together via, for example, an ether bond, a sulfone bond or more than one sulfone bond. The aromatic ring can also be fused. In an alternative implementation, the aryldiamine-based amine group may be in the meta or para position, for example in formula (XVII)
(XVII) 、芳族二胺包括(但*限於)(例如)二胺基二苯硬⑽S)及 (胺基苯氧基苯基)砜(BAPS)。藉由盘若其_ 一歹丞一妝基碾反應 生聚碾賴亞胺,上文所述之氧雙鄰苯二甲酸二 成聚醯亞胺鍵。 用於形 在一些實施例中,藉由使芳族二肝單 單體)與有機二胺單體反應可製 戈方知雙㈣軒) 中該兩種單體基本上以等莫耳量存在,或其中一^月曰,其 於另一單體而言以不超過約2〇%莫耳過量,且i早體相對 10%莫耳過量存在於反應混合物中,2由且較佳少於約 4八中一單體係以不 118106.doc -60- 200831609 超過約5%莫耳過量存在於反應混合物中。在其他實例中 該等單體將以相差小於1%莫耳過量之量存在。(XVII), aromatic diamines include (but are limited to), for example, diaminodiphenyl hard (10) S) and (aminophenoxyphenyl) sulfone (BAPS). The above-mentioned oxydiphthalic acid is condensed into a polyimidazole bond by the reaction of the ruthenium. In some embodiments, by reacting an aromatic di-hepatic monomer with an organic diamine monomer, the two monomers are substantially present in a molar amount. Or one of the oxime, which is not more than about 2% molar excess in the other monomer, and i is present in the reaction mixture in an excess relative to 10% molar excess, 2 and preferably less than Approximately 8% of the system was present in the reaction mixture in excess of about 5% molar excess from 118106.doc -60 to 200831609. In other examples the monomers will be present in an amount that differs by less than 1% molar excess.
第一單胺可用於聚颯醚醯亞胺之端帽或鏈終止(例如)以 控制分子量。在-特定實施例中,第_單胺包含芳族第一 單胺,其說明性實例包含苯胺、氯苯胺、全氟甲基苯胺、 蔡胺及其類似物。芳族第一單胺可具有連接至芳族環之其 他官能基,該等芳族環諸如(但不限於)芳基、烷基、芳基_ 一土,風基S曰基、醯胺基、齒素、鹵化烧基或芳基、烧 基颭基芳基醚基或芳基酮基。所連接之官能基應不妨礙 芳無第單胺控制聚碾醚醯亞胺分子量之功能。美國專利 第6,919,422號中列出合適單胺化合物。 芳無一羧酸酐(亦即,包含一個環酐基團之芳基)亦可用 於控制ΛΚ醯亞胺石風之分子量。說明性實例包含鄰苯二甲酸 針諸%氯4苯一甲酸軒之經取代鄰$二曱酸肝及其類似 物。該等酐可具有連接至㈣環之其他官能基,其說明性 實例包含上述芳族第一單胺之該等官能基。 在二只例中,可需要具有低含量亞異烷基鍵之聚颯s 醯亞胺。咸信在-些PAEK摻合物中,】異烧基鍵之存4 Z進可混溶性,此舉可降低高溫下之負㈣力且將為q -而要的,、有έ亞異烷基之聚合物之可混溶pEEK摻4 物描述於(例如)美國專利第5,〇79,3〇9號及第 在一些實例中,低含量亞異烧基可意謂少於3G莫耳%聚石j 賴亞胺鍵將含有亞異烧基,在其他實例中,聚颯醚㈣ 胺鍵將含有少於2〇莫耳%亞異烧基。在其他實例中,以 118106.doc -61 - 200831609 醚醯亞胺鍵中將存在少於ίο莫耳%亞異烷基。 如於 340-425 °C 下由 American Society for Testing Materials(ASTM)D1238所量測,聚砜醚醯亞胺之熔融指數 可為約0.1至約10公克/分鐘(g/min)。在一實施例中,如藉 由凝膠滲透層析法用聚苯乙烯標準量測,聚砜醚醯亞胺樹 脂之重量平均分子量(Mw)為約10,000至約150,000公克/莫 耳(g/rnol)。在另一實施例中,聚石風醚醯亞胺之Mw為 20,000 至 60,000 g/mole 〇 ASTM D5205 "Standard Classification System for Polyetherimide (PEI) Materials11 中列出一些聚醚醯亞胺之實例。 在一些實例中,尤其當需要形成薄膜及纖維時,組合物 應基本上不含纖維增強物,諸如玻璃、碳、陶瓷纖維或金 屬纖維。在一些實例中,實質上不含意謂不到全部組合物 的5重量%,在其他情況下,組合物中應存在少於1重量% 之纖維增強物。 在其他實例中,具有在冷卻時展示某些結晶度之組合物 係有益的。此在具有高表面積之物件(諸如纖維及薄膜)中 更為重要,該等物件因其高表面積將迅速冷卻且可能不展 示得到最佳特性所必需之完全結晶度。在一些實例中,以 結晶溫度(Tc)反映結晶度之形成,可經諸如差示掃描熱量 測定(DSC)(例如ASTM方法D3418)之方法量測Tc。將可量 測之最大結晶速率之溫度作為Tc。在一些實例中,例如在 80°C /min之冷卻速率下,需要具有一大於或等於約240°C 之Tc。在其他實例中,例如在20°C /min之較低冷卻速率 118106.doc -62- 200831609 下,可能需要大於或等於約280°C之結晶溫度。 在一些實例中’組合物將具有至少兩個截然不同之玻璃 轉移脈度(Tg) ·來自PAEK樹脂或部分可混溶之ρΑΕκ摻合 物之第Tg,及與聚颯醚醯亞胺樹脂或該樹脂佔支配地位 之混合物相關之第二Tg。可藉由諸如DSC或動態力學分析 (DMA)之任何習知方法量測該等玻璃轉移溫度(丁幻。在一 些實例中,第一Tg可為約120至約200。〇且第二Tg可為約 240至約350 C。在其他實例中,具有約280至約35(TC之甚 至更南之第二Tg可為有益的。在一些實例中,以視摻合物 之特定樹脂、分子量及組成而截然不同,或轉移可部分重 疊。 在另一實施例中,藉由ASTM方法D3835使用剪切率為 100至10000 1/秒之毛細管流變儀量測在38〇它下量測,聚 礙_醯亞胺PEAK摻合物之熔融黏度為約2〇〇帕秒(pascal_ seconds)至約1〇,〇〇〇帕秒(Pa⑷。於38〇〇c下熔融黏度為約 200帕秒至約1〇,〇〇〇帕秒之樹脂摻合物將使得組合物藉由 使用溶融加工技術更易於形成物件。在其他實例中,將使 用約200至約5,000 Pa_s之較低溶融黏度。 尤其在本文所述PAEK-聚礙鱗酿亞胺組合物所需之高溫 下,熔融加工之另一態樣為:在模製或擠壓製程期間組合 物之溶融黏度不經歷過多變化。一種量測熔融穩定性之方 法係使用平行板流變儀檢查加工溫度(例如380°C )下黏度隨 時間之變化。在一些實例中,在溫度下保持大於或等於約 10分鐘之後,應保留初始黏度之大於或等於約5〇%。在其 118106.doc -63- 200831609 他實例中,歷時至少約10分鐘,熔融黏度變化應小於初始 值的約35%。在組合物已熔融及達到平衡後丨至5分鐘可量 測初始熔融黏度值。在將熱施加於樣品之後,在量測(記 錄)黏度之前通常等待i-5分鐘以確保樣品完全熔融及達到 平衡。用於量測熔融黏度對時間之合適方法為(例 如)ASTM方法D4440。注意可以泊(p〇ise,p)或帕秒(pa_s) 報導熔融黏度;1 Pa-s=10 P。 C. 共聚醚醯亞胺 了使用之^^合物亦可包括具有大於或等於約218之玻 璃轉移溫度之共聚醚醯亞胺的共聚物,該共聚醚醯亞胺包 含式(I)與(II)之結構單元:The first monoamine can be used in the end cap or chain termination of poly(oxime) oxime imine to, for example, control molecular weight. In a particular embodiment, the mono-monoamine comprises an aromatic first monoamine, illustrative examples of which include aniline, chloroaniline, perfluoromethylaniline, cilamine, and the like. The aromatic first monoamine may have other functional groups attached to an aromatic ring such as, but not limited to, an aryl group, an alkyl group, an aryl group - a soil, a wind-based S-mercapto group, a guanamine group. A dentate, a halogenated alkyl or aryl group, a pyrenyl aryl ether group or an aryl ketone group. The functional groups attached should not interfere with the function of the aromatic monoamine-free molecular weight of the polyaniline. Suitable monoamine compounds are listed in U.S. Patent No. 6,919,422. Aromatic carboxylic anhydride (i.e., an aryl group containing a cyclic anhydride group) can also be used to control the molecular weight of the sulfite. Illustrative examples include phthalate needles, % chloro 4 benzoic acid, and substituted ortho-disaccharide livers and the like. The anhydrides may have other functional groups attached to the (tetra) ring, illustrative examples of which include such functional groups of the above aromatic first monoamines. In two cases, polyfluorene sinoimine having a low content of iso-isoalkyl bonds may be required. In some PAEK blends, the presence of the iso-burning bond is 4 Miscible, which reduces the negative (four) force at high temperatures and will be q-, and has an oxime iso-alkane. The polymer-miscible pEEK-incorporated compound is described, for example, in U.S. Patent No. 5, No. 79, No. 3, and in some examples, a low-content isodecyl group may mean less than 3 Gm. The % polylithium j lysine bond will contain a sulfiso group, and in other instances, the poly(ether) (4) amine bond will contain less than 2 moles of lysine. In other examples, less than ίο mol % iso-isoalkyl will be present in the ether oxime imine bond 118106.doc -61 - 200831609. The polysulfone ether quinone imine may have a melt index of from about 0.1 to about 10 grams per minute (g/min) as measured by American Society for Testing Materials (ASTM) D1238 at 340-425 °C. In one embodiment, the polysulfone ether quinone imine resin has a weight average molecular weight (Mw) of from about 10,000 to about 150,000 grams per mole (g/) as measured by gel permeation chromatography using polystyrene standards. Rnol). In another embodiment, the polyether sulfonimide has an Mw of from 20,000 to 60,000 g/mole 〇 ASTM D5205 "Standard Classification System for Polyetherimide (PEI) Materials11. In some instances, particularly when it is desired to form films and fibers, the composition should be substantially free of fiber reinforcements such as glass, carbon, ceramic fibers or metal fibers. In some instances, substantially no more than 5% by weight of the total composition is meant, and in other instances, less than 1% by weight of the fiber reinforcement should be present in the composition. In other examples, compositions having some degree of crystallinity upon cooling are beneficial. This is even more important in articles having high surface areas, such as fibers and films, which will rapidly cool due to their high surface area and may not exhibit the full degree of crystallinity necessary to achieve optimum characteristics. In some examples, the formation of crystallinity is reflected by the crystallization temperature (Tc), and Tc can be measured by a method such as differential scanning calorimetry (DSC) (e.g., ASTM method D3418). The temperature at which the maximum crystallization rate can be measured is taken as Tc. In some instances, such as at a cooling rate of 80 ° C / min, it is desirable to have a Tc greater than or equal to about 240 °C. In other examples, such as at a lower cooling rate of 118 ° C. / 62 - 200831609 at 20 ° C / min, a crystallization temperature greater than or equal to about 280 ° C may be required. In some examples, the composition will have at least two distinct glass transition pulsations (Tg), a Tg from a PAEK resin or a partially miscible ρΑΕκ blend, and a poly(etheretherimide) resin or The resin is the second Tg associated with the dominant mixture. The glass transition temperatures can be measured by any conventional method such as DSC or Dynamic Mechanical Analysis (DMA). In some examples, the first Tg can be from about 120 to about 200. The second Tg can be From about 240 to about 350 C. In other examples, it may be beneficial to have a second Tg of from about 280 to about 35 (and even more south of TC. In some examples, the specific resin, molecular weight, and The composition is completely different, or the transfer may be partially overlapped. In another embodiment, the measurement is performed at 38 〇 using a capillary rheometer with a shear rate of 100 to 10000 1 / sec by ASTM method D3835. The melt viscosity of the 醯 胺 imine PEAK blend is about 2 〇〇 pascal (seconds) to about 1 〇, 〇〇〇 pa sec (Pa (4). The melt viscosity at 38 〇〇 c is about 200 Pa s to A resin blend of about 1 Torr, which will allow the composition to be more easily formed by using a melt processing technique. In other examples, a lower melt viscosity of from about 200 to about 5,000 Pa_s will be used. The other state of melt processing at the high temperatures required for the PAEK-polymerization of the squamous imine composition described herein The sample is: the melt viscosity of the composition does not undergo excessive changes during the molding or extrusion process. One method of measuring the melt stability is to check the viscosity of the process at a processing temperature (for example, 380 ° C) with a parallel plate rheometer. Variations. In some instances, the initial viscosity should be retained greater than or equal to about 5% after the temperature is maintained at greater than or equal to about 10 minutes. In its example 118106.doc-63-200831609, it lasts at least about 10 minutes. The change in melt viscosity should be less than about 35% of the initial value. The initial melt viscosity value can be measured after the composition has melted and reached equilibrium for 5 minutes. After applying heat to the sample, before measuring (recording) viscosity Usually wait for i-5 minutes to ensure that the sample is completely melted and equilibrated. A suitable method for measuring melt viscosity versus time is, for example, ASTM method D4440. Note that it can be poise (p〇ise, p) or pascal (pa_s) The melt viscosity is reported; 1 Pa-s = 10 P. C. The copolymer of the polyether quinone imide may also comprise a copolymer of a copolyether quinone having a glass transition temperature of greater than or equal to about 218, which Copolymerization Ether quinone imine comprises structural units of formula (I) and (II):
及視情況式(III)結構單元:And according to the situation (III) structural unit:
118106.doc -64 - 200831609 其中R1包含未經取代之Cm二價芳族烴或包含鹵素或烷基 取代基或該等取代基之混合物之經取代C6_22二價芳族烴; 或通式(IV)之二價基團:Wherein R1 comprises an unsubstituted Cm divalent aromatic hydrocarbon or a substituted C6_22 divalent aromatic hydrocarbon comprising a halogen or alkyl substituent or a mixture of such substituents; or formula (IV) Bivalent group:
(IV) 其中有關於芳族環未指定位置異構體的基團係處於Q之 間位或對位,且Q為選自由式(V):(IV) wherein the group in which the aromatic ring is not assigned a positional isomer is in the meta or para position of Q, and Q is selected from the formula (V):
γ\α 0 〇 CF〇γ\α 0 〇 CF〇
