200825324 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種燈具，特別是指一種具有高散熱 效果與可達到高照明功率的照明模組。 ' 【先前技術】 發光二極體（Light Emitting Diode ;簡稱為LED)，或高 亮度發光二極體（High Light Emitting Diode ;簡稱為 Hled) 皆具有小電流、小功率的特性，因此，已被廣泛地應用於 各種燈具中，例如，投射燈、。雖然單一個發光二極體的 耗電篁極低’但發光過程伴隨產生的熱量仍會逐漸累積而 造成熱效應，並影響其發光效能與使用壽命，當為了增加 照明亮度而提高該發光二極體的照明功率時，會使熱效麻 所造成的影響更為嚴重。因此’發光二極體光源對於熱量 的散發要求極高，相對地，熱量散發效率的良窳也成為改 善發光二極體燈具之照明亮度的限制條件。 參閱圖1與圖2’習知的一照明燈1具有一燈殼11、一 裝设於a亥燈破11内的發光二極體12，及一與該燈殼11相 組結並與該發光二極體12電連接的供電組合體13。 該燈殼11是由鋁擠型材製成，具有一殼體ιη及一凹 設於該殼體111且概成缽形的投射空間112，該發光二極體 12疋谷置於該投射空間112内，以配合界定出該投射空間 112的内曲面113改善其投射與照明效果。 該供電組合體13包括一與該燈殼11相組接的燈座U1 、一容置安裝在該燈座131内並與該發光二極體12電連接 5 200825324 的電路板132，及二相間隔地自該電路板丨32凸伸出該燈座 131外的插電端子133。 雖然該照明燈1可藉由該燈殼u將該發光二極體12照 明過程中產生的熱量導出而增加其散熱效果，但實際上仍 存有下列缺失·· 一、 由於該燈殼11的内、外表面多是呈平滑設計，可 散熱面積有限，散熱效率也受到限制，該發光二極體12的 一般只旎使用照明功率為3W的型式，才能避免熱效應影響 該照明燈1的功能，使該習知照明燈丨相對具有散熱效果 較差與無法進一步提高照明功率與亮度的缺點。 二、 該照明燈1在發光的過程中，除了該發光二極體 12會產生熱量外，該電路板132也會產生熱量，該發光二 極體12的熱量雖然可藉由可導熱的燈殼n發散，但由於該 燈座131多是由塑膠材質製成，使該電路板132供電過程 中產生的熱量較不易被導出，長期使用下，也會影響該電 路板132的功能與使用壽命，同樣具有散熱功能不夠完整 ，及易影響整體效能與使用壽命的缺失。 三、 該照明燈1的電路板132安裝在該燈座131内時 ，通常是以如圖1所示的豎立方式裝設，使該電路板132 與該燈座131接觸面積較小而無法藉由傳導有效散熱，同 樣具有散熱較不佳而會損及其運作效能的缺點。 【發明内容】 因此，本發明之目的，是在提供一種散熱效率較高而 能提升照明功率、照明亮度與整體使用效能的具有散熱燈 6 200825324 殼的照明模組。 本毛明的另一目的，是在提供一種可增加散熱面積與 對流效應而能有效改善散熱效率並適用於各種燈具的散熱 燈殼。 … 於是，本發明具有散熱燈殼的照明模組包含一散熱殼 體單元、一安裝於該散熱殼體單元内的發光元件，及一與 該發光元件電連接的電力單元。 該散熱殼體單元是由可導熱的金屬材質所製成，包括 可相組接的一燈殼，及一燈座，該燈殼具有一圍繞一軸線 並界定出一投射空間的主殼體，及多數個圍繞該軸線相間 隔地凸設於該主殼體一外表面的散熱肋條，該等散熱肋條 各具有與該主殼體的外表面相間隔且呈反向設置的一窄端 寬度大於該窄端部的寬度的寬端部，及一自該窄端 部呈寬度漸增地延伸到該寬端部的肋面部，該燈座具有一 座體、一凹設於該座體的容置槽，及多數個相間隔地設置 於該座體一外表面的散熱鰭片。 该發光元件是位於該散熱殼體單元之燈殼的投射空間 内，包括一貼觸於該燈殼的主殼體的基部、一設置於該基 部的發光部’及分別連設至該發光部且不與該主殼體接觸 的一正端子、一負端子。 該電力單元包括二穿設該散熱殼體單元的燈座與燈殼 分別與該發光元件的正、負端子電連接的導線，及一與該 二導線電連接的供電組合體，該供電組合體是裝設於該燈 座的容置槽並與其座體相貼觸。 200825324 而本發明散熱燈殼是由可導熱的金屬材質所製成，包 含一主殼體，及多數個相間隔地設置於該主殼體的散熱肋 條。 該主殼體包括一圍繞一轴線凹設形成於該主殼體的投 射空間。 該專政熱肋條是圍繞談軸線相間隔地凸設於該主殼體 外表面’各包括與該主殼體的外表面相間隔且呈反向設 置的一窄端部、一寬度大於該窄端部的寬度的寬端度，及 一自該窄端部呈寬度漸增地延伸到該寬端部的肋面部。 本發明另一種型式的散熱燈殼也是由可導熱的金屬材 質所製成，包含呈相間隔設置的一内殼體、一外殼體，及 至少一設置於該内、外殼體之間的中介殼體。 该内殼體包括一内底壁，及一自該内底壁周緣傾斜向 上延伸的内圍繞壁。 該外殼體包括一與該内底壁相間隔的外底壁，及一自 該外底壁周緣傾斜向上延伸並與該内圍繞壁相間隔的外圍 繞壁。 該中介殼體包括一分別與該内底壁與該外底壁相貼觸 的中間底壁，及一自該中間底壁周緣傾斜向上延伸，並分 別與該内、外圍繞壁相間隔的中間圍繞壁。 因此，本發明的有益效果在於：除了可藉由該散熱殼 體單元的設計同時改善該發光二極體與該供電組合體的散 熱效率外，還可藉由該窄端部到寬端部的面積變化，或該 内殼體、外殼體與中介殼體多層殼式的設計與面積變化， 8 200825324 在該燈殼形成有溫差的溫度分佈而較易產生熱對流，以進 -步增加散熱效率’使本發明相對具有散熱效果較佳、可 增加照明功率與亮度及使用效能較佳㈣性與優點。 【實施方式】 ^ 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之數個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖4與圖5，本發明具有散熱燈殼的照明模組2之 一第一較佳實施例包含一散熱殼體單元3、一安裝於該散埶 殼體單元3内的發光元件4、-與該發光元件4電連接的電 力早70 5,及一對應該發光元件4覆設封裝於該散熱殼體單 元3的透光片6。 孩散熱鈸體單元3是由可導熱的金屬材質所製成，包 括可相組接的一燈殼31，及一燈座32，該燈殼31具有一 圍繞一軸線I並界定出一概呈缽形的投射空間312的主殼體 3Π ’及多數個圍繞該軸線I相間隔地凸設於該主殼體311 一外表面313的散熱肋條314，該等散熱肋條314各具有與 該主殼體311的外表面313相間隔且呈反向設置的一窄端部 315、一寬度大於該窄端部315的寬度的寬端部316,及一 自該窄端部3 15呈寬度漸增地延伸到該寬端部3 16的肋面 部317’該燈座32具有一座體321、一凹設於該座體32! 的容置槽322，及多數個相間隔地設置於該座體321 一外表 9 200825324 面323的散熱鰭片324。 其中，該燈殼31的主殼體311具有一鄰接該燈座32的 基壁部318,及一自該基壁部318周緣朝遠離該燈座32的 方向延伸的圍繞壁部319，該投射空間312是由該基壁部 318與該圍繞壁部319配合界定形成，且該等散熱肋條314 是相間隔地設置於該圍繞壁部319的外表面，在該較佳實 施例中，每一散熱肋條314的窄端部315是鄰接於該基壁 部318，其寬端部316則是遠離該基壁部318設置。但不應 以此限制該等散熱肋條314的設計型式，也可以使該寬端 部316鄰接於該基壁部318，該窄端部315則遠離該基壁部 318 ^又置，同樣可藉由該等散熱肋條Η#的寬度與散熱面積 的變化達到有溫差的溫度分佈型式。 在該第一較佳實施例中，該燈殼31與該燈座32是分 別由鋁擠型材一體製成，而具有較佳的導熱與散熱功能， 此外，該散熱殼體單元3還包括分別塗覆於該燈殼31的一 第一輔助散熱層33，及塗覆於該燈座32的一第二輔助散熱 層34，δ亥第一輔助散熱層33是均勻地塗覆於該主殼體 的外胃表面313與該等散熱肋條314上，該第二輔助散熱層 34疋均勻地塗覆於該座體32厂的外表面μ)與該等散熱鰭 片324上。該第一、第二輔助散熱層、34的塗覆方式是 將以氮化领為原料的導熱塗料分別喷塗於該燈殼31與該燈 座32後，再經乾燥使氮化硼粒子固著而形成，配合該氮化 硼所形成的第一、第二辅助散熱層33、34可使該燈殼31、 燈座32的散熱表面大幅增加（可提高到15〇倍以上），所以 10 200825324 可再進一步提升該散熱殼體單元3的散熱效果。 較佳地，該散熱殼體單元3還包括一設置於該燈殼3ι 與該燈座32之間卡接單元35，該卡接單元35包括至少一 個朝向該燈殼31地凸設於燈座32之座體321的卡接凸柱 351，及至少一個對應該卡接凸柱351凹設於該燈殼3丨之 主殼體311，而可供該卡接凸柱351容置定位的卡接凹槽 352，組裝時，是藉由該卡接凸柱351與該卡接凹槽μ。相 對應卡接使該燈殼31與該燈座32相組結，再配合螺接結 構就可進一步使該燈殼31與燈座32呈不會相對移動與轉 動的組合成一體。 該發光元件4是位於該散熱殼體單元3之燈殼31的投 射空間312内，包括一貼觸於該燈殼31的主殼體3ιι的基 部41、一設置於該基部41的發光部42，及分別連設至該 發光部42且不與該主殼體hi接觸的一正端子43丨、一負 端子432，在該較佳實施例中，是使甩LED作為該發光元 件，且該發光το件4是藉由導熱膠貼固或低溫焊錫焊接固 定於該主殼體311。 該電力單元5包括二穿設該散熱殼體單元3的燈座32 與燈殼31分別與該發光元件4的正、負端子431、432電 連接的導線51，及一與該二導線51電連接的供電組合體 52，該供電組合體52是裝設於該燈座32的容置槽322並 與其座體321相貼觸。 該供電組合體52具有一與該二導線51電連接並貼觸 於該燈座32的座體321的電路板521、二分別與該電路板 11 200825324 521電連接並朝遠離該發光元件4的方向延伸而適於與一外 部電力（圖未示）電連接的插電端子522，及一配合該燈座32 的容置槽322圍繞包覆在該電路板521外並可供該二插電 端子522穿設定位的固定座523，在該較佳實施例中，該電 路板521是以導熱膠黏固於該燈座32。 較佳地，該散熱殼體單元3之燈座32的該等散熱鰭片 324是圍繞該轴線I相間隔地設置於該燈殼31與其座體32 之間，並相配合界定出一位於該燈殼31的基壁部318與該 座體321之間，以供該二導線51容置的過渡區間325。 此外，該燈座32還具有一貫穿其座體321的穿線口 326 ’及該燈殼31具有多數個對應該穿線口 326貫設於該 主殼體311的二通孔3110，該電力單元5的導線51是依序 通過该穿線口 326與該二通孔3110而分別與該發光元件4 的正、負端子43 1、432電連接。 該透光片6是覆設封裝於該燈殼31的投射空間312， 及圍繞該發光元件4的發光部42設置。 較佳地，該照明模組2還包括一圈繞組接於該燈殼31 之主殼體311 —外周緣的環狀罩蓋7，該環狀罩蓋7並可防 止該透光片6脫落而可穩定地定位在該燈殼31的投射空間 312 内。 再配合參閱圖6,使用時，是先將該電力單元5的插電 端子522與該外部電力電連接，以通過該電路板521、該二 導線51將電力提供至該發光元件4，激發該發光部42產生 光線，所產生的光線可通過該透光片6照射出，並可配合 12 200825324 該透光片6的設計增加光線折射與散射效果，進而可增加 照明的亮度。 在該發光元件4照明期間，該電路板521與該發光元 件4皆會有部分電能作功成為熱能，所產生的熱能若持續 累積於該電路板521與該發光元件4處而成高溫狀態，將 會影響到該發光元件4與該電路板521的效能，因此本發 明有效與高效率的散熱設計將可避免熱效應的不良影響， 並可維持整體照明模組2的工作效能。 該發光元件4所產生的熱能可經由該基部41透過該導 熱膠傳導到該燈殼31，藉由連設於該主殼體311的散熱肋 條314，增加該燈殼31的散熱面積，而可加速熱量的傳導 與發政’此外’由於該等散熱肋條314是呈有寬度變化的 設計，使該窄端部315的散熱面積會比該寬端部316的散 熱面積小，所對應的散熱量也相對較低，而形成沿該窄端 部315經該肋面部317至該寬端部316呈溫度逐漸降低的 分佈狀態，藉由此種設計所造成的溫差分佈，可在該窄端 部315與該寬端部316之間形成熱對流而更有利於散熱。 該電路板521的熱量也可透過該導熱膠傳導到該燈座 32，再藉由设置於該座體321的散熱鰭片324增加散熱面 積而可加速散熱效率，避免該電路板521的溫度過高而影 響其效能。 值得說明的是，本發明藉由該等散熱肋條314有寬度 變化的設計而可形朗流以進—步提升散熱速度，因此， 可配合使用具有較高功率的發光元件4，例如，—般的散熱 13 200825324 料只能配合使用約3W功率的發光元件4，如果使用具較 南功率的發光元件4則可能因散熱效率不佳，溫度過高導 致該發光元件4燒毁，而本發明藉由可引發對流進一步增 加散熱效率的設計則可使用到功率5W的發光元#4，使照 明冗度可再提升而增加該照明模組2的應用範圍。 此外西己〇以氮化哪為原料形成於該燈殼^、燈座μ 的第-、第二輔助散熱層33、34，還能進一步增加總散熱 面積，使散熱效率更加提高。 ★，閱圖8 #本發明_第二較佳實施例所採用的散熱燈 殼31型式，該第二較佳實施例與該第—較佳實施例的差別 主要是在祕殼31的設計型式，其他構造與元件則與該第 -較佳實施例相同，所以在此僅就該第二較佳實施例的燈 殼3'進行說明，該散熱燈殼31也是由可導熱的金屬材質 所製成，包含-内殼體36、一與該内殼體36相間隔設置的 外殼體37 ’及至少-設置於該内、外殼體％、37之間的中 介殼體38，在該較佳實施例中，該内、外殼體％、37與該 中介设體38皆是由紹擠型材所製成。 該内殼體36包括一内底壁361，及一自該内底壁361 周緣傾斜向上延伸的内圍繞壁362。 該外咸體37包括一與該内底壁361相間隔的外底壁 371，及自該外底壁371周緣傾斜向上延伸並與該内圍繞 壁362相間隔的外圍繞壁372。 該中介殼體38包括一分別與該内底壁361與該外底壁 371相貼觸的中間底壁381，及一自該中間底壁381周緣傾 14 200825324 斜向上延伸，並分別與該内、外圍繞壁362、372相間隔的 中間圍繞壁382。在該第二較佳實施例中，該燈殼η是包 含有多數個設置於該内、外殼體36、37之間的中介殼體38 ’且該等中介殼體38的中間底壁381是呈緊密地相貼觸， 及其中間圍繞壁382是呈相間隔地設置，但該中介殼體38 的數量不應該因此受到限制，也可以只設置一個中介殼體 38，或二個、三個，甚至三個以上的中介殼體38，都可達 到有效增加散熱面積的目的。 此外’該内殼體36的内圍繞壁362、該等中介殼體38 的中間圍繞壁382，及該外殼體37的外圍繞壁372是自内 而外呈咼度漸增的型式，而可更進一步擴大該等圍繞壁362 、382、372的面積差距而較易形成有溫差的分佈型態。 當該發光元件4(見圖4)藉由導熱膠貼設至該内殼體36 的内底壁361時，照明過程所產生的熱量同樣可透過該内 底壁361、中間底壁381、外底壁371傳導並分別往該内圍 繞壁362、中間圍繞壁382與外圍繞壁372導出散熱，配合 呈相間隔排列設置的該等圍繞壁362、382、372的設計型 式，同樣可增加該燈殼3丨的總散熱面積，加上該内圍繞壁 362、中間圍繞壁382與外圍繞壁372的散熱面積不同，而 在該等圍繞壁362、382、372严曰]造成有溫差的溫度分佈型 態，藉此，同樣可利用溫差形成的熱對流進一步加速該燈 殼31的散熱效率，而達到與該第一較佳實施例相同的效熱 效果。 同樣地，也可以在該内殼體36、中介殼體38與外殼體 15 200825324 37的外表面喷塗以氮化硼為原料的導熱塗料，以形成該第 一輔助散熱層33，進而更進一步地改善該燈殼31的散熱效 果。 歸納上述，本發明具有散熱燈殼的照明模組2可獲致 下述的功效及優點，故確實能達到本發明的目的： 一、 除了以易散熱的金屬材質製造該燈殼31外，還以 分別在該燈殼31的主殼體311設置的該等散熱肋條314, 或以多數具不同口徑並呈相間隔排列的圍繞壁362、382、 372等型式大幅增加該燈殼31的散熱面積，使該發光元件 4車乂不易受熱效應影響，而具有散熱效果較佳的優點。 二、 配合該等散熱肋條314的窄端部315、肋面部317 與寬端部316 #寬度與散熱面積的變化，造成有溫差的溫 度分佈型態，而有利於形成熱對流，以進一步加速熱量的 散發，即使增加所使用的發光4的功率值也不會影響 其發光效能，使本發明可藉由增加該發光元件4的照明二 率’而提高照明亮度與應用範圍。 、 丹外敖體37的組結 型式，使該内圍繞壁362、中間圍繞壁382與外圍繞壁奶 各具有不同的散熱面積，而能於該發光元# 4照明過程中 形成有溫差的溫度分佈，同樣有利於造成熱對流而能進一 ^加速散熱，並能增加該發光元# 4的照明功率以增加單 一發光兀件4的照明亮度，盘 應用範圍。 ”進外加該照明模組2的 四 除了對該發光元件 4作散熱設計外，裝設該電路 16 200825324 板521的燈座32也配合使用散熱效果較佳的材質，並增設 散熱鰭片324進一步增加散熱面積以加速散熱，使該電路 板521也較不易受熱效應影響，使本發明可藉由提供較完 整的散熱設計增加整體的效能與使用壽命。 五、藉由該第一、第二輔助散熱層33、34額外再增加 該燈殼31、燈座32的散熱面積，更有助於熱量的發散，同 樣可使本發明藉由有效而快速的散熱，達到可增如整體效 能與延長使用壽命的功效。 參閱圖3、圖7與圖8，以下就一實驗測試結果補充說 明該散熱燈殼31藉由該等散熱肋條314,或該内殼體36、 中介殼體38與外殼體37層層環狀相疊的設計所能達成的 效果，表-1為在室溫環境（環境溫度為20°C)下，將LED分 別裝設至燈殼A、燈殼B1、燈殼B2、燈殼C，並對該發光 元件持續通電以提供照明，經過3小時後，再量測該燈殼A 、燈殼B1、燈殼B2與燈殼C的光通量與燈殼溫度的結果 ，其中，燈殼A(見圖3)是傳統未設置有散熱肋條或散熱鰭 片的钵形燈殼11，燈殼B1與燈殼B2(見圖7)皆是本發明設 置有散熱肋條314的燈殼31，燈殼C(見圖8)則是由該内殼 體36、該等中介殼體38與該外殼體37環狀組合的燈殼31 ，其中，燈殼A與燈殼B1所搭配的LED之功率皆為3W， 燈殼B2與與燈殼C所搭配之LED之功率則為5 W。 要再補充說明的是，本測試所採用的LED有二種類型 ，燈殼A、燈殼B1與燈殼B2所搭配的是傳統由砷化鎵晶 粒所製成的LED，燈殼C所搭配的則是由矽晶片的晶粒所 17 200825324 製成的LED，不同的晶粒型式所造成的差別主要是使用相 同功率的LED時，以矽晶片晶粒製造的LED的光通量會比 由砷化鎵晶粒所製造者高，但散熱溫度則與晶粒型式無直 接關聯，主要是與所用LED的功率有關，功率越高所產生 的熱篁與溫度也相對越高，因此雖然不同晶粒所製造的 LED會表現不同的照明亮度，但仍可直接以具有相同功率 的LED比較不同型式燈殼的散熱效果。 型式 燈般A 燈殼B1 燈殼B2 燈般C LED功率（W) 3 3 5 5 光通量（LM) 105 110 140 180 散熱溫度（°C) 72.6 x-63.0 Y-61.5 z-57.8 x-73.0 y-71.5 ζ-67·8 a-60·0 b-58.4 c-56.8 d-55.2 e-53.6 …此风j i μ签s> 丄δ、碌寻敢熟肋 •条 的乍端部315、寬端部316等部位所量得的溫度。 註（2) . a、b一、c、d、e分別表示該燈殼31自内而外依序在該内殼體 36、三個中介殼趙38、外殼體37所量得的溫度。 根據表1的結果顯示，使用相同功率（3W)的led時， 燈殼B1的光通量會略高於燈殼a的光通量，且在該燈殼 B1不同位置里#的溫度皆小於該燈殼a的溫度，顯示本發 明的設計確實可增加散熱效率，此外，燈殼A的溫度分佈 是呈均-而沒有溫差的分佈型式(即圖3的該殼體ηι上的 任何位置的溫度是呈均溫分佈），燈殼m的溫度則是呈有 /皿差的刀佈型式’顯不該等散熱肋條力寬度變化可導 致溫差分佈而較易引說献番^ ^ 匆引起熱對流，以再增進散熱效果，進而 18 200825324 使LED可表現較佳的效能，而相對有較高的光通量。 另外’根據燈殼B2與燈殼C的測試數據可看出，不管 是具有散熱肋條314,或具有多層殼體36、38、37的燈殼 3 1都能承受功率5 W的LEd，並能快速的散熱，燈殼b2除 了該基壁部318的温度略高於該燈殼A的溫度外，其餘部 位所量得的溫度值皆低於燈殼A，燈殼c則由於是將内殼 體36、中介设體38與外殼體37層層相疊，使其總散熱表 面積比燈殼B2更大幅增加，進而能呈現較低的溫度與表現 更佳的散熱效果，同時，燈殼B2與燈殼c都還是保持有溫 差的溫度分佈型式，顯示本發明的散熱燈殼31確實可藉由 該等散熱肋條314，或該等殼體36、37、38增加散熱面積 與造成熱對流，而能達到有效散熱與可搭配高功率的發光 元件4的使用功能。 值得說明的是，雖然相同功率的LED通常可表現同等 的照明亮度（光通量），但與不同燈殼相搭配時，由於不同燈 殼所表現的散熱效果不同，若具有較佳的效熱效果則可避 免在LED累積過多的熱量而影響其發光效能，因此，雖然 燈殼A與燈殼B1所搭配的LED功率與型式都是相同的， 但由於燈殼B1有較佳的散熱效果，而可於燈殼Bi量測到 略局於燈殼A的光通量。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 19 200825324 【圖式簡單說明】 圖1是一立體分解圖，說明習知的一照明燈； 圖2是一組合剖視圖，說明該照明燈組裝完成的情形 圖3是-立體圖，說明習知照明燈所用的燈殼型式； 圖4疋一頂視的立體分解圖，說明本發明具有散熱燈 殼的照明模組的一第一較佳實施例； 圖5是-後視的立體分解圖，說明該較佳實施例； 圖6是一立體組合圖，說明該較佳實施例組裝完成的 情形； 說明該第一較佳實施例一散熱燈殼 說明本發明一第二較佳實施例一散 圖7是一立體圖 的設計型式；及 圖8是一剖視圖 熱燈殼的設計型式。 20 200825324 【主要元件符號說明】 2……· …照明模組 35卜· -----^接凸柱 3…·… …散熱殼體單元 352… -----^接凹槽 ^ a ______ «3 i…… …燈欢 .· 門叙肢 311 ·… …主殼體 361… •…内底壁 312 ·… …投射空間 362… •…内圍繞壁 313 * … …外表面 37…… •…外设體 314 ·… …散熱肋條 371… •…外底壁 315 ·… …窄端部 372… •…外圍繞壁 316… …寬端部 38"… •…中介殼體 317 ·… …肋面部 381… •…中間底壁 318… …基壁部 382… …·中間圍繞壁 319 ·… …圍繞壁部 4…… •…發光元件 3110 … …通孔 41 ••… •…基部 ^ 〇 ..... Λ1..... .· · ·媒止划 5 L...... …燈厘 321 ···· …座體 431… —正端子 322 ···· …容置槽 432… •…負端子 323 ·… …外表面 5…… …·電力單元 324 …· …散熱鰭片 51 ••… •…導線 325 …· …過渡£間 52••… …·供電組合體 326 * * …穿線口 521… •…電路板 33…… …第一輔助散熱層 522… •…插電端子 34…… …第二辅助散熱層 523… •…固定座k 3 5…… ----^接單元 6…… •…透光片 21 200825324 7 ·………環狀罩蓋 I.........••軸線 22200825324 IX. Description of the Invention: [Technical Field] The present invention relates to a lamp, and more particularly to a lighting module having high heat dissipation effect and high illumination power. [Prior Art] Light Emitting Diodes (LEDs) or High Light Emitting Diodes (HLEDs) have small current and low power characteristics, so they have been Widely used in a variety of luminaires, such as projection lamps. Although the power consumption of a single light-emitting diode is extremely low, the heat generated by the light-emitting process will gradually accumulate and cause a thermal effect, which affects its luminous efficacy and service life. When the brightness is increased, the light-emitting diode is increased. When the lighting power is used, the effect caused by the heat effect is more serious. Therefore, the light-emitting diode light source requires extremely high heat emission. In contrast, the heat dissipation efficiency is also a limiting condition for improving the illumination brightness of the light-emitting diode lamp. Referring to FIG. 1 and FIG. 2, a conventional illumination lamp 1 has a lamp housing 