200826765 AU0605051 21909twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種陣列基板的製造方法，且特別是 有關於一種可撓式陣列基板的製造方法。 【先前技術】 以可撓性基板取代硬質基板製作顯示器已成為下世 f 代顯示器發展的趨勢。平面顯示器是否具備可撓性，取決 ^其所使用的基板材質。當平面顯示器所使㈣基板為硬 質基板(rigid substrate)時，平面顯示器將不具有可撓性。反 之，當平面顯示器所使用的基板為可撓性基板(如塑膠基板) 時，，平面顯示器便具有良好的可撓性。目前，在硬質基板 上製作薄膜電晶體的技術已漸趨成熟，但在可撓性基板上 製作薄膜電晶體的技術仍有待開發。 為了因應可撓性基板導入製程的需求，可利用硬質基 板支撐可撓性基板，於現有設備中進行製程，以降低製二 I， 成本。一般來說，若要在可撓性基板上製作薄膜電晶體， 通常需先將可撓性基板黏著於硬質基板上，之後再進行一 系列的成膜製程。目前將可撓性基板黏著於硬質基板上的 方法通常是以黏著劑全面性塗佈於可撓性基板與硬質基板 之間。然而，全面性塗佈黏著劑會使得黏著劑的用量較高， 而且在接合可撓性基板與硬質基板時，黏著劑中容易有氣 泡的產生。再者，於製程結束後，必須考慮到可撓性基板 是否容易從硬質基板上取下而不傷及成膜製程中所製^的 200826765 AU0605051 21909twf.doc/n 元件。因此，可撓性基板與硬質基板之間的接合(b〇nding) 將影響可撓性陣列基板的製程良率。 【發明内容】 本發明提供一種可撓性陣列基板的製造方法，以提升 可撓性陣列基板的製程良率。 本發明另提供一種基板模組，以改善可撓性基板與硬 質基板之間黏著劑中的氣泡問題。 本發明提出一種可撓性陣列基板的製造方法，其包括 下列步驟。首先，提供—具有—第—表面以及—第二表面 之可撓性基板。然後，於可撓性基板之第一表面上形成多 個溝渠。接著，提供-黏著劑於溝渠中。_，藉由黏著 劑接合可撓性基板錢基板。之後，於可撓性基板 之第二表面上進行一成膜製程。 在本發明之一實施例中，提供黏著劑於溝渠中之方法 例如是提供黏著劑於可撓性基板之第一表面上之溝渠中。 在本發明之一實施例中，可撓性陣列基板的製造方法 更包括移除位於可撓性基板之第一表面上之黏著劑。 在本發明之一實施例中，可撓性陣列基板的製造方法 更包括切割可撓性基板以形成多個可撓性區塊。 在本發明之一實施例中，移除位於可撓性基板之第_ 表面上之黏著劑之步驟是在切割可撓性基板以形成可撓性 區塊之步驟後進行。 在本發明之一實施例中，可撓性陣列基板的製造方法 200826765 AU0605051 21909twf.doc/n 熱或上 更包括提供一能量於黏著劑，其中能量例如是光、 述組合。 在本發明之-實施例中，在完成該成膜製程後 =列基㈣製造方法可進-步使可驗基板與硬質基= 在本發明之-實施例中，上述之可撓性基板例 塑膠基板，而硬質基板例如是一玻璃基板。 在本發明之-實關巾，溝渠的形成方法例如是姓 刻、洋雕印刷(embossing)或是雷射加工(lasermachi 在本發明之—實施财’上述之絲例如是彼此平行 或疋彼此交錯地排列於可撓性基板之第一表面上。 在本發明之-實施例中，上述之成膜製程例如是 元件陣列製程、彩色滤光片製程，或前述製程之缸人。此 外，主動元件陣列製程例如是非⑽薄膜電晶體陣列製 权、多晶;^薄膜電晶體陣列製程或有機薄膜電晶體陣列製 程。 、 本發明另提出-種基板模組’其包括—硬#基板以及 -具有-第-表面以及一第二表面之可撓性基板，其中可 撓性基板H©上具衫赠渠。此基板模組更包括 =配置於溝渠内之黏著劑，其巾可撓性基板之第—表面是 藉由黏著層黏著於硬質基板上。 由於本發明在可撓性基板之表面上形成溝渠，並藉由 /木:的黏著劑黏合可撓性基板與硬質基板，因此可以避 免黏著劑巾有氣泡產生。此外，在本發明之部分實施例中， 200826765 AU0605051 21909twf.doc/n §可撓性基板被切割成多個可撓性區塊時，能夠使黏著劑 被同步移除丄以輕易地將可撓性區塊與硬質基板分離。因 本發明藉由提供可撓性基板與硬質基板—種較佳的黏 著方式，進而改善可撓性陣列基板的製程良率。 上為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1A至圖1E為依照本發明實施例所繪示之可撓性陣 列基板的製造流程剖面圖，圖2A_ 2C所繪示為利用浮 雕印刷形成溝渠之方法，而圖3A至圖3B分縣本發明實 施例中可撓性基板之溝渠排列上視圖。 、 ^首先，請參照圖1A，提供一可撓性基板100,其具有 第一表面102以及第二表面1〇4。在本發明之一實施例中， 可撓性基板100例如是塑膠基板，而塑膠基板之材質例如 是 PES、PET、PI 等。 、 接著請參照圖1B，於可撓性基板1〇〇之第一表面1〇2 上，成多個溝渠106。請參照圖3A與圖3B，溝渠1〇6例 如疋彼此平行(如圖3A)或彼此交錯(如圖3B)地排列於可挽 性基板100之第-表面1〇2上。在本實施例中，溝渠 的^布位置例如是職、於—個顯示面板(pand)的邊界。而 溝渠106的形成方法例如是進行蝕刻製程、浮雕印刷或是 雷射加^。餘刻製程以及雷射加卫為此領域中具有通常知 識者所熟知，故於此不再贅述。 200826765 AU0605051 21909twf.doc/n 另外，利用浮雕印刷形成溝渠106之方法可以如圖2a 至圖2C的製造流程所示。請參照圖2A，首先，提供一具 有第一表面102以及第二表面1〇4之可撓性基板1〇〇，以 及一具有多個突出部202之模具(m〇ld)200。由圖2A可知， 模具200配置於可撓性基板1〇〇之第一表面1〇2的上方。 接著請參照圖2B，對模具200施以一下壓力或對可 撓性基板100施以一上壓力（未繪示），使模具2〇〇壓著於 可撓性基板100之第一表面102上。由圖2B所示，模具 200之突出部202擠壓並陷入可撓性基板100中，以於可 撓性基板100之第一表面102上形成與模具200之突出部 相對應之溝渠106。 请參照圖2C，將模具200升起，使可撓性基板1〇〇 與模具200分離。 接著，請繼續參照圖1C，提供一黏著劑112於可撓性 基板100之第一表面102上之溝渠106中，並藉由黏著劑 112接合可撓性基板1〇〇以及一硬質基板1〇8。在本發明之 一實施例中，硬質基板108例如是玻璃基板。提供黏著劑 112於溝渠1〇6中的方法例如是將可撓性基板100以及硬 質基板108置入一密閉腔室中，並將此密閉腔室抽真空。 將相貼合的可撓性基板100與硬質基板108浸泡在盛有黏 著劑112的容器中。然後，使該密閉腔室的氣壓回復至大 氣壓力。利用真空環境或是低壓環境中壓力的改變以及毛 細現象，可使得容器中的黏著劑112導入可撓性基板100 與硬質基板108之間的溝渠106。之後，提供一能量（如 200826765 AU0605051 21909twf.doc/n 光、熱或前述組合）於黏著劑112以固化黏著劑H2。詳 吕之’當黏著劑112為熱固化性材料時，本實施例可利用 加熱的方式使黏著劑112固化；當黏著劑in為光敏性材 料（如紫外線固化膠）時，本實施例可利用照射光線（如 紫外光）的方式使黏著劑112固化。因此，在可撓性基板 100之第一表面102藉由溝渠1〇6内的黏著劑112黏著於 硬質基板108之後，即形成所謂的基板模組12〇。 接著請參照圖1D，於可撓性基板1〇〇之第二表面1〇4 上進行成膜製程。在本實施例中，成膜製程例如是主動元 件陣列製程、彩色濾光片製程，或前述製程之組合。詳言 之’當可撓性基板100是用以製作出主動元件陣列基板 日守’本實施例可在可撓性基板100上進行主動元件陣列製 程；當可撓性基板100是用以製作出彩色濾光片基板時， 本實施例可在可撓性基板100上進行彩色濾光片製程。當 然’本實施例亦可在可撓性基板100上同時進行主動元件 陣列基板以及彩色濾光片製程，以形成具有彩色濾光薄膜 之主動元件陣列基板。承上述，主動元件陣列製程例如是 非晶矽薄膜電晶體陣列製程、多晶矽薄膜電晶體陣列製程 或有機薄膜電晶體陣列製程。 請參照圖1Ε，切割可撓性基板100，以形成多個可挽 性區塊110。將可撓性基板100切割成可撓性區塊11〇二 方法例如是使用雷射切割(laser cutting)或是機械切割。在 本實施例中，可撓性區塊110的邊界例如是對應於一個顯 示面板的邊界，亦即可撓性區塊110的邊界例如是對應於 200826765 AU0605051 21909twf.doc/n 溝渠106的分布位置。 