() II II I -Ο-,-S_,一c一 ,一s— ,一C—, 0 cf3 及式CyH2y(其中y為具有1至約5之值的整數)之伸烧基或亞 烷基組成之群之共價鍵或成員,且R2為二價芳基;式⑴單 元與式(II)單元之重量比在約99.9:0.1與約25:75之範圍内。 具有該等要素之共聚物在於2005年2月1曰以Bruneiie等人 之名義頒予的標題為"COPOLYETHERIMIDES”之美國專利 第6,849,706號(該案之全文以引用方式倂入本文中,就像 經詳細描述一樣)中有更充分描述。 E· 摻合物之其他添加劑 除了掺合物之聚合物組份外,亦可添加其他有益組合物 以製造改良之製品物件。熟練技術人員應瞭解可添加至聚 合物以改良一或多種製造或效能特性之廣泛成份。 在-些情況下,可將金屬氧化物添加至本發明聚合物。 在-些實例中’金屬氧化物可藉由減少放熱及增加到達放 熱峰值之時間而進一步改良耐燃_效能。二氧化鈦為重 118106.doc •65- 200831609 要的。其他金屬氧化物包括氧化辞、氧化删、氧化録、氧 化鐵及過渡金屬氧化物。在一些實例中可能需要白色金屬 氧化物。金屬氧化物可單獨使用或與其他金屬氧化物組合 使用。可使用任何有效量之金屬氧化物,在一些實例中, 為聚合物摻合物之0.0丨至20重量%。 其他可用添加劑包括防煙劑’諸如金屬硼酸鹽,例如硼 酸鋅、驗金屬或驗土金屬侧酸鹽,或其他顯鹽。另外, 可使用其他含硼化合物,諸㈣酸、«自旨、氧化硼或棚 的其他氧化物。另外,可利用其他阻燃添加劑,諸如芳基 磷酸醋及溴化芳族化合物,包括含有由溴化芳基化合物製 得之鍵的聚合物。鹵仆婪故>^ ^ Q化方無化合物之實例為溴化苯氧基樹 脂、鹵化聚苯乙烯、豳化醯亞胺、演化聚碳酸醋、溴化環 氧樹脂及其混合物。 =可利用習知阻燃添加劑,例如,鱗酸自旨、靖酸鹽及函 化芳族化σ物#可利用任何或全部該等阻燃劑之混合 物0鹵化芳族化合物之奢加&、白,^ 實例為溴化笨氧基樹脂、_化聚苯 乙稀、鹵化酉盘亞胺、後儿取山 臭化酸酯、溴化環氧樹脂及其混 合物“黃酸鹽之實例為全氣丁基續酸鉀、甲苯石黃酸鈉、苯 續酸鈉、二氯苯續酸鈉、二苯硬續酸鉀及甲烧續酸鈉。在 一貝例中豸至屬及驗土金屬之續酸鹽較佳^磷酸醋阻 燃劑之實例㈣酸三芳自旨、磷酸三甲苯酯、構酸三苯醋、 二填酸雙酚A苯輯、二磷酸間苯二酴苯醋、苯基_雙_ (’’5 —甲基己基磷酸酯)、磷酸乙基二苯基酯、磷酸雙 (2乙基己基)_對甲笨基酯、磷酸雙(2·乙基己基)_苯基酯、 118106.doc -66- 200831609 三(壬基苯基)磷酸酯、磷酸氫苯基甲基酯、磷酸二(十二烷 基)-對甲苯基酯、論化填酸三苯酯、礙酸二丁基苯基酉旨、 填酸2-氯乙基二苯基酯、雙(2,5,5’-三甲基己基)磷酸對曱 本基自曰、磷酸2-乙基己基二苯酯、磷酸氫二苯酯、間苯二 齡二磷酸酯及其類似物。 在一些實例中,可能需要基本上不含自素原子(尤其為 /臭及氯)之阻燃組合物。基本上不含自素原子意謂在一些 貝施例中組合物具有以組合物重量計少於約之_素且 在其他實施例中具有以含鹵素原子之組合物重量計少於約 1重1 %之鹵素。可藉由一般化學分析測定鹵素原子之 量。 組合物亦可視情況包括氟聚合物,其量為以組合物之重 量計〇·〇1至約5.0%。可以任何為樹脂組合物提供抗滴特性 之有效量使用氟聚合物。合適氟聚合物及用於製備該等氟 聚合物之方法的一些可能實例在(例如)美國專利第 3,671,487號、第3,723,373號及第3,3 83,092號中陳述。合 適敗聚合物包括包含衍生自一或多種氟化α烯烴單體之結 構單元的均聚物及共聚物。術語”氟化α浠烴單體”意謂包 括至少一個氟原子取代基之α烯烴單體。一些合適氟化以稀 煙單體包括(例如)氟乙烯(例如CF2=CF2、CHF=CF2、 CH2=CF2 及 CH2=CHF)及氟丙烯(例如 CF3CF=CF2、 CF3CF=CHF . CF3CH=CF2 ^ CF3CH=CH2 ' CF3CF-CHF χ CHF2CH=CHF及 CF3CF=CH2)。 一些合適氟化α烯烴共聚物包括包含衍生自兩個或兩個 118106.doc -67- 200831609 以上鼠化CX稀煙早體之έ士綠g — 、、。構早兀之共聚物(例如聚(四氟乙 烯_六氟乙稀))及包含衍生自一或多個氟化單體及一或多個 可與氣化單體共聚合之非氣化單烯系不飽和單體之結構單 元的共聚物(例如聚(四氟r、膝 亂乙烯-乙烯-丙烯)共聚物)。合適非 氟t單烯^鮮單體包括(例如㈣烴㈣(諸如乙稀、 丙烯了烯)@烯酸酯單體(諸如甲基丙烯酸甲酯、丙烯 '酸丁酯及其類似物H i )) 較佳為聚(四氟乙烯)均聚物 (PTFE)〇 推合物可進-步含有填料及增強劑,例如纖維玻璃、經 碾碎之玻璃、玻璃珠、薄片及其類似物。可添加諸如滑 1、矽灰石、雲母'高嶺土或微晶高嶺石黏土、矽石、石 英及重晶石之礦物。亦可用有效量之無機填料(諸如碳纖 維及奈来管、金屬纖維、金屬粉末、導電碳)及其他添加 劑(包括奈米尺度之增強劑)來改質組合物。 八他添加劑包括抗氧化劑,諸如亞鱗酸酯、亞膦酸二酯 • 及受阻酚。包括亞磷酸三芳酯及膦酸芳酯之含磷穩定劑以 可用添加劑聞名。亦可利用含雙官能磷之化合物。分子量 大於或等於約300之穩定劑為較佳的。在其他實例中,可 使用分子量大於或等於500之含磷穩定劑。以調配物重量 汁含磷穩定劑通常以〇·〇5-〇·5〇/0存在於組合物中。摻合物中 亦可存在者色劑以及光穩定劑及UV吸收劑。亦涵蓋助流 劑及脫模化合物。脫模劑之實例為烷基羧酸酯,例如,異 戊四醇四硬脂酸酯、甘油三硬脂酸酯及乙二醇二硬脂酸 酯。以調配物重量計脫模劑通常以〇〇5_〇·5%存在於組合物 118106.doc -68- 200831609 中。較佳脫模劑將具有通常大於約300之高分子量以防止 熔融加工期間脫模劑自熔融聚合物混合物流失。 本發明之物件中所用之聚合物摻合物亦可包括多種添加 劑,諸如成核劑、澄清劑、增剛劑(stiffness agent)及/或結 曰曰速率劑。以習知方式及以習知量使用該等試劑。 3· 製備本發明之摻合物之方法 可藉由包括將材料與調配物中所要之任何其他添加劑密() II II I -Ο-, -S_, a c-, a s-, a C-, 0 cf3 and a formula CyH2y (where y is an integer having a value from 1 to about 5) of an alkylene group or an alkylene group A covalent bond or member of the group of groups, and R2 is a divalent aryl group; the weight ratio of the unit of formula (1) to the unit of formula (II) is in the range of about 99.9:0.1 and about 25:75. Copolymers having such elements are disclosed in U.S. Patent No. 6,849,706, entitled "COPOLYETHERIMIDES", issued on February 1, 2005 in the name of Bruneiie et al. Further descriptions are described in detail. E. Blend Other Additives In addition to the polymer component of the blend, other beneficial compositions may be added to make improved article articles. Those skilled in the art will appreciate A wide range of ingredients added to the polymer to modify one or more manufacturing or performance characteristics. In some cases, a metal oxide can be added to the polymer of the present invention. In some instances, the 'metal oxide can be reduced by Increasing the time to reach the exothermic peak to further improve the flame resistance _ potency. Titanium dioxide is weight 118106.doc •65- 200831609. Other metal oxides include oxidation, oxidation, oxidation, iron oxide and transition metal oxides. A white metal oxide may be required. The metal oxide may be used alone or in combination with other metal oxides. The effective amount of metal oxide, in some instances, is from 0.0 to 20% by weight of the polymer blend. Other useful additives include smoke suppressants such as metal borate, such as zinc borate, metal or soil. a side acid salt, or other salt. In addition, other boron-containing compounds, (tetra) acid, other materials, boron oxide or other oxides of the shed may be used. In addition, other flame retardant additives such as aryl phosphate vinegar may be used. A brominated aromatic compound, including a polymer containing a bond prepared from a brominated aryl compound. An example of a compound having no compound is a brominated phenoxy resin, a halogenated polystyrene,豳 醯 imine, evolved polycarbonate, brominated epoxy resin and mixtures thereof. = Usable flame retardant additives can be used, for example, sulphuric acid, sulphate and functionalized aromatic sigma # available Any or all of these flame retardant mixtures 0 halogenated aromatic compounds of the luxury & white, ^ examples of brominated epoxy resin, _ polystyrene, bismuth halide imide, after the mountain Stinyl ester, brominated epoxy resin and mixtures thereof Examples of xanthates is resumed full gas butyl potassium, sodium toluene yellow stone, sodium benzene continued, continued dichlorobenzene sodium, potassium diphenyl hard continued and continued for methane sodium. In one case, the genus and the test salt of the soil tester are preferred. Examples of the phosphoric acid vinegar flame retardant (4) Acid Sanfang Zizhi, tricresyl phosphate, acid triphenyl vinegar, di-acid bisphenol A benzene Series, isophthalic acid diphenyl benzene vinegar, phenyl _ bis (''5-methylhexyl phosphate), ethyl diphenyl phosphate, bis(2-ethylhexyl) phosphino-p-propyl phosphate , bis(2·ethylhexyl)-phenyl phosphate, 118106.doc -66- 200831609 tris(nonylphenyl)phosphate, phenylmethyl phosphate, di(dodecyl)-phosphate Tolyl ester, triphenyl ester, tributylphenyl phthalate, 2-chloroethyl diphenyl acid, bis(2,5,5'-trimethylhexyl) phosphate Indole based on hydrazine, 2-ethylhexyl diphenyl phosphate, diphenyl hydrogen phosphate, isophthalic acid diphosphate and the like. In some instances, a flame retardant composition that is substantially free of self-priming atoms (especially / odorous and chlorine) may be required. Substantially free of self-atomic atoms means that in some of the examples, the composition has less than about 1 weight based on the weight of the composition and in other embodiments less than about 1 weight by weight of the halogen atom-containing composition. 1% halogen. The amount of halogen atoms can be determined by general chemical analysis. The composition may also optionally include a fluoropolymer in an amount of from 〇1 to about 5.0% by weight of the composition. The fluoropolymer can be used in any effective amount to provide the drip resistance of the resin composition. Some possible examples of suitable fluoropolymers and methods for preparing such fluoropolymers are set forth in, for example, U.S. Patent Nos. 3,671,487, 3,723,373 and 3,3,83,092. Suitable polymers include homopolymers and copolymers comprising structural units derived from one or more fluorinated alpha olefin monomers. The term "fluorinated alpha terpene hydrocarbon monomer" means an alpha olefin monomer comprising at least one fluorine atom substituent. Some suitable fluorinated dilute tobacco monomers include, for example, fluoroethylene (e.g., CF2 = CF2, CHF = CF2, CH2 = CF2, and CH2 = CHF) and fluoropropene (e.g., CF3CF = CF2, CF3CF = CHF. CF3CH = CF2 ^) CF3CH=CH2 'CF3CF-CHF χ CHF2CH=CHF and CF3CF=CH2). Some suitable fluorinated alpha olefin copolymers include a gentleman green g-, which is derived from two or two 118106.doc-67-200831609 or more murine CX flue-cured tobacco. a copolymer of early ruthenium (eg, poly(tetrafluoroethylene hexafluoroethylene)) and comprising a non-gasified single derived from one or more fluorinated monomers and one or more copolymerizable with a gasifying monomer a copolymer of structural units of an ethylenically unsaturated monomer (e.g., a poly(tetrafluoror, knee ethylene-ethylene-propylene) copolymer). Suitable non-fluorot monoethylenic monomers include (for example, (tetra)hydrocarbon (tetra) (such as ethylene, propylene olefin) @ enoate monomers (such as methyl methacrylate, propylene butyl acrylate and the like) Preferably, the poly(tetrafluoroethylene) homopolymer (PTFE) ruthenium compound may further comprise fillers and reinforcing agents such as fiberglass, milled glass, glass beads, flakes and the like. Minerals such as slip 1, limestone, mica 'kaolin or microcrystalline kaolinite clay, vermiculite, quartz and barite may be added. The composition can also be modified with an effective amount of an inorganic filler such as carbon fibers and tubes, metal fibers, metal powders, conductive carbon, and other additives, including nanoscale reinforcing agents. Eight additives include antioxidants such as linoleates, phosphite diesters and hindered phenols. Phosphorus-containing stabilizers including triaryl phosphites and aryl phosphonates are known as useful additives. Compounds containing difunctional phosphorus can also be utilized. Stabilizers having a molecular weight greater than or equal to about 300 are preferred. In other examples, a phosphorus-containing stabilizer having a molecular weight greater than or equal to 500 can be used. The juice phosphorus-containing stabilizer is usually present in the composition as 〇·〇5-〇·5〇/0 by weight of the formulation. A colorant as well as a light stabilizer and a UV absorber may also be present in the blend. Glidants and mold release compounds are also included. Examples of the release agent are alkyl carboxylates such as, for example, pentaerythritol tetrastearate, glyceryl tristearate, and ethylene glycol distearate. The release agent is usually present in the composition 118106.doc-68-200831609 in an amount of 〇5_〇·5% based on the weight of the formulation. Preferably, the release agent will have a high molecular weight, typically greater than about 300, to prevent release of the release agent from the molten polymer mixture during melt processing. The polymer blends used in the articles of the present invention may also include various additives such as nucleating agents, fining agents, stiffness agents, and/or knot rate agents. These agents are used in a conventional manner and in known amounts. 3. A method of preparing a blend of the present invention by including the material and any other additives desired in the formulation