11 , a light-emitting diode 12 mounted in the a-light 11 , and a light-emitting diode 11 and the same The power supply assembly 13 to which the light-emitting diodes 12 are electrically connected. The lamp housing 11 is made of an aluminum extruded material, and has a housing and a projection space 112 recessed in the housing 111 and formed in a meandering shape. The light-emitting diode 12 is placed in the projection space 112. Internally, the inner curved surface 113 defining the projection space 112 is adapted to improve its projection and illumination effects. The power supply assembly 13 includes a socket U1 that is coupled to the lamp housing 11, a circuit board 132 that is received in the socket 131 and electrically connected to the LED 12, and a two-phase circuit. The plug-in terminals 133 outside the socket 131 are protruded from the circuit board 32 at intervals. Although the illuminating lamp 1 can increase the heat dissipation effect of the illuminating diode 12 by the heat generated during the illumination of the illuminating diode 12, there are actually the following defects: 1. Due to the lamp housing 11 The inner and outer surfaces are mostly designed to be smooth, the heat dissipation area is limited, and the heat dissipation efficiency is also limited. The light-emitting diode 12 generally uses only a type of illumination power of 3W to prevent the thermal effect from affecting the function of the illumination lamp 1. The conventional illumination lamp has the disadvantage that the heat dissipation effect is relatively poor and the illumination power and brightness cannot be further improved. 2. In the process of illuminating the illuminating lamp 1, in addition to the heat generated by the illuminating diode 12, the circuit board 132 generates heat, and the heat of the illuminating diode 12 can be controlled by a heat-conductible lamp housing. n diverges, but since the lamp holder 131 is mostly made of a plastic material, the heat generated during the power supply of the circuit board 132 is less likely to be derived, and the function and service life of the circuit board 132 may also be affected under long-term use. The same heat dissipation function is not complete, and it is easy to affect the overall performance and the lack of service life. 3. When the circuit board 132 of the illuminating lamp 1 is mounted in the lamp holder 131, it is usually installed in an upright manner as shown in FIG. 1, so that the contact area between the circuit board 132 and the lamp holder 131 is small and cannot be borrowed. Effective heat dissipation by conduction also has the disadvantage of poor heat dissipation and damage to its operational efficiency. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a lighting module having a heat dissipating lamp 6 200825324 having a high heat dissipation efficiency and capable of improving lighting power, lighting brightness, and overall use efficiency. Another object of the present invention is to provide a heat-dissipating lamp envelope which can increase the heat dissipation area and convection effect and can effectively improve the heat dissipation efficiency and is suitable for various lamps. Therefore, the lighting module having the heat-dissipating lamp housing of the present invention comprises a heat-dissipating housing unit, a light-emitting element mounted in the heat-dissipating housing unit, and a power unit electrically connected to the light-emitting element. The heat dissipation housing unit is made of a heat-conducting metal material, including a lamp housing that can be assembled, and a lamp holder having a main housing surrounding an axis and defining a projection space. And a plurality of heat dissipation ribs protruding from the outer surface of the main casing at intervals around the axis, the heat dissipation ribs each having a narrow end width spaced apart from the outer surface of the main casing and disposed in a reverse direction a wide end portion of the width of the narrow end portion, and a rib portion extending gradually from the narrow end portion to the wide end portion, the lamp holder having a body and a receiving groove recessed in the seat body And a plurality of heat dissipating fins disposed on an outer surface of the base body at intervals. The light-emitting element is located in a projection space of the lamp housing of the heat-dissipating housing unit, and includes a base portion of the main housing that is in contact with the lamp housing, a light-emitting portion disposed at the base portion, and a light-emitting portion respectively connected to the light-emitting portion And a positive terminal and a negative terminal that are not in contact with the main casing. The power unit includes two wires electrically connected to the lamp socket and the lamp housing of the heat dissipation housing unit and the positive and negative terminals of the light emitting component, and a power supply assembly electrically connected to the two wires. The power supply assembly It is installed in the receiving groove of the lamp holder and is in contact with the seat body. 200825324 The heat dissipation lamp housing of the present invention is made of a heat conductive metal material, and comprises a main casing and a plurality of heat dissipating ribs spaced apart from the main casing. The main housing includes a projection space recessed around an axis to form the main housing. The dictator heat ribs are disposed on the outer surface of the main casing at intervals along the axis of the main body. Each of the