如圖1E所示，本發明之可撓性陣列基板的製造方法 可進一步包括移除位於可撓性基板10〇之第一表面1〇2上 的黏著劑112,以使可撓性區塊110與硬質基板1〇8分離。 值得注意的是，由於可撓性區塊11〇的邊界例如是對應於 溝渠106的分布位置，因此黏著劑112可在切割可撓性基 板100以形成可撓性區塊110時同步被移除。 , 綜上所述，本發明藉由可撓性基板之溝渠中的黏著劑 將可撓性基板與硬質基板相接合，因此可以避免黏著劑中 氣泡的產生。而且在進行切割可撓性基板以形成可撓性區 塊之後，本發明能將可撓性區塊輕易地與硬質基板分離而 不傷及成膜製程所製作的元件或結構。此外，切割可撓性 基板以形成可撓性區塊的同時，位於溝渠内的黏著劑會一 併被移除，因此不會有黏著劑殘留的問題產生。換言之， 本發明之可撓性陣列基板的製造方法可崎低製造成本並 知·南製程的良率。 I —雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 圖1 A至圖1£:為依照本發明實施例所繪示之可撓性 11 200826765 AU0605051 21909twf.doc/n 陣列基板的製造流程剖面圖。 圖2A至圖2C所繪示為利用浮雕印刷形成溝渠之方 法。 圖3A至圖3B分別為本發明實施例中可撓性基板之溝 渠排列上視圖。 【主要元件符號說明】 100 :可撓性基板 102 :第一表面 104 ··第二表面 106 :溝渠 108 :硬質基板 110 :可撓性區塊 112 :黏著劑 120 :基板模組 200 ·•模具 202 :突出部 12200826765 AU0605051 21909twf.doc/n IX. Description of the Invention: TECHNICAL FIELD The present invention relates to a method of fabricating an array substrate, and more particularly to a method of fabricating a flexible array substrate. [Prior Art] The use of a flexible substrate instead of a hard substrate to produce a display has become a trend in the development of the next generation of displays. Whether the flat panel display is flexible depends on the substrate material used. When the (four) substrate of the flat panel display is a rigid substrate, the flat panel display will not have flexibility. Conversely, when the substrate used in the flat panel display is a flexible substrate (such as a plastic substrate), the flat panel display has good flexibility. At present, the technology for fabricating thin film transistors on rigid substrates has gradually matured, but the technology for fabricating thin film transistors on flexible substrates has yet to be developed. In order to meet the requirements of the flexible substrate introduction process, the flexible substrate can be supported by a rigid substrate, and the process can be performed in an existing device to reduce the cost and the cost. In general, in order to fabricate a thin film transistor on a flexible substrate, it is usually necessary to adhere the flexible substrate to the rigid substrate before performing a series of film forming processes. At present, a method of adhering a flexible substrate to a rigid substrate is generally performed by applying an adhesive integrally between the flexible substrate and the rigid substrate. However, the overall application of the adhesive results in a higher amount of the adhesive, and when the flexible substrate and the rigid substrate are joined, the generation of bubbles is likely to occur in the adhesive. Furthermore, after the completion of the process, it is necessary to consider whether the flexible substrate is easily removed from the hard substrate without damaging the 200826765 AU0605051 21909 twf.doc/n component manufactured in the film forming process. Therefore, the bonding between the flexible substrate and the hard substrate affects the process yield of the flexible array substrate. SUMMARY OF THE INVENTION The present invention provides a method of fabricating a flexible array substrate to improve process yield of a flexible array substrate. The present invention further provides a substrate module for improving the problem of air bubbles in the adhesive between the flexible substrate and the rigid substrate. The present invention provides a method of manufacturing a flexible array substrate comprising the following steps. First, a flexible substrate having a - surface and a second surface is provided. Then, a plurality of trenches are formed on the first surface of the flexible substrate. Next, an adhesive is provided in the trench. _, the flexible substrate money substrate is