接混合之多種方法使本發明之物件中所用之聚合物摻合物 與前述成份摻合。儘管溶液摻合亦為可能的,但較佳程序 包括熔融摻合。因為可利用商業聚合物加工設施中之熔融 摻合設備,所以熔融加工方法一般較佳。該等熔融加工方 法中所制之設備的說明性實例包括:共轉及反轉擠廢 機、單螺桿擠壓機、共捏合機、磁碟組件處理器及其他多 種類型之擠壓設備。較佳將該方法中之熔融溫度最小化以 避免樹脂過度降解。儘管只要將樹脂在加卫設備中之滞留 時間保持在很短亦可使_高溫度,但仍經常需要將溶融 樹脂組合物中之熔融溫谇祕 度維持在約250。(:與約370°C之間。 在一些實施例中,熔融加 加工組合物經模中之小出口孔自諸 如擠壓機之加工設備排屮 + 出 且稭由使所得熔融樹脂絲束穿 過水浴來將絲束冷卻。可验a 把經冷卻絲束切段及/或模製成 供包裝、進一步處理或最緣 取〜用逆產品之任何便利形狀(亦 即,顆粒物)。 可藉由多種熔融摻合技術製備本文所述之摻合物。較佳 使用具有良好混合螺桿之直办 〃二通風單或雙螺桿擠壓機。一 118106.doc •69· 200831609 般而言,運行該擠壓機之熔融加工溫度應比熱塑性物質之 Tg兩約l〇〇°c至約15(TC。可使用個別給料器或作為混合物 將王部成份混合物在擠壓機喉部一起饋入。在一些狀況 下,例如在兩種或兩種以上樹脂之摻合物中,首先在第一 次擠壓中擠壓部分成份,接著在第二次擠壓中添加剩餘混 合物可為有利的。首先將著色劑複合成濃縮物隨後將濃縮 物與剩餘樹脂組合物混合可為有益的。在其他狀況下,在 _ 擠壓機喉部之下游另外添加部分混合物可為有益的。擠壓 後,可使該聚合物熔體成絲束狀且將其冷卻,隨後將其切 段或造粒成適於下一製造步驟之尺寸的顆粒物。較佳顆粒 物長約1/16至1/8吋,但熟練技術人員應瞭解任何顆粒物尺 寸均可打。隨後將顆粒化熱塑性樹脂乾燥以移除水且將其 模製成本發明物件。於約135〇c至約15(rc下乾燥歷時約4 至約8小時為較佳的,但乾燥時間將隨樹脂類型而改變。 使用適於製造具有光滑表面之物件之溫度、壓力及夾持之 # 射出成型較佳。用於模製之熔融溫度將比樹脂之Tg高約 l〇〇C至約200°C。油加熱模對於較高Tg樹脂為較佳的,模 製溫度可在約5(TC至約175。(:之範圍内變動,而約12(rc至 約175°C之溫度較佳。熟練技術人員應瞭解許多可用於製 備本發听組合物及物件之該等複合及模製條件之變體。 F·經塗佈聚合物製品物件之最終用途 本發明物件中所使用之聚合物、共聚物及摻合物之高撓 曲模數及高抗張伸長率使其可用於諸如薄片之應用,其中 該等聚合物、共聚物及摻合物顯示抗衝擊損壞性且亦顯示 118106.doc 200831609A plurality of methods of mixing are used to blend the polymer blend used in the article of the present invention with the foregoing ingredients. Although solution blending is also possible, preferred procedures include melt blending. Melt processing methods are generally preferred because of the ability to utilize melt blending equipment in commercial polymer processing facilities. Illustrative examples of equipment made in such melt processing methods include co-rotating and reversing extruders, single-screw extruders, co-kneaders, disk assembly processors, and many other types of extrusion equipment. It is preferred to minimize the melting temperature in the process to avoid excessive degradation of the resin. Although it is possible to maintain the residence time of the resin in the curing apparatus at a very short temperature, it is often necessary to maintain the melt temperature stability in the molten resin composition at about 250. (: between about 370 ° C. In some embodiments, the molten processing composition is discharged from a processing apparatus such as an extruder through a small exit hole in the mold and the straw is passed through the obtained molten resin filament The water bath is used to cool the tow. It can be checked that the cooled tow is cut and/or molded for packaging, further processing or most convenient use of any convenient shape (ie, particulate matter) of the reverse product. The blends described herein are prepared by a variety of melt blending techniques. It is preferred to use a straight ventilated single or twin screw extruder with a good mixing screw. 118106.doc • 69· 200831609 The melt processing temperature of the extruder should be from about 10 ° C to about 15 (TC) of the Tg of the thermoplastic. The mixture of the king components can be fed together at the throat of the extruder using individual feeders or as a mixture. In some cases, such as in a blend of two or more resins, it may be advantageous to first squeeze a portion of the component in a first extrusion, followed by adding the remaining mixture in a second extrusion. The colorant is compounded into a concentrate and then It may be beneficial to mix the shrinkage with the remaining resin composition. In other cases, it may be beneficial to additionally add a portion of the mixture downstream of the throat of the extruder. After extrusion, the polymer may be melted into a tow. And cooling it, then dicing or granulating it into granules of a size suitable for the next manufacturing step. Preferably, the granules are about 1/16 to 1/8 Å long, but the skilled artisan should be aware of any particle size. The granulated thermoplastic resin is then dried to remove water and molded into the article of the invention. It is preferably from about 135 ° C to about 15 (dry for about 4 to about 8 hours, preferably drying time). It will vary with the type of resin. It is preferred to use an injection molding suitable for the temperature, pressure and clamping of articles having a smooth surface. The melting temperature for molding will be about 1 〇〇C to about the Tg of the resin. 200 ° C. The oil heating mold is preferred for higher Tg resins, and the molding temperature can vary from about 5 (TC to about 175.), and about 12 (rc to about 175 ° C temperature) The skilled artisan should be aware that many can be used to prepare the present listening composition. Variations of such composite and molding conditions of the article F. End use of the coated polymer article The high flexural modulus and high resistance of the polymers, copolymers and blends used in the articles of the invention The elongation of the sheet makes it useful for applications such as sheets, where the polymers, copolymers and blends exhibit impact damage resistance and also exhibit 118106.doc 200831609
充分剛性以使其在負載下不發生撓曲或彎曲。韌性(顯示 為回斷裂伸長率)、剛性(顯示為高撓曲模數)及耐燃性(顯 不為低放熱值)之組合使由該等組合物形成之薄片或其他 物件極其有用。例如,該等薄片可用於建構運輸車輛,例 —八車骯機或火車内部。其亦可用於建造及建構。可 藉由(例如)擠壓、壓縮模製或壓光來製備薄片,且可藉由 :他方法使薄片熱成形或定形。薄膜及薄片亦可為更複雜 g建構之組件。在_些實例中’冑由例如以方法 D638里測而具有大於或等於約5〇%之斷裂抗張伸長率顯示 ^好衝擊性。在其他實例中,藉由例如以仏頂方法⑽〇 量測而具有大於或等於約則Kpsi(2㈣Mpa)之撓曲模數 顯不焉剛性。 1由層μ熱衝壓、模製(模裝飾中)、溶體擠壓、兩 種樹脂共擠壓或其他類似結合或接合技術使包含摻合物之 =聚碳酸s旨層結合時’該等摻合物及共聚物展示對聚礙 鮫S曰層之良好無底漆黏著力。較佳方法包括(例如)射出成 型、吹塑、壓縮模製、型面擠壓、薄片或薄膜擠壓、氣體 辅助模t、結構泡泳塑料模製及熱成形。 使用諸如薄膜及薄片擠壓之利熱塑方法可將本文所述 之組合物轉化成物件,薄膜及薄片擠壓法可包括(但不限 1)溶鑄、吹膜擠壓及壓光。可制共擠壓及層壓法 形成複合多層薄膜或薄片。 例如可將本文所述之組合物轉化成下述多層薄片,該 曰蓴片L 3 —具有一第一側面及一第二側面之第一薄 118106.doc •71- 200831609 片其中3亥第—薄片包含熱塑性聚合物,且其中㈣ 片:第-側面係安置於複數個肋狀物之第一側;及一具有 一弟一側面及—第二侧面之第二薄片,其中該第二薄片包 含-熱塑性聚合物,其中該第二薄片之第一側面係安置於 禝數個肋狀物之第二側,且其中複數個肋狀物之第一側係 與複數個肋狀物之第二側相對。 、亦可將本發明之聚合物掺合物定形成或製成彈性薄膜、Fully rigid so that it does not flex or bend under load. The combination of toughness (shown as back elongation at break), stiffness (shown as high flexural modulus), and flame resistance (not shown to be a low exotherm) makes the sheet or other article formed from the compositions extremely useful. For example, the sheets can be used to construct a transport vehicle, such as an eight-car smasher or a train interior. It can also be used for construction and construction. The sheet can be prepared by, for example, extrusion, compression molding, or calendering, and the sheet can be thermoformed or shaped by another method. Films and sheets can also be components of more complex construction. In some examples, 断裂 has a good impact resistance by, for example, having a tensile elongation at break of greater than or equal to about 5% by weight as measured by Method D638. In other examples, the flexural modulus having greater than or equal to about Kpsi (2 (four) Mpa) is, for example, measured by the dome method (10) 显. 1 by layer μ hot stamping, molding (in mold decoration), solution extrusion, two resin co-extrusion or other similar bonding or bonding techniques to make the inclusion of the blend = polycarbonate layer The blends and copolymers exhibit good primer-free adhesion to the barrier layer. Preferred methods include, for example, injection molding, blow molding, compression molding, profile extrusion, sheet or film extrusion, gas assisted mold t, structural bubble molding, and thermoforming. The compositions described herein can be converted into articles using a thermoplastic process such as film and sheet extrusion. Film and sheet extrusion processes can include, but are not limited to, solution casting, blown film extrusion, and calendering. A co-extrusion and lamination process can be used to form a composite multilayer film or sheet. For example, the composition described herein can be converted into a multilayer sheet having a first side and a first side of a second side 118106.doc • 71- 200831609 of which 3 Haidi - The sheet comprises a thermoplastic polymer, and wherein (4) the sheet: the first side is disposed on a first side of the plurality of ribs; and the second sheet has a side and a second side, wherein the second sheet comprises a thermoplastic polymer, wherein a first side of the second sheet is disposed on a second side of the plurality of ribs, and wherein the first side of the plurality of ribs and the second side of the plurality of ribs relatively. The polymer blend of the present invention may also be formed into an elastic film,
塗層、薄片、條帶、卷帶、長條及其類似物。可藉由此項 技術中已知之任何方法製造本發明之彈性薄膜、塗層及薄 片,該等方法包括吹泡法(例如,簡單發泡以及雙軸定向 技術,如截留發泡、雙重發泡及拉幅)、澆鑄擠壓、射出 成型法、熱成形法、擠壓塗佈法、型面擠壓及薄片擠壓 法0 壓縮模製為熟練技術人員所熟知,其中將聚合物摻合物 置於模腔中或使其與波狀金屬表面接觸。接著藉由(例如) 液壓機將熱及/或壓力施加於聚合物摻合物歷時給定時 間、壓力及溫度,該等條件可視摻合物特性而變化。來自 造模工具之壓力迫使聚合物摻合物填充整體模腔。_曰模 製物件冷卻,則可在推出機構幫助下將其自模移除。一曰 完成該製程,則聚合物摻合物將獲得模腔或波形金屬表面 之形狀。Visamara之美國專利第4,698,001號揭示進行壓縮 模製之方法。 射出成型法係製造非增強型熱塑性部件之最普遍方、法, 且此法更通常用於短纖維增強型熱塑性複合物。射出成型 I18106.doc -72- 200831609 法可用於製造本發明之物件。射出成型法為一種將其量為 數倍於產生物件所必須之量的聚合物捧合物在加熱室中加 熱成黏性液體且接著在壓力下注入模腔之方法。聚合物換 合物在高壓下保留於模腔中直至冷卻且隨後將其移除。術 語"射出成型"亦包括射出成型之相對新的進展,其中使兩 部分半液體樹脂摻合物流過噴嘴且流入模腔,在模腔中其 因化于反應而發生聚合。射出成型及射出成型設備進一步 詳細論述於Hujick之美國專利第3,915,6〇8號、Ludwig之美 國專利第3,302,243號及Lameris之美國專利第3,224,〇43 號。射出成型法為熱塑法中最快速之方法,且因此一般用 於大體積應用,諸如汽車及消費型產品。週期在2〇秒與6〇 秒之範圍内。射出成型亦產生可高度重複之近淨定形部 分。能繞插入物、孔及核心材料模製為另一優勢。最後, 射出成型一般提供任何方法中最佳之表面光潔度。熟練技 術人員應瞭解射出成型法是否為製造本發明之給定物件的 最佳特定加工方法。 吹塑為一種製造中空熱塑性產品之技術。吹塑包括將本 發明之熱塑性聚合物之擠壓管置於一模中且向管内施加足 夠空氣壓力以使得管外部與模腔内表面一致。美國專利第 5,55 1,860號進一步詳細描述一種進行吹塑以製造製品物件 之方法。吹塑不限於製造中空物體。例如,可藉由吹製一 單元且隨後將該單元切成兩半以製造兩個外殼而製得,,外 殼11。簡單吹泡薄膜法亦描述於(例如)77^ 〇/ ⑽Kirk-Othmer,第 3版,John Wiley & 118106.doc -73- 200831609Coatings, sheets, strips, tapes, strips and the like. The elastic films, coatings and sheets of the present invention can be made by any method known in the art, including bubble blowing methods (e.g., simple foaming and biaxial orientation techniques such as cut-off foaming, double foaming) And tentering, casting extrusion, injection molding, thermoforming, extrusion coating, profile extrusion and sheet extrusion 0. Compression molding is well known to the skilled person, wherein the polymer blend is placed In the mold cavity or in contact with the corrugated metal surface. Heat and/or pressure is then applied to the polymer blend by, for example, a hydraulic press for a time period, pressure, and temperature, which conditions may vary depending on the characteristics of the blend. The pressure from the molding tool forces the polymer blend to fill the entire mold cavity. _曰 The molded object is cooled and can be removed from the mold with the help of the push-out mechanism. Once the process is complete, the polymer blend will take the shape of a mold cavity or a corrugated metal surface. A method of compression molding is disclosed in U.S. Patent No. 4,698,001 to the entire disclosure of U.S. Pat. Injection molding is the most common method of making non-reinforced thermoplastic parts, and this method is more commonly used for short fiber reinforced thermoplastic composites. Injection molding I18106.doc -72- 200831609 The method can be used to manufacture articles of the present invention. The injection molding method is a method in which a polymer composition which is multiplied by the amount necessary for producing an object is heated in a heating chamber into a viscous liquid and then injected into a cavity under pressure. The polymer blend remains in the mold cavity under high pressure until it is cooled and then removed. The term "injection molding" also includes a relatively new development in injection molding in which a two-part semi-liquid resin blend flows through a nozzle and into a mold cavity where it polymerizes due to reaction. The injection molding and injection molding apparatus is further described in detail in U.S. Patent No. 3,915,6,8 to Hujick, U.S. Patent No. 3,302,243 to Ludwig, and U.S. Patent No. 3,224, to La. Injection molding is the fastest method in the thermoplastic process and is therefore generally used in high volume applications such as automotive and consumer products. The period is in the range of 2 sec and 6 sec. Injection molding also produces a highly repeatable near-net shaped portion. Molding around inserts, holes, and core materials is another advantage. Finally, injection molding generally provides the best surface finish in any method. The skilled artisan will understand whether the injection molding process is the best specific processing method for making a given article of the present invention. Blow molding is a technology for making hollow thermoplastic products. Blow molding involves placing a squeeze tube of the thermoplastic polymer of the present invention in a mold and applying sufficient air pressure to the tube to conform the exterior of the tube to the inner surface of the mold cavity. A method of performing blow molding to produce articles of an article is described in further detail in U.S. Patent No. 5,55,860. Blow molding is not limited to the manufacture of hollow objects. For example, the outer casing 11 can be produced by blowing a unit and then cutting the unit into two halves to manufacture two outer casings. The simple bubble film method is also described, for example, in 77^ 〇/(10) Kirk-Othmer, 3rd edition, John Wiley & 118106.doc -73- 200831609