outer ribs is spaced apart from the outer surface of the main casing and disposed at a narrow end portion, and a width greater than the narrow end portion. The wide end of the width, and a rib face extending gradually from the narrow end portion to the wide end portion. Another type of heat-dissipating lamp housing of the present invention is also made of a heat-conducting metal material, comprising an inner casing, an outer casing, and at least one intermediate casing disposed between the inner and outer casings. body. The inner casing includes an inner bottom wall and an inner surrounding wall extending obliquely upward from a periphery of the inner bottom wall. The outer casing includes an outer bottom wall spaced from the inner bottom wall and a peripheral winding wall extending obliquely upward from the outer peripheral wall and spaced from the inner surrounding wall. The intermediate housing includes an intermediate bottom wall respectively contacting the inner bottom wall and the outer bottom wall, and an intermediate portion extending obliquely upward from a circumference of the intermediate bottom wall and spaced apart from the inner and outer surrounding walls respectively Surround the wall. Therefore, the beneficial effects of the present invention are that, in addition to improving the heat dissipation efficiency of the light emitting diode and the power supply assembly by the design of the heat dissipation housing unit, the narrow end portion to the wide end portion can also be The area change, or the design and area change of the inner shell, the outer shell and the intermediate shell, and the shape and area change of the inner shell, the outer shell and the intermediate shell, 8 200825324, the temperature distribution of the temperature difference is formed in the lamp shell, and heat convection is more easily generated to further increase the heat dissipation efficiency. The invention has the advantages of better heat dissipation effect, increased illumination power and brightness, and better performance (four) properties and advantages. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 4 and FIG. 5, a first preferred embodiment of the lighting module 2 having a heat-dissipating lamp housing comprises a heat-dissipating housing unit 3, a light-emitting component 4 mounted in the heat-dissipating housing unit 3, - the electric power electrically connected to the light-emitting element 4 is earlier than 70, and a pair of light-emitting elements 4 are disposed to cover the light-transmissive sheet 6 of the heat-dissipating casing unit 3. The child heat sink unit 3 is made of a heat conductive metal material, and includes a lamp housing 31 that can be assembled, and a lamp holder 32 having an axis I defined around the axis. The main housing 3 ′′ of the shaped projection space 312 and a plurality of heat dissipation ribs 314 protruding from the outer surface 313 of the main housing 311 are spaced apart from the axis I, and the heat dissipation ribs 314 each have a main housing The outer surface 313 of the 311 is spaced apart and disposed in a reverse direction, a narrow end portion 315, a wide end portion 316 having a width greater than the width of the narrow end portion 315, and an increasing width from the narrow end portion 3 15 To the rib portion 317' of the wide end portion 3 16 , the socket 32 has a body 321 , a receiving groove 322 recessed in the base 32 ! , and a plurality of spaced apart portions of the seat body 321 . 9 200825324 Heat sink fins 324 of face 323. The main housing 311 of the lamp housing 31 has a base wall portion 318 adjacent to the socket 32, and a surrounding wall portion 319 extending from the periphery of the base wall portion 318 away from the socket 32. The space 312 is defined by the base wall portion 318 and the surrounding wall portion 319, and the heat dissipation ribs 314 are spaced apart from the outer surface of the surrounding wall portion 319. In the preferred embodiment, each The narrow end portion 315 of the heat dissipation rib 314 is adjacent to the base wall portion 318, and the wide end portion 316 is disposed away from the base wall portion 318. However, the design of the heat dissipation ribs 314 should not be limited. The wide end portion 316 can be adjacent to the base wall portion 318. The narrow end portion 315 is further away from the base wall portion 318. A temperature distribution pattern having a temperature difference is achieved by the variation of the width and the heat dissipation area of the heat dissipation ribs Η#. In the first preferred embodiment, the lamp housing 31 and the lamp holder 32 are integrally formed of an aluminum extruded profile, respectively, and have better heat conduction and heat dissipation functions. Further, the heat dissipation housing unit 3 further includes respectively a first auxiliary heat dissipation layer 33 coated on the lamp housing 31, and a second auxiliary heat dissipation layer 34 coated on the lamp holder 32, the first auxiliary heat dissipation layer 33 is uniformly applied to the main housing The outer outer surface 313 of the body and the heat dissipation ribs 314 are uniformly coated on the outer surface of the base 32 and the heat dissipation fins 324. The first and second auxiliary heat dissipation layers 34 are coated by spraying the heat conductive paint with the nitrided material as the raw material on the lamp housing 31 and the lamp holder 32, and drying the boron nitride particles. The first and second auxiliary heat dissipation layers 33 and 34 formed by the