bonded by an adhesive. Thereafter, a film forming process is performed on the second surface of the flexible substrate. In one embodiment of the invention, a method of providing an adhesive in a trench, for example, is to provide an adhesive in a trench on a first surface of the flexible substrate. In an embodiment of the invention, the method of fabricating the flexible array substrate further includes removing the adhesive on the first surface of the flexible substrate. In an embodiment of the invention, the method of fabricating the flexible array substrate further comprises cutting the flexible substrate to form a plurality of flexible blocks. In one embodiment of the invention, the step of removing the adhesive on the first surface of the flexible substrate is performed after the step of cutting the flexible substrate to form a flexible block. In one embodiment of the invention, a method of making a flexible array substrate 200826765 AU0605051 21909 twf.doc/n heat or further includes providing an energy to the adhesive, wherein the energy is, for example, light, a combination. In the embodiment of the present invention, after the film forming process is completed, the column (four) manufacturing method can further improve the substrate and the hard substrate. In the embodiment of the present invention, the above flexible substrate is exemplified. A plastic substrate, for example, a glass substrate. In the solid towel of the present invention, the method of forming the ditch is, for example, surname carving, embossing or laser processing (lasermachi in the present invention - the implementation of the above-mentioned filaments are, for example, parallel or mutually staggered with each other Arranging on the first surface of the flexible substrate. In the embodiment of the invention, the film forming process is, for example, a device array process, a color filter process, or a cylinder of the foregoing process. The array process is, for example, a non-(10) thin film transistor array, polycrystalline; a thin film transistor array process or an organic thin film transistor array process. The present invention further proposes a substrate module which includes a hard substrate and a a flexible substrate on the first surface and a second surface, wherein the flexible substrate H© has a shirt channel. The substrate module further includes an adhesive disposed in the trench, and the flexible substrate of the towel - the surface is adhered to the hard substrate by the adhesive layer. Since the present invention forms a trench on the surface of the flexible substrate, and adheres the flexible substrate and the hard substrate by the adhesive of /wood: The adhesive towel has bubble generation. Further, in some embodiments of the present invention, 200826765 AU0605051 21909twf.doc/n § When the flexible substrate is cut into a plurality of flexible blocks, the adhesive can be removed synchronously丄In order to easily separate the flexible block from the hard substrate, the present invention improves the process yield of the flexible array substrate by providing a flexible substrate and a hard substrate as a better adhesion method. The above features and advantages of the present invention will become more apparent from the following description of the preferred embodiments illustrated in the accompanying drawings. FIG. 1A to FIG. FIG. 2A-2C illustrates a method for forming a trench by embossing printing, and FIGS. 3A to 3B illustrate a trench arrangement of a flexible substrate according to an embodiment of the present invention. First, referring to FIG. 1A, a flexible substrate 100 having a first