Sons’ New York,1981,第 16卷,第 416 417頁及第 i8卷, 第 191-192頁。 可經由吹膜擠壓或藉由使用習头。拉伸技術於鄰近熱變形 之溫度拉伸鑄造或壓光薄膜來製備定向薄膜。例如,可使 用徑向拉伸縮放儀進行多軸向同時拉伸;可使用x_y方向 拉伸縮放儀同時或相繼在平面x_y方向上拉伸。亦可使用 具有相繼單軸拉伸部分之設備達成單軸及雙軸拉伸,諸如 ㈣有用於縱向拉伸之不同速度滾筒之部分及用於橫向拉 伸之拉幅機部分之機器。 熱塑模製系統包括熱塑擠壓模,該熱塑擠壓模係用於擠 壓可調節模閘構件(亦即,動態模配置)所設定之熱塑板以 改變擠壓板不同部分中擠壓材料之厚度。熱塑擠壓模具有 用於將擠壓熱塑板自Μ塑擠壓模切除之修|片。將複數個 可為真空或壓縮模之熱塑模各自安放於諸如旋轉平臺之活 動平臺上以將一模同時移入某位置以接收來自熱塑擠壓模 • 的經修整熱塑板。由自擠壓模饋入之仍受熱之熱塑材料受 熱板形成具有可變厚度之模製部件。將複數個模安放至平 臺以將一模饋入加載位置以接收來自擠壓模之熱塑板及將 第二模饋入釋放位置以將形成部分自該模移除。平臺可為 往復或旋轉平臺且允許冷卻各模製部件,同時另一模製部 件接收熱塑板。提供具有下述步驟之熱塑模製法:根據調 節熱塑擠壓模以改變穿過其進入擠壓板不同部分中之擠壓 材料之厚度的設備選擇熱塑擠壓模配置。將熱塑材料加熱 至流態且將其擠壓穿過所選擇之熱塑模,該熱塑模已經調 118106.doc -74- 200831609 節以改變擠壓板不同部分中擠壓材料之厚度、將具有可變 厚度之擠壓熱塑板修整成預定大小且將受熱熱塑材料之各 修整板導向至熱成形模上且在模中模製預定部件使得由材 料擠壓期間受熱之材料板形成具有可變厚度之模製部件。 射出成i法熱成形法、擠壓塗佈法、型面擠壓法及薄片 擠壓法描述於(例如)Plastics Materials and Pr〇cesses,Sons’ New York, 1981, vol. 16, pp. 416, 417 and vol. i, pp. 191-192. It can be extruded through a blown film or by using a head. Stretching techniques are used to produce oriented films by drawing or calendering a film adjacent to the temperature of hot deformation. For example, a radial stretch scaler can be used for simultaneous multi-axial stretching; the x_y direction can be used to stretch the scaler simultaneously or sequentially in the plane x_y direction. Uniaxial and biaxial stretching can also be achieved using equipment having successive uniaxially stretched portions, such as (d) machines having portions of different speed rollers for longitudinal stretching and tenter portions for lateral stretching. The thermoplastic molding system includes a thermoplastic extrusion die for extruding a thermoplastic plate set by an adjustable die member (ie, a dynamic mold configuration) to change different portions of the extrusion plate The thickness of the extruded material. The thermoplastic extrusion die has a repairing piece for cutting the extruded thermoplastic plate from the extrusion die. A plurality of thermoplastic molds, which may be vacuum or compression molds, are each placed on a movable platform such as a rotary table to simultaneously move a mold into a position to receive the finished thermoplastic sheet from the thermoplastic extrusion mold. The still heated thermoplastic material fed from the extrusion die forms a molded part having a variable thickness. A plurality of molds are placed on the platform to feed a mold into the loading position to receive the thermoplastic sheet from the extrusion die and to feed the second mold into the release position to remove the forming portion from the mold. The platform can be a reciprocating or rotating platform and allows for cooling of the molded parts while the other molded part receives the thermoplastic sheet. A thermoplastic molding process is provided that selects a thermoplastic extrusion die configuration in accordance with a device that adjusts the thermoplastic extrusion die to vary the thickness of the extruded material that passes through it into different portions of the extrusion plate. Heating the thermoplastic material to a fluid state and extruding it through the selected thermoplastic mold, which has been adjusted 118106.doc-74-200831609 to change the thickness of the extruded material in different portions of the extruded sheet, An extruded thermoplastic sheet having a variable thickness is trimmed to a predetermined size and each of the conditioning sheets of the heated thermoplastic material is directed onto the hot forming die and the predetermined component is molded in the mold such that the heated material sheet is formed during extrusion by the material A molded part having a variable thickness. The injection-forming method, the extrusion coating method, the profile extrusion method, and the sheet extrusion method are described, for example, in Plastics Materials and Pr〇cesses.
Seymour S. Schwartz and Sidney H. Goodman, VanSeymour S. Schwartz and Sidney H. Goodman, Van
Nostrand Reinhold Company,New York, 1982,第 527-563 頁、第632-647頁及第596-602頁。 —可使用真空模製法來製造本發明之定形製品物件。根據 該方法,藉由鐵架或其他裝配有夾具更易於操作之裝置固 定式1之聚合材料薄片,接著將該薄片引入一裝置,在該 裝置中’ H由佈置在上部及下部位置之陶£加熱器或金屬 絲加熱器對其進行加熱。薄片在加熱時開始熔融。一旦薄 片I生下垂後仍繼續加熱,薄片在框架内經拉伸。觀測該 拉伸,可將薄片模製成均一厚度且無折皺或其他缺陷。此 日守,自加熱没備取出薄片框架,將其鄰近於模定位,且在 1個大氣壓之減壓下對其進行真空模製,於是可獲得所要 模製定形物件。其後,可將物件用空氣或霧化水冷卻及自 模取出。 根據壓力模製,將已加熱或以其他方式變得易於操作之 薄片置於模上,向該薄片施加壓力使得薄片經施加壓力而 獲得模之形狀。 使用衝壓模製法亦可製造包含式J之樹脂之製品物件。 118106.doc -75· 200831609 例如,將擠壓模中之式j聚合物之定形塊裝配至垂直壓力 機,隨後在5至500 kg/cm2(較佳1〇至2〇 kg/em2)之壓力下進 仃熱模製,從而得到所要定形物件。接著將模以空氣或霧 化水冷卻且將物件自模取出。在該模製中,承壓時間通常 為至;15秒,且一般為15至4〇秒。為了改良表面特徵,較 佳在兩階段壓力條件下進行該模製。在第—階段,使聚合 物材料在10至20 kg/cm2之壓力下維持15或4〇秒。接著在第Nostrand Reinhold Company, New York, 1982, pp. 527-563, 632-647 and 596-602. - The shaped article of the invention can be made using a vacuum molding process. According to this method, the sheet of polymeric material of Formula 1 is held by an iron frame or other device that is more easily handled by a jig, and then the sheet is introduced into a device in which the 'H is placed in the upper and lower positions. Heat it with a heater or wire heater. The flakes begin to melt upon heating. Once the sheet I continues to heat after sagging, the sheet is stretched within the frame. By observing the stretching, the sheet can be molded to a uniform thickness without wrinkles or other defects. In this case, the sheet frame is taken out from the heating, positioned adjacent to the mold, and vacuum-molded at a reduced pressure of 1 atm, so that the desired mold-shaped object can be obtained. Thereafter, the object can be cooled with air or atomized water and taken out of the mold. According to the pressure molding, a sheet which has been heated or otherwise made easy to handle is placed on the mold, and pressure is applied to the sheet so that the sheet is subjected to pressure to obtain a shape of the mold. Articles of the article comprising the resin of formula J can also be produced using a stamping process. 118106.doc -75· 200831609 For example, assembling a shaped block of the polymer of formula j in an extrusion die to a vertical press, followed by a pressure of 5 to 500 kg/cm 2 (preferably 1 to 2 kg/em 2 ) The lower part is hot molded to obtain the desired shaped object. The mold is then cooled with air or misted water and the article is removed from the mold. In this molding, the pressure time is usually up to 15 seconds, and is generally 15 to 4 seconds. In order to improve the surface characteristics, the molding is preferably carried out under two-stage pressure conditions. In the first stage, the polymer material is maintained at a pressure of 10 to 20 kg/cm2 for 15 or 4 seconds. Then at the first
二階段使聚合物材料在4〇至5〇 kg/cm2之壓力下維持至少5 心因此可產生具有優良表面光潔度之模製物件。當使用 具有不良流動性之式1之含無機填料之熱塑性樹脂時該方 法可為較佳的。 吾人熟知之射出成型法亦可用則吏用式工之樹脂製造製 品物件。射出成型為在壓力下將樹脂注入模腔中。射出壓 力通常為40至140 kgW,且較佳為7〇至i2〇 kg/cm2。 熟練技術人員應瞭解藉由此項技術中已知之任何方法可 將由.本文揭示之聚合物摻合物製得之製品物件製成任何所 要形狀。該等形狀可為簡單幾何形狀(諸如立方形、球 形、桿狀、薄片狀、錐形)以及製造詩複雜最終用途應 用模製部件所需的更複雜形狀。本文所述之聚合物摻合 物1形成之形狀僅受與使用高溫聚合物之不同最終用途應 用相關之可能模料_。該等最終料包括汽車、航: 航天、軍事、飲食服務、電子、照明及醫療等。該等物: 之實例包括(但不限於)炊具、飲食服務物品、醫療裝置、 托盤、盤子、手柄、頭蓋、獸籠、電連接器、電設備外 118106.doc •76- 200831609 殼、引擎零件、汽車引擎零件、照明插槽及反射器、電動 馬達部件、配電設備、通訊設備、電腦及其類似物,包括 在搭扣配合連接器中模製之裝置。亦可將本文所述之以間 苯二紛聚芳s旨為主之摻合物製成層壓系統之薄膜及薄片以 及組件。 依據本發明’用與構成未經塗佈物件之底層聚合物摻合 物不同的組合物塗佈製品物件之一或多個表面。根據本發 月之塗層應包括热練技術人員已知之所有塗層,包括所有 類型之油漆、薄片、薄膜等。 或者,可藉由將組合物於合適溶劑中之溶液或懸浮液澆 鑄於基板、帶或觀上接著移除溶劑來製備薄膜及薄片。亦 可使用諸如電漿沈積、濺鍍、真空沈積及箔層壓之標準方 法將薄膜或薄片金屬化。可進一步將單層或多層塗層施加 於本發明之物件以賦予其其他特性,諸如導電性、耐擦傷 性、耐紫外線性、美學效應等。 對本發明而s ’術語油漆意欲包括厚度介於約1與500 之間(更特疋言之為約丨〇 nm至約250 nm)的油漆、真漆 及聚"物塗層。熟練技術人員應瞭解依據本發明可利用任 可厚度之塗層,且諸如1〇_7〇 ,或甚至⑺,_之特定 田範圍僅代表可用於本發明所涵蓋之一些最終用途中之 塗層厚度’其中塗層包含油漆、金屬及聚合物。 ^月亦針對包含式1之樹脂之薄片及薄膜,其在物件 , 個表面中的全部或一些表面上具有遮蓋層。 可矛ίΐ用多錄ne、j> 方法來製造一表面上具有油漆塗層之經製造 118106.doc -77- 200831609 聚合物物件,該物件由 合物製成。根據該等方法之:實醚醯亞胺摻合物之組 劑塗佈於定形物件表面之將底漆或銷定塗佈 形成塗層。覆蓋定d”上且接著將其乾燥以 精確方法對本發明而言不重全部或部分之 術來施加塗層,諸如使=二可藉由標準施加技 預先塗佈或不預先塗佈The second stage maintains the polymeric material at a pressure of 4 Torr to 5 Torr/cm 2 for at least 5 cores so that a molded article having an excellent surface finish can be produced. This method may be preferred when a thermoplastic resin containing an inorganic filler of the formula 1 having poor fluidity is used. The injection molding method that is well known to us can also use the resin of the formula to manufacture articles. Injection molding is to inject resin into the mold cavity under pressure. The injection pressure is usually 40 to 140 kgW, and preferably 7 to i2 〇 kg/cm2. The skilled artisan will appreciate that articles of manufacture made from the polymer blends disclosed herein can be formed into any desired shape by any of the methods known in the art. These shapes can be simple geometric shapes (such as cuboids, spheres, rods, flakes, cones) and the more complex shapes required to make molded parts for poetic end-use applications. The shape of the polymer blend 1 described herein is only affected by the possible moldings associated with different end use applications using high temperature polymers. These finals include automobiles, aviation: aerospace, military, food service, electronics, lighting and medical. Examples of such things include, but are not limited to, cookware, food service items, medical devices, trays, plates, handles, head covers, animal cages, electrical connectors, electrical equipment, etc. 118106.doc •76- 200831609 Shells, engine parts Automotive engine parts, lighting slots and reflectors, electric motor components, power distribution equipment, communication equipment, computers and the like, including devices molded in snap-fit connectors. Blends and sheets and/components of the lamination system can also be made from the blends described herein, which are mainly composed of meta-phenylene. One or more surfaces of the article of article are coated in accordance with the present invention by a composition different from the underlying polymer blend that constitutes the uncoated article. Coatings according to this month shall include all coatings known to the skilled technician, including all types of paints, sheets, films, and the like. Alternatively, the film and sheet can be prepared by casting a solution or suspension of the composition in a suitable solvent onto a substrate, tape or on top of the substrate followed by removal of the solvent. The film or sheet can also be metallized using standard methods such as plasma deposition, sputtering, vacuum deposition, and foil lamination. A single or multiple layer coating may be further applied to the article of the present invention to impart other characteristics such as electrical conductivity, scratch resistance, UV resistance, aesthetic effects, and the like. For the purposes of the present invention, the term paint is intended to include paints, lacquers, and poly-coatings having a thickness of between about 1 and 500 (more specifically, about 丨〇 nm to about 250 nm). The skilled artisan will appreciate that coatings of any thickness may be utilized in accordance with the present invention, and that specific fields such as 1 〇 7 〇, or even (7) _ represent only coatings that may be used in some of the end uses covered by the present invention. Thickness 'where the coating contains paint, metal and polymer. ^ Month is also directed to a sheet and film comprising the resin of Formula 1, which has a covering layer on all or some of the surfaces of the object. A multi-recorded ne, j> method is used to fabricate a polymer article having a paint finish on a surface, which is made of a compound. According to the methods, the composition of the solid ether quinone imide blend is applied to the surface of the shaped article to be coated or pinned to form a coating. Coating is applied over the d" and then dried in a precise manner for the present invention without weighting all or part of the process, such as to enable the second to be pre-coated or not pre-coated by standard application techniques.