boron nitride can form a large increase in the heat dissipation surface of the lamp housing 31 and the lamp holder 32 (up to 15 times or more), so 10 200825324 can further improve the heat dissipation effect of the heat dissipation housing unit 3. Preferably, the heat-dissipating housing unit 3 further includes a latching unit 35 disposed between the lamp housing 3 and the socket 32. The latching unit 35 includes at least one protruding lamp holder 31 facing the lamp housing 31. The latching post 351 of the base 321 of the 32, and at least one main housing 311 corresponding to the latching post 351 recessed in the lamp housing 3, and the card for the positioning of the latching post 351 The recess 352 is assembled by the latching post 351 and the latching groove μ. Correspondingly, the lamp housing 31 is assembled with the lamp holder 32, and the screwing structure is further configured to further integrate the lamp housing 31 and the lamp holder 32 into a combination that does not move relative to the rotation. The light-emitting element 4 is located in the projection space 312 of the lamp housing 31 of the heat dissipation housing unit 3, and includes a base portion 41 that is in contact with the main housing 3 ι of the lamp housing 31, and a light-emitting portion 42 disposed on the base portion 41. And a positive terminal 43A and a negative terminal 432 respectively connected to the light emitting portion 42 and not in contact with the main housing hi. In the preferred embodiment, the LED is used as the light emitting element, and the The light-emitting member 4 is fixed to the main casing 311 by heat-adhesive bonding or low-temperature soldering. The power unit 5 includes two wires 51 electrically connected to the lamp housing 32 of the heat dissipation housing unit 3 and the lamp housing 31 and the positive and negative terminals 431 and 432 of the light-emitting element 4, and one of the two wires 51. The power supply assembly 52 is connected to the receiving groove 322 of the socket 32 and is in contact with the base 321 . The power supply assembly 52 has a circuit board 521 electrically connected to the two wires 51 and contacting the base 321 of the socket 32, and two electrically connected to the circuit board 11 200825324 521 and away from the light-emitting element 4 The plug-in terminal 522, which is adapted to be electrically connected to an external power (not shown), and a receiving slot 322 that cooperates with the socket 32 are wrapped around the circuit board 521 and are available for the two plug-in The terminal 522 is inserted into the fixed holder 523. In the preferred embodiment, the circuit board 521 is adhered to the socket 32 by a thermal conductive adhesive. Preferably, the heat dissipation fins 324 of the socket 32 of the heat dissipation housing unit 3 are disposed between the lamp housing 31 and the base 32 at intervals along the axis I, and cooperate to define a location. A transition section 325 is provided between the base wall portion 318 of the lamp housing 31 and the base body 321 for receiving the two wires 51. In addition, the lamp holder 32 further has a threading opening 326 ′ extending through the seat body 321 , and the lamp housing 31 has a plurality of two through holes 3110 corresponding to the threading opening 326 of the main housing 311 . The power unit 5 The wires 51 are electrically connected to the positive and negative terminals 43 1 and 432 of the light-emitting element 4 through the threading opening 326 and the two through holes 3110, respectively. The light-transmissive sheet 6 is disposed to cover the projection space 312 of the lamp housing 31, and is disposed around the light-emitting portion 42 of the light-emitting element 4. Preferably, the lighting module 2 further includes an annular cover 7 that is wound around the outer periphery of the main casing 311 of the lamp housing 31. The annular cover 7 can prevent the transparent sheet 6 from falling off. It can be stably positioned in the projection space 312 of the lamp housing 31. Referring to FIG. 6 again, in use, the plug-in terminal 522 of the power unit 5 is first electrically connected to the external power to provide power to the light-emitting element 4 through the circuit board 521 and the two wires 51, thereby exciting the The light-emitting portion 42 generates light, and the generated light can be irradiated through the light-transmitting sheet 6, and can cooperate with the design of the light-transmissive sheet 6 of 12 200825324 to increase the light refraction and scattering effect, thereby increasing the brightness of the illumination. During the illumination of the light-emitting element 4, the circuit board 521 and the light-emitting element 4 both have a portion of electrical energy to work as thermal energy, and the generated thermal energy is continuously accumulated on the circuit board 521 and the light-emitting element 4 to be in a high temperature state. The performance of the light-emitting element 4 and the circuit board 521 will be affected. Therefore, the effective and efficient heat dissipation design of the present invention can avoid the adverse effects of the thermal effect and maintain the working efficiency of the overall lighting module 2. The heat energy generated by the light-emitting element 4 can be transmitted to the lamp housing 31 through the base material 41, and the heat dissipation rib 314 connected to the main housing 311 increases the heat dissipation area of the lamp housing 31. Accelerating heat conduction and dying 'further' because