surface 102 and a second surface 1〇4 is provided. In one embodiment of the invention, the flexible substrate 100 is, for example, a plastic. Substrate, The material of the plastic substrate is, for example, PES, PET, PI, etc. Next, referring to FIG. 1B, a plurality of trenches 106 are formed on the first surface 1〇2 of the flexible substrate 1A. Please refer to FIG. 3A and FIG. 3B. The trenches 1〇6, for example, are parallel to each other (as in FIG. 3A) or staggered to each other (as shown in FIG. 3B) on the first surface 1〇2 of the slidable substrate 100. In this embodiment, the trenches are disposed at the surface For example, it is the boundary of a display panel, and the method of forming the trench 106 is, for example, an etching process, an embossing process, or a laser addition. The process of the engraving and the laser enhancement are generally common in this field. The knowledge is well known and will not be described here. 200826765 AU0605051 21909twf.doc/n In addition, the method of forming the trench 106 by embossing can be as shown in the manufacturing flow of FIGS. 2a to 2C. Referring to FIG. 2A, first, a flexible substrate 1A having a first surface 102 and a second surface 1〇4, and a mold having a plurality of protrusions 202 are provided. As can be seen from FIG. 2A, the mold 200 is disposed above the first surface 1〇2 of the flexible substrate 1A. Next, referring to FIG. 2B, a pressure is applied to the mold 200 or an upper pressure (not shown) is applied to the flexible substrate 100 to press the mold 2 against the first surface 102 of the flexible substrate 100. . As shown in Fig. 2B, the projection 202 of the mold 200 is pressed and trapped in the flexible substrate 100 to form a trench 106 corresponding to the projection of the mold 200 on the first surface 102 of the flexible substrate 100. Referring to Fig. 2C, the mold 200 is raised to separate the flexible substrate 1 from the mold 200. Next, referring to FIG. 1C, an adhesive 112 is disposed on the trench 106 on the first surface 102 of the flexible substrate 100, and the flexible substrate 1 and the rigid substrate 1 are bonded by the adhesive 112. 8. In one embodiment of the invention, the rigid substrate 108 is, for example, a glass substrate. The method of providing the adhesive 112 in the trench 1〇6 is, for example, placing the flexible substrate 100 and the rigid substrate 108 in a closed chamber and evacuating the sealed chamber. The bonded flexible substrate 100 and the rigid substrate 108 are immersed in a container containing the adhesive 112. Then, the air pressure of the closed chamber is returned to the atmospheric pressure. The adhesive 112 in the container can be introduced into the trench 106 between the flexible substrate 100 and the rigid substrate 108 by a change in pressure or a capillary phenomenon in a vacuum environment or a low pressure environment. Thereafter, an energy (e.g., 200826765 AU0605051 21909 twf.doc/n light, heat or a combination of the foregoing) is applied to the adhesive 112 to cure the adhesive H2. DETAILED DESCRIPTION OF THE INVENTION When the adhesive 112 is a thermosetting material, the embodiment can cure the adhesive 112 by heating; when the adhesive in is a photosensitive material (such as ultraviolet curing adhesive), the embodiment can be utilized. The adhesive 112 is cured by irradiation with light such as ultraviolet light. Therefore, after the first surface 102 of the flexible substrate 100 is adhered to the hard substrate 108 by the adhesive 112 in the trench 1? 