貝玉,/冗堂,刷塗或流塗。 對於商業製造或大規模製造經塗佈定形物件而言,使用喷 搶之方法係有效的、詳言之’較佳使用藉由使用機器人之 塗佈方法。 根據本發明之最終用上余雍4^ . _ ^Beiyu, / redundant, brush or flow coating. For commercial manufacturing or large-scale production of coated shaped articles, the use of the blasting method is effective, in particular, by the use of a robotic coating method. According to the invention, the final use of embers 4^ . _ ^
取、用延應用之一者為L.ED•基座。LED 晶片可為許多形狀之一,包括(但不限於)倒梯形、立方 形、長方形或半球形。LED晶片可包括可與反光材料接觸 或經反光材料塗佈之底面。儘管LED晶片可自其所有侧面 發光,但LED晶片基座可經組態以將所發出之光向單一方 向反射。該等基座係習知的且可包括拋物線形反射器,其 中該LED晶片位於封裝基座表面。該封裝之實例在美國專 利第4,920,404號(該案之全文以引用之方式併入本文中)中 顯示。根據本發明使用本文所提及之任何聚合物、共聚物 或摻合物可製得經塗佈LED基座,更特定言之可製得經反 光材料塗佈之LED基座。 本發明之定形物件亦可採用經一或多層其他薄片材料塗 佈之薄片形式。多孔纖維增強型熱塑性複合薄片已描述於 美國專利第4,978,489號及第4,670,331號中,且因為纖維增 118106.doc -78 - 200831609 強型熱塑性薄片易於模製成物件,所以其用於產品製造業 中之許多及各種應用中。 本發明之經塗佈製品物件亦可採用作為核心或包層之光 纜形式。熟練技術人員應熟悉纖維光纜、製造纖維光纜之 方法及纖維光纜特性。本文所述之聚合物、共聚物及摻合 物之光學特性亦可理想地用於除光纜以外之光學應用中, 包括(例如)經塗佈或未經塗佈之透鏡及經塗佈或未經塗佈 之而ί火材料。One of the applications for taking and using is the L.ED• pedestal. The LED wafer can be one of many shapes including, but not limited to, inverted trapezoidal, cubic, rectangular or hemispherical. The LED wafer can include a bottom surface that can be contacted with a reflective material or coated with a reflective material. Although the LED wafer can be illuminated from all sides thereof, the LED wafer pedestal can be configured to reflect the emitted light in a single direction. The pedestals are conventional and may include a parabolic reflector, wherein the LED wafer is on the surface of the package pedestal. An example of such a package is shown in U.S. Patent No. 4,920,404, the disclosure of which is incorporated herein by reference. A coated LED pedestal, and more particularly an LED substrate coated with a reflective material, can be made in accordance with the present invention using any of the polymers, copolymers or blends referred to herein. The shaped article of the present invention may also be in the form of a sheet coated with one or more layers of other sheet material. Porous fiber reinforced thermoplastic composite sheets have been described in U.S. Patent Nos. 4,978,489 and 4,670,331, and because of the increase in fiber 118106.doc -78 - 200831609, the strong thermoplastic sheets are easily molded into articles, so they are used in product manufacturing. Many and various applications. The coated article of the present invention may also be in the form of a cable that is core or clad. Skilled artisans should be familiar with fiber optic cables, methods of making fiber optic cables, and fiber optic cable characteristics. The optical properties of the polymers, copolymers, and blends described herein are also desirably used in optical applications other than fiber optic cables, including, for example, coated or uncoated lenses and coated or uncoated The coated material is fired.
未進V詳細闡述,咸信熟習此項技術者可使用本文之 描述來利用本發明。本發明包括以下實例以為熟習此項技 術者實施本發明提供其他指導。所提供之實例僅為本發明 之代表且用於教不本發明。相應地,該等實例不欲以任何 方式限制本發明。 本文所揭示之所有專利、專利申請案及其他公開案之全 文以引用方式倂人本文中,就像經詳細描述一樣。 實例 未進一步詳細闡述,咸作孰 A k油練技術人員可使用本文之描 逸來進行及使用本發明。 本發明包括以下實例以為熟習此 項技術者實施本發明提供苴 太恭% " 、/、他扣V。所提供之該等實例為 本發明之代表且用於教 ^ ^ , 無明。相應地,該等實例不欲 以任何方式限制本發 軛,。除非下文另外說明,否則 所有部分均以重量計。 ύ % 實例1 實例1-9 118106.doc •79- 200831609 使用ASTM測試方法量測一些特性。在測試前將所有模 製樣品於50%相對濕度下調濕至少48小時。根據ASTM D256於室溫下以粗3.2 mm之桿體量測反向缺口艾氏碰撞值 (Reverse notched Izod impact value)。根據 ASTM D648 於 0.46 MPa(66 psi)下以粗3.2 mm之桿體量測熱變形溫度 (HDT)。根據ASTM方法D638以3·2 mm I類桿體量測抗張特 性。根據ASTM方法D790以3.2 mm桿體量測撓曲特性。根 據ASTM方法D1525在50N下量測維卡溫度(Vicat temperature)。根據ASTM方法D34 18但使用不同加熱及冷 卻速率進行差示掃描熱量測定(DSC)。將樣品以20°C/min 加熱至350°C且以20°C/min或80°C/min冷卻以記錄結晶溫度 峰值(Tc)。以1赫茲(Hertz)之擺動頻率、3°C/min之加熱速 率以3.2 mm桿體進行撓曲動態機械分析(DMA)。根據 ASTM方法D5418自約30至約300°C進行DMA測試。根據 ASTM方法D3 83 5在3 80°C下用1 X 10 mm模在毛細管流變儀 上量測黏度與剪切率之比。在測試前使用平行板流變儀將 摻合物之顆粒物於150°C下以10弧度/分鐘乾燥至少3小時。 量測3 80°C下炼融黏度隨時間之變化。 藉由此項技術中已知之數種技術(例如,ASTM方法 D34318)可量測玻璃轉移溫度(Tg)。在Tg量測中可利用不 同加熱速率,例如每分鐘5°C至30°C,或在其他實例中每 分鐘10°C至20°C。 材料 PCE為BPA共聚碳酸酯,其含有約00重量%間苯二酸酯 118106.doc -80 - 200831609 與對苯二甲酸酯基團之1:1混合物,且其餘為BPA碳酸酯基 團,PCE之 Mw約 28,300,且 Tg為約 175°C。 PSEI-1為由4,4’-氧雙鄰苯二曱酸酐(ODPA)與約等莫耳量 之4,4’-二胺基二苯颯(DDS)反應製備之聚颯醚醯亞胺, PSEI-1 之 Mw約 3 3,000,且 Tg為約 310〇C 0 : PSEI-2為由約80莫耳% 4,4,_氧雙鄰苯二甲酸酐(ODPA)與 : 約20莫耳%雙酚-A二酐(BPADA)之混合物與約等莫耳量之 4,4^二胺基二苯颯(DDS)反應製得之聚颯醚醯亞胺共聚 _ 物,PSEI-2之 Mw約 28,000,且 Tg為約 280〇C。 PSEI-3為由雙酴一A二酐(BPADA)與約等莫耳量之4,4,-二 胺基二苯颯(DDS)反應製備之聚砜醚醯亞胺,PSEI-3之Mw 約 34,000,且 Tg為約 247°C。 PSEI-4為由雙酚-A二鈉鹽與等莫耳量之1H-異吲哚-1,3(2H)-二酮,2,2’·(磺醯基二-4,1_伸苯基)雙[4-氯-(9CI)]反 應製備之聚砜醚醯亞胺,PSEI-4之Mw約50,000且Tg為約 φ 265°C。 使用表1中指定之組合物製備本發明調配物1-9。所有組 份之量表示為重量份/一百重量份樹脂,其中總樹脂重量 . 包括穩定劑(若存在)。使間苯二醯基及對苯二醯基二酸氯 化物與雙酚A在鹼及三乙胺相轉移催化劑存在下兩相(二氯 甲烷/水)反應來製備聚碳酸酯(PCE)共聚物。在(例如)美國 專利第5,521,258號之第13欄、第15-45行中可發現此類型 合成之合成細節。所得聚酯碳酸酯共聚物具有60%酯單元 (為間苯二甲酸酯與對苯二甲酸酯單元之重量比為1:1之混 118106.doc -81- 200831609Without further elaboration, it will be apparent to those skilled in the art that the invention can be utilized in the description herein. The invention includes the following examples to provide additional guidance to those skilled in the art in practicing the invention. The examples provided are merely representative of the invention and are not intended to teach the invention. Accordingly, the examples are not intended to limit the invention in any way. The entire disclosures of all patents, patent applications, and other publications herein are hereby incorporated by reference in its entirety herein in its entirety herein. EXAMPLES Without further elaboration, the skilled artisan skilled in the art can use the invention herein to carry out and use the invention. The present invention includes the following examples in order to provide the present invention to those skilled in the art to provide the present invention. The examples provided are representative of the invention and are used to teach ^^, illuminate. Accordingly, the examples are not intended to limit the present yoke in any way. All parts are by weight unless otherwise stated below. ύ % Example 1 Example 1-9 118106.doc •79- 200831609 Some features were measured using the ASTM test method. All molded samples were conditioned at 50% relative humidity for at least 48 hours prior to testing. The reverse notched Izod impact value was measured in a 3.2 mm thick rod at room temperature according to ASTM D256. The heat distortion temperature (HDT) was measured in accordance with ASTM D648 at 0.46 MPa (66 psi) with a 3.2 mm thick rod. The tensile properties were measured in accordance with ASTM method D638 with a 3·2 mm class I rod. Flexural properties were measured on a 3.2 mm rod according to ASTM method D790. The Vicat temperature was measured at 50 N according to ASTM method D1525. Differential Scanning Calorimetry (DSC) was performed according to ASTM method D34 18 but using different heating and cooling rates. The sample was heated to 350 ° C at 20 ° C / min and cooled at 20 ° C / min or 80 ° C / min to record the crystallization temperature peak (Tc). Flexural dynamic mechanical analysis (DMA) was performed with a 3.2 mm rod at a Hertz oscillation frequency and a heating rate of 3 °C/min. The DMA test was carried out according to ASTM method D5418 from about 30 to about 300 °C. The ratio of viscosity to shear rate was measured on a capillary rheometer using a 1 X 10 mm mode at 3 80 °C according to ASTM method D3 83 5. The pellets of the blend were dried at 10 °C/min for at least 3 hours at 150 °C using a parallel plate rheometer prior to testing. Measure the change in smelting viscosity over time at 80 °C. The glass transition temperature (Tg) can be measured by several techniques known in the art (e.g., ASTM method D34318). Different heating rates can be utilized in Tg measurements, such as 5 ° C to 30 ° C per minute, or 10 ° C to 20 ° C per minute in other examples. The material PCE is a BPA copolycarbonate containing about 00% by weight of a 1:1 mixture of isophthalate 118106.doc-80 - 200831609 with a terephthalate group, and the balance being a BPA carbonate group, PCE has a Mw of about 28,300 and a Tg of about 175 °C. PSEI-1 is a polyfluorene ether ylide prepared by reacting 4,4'-oxybisphthalic anhydride (ODPA) with about 4 parts of 4'-diaminodiphenyl hydrazine (DDS). , PSEI-1 has a Mw of about 33,000 and a Tg of about 310 〇C 0 : PSEI-2 is about 80 mol% 4,4, oxy phthalic anhydride (ODPA) with: about 20 m Copolyether oxime imine copolymer obtained by reacting a mixture of % bisphenol-A dianhydride (BPADA) with about 4 parts of 4,4 diaminodiphenyl hydrazine (DDS), PSEI-2 Mw is about 28,000 and the Tg is about 280 °C. PSEI-3 is a polysulfone ether imine prepared by the reaction of diterpene-A dianhydride (BPADA) with about 4,4,-diaminodiphenyl hydrazine (DDS), the Mw of PSEI-3. It is about 34,000 and has a Tg of about 247 °C. PSEI-4 is composed of bisphenol-A disodium salt and isomolar 1H-isoindole-1,3(2H)-dione, 2,2'·(sulfonyldi-4,1_stretch The polysulfone ether quinone imine prepared by the phenyl)bis[4-chloro-(9CI)] reaction, PSEI-4 has a Mw of about 50,000 and a Tg of about φ 265 °C. Formulations 1-9 of the invention were prepared using the compositions specified in Table 1. The amounts of all components are expressed in parts by weight per hundred parts by weight of resin, of which total resin weight. Including stabilizers, if present. Polycarbonate (PCE) copolymerization by reacting m-benzoic acid and p-benzoic acid diacid chloride with bisphenol A in the presence of a base and a triethylamine phase transfer catalyst in two phases (dichloromethane/water) Things. Synthetic details of this type of synthesis can be found, for example, in column 13, line 15-45 of U.S. Patent No. 5,521,258. The obtained polyester carbonate copolymer has 60% ester units (mixing ratio of isophthalate to terephthalate units is 1:1) 118106.doc -81- 200831609