the heat dissipation ribs 314 are designed to have a width change, the heat dissipation area of the narrow end portion 315 is smaller than the heat dissipation area of the wide end portion 316, and the corresponding heat dissipation amount It is also relatively low, and a distribution state in which the temperature gradually decreases along the narrow end portion 315 through the rib surface portion 317 to the wide end portion 316 is formed, and the temperature difference distribution caused by the design can be at the narrow end portion 315. Thermal convection is formed between the wide end portion 316 to facilitate heat dissipation. The heat of the circuit board 521 can also be transmitted to the lamp holder 32 through the thermal conductive adhesive, and the heat dissipation area can be increased by the heat dissipation fins 324 disposed on the base body 321 to accelerate the heat dissipation efficiency and avoid the temperature of the circuit board 521. High and affect its effectiveness. It should be noted that the present invention can be shaped to increase the heat dissipation speed by the design of the width variation of the heat dissipation ribs 314. Therefore, the light-emitting element 4 having a higher power can be used in combination, for example, The heat dissipation 13 200825324 can only be used with the light-emitting element 4 of about 3W power. If the light-emitting element 4 with a south power is used, the heat-emitting efficiency may be poor, and the temperature may be too high, causing the light-emitting element 4 to burn out. The design that can further increase the heat dissipation efficiency by convection can use the illuminant #4 with a power of 5W, so that the illumination redundancy can be further increased to increase the application range of the lighting module 2. In addition, the hexanide is formed on the first and second auxiliary heat dissipation layers 33 and 34 of the lamp housing ^, the lamp holder μ, and further increases the total heat dissipation area, thereby further improving the heat dissipation efficiency. ★, FIG. 8 is a type of heat dissipation lamp housing 31 used in the second preferred embodiment of the present invention. The difference between the second preferred embodiment and the first preferred embodiment is mainly in the design of the secret case 31. Other structures and components are the same as those of the first preferred embodiment. Therefore, only the lamp housing 3' of the second preferred embodiment will be described. The heat dissipation lamp housing 31 is also made of a heat conductive metal material. The inner casing 36, an outer casing 37' spaced apart from the inner casing 36, and at least an intermediate casing 38 disposed between the inner and outer casings 70, 37 are preferably implemented. In the example, the inner and outer casings %, 37 and the intermediate body 38 are all made of a squeezed profile. The inner casing 36 includes an inner bottom wall 361 and an inner surrounding wall 362 extending obliquely upward from the periphery of the inner bottom wall 361. The outer body 37 includes an outer bottom wall 371 spaced from the inner bottom wall 361, and an outer surrounding wall 372 extending obliquely upward from the outer bottom wall 371 and spaced from the inner surrounding wall 362. The intermediate housing 38 includes an intermediate bottom wall 381 respectively in contact with the inner bottom wall 361 and the outer bottom wall 371, and an obliquely upwardly extending from the peripheral bottom wall 381 of the intermediate bottom wall 381, and respectively The outer surrounding wall 362, 372 is spaced around the middle surrounding wall 382. In the second preferred embodiment, the lamp housing η includes a plurality of intermediate housings 38' disposed between the inner and outer housings 36, 37 and the intermediate bottom wall 381 of the intermediate housings 38 is They are in close contact with each other, and the intermediate surrounding wall 382 is disposed at intervals, but the number of the intermediate casings 38 should not be limited thereby, and only one intermediate casing 38, or two or three Even three or more intermediate housings 38 can achieve the purpose of effectively increasing the heat dissipation area. In addition, the inner surrounding wall 362 of the inner casing 36, the intermediate surrounding wall 382 of the intermediate casing 38, and the outer surrounding wall 372 of the outer casing 37 are of increasing thickness from the inside to the outside, but Further expanding the area gaps around the walls 362, 382, and 372 makes it easier to form a distribution pattern having a temperature difference. When the light-emitting element 4 (see FIG. 4) is attached to the inner bottom wall 361 of the inner casing 36 by the heat-conductive adhesive, the heat generated by the illumination process can also pass through the inner bottom wall 361, the intermediate bottom wall 381, and the outer portion. The bottom wall 371 conducts and respectively dissipates heat to the inner surrounding wall 362, the intermediate surrounding wall 382 and the outer surrounding wall 372, and the design of the surrounding walls 362, 382, 372 arranged at intervals is also increased. The total heat dissipation area of the casing 3丨, plus the heat dissipation area of the inner surrounding wall 362, the intermediate surrounding wall 382 and the outer surrounding wall 372, and the surrounding walls 362, 382, 372 are severely caused by temperature distribution. In this way, the heat convection formed by the temperature difference