6, a so-called substrate module 12 is formed. Next, referring to FIG. 1D, a film forming process is performed on the second surface 1〇4 of the flexible substrate 1A. In the present embodiment, the film forming process is, for example, an active device array process, a color filter process, or a combination of the foregoing processes. In detail, when the flexible substrate 100 is used to fabricate an active device array substrate, the present embodiment can perform an active device array process on the flexible substrate 100; when the flexible substrate 100 is used to fabricate In the case of a color filter substrate, this embodiment can perform a color filter process on the flexible substrate 100. Of course, the active device array substrate and the color filter process can be simultaneously performed on the flexible substrate 100 to form an active device array substrate having a color filter film. In view of the above, the active device array process is, for example, an amorphous germanium thin film transistor array process, a polysilicon thin film transistor array process, or an organic thin film transistor array process. Referring to FIG. 1A, the flexible substrate 100 is cut to form a plurality of manageable blocks 110. The method of cutting the flexible substrate 100 into a flexible block 11 is, for example, using laser cutting or mechanical cutting. In this embodiment, the boundary of the flexible block 110 is, for example, a boundary corresponding to one display panel, that is, the boundary of the flexible block 110 is, for example, corresponding to the distribution position of the 200826765 AU0605051 21909twf.doc/n trench 106. . As shown in FIG. 1E, the method of fabricating the flexible array substrate of the present invention may further include removing the adhesive 112 on the first surface 1〇2 of the flexible substrate 10 to make the flexible block 110. Separated from the rigid substrate 1〇8. It should be noted that since the boundary of the flexible block 11〇 is, for example, corresponding to the distribution position of the trench 106, the adhesive 112 can be synchronously removed when the flexible substrate 100 is cut to form the flexible block 110. . As described above, according to the present invention, the flexible substrate and the rigid substrate are bonded by the adhesive in the trench of the flexible substrate, so that generation of bubbles in the adhesive can be avoided. Further, after the flexible substrate is cut to form a flexible block, the present invention can easily separate the flexible block from the hard substrate without damaging the element or structure produced by the film forming process. Further, while the flexible substrate is cut to form a flexible block, the adhesive located in the ditch is removed together, so that no problem of adhesive residue remains. In other words, the method for manufacturing a flexible array substrate of the present invention can reduce the manufacturing cost and know the yield of the south process. I. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make a few changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1 is a cross-sectional view showing a manufacturing process of an array substrate according to an embodiment of the present invention. 11 200826765 AU0605051 21909 twf.doc/n. 2A to 2C illustrate a method of forming a trench by emboss printing. 3A to 3B are respectively top views of the arrangement of the trenches of the flexible substrate in the embodiment of the present invention. [Description of main component symbols] 100: Flexible substrate 102: First surface 104 · Second surface 106: Ditch 108: Hard substrate 110: Flexible block 112: Adhesive 120: Substrate module 200 • Mold 202: protrusion 12