合物)及40%以雙酚A為主之碳酸酯單元。使如表1中所指 定之成份在油漆震盪器中一起混合且在2·5吋真空通風單 螺桿擠壓機上以80-90 rpm於575-640°F下擠壓。使所得摻 合物顆粒化,且在將顆粒物射出成型為5 X 7 X 1/8吋之薄 片之前於275°F下乾燥4小時。設定模製機使其熔融溫度為 675°F且模製溫度為275°F。測定各模製樣品之20。光澤、 CIE L*值及外觀。根據ASTM D523使用黑瓦標準(black tile standard)量測二十度光澤。如R. McDonald編之 ’’Colour Physics for Industry,Second Edition·’ The Society of Dyers and Colourists,Bradford,UK (1997)所述量測CIE 亮度(L*)值。外觀係指如模製部件之顏色及半透明度/不透 明度之主觀目檢。 接著使用以Leybold Co·之Dynamet 4V器具沈積的約700 埃之濺塗鋁層將樣品金屬化。隨後將樣品進一步以50-100 埃之衍生自六曱基二矽氮烷之電漿聚合清晰塗料塗佈。 使用裝配有購自Labsphere Co之RSA-PE 18反射分光計 之Perkin Elmer Lambda 19 UV/可見光/近紅外分光光度計 量測金屬化部件之金屬塗佈表面上之反射率及漫反射率。 將樣品與Spectralon鏡面標準比較。與標準量測漫反射率 (其係散射光之量度)相比,在約400奈米處量測總反射率 %,藉由使用所量測信號之光阱及漫射光含量將光之直接 反射(鏡面反射)部分自量測中排除。使用Pacific Gardner XL 835量熱器量測金屬化樣品上之濁度。將來自金屬化樣 品之散射光%與直接反射光比較。以此方式所量測之濁度 118106.doc -82 - 200831609 .與沒反射率%相關。由3_5個觀測者組成之小組使用並排比 杈所有金屬化平板、使用主觀正(+)或負㈠尺度進行視覺 分級,其中正對應於對於用作長期反光調節器可接受地不 含缺陷之表面,且負對應於產生對於反射器最終用途不可 接受之極不清晰、模糊反射之渾濁表面。 ' 表1 调配物 1 2 3 4 5 6 7 8 9 PCE PSEI-3 PSEI-2 PSEM 60 40 50 50 50 50 30 70 40 60 60 40 70 30 50 50 60 40 外觀 + + + + + + + + + +係指所定義測試結果之可接受程度。 實例2 將上述發明調配物丨、2、3、4及5射出成型為凹面、拋 物面汽車前燈反射器。用鋁濺塗該等部件表面,且使用上 述技術施加清晰塗層。 實例3 將根據表1之調配物6、7、8及9製得之材料在模腔中射 出成型為倒梯形LED基座。將電流饋入至LED,且LED反 射率為電子應用可接受的。 實例4 對於調配物10-3 1而言,使用ASTM測試方法量測特性。 根據ASTM D1238於295°C下使用6·7 Kg重量對乾燥顆粒物 進行熔融流動率(MFR)測定。在測試前將所有模製樣品在 118106.doc -83 - 200831609 50%相對濕度下調濕至少48 h。根據ASTM D256於室溫下 以粗3·2 mm之桿體量測缺口艾氏碰撞值。根據ASTM D648 於1.82 MPa(264 psi)下以粗3·2 mm之桿體量測熱變形溫度 (HDT)。用 ASTM方法 D3763於23〇C 下以 102 X 3.2 mm光盤 量測二軸或安裝碰撞,報導衝擊能量峰值。根據ASTM方 法D638以3.2 mm I型桿體量測抗張特性。根據ASTM方法 〇790以3.2 111111桿體量測撓曲特性。使用八8丁]^方法〇543以 3.2 mm桿體量測耐溶劑性。根據ASTM方法D1003在2.0 mm處量測透光率%(T%)及濁度%(H%)。如藉由FAR 25.853 中所列之方法量測,使用Ohio State University(OSU)放熱 速率設備在厚2.0 mm之15.2 x 15.2 cm平板上進行放熱測 試。在兩分鐘時量測放熱,以kW-min/m2(千瓦分鐘每平方 公尺)為單位。量測放熱峰值,以kW/m2(千瓦每平方公尺) 為單位。亦量測到達放熱峰值之時間,以分鐘表示。放熱 測試法亦描述於"Aircraft Materials Fire Test Handbook" DOT/FAA/AR-OO/12,第五章’’Heat Release Test for Cabin Materials" o 材料And 40% of carbonate units based on bisphenol A. The ingredients as specified in Table 1 were mixed together in a paint shaker and extruded at 575-640 °F at 80-90 rpm on a 2.5 吋 vacuum-ventilated single screw extruder. The resulting blend was pelletized and dried at 275 °F for 4 hours before the pellets were injection molded into a 5 X 7 X 1/8 inch sheet. The molding machine was set to have a melting temperature of 675 °F and a molding temperature of 275 °F. 20 of each molded sample was measured. Gloss, CIE L* value and appearance. The twenty degree gloss was measured according to ASTM D523 using a black tile standard. The CIE brightness (L*) value is measured as described by R. McDonald, ''Colour Physics for Industry, Second Edition', The Society of Dyers and Colourists, Bradford, UK (1997). Appearance refers to the subjective visual inspection of the color and translucency/opacity of the molded part. The sample was then metallized using a layer of approximately 700 angstroms of sputtered aluminum deposited by Leybold Co.'s Dynamet 4V apparatus. The sample was then further coated with a 50-100 angstrom plasma clear polymer derived from hexamethylene diazoxide. The reflectance and diffuse reflectance on the metal coated surface of the metallized component were measured using a Perkin Elmer Lambda 19 UV/Vis/NIR spectrophotometer equipped with an RSA-PE 18 reflectance spectrometer from Labsphere Co. Compare samples to Spectralon mirror standards. The total reflectance % is measured at about 400 nm compared to the standard measured diffuse reflectance (which is a measure of scattered light), and the light is directly reflected by using the optical trap of the measured signal and the diffused light content. (Specular reflection) is partially excluded from the measurement. The turbidity on the metallized samples was measured using a Pacific Gardner XL 835 calorimeter. The % scattered light from the metallized sample is compared to the directly reflected light. The turbidity measured in this way is 118106.doc -82 - 200831609 . It is related to the % non-reflectivity. A panel of 3_5 observers uses a side-by-side comparison of all metallized plates, using a subjective positive (+) or negative (a) scale for visual grading, which corresponds to a surface that is acceptable for use as a long-term retroreflector without defects And negative corresponds to a turbid surface that produces an extremely unclear, hazy reflection that is unacceptable for the ultimate use of the reflector. ' Table 1 Formulation 1 2 3 4 5 6 7 8 9 PCE PSEI-3 PSEI-2 PSEM 60 40 50 50 50 50 30 70 40 60 60 40 70 50 50 60 40 Appearance + + + + + + + + + + + is the acceptable level of the test results defined. Example 2 The above inventive formulations 丨, 2, 3, 4 and 5 were injection molded into a concave, parabolic automobile headlight reflector. The surface of the parts was sputtered with aluminum and a clear coating was applied using the techniques described above. Example 3 Materials made according to formulations 6, 7, 8, and 9 of Table 1 were injection molded into a cavity into an inverted trapezoidal LED pedestal. Current is fed to the LED and the LED reflectivity is acceptable for electronic applications. Example 4 For Formulation 10-3 1, the properties were measured using the ASTM test method. The dry particulate matter was subjected to melt flow rate (MFR) measurement according to ASTM D1238 at 295 ° C using a weight of 6.7 Kg. All molded samples were conditioned for at least 48 h at 118106.doc -83 - 200831609 50% relative humidity prior to testing. The notched Ehrlich collision value was measured at a room temperature of 3.0 mm in accordance with ASTM D256. The heat distortion temperature (HDT) was measured in accordance with ASTM D648 at 1.82 MPa (264 psi) with a body measuring 3. 2 mm thick. The ASTM method D3763 was used to measure the two-axis or mounted collision at 23 〇C on a 102 X 3.2 mm disc, reporting the peak impact energy. Tensile properties were measured in a 3.2 mm type I rod according to ASTM method D638. The deflection characteristics were measured in accordance with the ASTM method 〇790 with a 3.2 111111 rod. The solvent resistance was measured with a 3.2 mm rod using an 8-8 method. Transmittance % (T%) and turbidity % (H%) were measured at 2.0 mm according to ASTM method D1003. An exothermic test was performed on a 15.2 x 15.2 cm plate measuring 2.0 mm thick using an Ohio State University (OSU) exothermic rate device as measured by the method listed in FAR 25.853. The exotherm was measured at two minutes in kW-min/m2 (kilowatt minutes per square meter). The exothermic peak is measured in kW/m2 (kilowatts per square meter). The time to reach the exothermic peak is also measured, expressed in minutes. The exothermic test method is also described in "Aircraft Materials Fire Test Handbook" DOT/FAA/AR-OO/12, Chapter 5 '’Heat Release Test for Cabin Materials" o Materials
該等調配物中所用之間苯二酚酯聚碳酸酯(ITR)樹脂係 由間苯二醯氯與對苯二醯氯之1:1混合物與間苯二酚、雙 酚A(BPA)及碳醯氯縮合而製得之聚合物。以酯鍵與碳酸酯 鍵之大致莫耳比命名ITR聚合物。ITR9010具有約82莫耳°/〇 之間苯二酚酯鍵、8莫耳%之間苯二酚碳酸酯鍵及約10莫 耳%之3卩八碳酸酯鍵。Tg=131°C 118106.doc -84 - 200831609 PEI=ULTEM 1000聚醚醯亞胺,聚醚醯亞胺由雙酚A二酐 與约等莫耳量之得自GE Plastics之間苯二胺反應製得。 PEI-矽氧烷係由間苯二胺、BPA-二酐及含有平均約10個 聚矽氧原子之雙-胺基丙基官能曱基聚矽氧之亞胺化反應 製得之聚醚醯亞胺二甲基矽氧烷共聚物。由凝膠滲透層析 • 法量測,其矽氧烷含量為約34重量%,且Μη為約24,000。 ; PC 為 ΒΡΑ 聚碳酸酯,得自 GE Plastics 之 LEXAN 130。 藉由在2.5吋單螺桿真空通風擠壓機中擠壓以間苯二酚 為主之聚酯碳酸酯樹脂與聚醚醯亞胺及聚矽氧聚醯亞胺'共 聚物樹脂之混合物來製備摻合物。除非另外說明,否則以 總組合物之重量%列出組合物。將擠壓機設定於約285至 340°C。在真空下以約90 rpm進行摻合。將擠壓物冷卻、 顆粒北及在120°C下乾燥。於設定溫度320-360°C及模製溫 度120°C下使用30秒週期將測試樣品射出成型。以UV保護 劑塗料塗刷物件。 φ 表2之調配物10及11展示在PEI/聚矽氧-聚醯亞胺共聚物 摻合物中如何以間苯二酚酯聚碳酸酯(ITR9010)代替PC, 此令人驚奇減少兩分鐘放熱及總放熱。延遲放熱到達最大 強度之時間亦增加到達放熱峰值之時間。注意添加間苯二 齡酯聚碳酸酯亦增加流動性(MFR=每10分鐘熔融流動速率 g,於295°C下量測)且改良斷裂伸長率。 118106.doc -85 - 200831609 表2 調配物 10 11 PEI 76 76 ITR9010 10 20 PEI-矽氧烷 4 4 PC 10 0 Ti〇2 3 3 放熱 2 min(kW-min/m2) 10 12 峰值(kWm2) 34 29 到達舉值之時間(min) 4.60 4.50 MFR@295〇C 3.0 3.6 撓曲模數Kpsi 464 462 撓曲強度Kpsi 22.1 22.4 抗張強度(Y) Kpsi 14.8 15.0 拉伸%(B) 39 50 HDT264psrt 163 164 伸長最大負載ft-lbs 54 56 缺口艾氏碰撞強度ft-lbs/in 1.4 1.3 表3顯示具有多種量之間苯二酚酯聚碳酸酯及1至4%聚 矽氧聚醯亞胺共聚物之一系列PEI摻合物。調配物12-1 8均 顯示極低的兩分鐘放熱及低放熱峰值。樣品均顯示指示良 好熔融流動之高MFR。在所有實例中,HDT大於150°C。 調配物之撓曲模數亦均2 400 Kpsi(2760 Mpa)。亦注意即 使具有低含量之聚醚醯亞胺,例如含量不到總摻合物一半 之調配物15及17,仍能達成令人驚奇的低放熱值。在該組 調配物12-18中存在百分之(phr)3.0之二氧化鈦及0.1 phr之 118106.doc -86- 200831609 亞磷酸三芳酯。 表3 調配物 12 13 14 15 16 17 18 PEI ITR9010 PEI-矽氧烷 56.5 42.5 1.0 78.0 20.0 2.0 63.0 35.0 2.0 48.0 50.0 2.0 69.5 27.5 3.0 46.0 50.0 4.0 76.0 20.0 4.0 佔所有摻合物3 phr之Ti02及0.1 phr之亞磷酸三芳酯 表4中調配物19及20顯示11〇2之添加在減少放熱及增加 到達放熱峰值之時間中的有益作用。注意實例19及20皆可 具有優良放熱特性,調配物11可具有稍低之放熱峰值及較 長之到達放熱峰值之時間,顯示金屬氧化物添加劑之有益 作用。The resorcinol ester polycarbonate (ITR) resin used in the formulations is a 1:1 mixture of m-benzoic acid chloride and terephthalic acid chloride with resorcinol, bisphenol A (BPA) and A polymer obtained by condensation of carbon ruthenium chloride. The ITR polymer is named by the approximate molar ratio of the ester bond to the carbonate bond. ITR 9010 has a benzenediol ester linkage of about 82 moles per Å, a sulphuric acid carbonate linkage of 8 mole percent, and a 3 octacarbonate linkage of about 10 mole percent. Tg=131°C 118106.doc -84 - 200831609 PEI=ULTEM 1000 polyether quinone imine, polyether quinone imine from bisphenol A dianhydride and about the molar amount of phenylenediamine from GE Plastics be made of. PEI-nonane is a polyether oxime prepared by imidization of m-phenylenediamine, BPA-dianhydride and bis-aminopropyl-functional fluorenyl polyoxyl oxide containing an average of about 10 polyfluorene oxygen atoms. Imino dimethyl siloxane copolymer. The oxime content was about 34% by weight and the Μη was about 24,000 by gel permeation chromatography. PC is ΒΡΑ polycarbonate available from GE Plastics' LEXAN 130. Prepared by extruding a mixture of resorcinol-based polyester carbonate resin and polyether quinone imine and polyoxymethylene phthalimide copolymer resin in a 2.5 吋 single screw vacuum ventilator Blend. Compositions are listed as % by weight of the total composition unless otherwise stated. Set the extruder to approximately 285 to 340 °C. Blending was carried out at about 90 rpm under vacuum. The extrudate was cooled, granulated north and dried at 120 °C. The test samples were injection molded at a set temperature of 320-360 ° C and a molding temperature of 120 ° C using a 30 second cycle. Brush the object with a UV protectant coating. φ Formulations 10 and 11 of Table 2 show how to replace PC with resorcinol ester polycarbonate (ITR9010) in a PEI/polyoxyn-polyimine copolymer blend, which is surprisingly reduced by two minutes. Exothermic and total exotherm. The time to delay the exotherm to reach the maximum intensity also increases the time to reach the exothermic peak. Note that the addition of isophthalic acid ester polycarbonate also increased fluidity (MFR = melt flow rate g per 10 minutes, measured at 295 ° C) and improved elongation at break. 118106.doc -85 - 200831609 Table 2 Formulation 10 11 PEI 76 76 ITR9010 10 20 PEI-oxane 4 4 PC 10 0 Ti〇2 3 3 Exothermic 2 min (kW-min/m2) 10 12 Peak (kWm2) 34 29 Time to reach value (min) 4.60 4.50 MFR@295〇C 3.0 3.6 Flexing modulus Kpsi 464 462 Flexural strength Kpsi 22.1 22.4 Tensile strength (Y) Kpsi 14.8 15.0 Stretch %(B) 39 50 HDT264psrt 163 164 Elongation Maximum Load ft-lbs 54 56 Notched Ehrlich Impact Strength ft-lbs/in 1.4 1.3 Table 3 shows the copolymerization of various amounts of benzenediol ester polycarbonate and 1 to 4% polyoxyl imine One of a series of PEI blends. Formulations 12-1 8 all showed extremely low two-minute exotherms and low exothermic peaks. The samples all showed a high MFR indicating a good melt flow. In all cases, the HDT is greater than 150 °C. The flexural modulus of the formulation is also 2 400 Kpsi (2760 Mpa). It is also noted that surprisingly low exotherms can be achieved even with low levels of polyetherimine, such as formulations 15 and 17 which are less than half of the total blend. Percent (phr) 3.0 of titanium dioxide and 0.1 phr of 118106.doc -86-200831609 triaryl phosphite are present in this set of formulations 12-18. Table 3 Formulations 12 13 14 15 16 17 18 PEI ITR9010 PEI-oxane 56.5 42.5 1.0 78.0 20.0 2.0 63.0 35.0 2.0 48.0 50.0 2.0 69.5 27.5 3.0 46.0 50.0 4.0 76.0 20.0 4.0 Ti02 and 0.1 of all blends 3 phr Phr of triaryl phosphite Formulations 19 and 20 in Table 4 show the beneficial effect of the addition of 11 〇 2 in reducing the exotherm and increasing the time to reach the exothermic peak. Note that both Examples 19 and 20 have excellent exothermic properties, and the formulation 11 may have a slightly lower exothermic peak and a longer time to reach the exothermic peak, indicating a beneficial effect of the metal oxide additive.