can also be used to further accelerate the heat dissipation efficiency of the lamp envelope 31 to achieve the same heat effect as the first preferred embodiment. Similarly, a thermal conductive coating made of boron nitride may be sprayed on the outer surfaces of the inner casing 36, the intermediate casing 38 and the outer casing 15 200825324 37 to form the first auxiliary heat dissipation layer 33, and further The heat dissipation effect of the lamp housing 31 is improved. In summary, the lighting module 2 having the heat-dissipating lamp housing of the present invention can achieve the following functions and advantages, so that the object of the present invention can be achieved: 1. In addition to manufacturing the lamp housing 31 with a metal material that is easy to dissipate heat, The heat dissipating ribs 314 respectively disposed in the main casing 311 of the lamp housing 31, or the surrounding walls 362, 382, 372 and the like having a plurality of different calibers and spaced apart, greatly increase the heat dissipating area of the lamp housing 31. The illuminating element 4 is not easily affected by the heat effect, and has the advantage of better heat dissipation. 2. Cooperating with the variation of the width and heat dissipation area of the narrow end portion 315, the rib portion 317 and the wide end portion 316 of the heat dissipation rib 314, the temperature distribution pattern with temperature difference is formed, which is favorable for forming heat convection to further accelerate heat. The emission, even if the power value of the illuminating light 4 used is increased, does not affect its luminous efficiency, so that the present invention can improve the illumination brightness and the application range by increasing the illumination rate of the illuminating element 4. The assembly form of the outer casing 37 has a different heat dissipation area for the inner surrounding wall 362, the intermediate surrounding wall 382 and the outer surrounding wall, and a temperature difference can be formed during the illumination of the luminous element #4. The distribution is also beneficial for causing thermal convection to further accelerate heat dissipation, and can increase the illumination power of the illuminating element #4 to increase the illumination brightness of the single illuminating element 4, and the application range of the disk. In addition to the heat dissipation design of the light-emitting element 4, the lamp holder 32 of the circuit 16 200825324 is also provided with a material having a better heat dissipation effect, and a heat dissipation fin 324 is further added. The heat dissipation area is increased to accelerate heat dissipation, so that the circuit board 521 is less susceptible to thermal effects, so that the present invention can increase the overall performance and service life by providing a more complete heat dissipation design. 5. With the first and second auxiliary The heat dissipation layers 33 and 34 additionally increase the heat dissipation area of the lamp housing 31 and the lamp holder 32, and further contribute to the heat dissipation. The invention can also achieve the overall efficiency and extended use by effectively and quickly dissipating heat. The effect of the life. Referring to FIG. 3, FIG. 7 and FIG. 8, the following is an experimental test result supplementing the heat dissipation lamp housing 31 by the heat dissipation ribs 314, or the inner casing 36, the intermediate casing 38 and the outer casing 37. The effect achieved by the design of layers and layers is shown in Table 1. In the room temperature environment (ambient temperature is 20 ° C), the LEDs are respectively installed to the lamp housing A, the lamp housing B1, and the lamp housing B2. Lamp housing C, and the light-emitting element After continuous energization to provide illumination, after 3 hours, the result of measuring the luminous flux of the lamp housing A, the lamp housing B1, the lamp housing B2 and the lamp housing C and the lamp housing temperature, wherein the lamp housing A (see Fig. 3) is The lamp housing 11 is not provided with a heat dissipating rib or a heat dissipating fin. The lamp housing B1 and the lamp housing B2 (see FIG. 7) are both the lamp housing 31 provided with the heat dissipation rib 314 of the present invention, and the lamp housing C (see FIG. 8). The lamp housing 31 is a ring-shaped combination of the inner casing 36 and the intermediate casing 38 and the outer casing 37. The LEDs of the lamp housing A and the lamp housing B1 are both 3W, and the lamp housing is 3W. The power of B2 and the LED matched with the lamp housing C is 5 W. It should be added that there are two types of LEDs used in this test. The lamp housing A, the lamp housing B1 and the lamp housing B2 are matched. Traditionally, LEDs made of gallium arsenide crystals, and lamp shell C are matched with LEDs made of germanium wafers. The different crystal types make the difference mainly using the same power. In the case of LEDs, the luminous flux of LEDs fabricated from germanium wafers is higher than those produced by gallium arsenide grains, but the heat dissipation temperature is not directly related to the grain pattern, mainly It is related to the power of the LED used. The higher the power, the higher the enthalpy and temperature. Therefore, although the LEDs produced by different dies will show different illumination brightness, they can still be directly compared with LEDs with the same power. Heat dissipation effect of different types of lamp housings. Type