表4 調配物 19 20 21 22 23 24 25 PEI 67.5 67.5 68 58 19.15 18.40 17.65 ITR9010 30.0 30.0 20 30 80.0 80.0 80.0 PEI-矽氧烷 2.5 2.5 2 2 0.75 1.50 2.25 PC 10 10 亞磷酸三芳酯 0.1 0.1 0.1 Ti〇2 0.0 3.0 3 3 放熱 2 min(kW-min/m2) 16 12 17 15 23 18 18 峰值(kW/m2) 31 29 29 35 39 40 40 到達峰值之時間(分鐘) 3.87 4.69 3.21 4.34 3.74 3.34 3.64 註釋 泡沫 泡沫 泡沫 體炭 體炭 體炭 MFR@295〇C 3.1 3.0 2.6 4.0 13.9 14.8 14.5 撓曲模數Kpsi 467 470 465 485 399 395 393 撓曲強度Kpsi 23.3 22.9 22.3 21.9 19.3 19.4 19.3 118106.doc -87 - 200831609 調配物 19 20 21 22 23 24 25 抗張強度(Y)Kpsi 14.3 14.0 13.8 13.3 12.4 12.4 12.3 拉伸%(B) 52 86 82 100 40 45 46 HDT264 psi°C 169 169 169 161 133 134 133 伸長最大負載ft-lbs 54 57 55 58 50.7 50.6 52.9 缺口艾氏碰撞強度ft-lbs/in 0.9 1.0 1.2 1.3 2.7 2.5 2.6 透光率%@2.0 mm 74.3 72.4 72.5 濁度 %@2.0 mm 5.9 6.6 5.8 表4中亦顯示調配物21及22。該等摻合物將間苯二酚酯 聚碳酸酯、聚醚醯亞胺及聚矽氧-聚醯亞胺共聚物與其他 非芳酯聚碳酸酯、雙酚-A聚碳酸酯(PC)組合。該等摻合物 可顯示高於150°C之HDT、2 390 Kpsi(2691 Mpa)之撓曲模 數及極低的兩分鐘放熱值及放熱奪值。 表4中顯示調配物23、24及25。該等摻合物具有高間苯 二酚酯聚碳酸酯含量。即使具有低PEI矽氧烷含量及低PEI 含量,該等摻合物仍可展示如藉由低放熱值及長的到達放 熱峰值之時間所示之改良耐燃性。該等掺合物可具有如藉 由高MFR以及高模數及強度所示之優良流動性。在所有實 例中斷裂抗張伸長率均可高於25%。注意在2.0 mm處,透 光率%可高於70%,同時可具有低濁度,在該三種組份聚 合物摻合物中甚至低於10%。缺口艾氏碰撞強度高於2.0 ft-lbs/in 〇 表5中顯示調配物26、27及28。該等摻合物具有約等量 之間苯二酚酯聚碳酸酯及PEI。即使具有低PEI矽氧烷含量 (0.75至2.25重量%),該等摻合物仍可展示低放熱值。摻合 118106.doc -88 - 200831609 物可具有如高MFR以及高模數390 Kpsi)及強度所示之 良好流動性。在所有實例中,斷裂抗張伸長率可高於 25%。注意在2.0 mm處,透光率%高於60%同時可具有低 濁度,在該等聚合物掺合物中濁度低於10%。 表5 實例 26 27 28 29 30 31 ΡΕΙ 49.15 48.40 47.65 79.15 78.40 77.70 ITR9010 50.0 50.0 50,0 20.0 20.0 20.0 ΡΕΙ矽氧烷 0.75 1.50 2.25 0.75 1.50 2.25 亞磷酸三芳酯 0.1 0.1 0.1 0.1 0.1 0.1 放熱 2 min(kW-min/m2) 14 12 13 13 10 9 峰值(kW/m2) 36 31 33 29 27 26 到達峰值之時間(min) 3.94 4.26 4.62 2.70 2.91 4.69 註釋 泡沫 泡沫 泡沐 泡沫 泡沫 泡沫 體碳 體碳 體碳 體碳 體碳 體碳 MFR@295〇C 6.7 6.9 7.0 2.1 2.1 2.3 撓曲模數Kpsi 441 430 433 467 473 473 撓曲強度Kpsi 22.1 21.7 21.8 23.9 24.4 24.2 抗張強度(Y)Kpsi 13.9 13.7 14.1 16.0 15.8 15.7 拉伸%(Β) 38 54 80 95 72 28 HDT264 psi°C 155 151 151 171 176 175 伸長最大負載fl-lbs 61.1 53.1 59.6 58.3 57.1 62.2 缺口艾氏碰撞強度fl-lbs/in 1.4 1.6 L5 1.0 1.0 1.2 透光率%@2.0 mm 73.0 72.4 68.8 72.1 70.1 66.4 濁度%@2.0 mm 2.5 3.1 5.8 2.5 4.0 7.0 表5中顯示調配物29-3 1。該等摻合物含有較低含量之間 苯二酚酯聚碳酸酯。雖然PEI矽氧烷含量(0.75至2·25重量 118106.doc -89- 200831609 %)極低,但摻合物仍可展示低放熱值及低的到達峰值之時 間。摻合物可顯示對熔融加工應用有用之流動性以及高模 數(23 90 Kpsi)及強度。在所有實例中斷裂抗張伸長率可高 於25%。注意在2.0 mm處,透光率%高於60%同時可具有 低濁度,在該等聚合物摻合物中濁度低於10%。 : 實例5 ; 使用ASTM測試方法量測特性。根據ASTM D1238在295 °C下用6.7 Kg重量對乾燥顆粒物進行熔融流動速率(MFR) ® 測定。在測試前將所有模製樣品在50%相對濕度下調濕至 少48 h。根據ASTM D256於室溫下以粗3.2 mm之桿體量測 缺口艾氏碰撞值。根據ASTM D648於1.82 MPa(264 psi)下 在粗3.2 mm桿體上量測熱變形溫度(HDT)。根據ASTM方 法D638在3.2 mm I型桿體上量測抗張特性。根據ASTM方 法D790在3.2 mm桿體上量測撓曲特性。 如藉由FAR 25.853中所列之方法量測,用Ohio State ⑩ University(OSU)放熱速率設備在2.0 mm厚的15·2 X 15.2 cm平板上進行放熱測試。在兩分鐘時量測放熱,以kW-min/m2(千瓦分鐘每平方公尺)為單位。量測放熱峰值,以 kW/m2(千瓦每平方公尺)為單位。亦量測到達放熱峰值之 時間,以分鐘為單位。放熱測試法亦描述於’’Aircraft Materials Fire Test Handbook" DOT/FAA/AR-OO/12,第五 章"Heat Release Test for Cabin Materials”。 材料* 該等實例中所使用之間苯二酚酯聚碳酸酯(ITR)樹脂係 118106.doc -90- 200831609 由間本一酸鼠與對苯二醢氣之1:1混合物與間苯二齡、雙 A(BPA)及故鼠細合而製得之聚合物。以醋鍵與碳酸酉旨 鍵之近似莫耳比命名ITR聚合物。ITR9010具有約82莫耳% 之間苯二酚酯鍵、8莫耳%之間苯二酚碳酸酯鍵及約1〇莫 *%2ΒΡΑ碳酸酯鍵。Tg=13TC。PEI-矽氧烷係由間苯二 胺、EPA-二酐及含有平均約1〇個聚矽氧原子之雙-胺基丙 基g月b甲基I發氧之亞胺化反應製得之聚_酸亞胺二甲基 矽氧烷共聚物。如藉由凝膠滲透層析法量測,矽氧烷含量 為約34重量%,且Μη為約24,000。 PSu為由雙酚Α與二氣二苯颯反應製得之聚砜,且係自 SolvayCo.作為 UDEL1700 出售。 PES為由二經基苯基砜及二氣二苯砜反應製得之聚醚 颯,且係自BASF Co.作為ULTRASON E出售。 注意根據該實例之摻合物具有在化合期間添加的百分之 (phr)三的二氧化鈦(Ti〇2)。藉由在2.5吋單螺桿真空通風擠 壓機中擠壓以間苯二酚為主之聚酯碳酸酯樹脂與聚颯或聚 鍵礙及聚矽氧聚醯亞胺共聚物樹脂之混合物來製備摻合 物除非另外說明’否則以總組合物之重量%列出組合 物。將擠壓機設定於約285至340°C。在真空下於約90 rpm 下進打摻合。將擠壓物冷卻、顆粒化及在l2(rc下乾燥。 於設定溫度320-360。(:及模製溫度120°C下用30秒週期將測 試樣品射出成型。表6之調配物32顯示間苯二酚酯聚碳酸 酯(ITR9010)、聚砜(pSu)及聚矽氧-聚醯亞胺共聚物(ρΕΙ-矽 氧烷)之摻合物,其可令人驚奇地減少兩分鐘放熱及放熱 118106.doc -91- 200831609 峰值。可將兩分鐘放熱自63降至47 kW-min/m2。亦可將放 熱峰值自120降至75 kW/m2。亦可將到達放熱峰值時間自 2.56增至3.72分鐘,延遲放熱到達最大強度之時間。調配 物3 3顯示聚颯與聚醚砜(PES)與ITR9010及聚矽氧聚醯亞胺 之摻合物,其亦可具有改良之放熱特性及改良之流動性。 表6 實例* 32 33 34 PSu 62.5 31.25 62.5 PES 0 31.25 0 PEI矽氧烷 2.5 2.5 2.5 ITR9O10 35 35 35 放熱 2 min(kW-min/m2) 47 57 31 峰值(kW/m2) 75 75 65 到達峰值之時間(min) 3.72 2.91 3.74 外觀 泡沫體碳 泡沫體碳 泡沫體碳 MFR@295〇C g/l〇 min 13.8 11.9 10.9 *具有3 phr Ti02之摻合物 實例6 表6,調配物34顯示聚醚颯(PES)與間苯二酚酯聚碳酸酯 (ITR9010)及2.5重量%之聚矽氧聚醯亞胺共聚物之摻合 物。可根據FAR/OSU測試燃燒調配物34且產生充當阻止火 焰蔓延之障壁之泡沫體碳。其亦可具有低放熱值、較長的 到達放熱峰值之時間且可充當更有效阻止火焰蔓延之障 壁〇 實例7 表7中之調配物35及36顯示PSu或PES與較高含量(60重 118106.doc -92- 200831609 量%)間苯二酚酯聚碳酸酯共聚物之摻合物。摻合物可顯示 低的兩分鐘放熱及低放熱峰值。當燃燒時,樣品產生充當 阻止火焰蔓延之障壁的泡沫體碳。實例35及36亦可顯示高 熔融流動性,令人驚奇的是其在FAR/OSU測試期間不燒毀 或自火焰流走。摻合物亦可顯示高撓曲模數300 Kpsi或 * 2070 MPa)及高撓曲強度〇 15 Kpsi或103.5 Mpa)以及高 ; 50%)斷裂伸長率。 表7 實例* 35 36 Psu 37.5 0 PES 0 37.5 PEI矽氧烷 2.5 2.5 ITR9010 60 60 放熱 2 min(kW-min/m2) 59 39 峰值(kW/m2) 70 58 到達峰值之時間(min) 2.65 2.40 外觀 泡沫體碳 泡沫體碳 MFR@295〇C g/l〇 min 17.7 13.9 撓曲模數Kpsi 382 399 撓曲強度Kpsi 17.6 18.3 抗張強度(Y)Kpsi 11.0 11.7 抗張模數Kpsi 372 383 拉伸%(B) 89 110 HDT264 psi°C 134 132 缺口艾氏碰撞強度fl>lbs/in 2.6 3.5 *摻合物具有3 phr之Ti02。 • __ 118106.doc •93- 200831609 實例8 在Baltzer真空金屬化室中將發明材料1、2、3及4之平板 炎持於旋轉固持器。該室係封閉的且啟動真空泵。將室内 壓力降至1(Τ3與1〇-4 mBar之間的真空。使樣品在固持器中 方疋轉且用輝光放電法預處理一分鐘。輝光放電法包含在約 0.08至0·1 Mbar之壓力下將空氣或氬氣混合物引入真空 室’同時高壓電流電源形成電漿歷時1分鐘,此舉改善樣 品表面。 在完成輝光放電法之後,再次啟動真空泵,且將室内壓 力降至1 〇-4 Mbar,且用鎢絲加熱純鋁使得鋁蒸發及在樣品 平板上冷凝。為保護鋁層,將塗料施加於樣品上,在第二 輝光放電步驟期間將HMDS(六曱基二矽氧烷)引入室中, 且將HMDS作為聚合物沉澱於鋁表面上以產生光源調節 器。 實例9 在Baltzer真空金屬化室中將調配物1、2、3、4、pSEI_3 及PSEI-4之材料平板夾持於旋轉固持器。該室係封閉的且 啟動真空泵。將室内壓力降至10-3與10-4 mBari間的真 空°將樣品在固持器中旋轉且用輝光放電法預處理一分 鐘。輝光放電法包含在約〇·〇8至〇·1 Mbar之壓力下將空氣 或氬氣混合物引入真空室,同時高壓電流電源產生電漿歷 時1分鐘,此舉改善樣品表面。 在完成輝光放電法之後,再次啟動真空泵,且將室内壓 力降至10 Mb ar ’且用鷂絲加熱純銘使得銘蒸發且在樣品 118106. doc -94- 200831609 薄片上冷凝。為保護鋁層,將塗料施加於樣品上,在第二 輝光放電步驟期間將HMDS(六甲基二矽氧烷)引入室中, 且將HMDS作為聚合物沉澱於鋁表面上以產生光源調節 器。 將PSEI-3及PSEI-4平板置於具有初始溫度218它之 ° Undberg/Blu_流烘箱(型號Μ01490)中,且以每分鐘約 : 〇 ·1 C之速率提高熱度。每隔15分鐘檢測平板一次直到其 _ 顯示反射率損失之可見跡象。下表8指示在何溫度下平板 反射性視覺上降低。對在金屬化之前經退火之psm_3及 PSEI-4平板進行類似測試。藉由將每一平板加熱至比其各 別玻璃轉移溫度低2〇°c之溫度且以每小時-1〇〇c至23。〇之 速率進行冷卻來製備經退火、預金屬化之平板。表8中資 料指示在某些狀況下PSEI_4可優於PSEI_3。該資料亦指示 在金屬化之前將模製物件預退火以促進金屬塗佈物件之熱 夕文能的改良。 表8·金屬化PSEI平板之熱處理 PSEI-3 PSEI-4 經退火 溫度(°C)* 溫度(°C)* — 是 244 254 否 氺姑曰、、c a 232 250 *觀測到反射率損失之溫度 儘官已參考較佳實施例對本發明進行描述,但熟習此項 技術者應瞭解可進行多種改變且可用等效物取代其要素而 不脫離本發明料n可進行許多修正以使特定狀況 或材料適於本發明之教示而不脫離其基本料^因此,希 118106.doc -95- 200831609 望本發明不限於揭示為用於進行本發明所涵蓋之最佳模式 的特定實施例,但本發明將包括處於所附申請專利範圍之 範疇内的所有實施例。Table 4 Formulation 19 20 21 22 23 24 25 PEI 67.5 67.5 68 58 19.15 18.40 17.65 ITR9010 30.0 30.0 20 30 80.0 80.0 80.0 PEI-oxime 2.5 2.5 2 2 0.75 1.50 2.25 PC 10 10 Triaryl phosphite 0.1 0.1 0.1 Ti 〇2 0.0 3.0 3 3 Exothermic 2 min (kW-min/m2) 16 12 17 15 23 18 18 Peak (kW/m2) 31 29 29 35 39 40 40 Time to peak (minutes) 3.87 4.69 3.21 4.34 3.74 3.34 3.64 Note Foam foam foam Carbon carbon charcoal MFR@295〇C 3.1 3.0 2.6 4.0 13.9 14.8 14.5 Flexural modulus Kpsi 467 470 465 485 399 395 393 Flexural strength Kpsi 23.3 22.9 22.3 21.9 19.3 19.4 19.3 118106.doc -87 - 200831609 Formulation 19 20 21 22 23 24 25 Tensile strength (Y) Kpsi 14.3 14.0 13.8 13.3 12.4 12.4 12.3 Tensile %(B) 52 86 82 100 40 45 46 HDT264 psi°C 169 169 169 161 133 134 133 Elongation Maximum load ft-lbs 54 57 55 58 50.7 50.6 52.9 Notched Ehrlich impact strength ft-lbs/in 0.9 1.0 1.2 1.3 2.7 2.5 2.6 Transmittance %@2.0 mm 74.3 72.4 72.5 Turbidity%@2.0 mm 5.9 6.6 5.8 Table 4 Also shows the formulation 21 and 22. These blends include resorcinol ester polycarbonate, polyether quinone imine and polydecyloxy-polyimine copolymers with other non-arylate polycarbonates, bisphenol-A polycarbonates (PC) combination. The blends can exhibit HDT above 150 °C, a flexural modulus of 2 390 Kpsi (2691 Mpa), and an extremely low two-minute exotherm and exotherm. Formulations 23, 24 and 25 are shown in Table 4. The blends have a high resorcinol ester polycarbonate content. Even with low PEI oxime content and low PEI content, the blends exhibit improved flame resistance as indicated by low exotherm values and long periods of time to reach exothermic peaks. The blends may have excellent flow properties as indicated by high MFR and high modulus and strength. The tensile elongation at break can be higher than 25% in all cases. Note that at 2.0 mm, the transmittance may be higher than 70% while having a low haze, even less than 10% in the three component polymer blends. Notched Ehrlich impact strengths above 2.0 ft-lbs/in 调 Formulations 26, 27 and 28 are shown in Table 5. The blends have about equal amounts of meta- benzenediol ester polycarbonate and PEI. Even with a low PEI oxime content (0.75 to 2.25 wt%), the blends can exhibit low exotherms. Blending 118106.doc -88 - 200831609 The material may have good fluidity as indicated by high MFR and high modulus 390 Kpsi) and strength. In all cases, the tensile elongation at break can be higher than 25%. Note that at 2.0 mm, the % transmittance is higher than 60% while having a low haze, and the turbidity is less than 10% in the polymer blends. Table 5 Example 26 27 28 29 30 31 ΡΕΙ 49.15 48.40 47.65 79.15 78.40 77.70 ITR9010 50.0 50.0 50,0 20.0 20.0 20.0 oxirane 0.75 1.50 2.25 0.75 1.50 2.25 Triaryl phosphite 0.1 0.1 0.1 0.1 0.1 0.1 Exothermic 2 min (kW -min/m2) 14 12 13 13 10 9 Peak (kW/m2) 36 31 33 29 27 26 Time to peak (min) 3.94 4.26 4.62 2.70 2.91 4.69 Notes Foam foam foam foam foam Carbon carbon Carbon body carbon carbon MFR@295〇C 6.7 6.9 7.0 2.1 2.1 2.3 Flexural modulus Kpsi 441 430 433 467 473 473 Flexural strength Kpsi 22.1 21.7 21.8 23.9 24.4 24.2 Tensile strength (Y) Kpsi 13.9 13.7 14.1 16.0 15.8 15.7 Stretch %(Β) 38 54 80 95 72 28 HDT264 psi°C 155 151 151 171 176 175 Elongation Maximum Load fl-lbs 61.1 53.1 59.6 58.3 57.1 62.2 Notched Ehrlich Impact Strength fl-lbs/in 1.4 1.6 L5 1.0 1.0 1.2 Transmittance %@2.0 mm 73.0 72.4 68.8 72.1 70.1 66.4 Turbidity %@2.0 mm 2.5 3.1 5.8 2.5 4.0 7.0 The formulation 29-3 1 is shown in Table 5. The blends contain a lower level of meta- succinyl ester polycarbonate. Although the PEI oxime content (0.75 to 2.25 weight 118106.doc -89 - 200831609%) is extremely low, the blend still exhibits a low exotherm and a low peak to peak time. The blends can exhibit fluidity useful for melt processing applications as well as high modulus (23 90 Kpsi) and strength. The tensile elongation at break in