lamp-like A lamp housing B1 lamp housing B2 lamp C LED power (W) 3 3 5 5 luminous flux (LM) 105 110 140 180 heat dissipation temperature (°C) 72.6 x-63.0 Y- 61.5 z-57.8 x-73.0 y-71.5 ζ-67·8 a-60·0 b-58.4 c-56.8 d-55.2 e-53.6 ...this wind ji μ sign s> 丄δ, 寻寻敢熟肋条The temperature measured by the end portion 315, the wide end portion 316, and the like. Note (2). a, b, c, d, and e respectively indicate the temperatures measured by the lamp housing 31 in the inner casing 36, the three intermediate casings Zhao 38, and the outer casing 37 from the inside to the outside. According to the results of Table 1, when using the same power (3W) led, the luminous flux of the lamp housing B1 will be slightly higher than the luminous flux of the lamp housing a, and the temperature of # in the different positions of the lamp housing B1 is smaller than the lamp housing a The temperature indicates that the design of the present invention can increase the heat dissipation efficiency. In addition, the temperature distribution of the lamp envelope A is a uniform-and no temperature difference distribution pattern (ie, the temperature at any position on the casing η of FIG. 3 is Temperature distribution), the temperature of the lamp shell m is in the form of a knife cloth with a / dish difference. It is obvious that the change in the force width of the heat dissipation rib can lead to the temperature difference distribution and it is easier to introduce the heat ^ ^ hurry to cause heat convection to Improve heat dissipation, and then 18 200825324 enables LEDs to perform better, while relatively higher luminous flux. In addition, according to the test data of the lamp housing B2 and the lamp housing C, it can be seen that the lamp housing 31 having the heat dissipation ribs 314 or the multilayer housings 36, 38, 37 can withstand a LE of 5 W power and can Rapid heat dissipation, except that the temperature of the base wall portion 318 is slightly higher than the temperature of the lamp housing A, the temperature values of the remaining portions are lower than the lamp housing A, and the lamp housing c is the inner casing. The body 36 and the intermediate body 38 are stacked on the outer layer 37 to make the total heat dissipation surface area increase more than the lamp housing B2, thereby exhibiting lower temperature and better heat dissipation performance, and at the same time, the lamp housing B2 and The lamp housing c is also a temperature distribution pattern that maintains a temperature difference, and it is shown that the heat dissipation lamp housing 31 of the present invention can increase the heat dissipation area and cause heat convection by the heat dissipation ribs 314, or the housings 36, 37, 38. It can achieve the function of effectively dissipating heat and the high-power light-emitting element 4. It is worth noting that although LEDs of the same power can usually exhibit the same illumination brightness (light flux), when combined with different lamp housings, the heat dissipation effect of different lamp housings is different, and if there is better heat effect, It can avoid excessive heat accumulated in the LED and affect its luminous efficiency. Therefore, although the LED power and type of the lamp housing A and the lamp housing B1 are the same, the lamp housing B1 has a better heat dissipation effect. The luminous flux slightly in the lamp housing A is measured in the lamp housing Bi. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a conventional illumination lamp; FIG. 2 is a cross-sectional view showing the assembled state of the illumination lamp. FIG. 3 is a perspective view showing a conventional illumination lamp. Figure 4 is a top perspective exploded view of a first preferred embodiment of a lighting module having a heat sink housing of the present invention; Figure 5 is an exploded perspective view of the rear view, illustrating FIG. 6 is a perspective view of a preferred embodiment of the present invention; illustrating a first preferred embodiment of a heat sink housing illustrating a second preferred embodiment of the present invention It is a design of a perspective view; and Figure 8 is a cross-sectional view of the design of the heat lamp housing. 20 200825324 [Explanation of main component symbols] 2...· ...lighting module 35 ····^ Connecting the post 3...·...heating housing unit 352... -----^接槽^ a ______ «3 i...... ...Liang Huan.· Door Narrative 311 ·... Main housing 361... •...Inner bottom wall 312 ·... Projection space 362... •... Inner surrounding wall 313 * External surface 37... •... Peripheral body 314 ... ... heat dissipation rib 371 ... • ... outer bottom wall 315 ... ... narrow end 372 ... ... ... outer surrounding wall 316 ... ... wide end 38 " ... • ... intermediate housing 317 ... Rib face 381... •... intermediate bottom wall 318... base wall portion 382... intermediate wrap wall 319 ... around wall portion 4... • light emitting element 3110 ... through hole 41 ••... •... base ^ 〇 ..... Λ1..... .· · · Medium stop stroke 5 L... ...Light 321 321 ····... Seat 431... — Positive terminal 322 ···· Slot 432... •...negative terminal 323 ·...outer surface 5... ...·power unit 324 ...· ...heat sink fin 51 ••... •...wire 325 ...· ... transition £ 52 .... power supply assembly 326 * * ... threading port 521... • ... circuit board 33 ... ... first auxiliary heat dissipation layer 522 ... • ... plug terminal 34 ... ... second auxiliary heat sink layer 523 ... ... ... fixed seat k 3 5...... ----^接接6...............transparent sheet 21 200825324 7 ·.........ring cover I....•• axis 22