all cases may be higher than 25%. Note that at 2.0 mm, the % transmittance is higher than 60% while having a low haze, and the turbidity is less than 10% in the polymer blends. : Example 5; The characteristics were measured using the ASTM test method. The dry particulate matter (MFR) ® was measured according to ASTM D1238 at 295 °C with a weight of 6.7 Kg. All molded samples were conditioned at 50% relative humidity for at least 48 h prior to testing. The notched Ehrlich collision value was measured in a 3.2 mm thick rod at room temperature according to ASTM D256. The heat distortion temperature (HDT) was measured on a coarse 3.2 mm rod at 1.82 MPa (264 psi) according to ASTM D648. Tensile properties were measured on a 3.2 mm Type I rod according to ASTM method D638. The deflection characteristics were measured on a 3.2 mm rod according to ASTM method D790. An exothermic test was performed on a 2.0 mm thick 15.2 X 15.2 cm plate using an Ohio State 10 University (OSU) exothermic rate device as measured by the method listed in FAR 25.853. The exotherm was measured at two minutes in kW-min/m2 (kilowatt minutes per square meter). The exothermic peak is measured in kW/m2 (kilowatts per square meter). The time to reach the exothermic peak is also measured in minutes. The exothermic test method is also described in ''Aircraft Materials Fire Test Handbook" DOT/FAA/AR-OO/12, Chapter 5"Heat Release Test for Cabin Materials." Materials* Resorcinol used in these examples Ester Polycarbonate (ITR) Resin 118106.doc -90- 200831609 A 1:1 mixture of m-acid and p-benzoquinone is combined with isophthalic acid, double A (BPA) and the mouse. The resulting polymer was named ITR polymer with an approximate molar ratio of vinegar to cesium carbonate. ITR9010 has about 82 mol% of benzenediol ester bond, 8 mol% of benzenediol carbonate. The bond and about 1〇%*%2ΒΡΑ carbonate bond. Tg=13TC. PEI-oxime is made up of m-phenylenediamine, EPA-dianhydride and bis-aminopropyl group containing an average of about 1〇 polyoxynium atom. a poly-acid imine dimethyl oxirane copolymer prepared by the imidization reaction of methyl group I methyl group O. The content of decane is about 34 as measured by gel permeation chromatography. % by weight, and Μη is about 24,000. PSu is a polysulfone prepared by the reaction of bisphenol hydrazine with dibenzophenone, and is sold as a UDEL 1700 from Solvay Co. PES is diphenyl benzene. The polyether oxime obtained by the reaction of a sulfone and a di-diphenyl sulfone is sold as a ULTRASON E from BASF Co. Note that the blend according to this example has a (phr) percent of titanium dioxide added during the compounding period. (Ti〇2). Extrusion of resorcinol-based polyester carbonate resin with polyfluorene or poly-bonds in a 2.5-inch single-screw vacuum-ventilation extruder A mixture of resins to prepare a blend unless otherwise stated 'otherwise the composition is listed as a weight percent of the total composition. The extruder is set at about 285 to 340 ° C. The blend is mixed under vacuum at about 90 rpm. The extrudate is cooled, granulated and dried at l2 (r. at a set temperature of 320-360. (: and the molding temperature is 120 ° C. The test sample is injection molded in a 30 second cycle. The formulation of Table 6 32 shows a blend of resorcinol ester polycarbonate (ITR9010), polysulfone (pSu) and polyoxo-polyimine copolymer (ρΕΙ-decane), which surprisingly reduces two Minutes of exothermic and exothermic 118106.doc -91- 200831609 peak. The two-minute exotherm can be reduced from 63 to 47 kW-min/m2. The thermal peak value drops from 120 to 75 kW/m2. It can also increase the peak exothermic time from 2.56 to 3.72 minutes, delaying the exotherm to reach the maximum intensity. Formulation 3 3 shows polyfluorene and polyethersulfone (PES) and ITR9010 and A blend of polyoxymethylene polyimine which may also have improved exothermic properties and improved flow properties. Table 6 Example* 32 33 34 PSu 62.5 31.25 62.5 PES 0 31.25 0 PEI oxime 2.5 2.5 2.5 ITR9O10 35 35 35 Exothermic 2 min (kW-min/m2) 47 57 31 Peak (kW/m2) 75 75 65 Peak of arrival Time (min) 3.72 2.91 3.74 Appearance Foam Carbon Foam Carbon Foam Carbon MFR@295〇C g/l〇min 13.8 11.9 10.9 * Blend with 3 phr Ti02 Example 6 Table 6, Formulation 34 shows poly A blend of ether oxime (PES) with resorcinol ester polycarbonate (ITR 9010) and 2.5% by weight polyoxymethylene polyimine copolymer. The formulation 34 can be tested according to FAR/OSU and foamed carbon that acts as a barrier against flame spread. It can also have a low exotherm value, a longer time to reach the exothermic peak and can act as a barrier to more effectively prevent flame spread. Example 7 The formulations 35 and 36 in Table 7 show PSU or PES with a higher content (60 weight 118106) .doc -92- 200831609 % by weight) a blend of resorcinol ester polycarbonate copolymer. The blend can exhibit a low two minute exotherm and a low exotherm peak. When burned, the sample produces foam carbon that acts as a barrier against flame propagation. Examples 35 and 36 also exhibited high melt flow, which was surprisingly not burned or flowed away from the flame during the FAR/OSU test. The blend may also exhibit a high flexural modulus of 300 Kpsi or * 2070 MPa) and a high flexural strength 〇 15 Kpsi or 103.5 MPa) and a high; 50%) elongation at break. Table 7 Example* 35 36 Psu 37.5 0 PES 0 37.5 PEI oxime 2.5 2.5 ITR9010 60 60 Exothermic 2 min (kW-min/m2) 59 39 Peak (kW/m2) 70 58 Time to peak (min) 2.65 2.40 Appearance foam carbon foam carbon MFR@295〇C g/l〇min 17.7 13.9 Flexural modulus Kpsi 382 399 Flexural strength Kpsi 17.6 18.3 Tensile strength (Y) Kpsi 11.0 11.7 Tensile modulus Kpsi 372 383 Stretching %(B) 89 110 HDT264 psi°C 134 132 Notched Ehrlich Impact Strength fl>lbs/in 2.6 3.5 * The blend has 3 phr of Ti02. • __ 118106.doc • 93- 200831609 Example 8 The slabs of inventive materials 1, 2, 3 and 4 were held in a rotary holder in a Baltzer vacuum metallization chamber. The chamber is closed and the vacuum pump is activated. The chamber pressure was reduced to a vacuum of 1 (Τ3 and 1〇-4 mBar. The sample was twisted in the holder and pretreated by glow discharge for one minute. The glow discharge method was included in the range of about 0.08 to 0.1 Mbar. The air or argon mixture is introduced into the vacuum chamber under pressure' while the high voltage current source forms a plasma for 1 minute, which improves the surface of the sample. After the glow discharge method is completed, the vacuum pump is started again and the pressure in the chamber is reduced to 1 〇-4. Mbar, and heating the pure aluminum with tungsten wire to evaporate the aluminum and condense on the sample plate. To protect the aluminum layer, apply the coating to the sample, and introduce HMDS (hexamethylene dioxane) during the second glow discharge step In the chamber, HMDS was deposited as a polymer on the aluminum surface to create a light source conditioner. Example 9 The material plates of formulations 1, 2, 3, 4, pSEI_3 and PSEI-4 were clamped in a Baltzer vacuum metallization chamber. Rotating the holder. The chamber is closed and the vacuum pump is activated. The pressure in the chamber is reduced to a vacuum between 10-3 and 10-4 mBari. The sample is rotated in the holder and pretreated by glow discharge for one minute. Glow Discharge French bread The air or argon mixture is introduced into the vacuum chamber at a pressure of about 〇·8 to M1 Mbar, and the high-voltage current source generates a plasma for 1 minute, which improves the surface of the sample. After the glow discharge method is completed, it is started again. Vacuum pump, and reduce the pressure in the chamber to 10 Mb ar 'and heat it with a wire to make it evaporate and condense on the sample 118106. doc -94- 200831609. To protect the aluminum layer, apply the coating to the sample. HMDS (hexamethyldioxane) was introduced into the chamber during the second glow discharge step, and HMDS was precipitated as a polymer on the aluminum surface to produce a light source conditioner. The PSEI-3 and PSEI-4 plates were placed with an initial The temperature was 218 in the Undberg/Blu_flow oven (model Μ01490) and the heat was increased at a rate of approximately 〇·1 C per minute. The plate was tested every 15 minutes until it showed visible signs of loss of reflectance. Table 8 below indicates the temperature at which the plate is reflectively reduced. Similar tests were performed on the annealed psm_3 and PSEI-4 plates before metallization. By heating each plate to a separate glass transfer Annealed, pre-metallized plates are prepared by cooling at a temperature of 2 ° C and at a rate of -1 ° C to 23. 每小时. The data in Table 8 indicates that PSEI_4 is better under certain conditions. PSEI_3. This data also indicates that the molded article is pre-annealed prior to metallization to promote the improvement of the thermal properties of the metal coated article. Table 8. Heat Treatment of Metallized PSEI Plate PSEI-3 PSEI-4 Annealing Temperature (° C) * Temperature (°C)* — is 244 254 No Auntie, ca 232 250 * Temperature at which reflectance loss is observed The present invention has been described with reference to the preferred embodiments, but those skilled in the art should It is understood that various changes can be made and equivalents can be substituted for the elements without departing from the invention. Many modifications can be made to adapt a particular condition or material to the teachings of the present invention without departing from the substance. The invention is not limited to the specific embodiments disclosed for the best mode of the invention, but the invention is intended to cover all embodiments within the scope of the appended claims.
118106.doc 96-118106.doc 96-
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