200824518 九、發明說明： 【發明所屬之技術領域】 本發明係有關表面處理裝置的輸送機。即’有關使用於 基板的製造過程，基板材以處理液進行表面處理之表面處 理裝置的輸送機。 【先前技術】 使用於電子機器的電路用基板，小型輕量化、極薄化、 柔軟化之進展顯著，所形成電路的微細化、高密度化也異 常顯著。 而如此基板的製造過程，使用表面處理裝置，基板材是 以藥液或洗淨液等處理液執行表面處理。 《習知技術》 在此種表面處理裝置，基板材是在其處理室內以輸送機 的直輥製或輪製之上下輸送輥來運送，而從噴嘴噴射處理 液，用以依序地作表面處理而形成電路，以製造基板。 然而多數的情況，輸送機或噴嘴配設在環境氣體中/空 中，基板材是利用在環境氣體中/空中噴射的處理液進行 表面處理。 相對於此，輸送機或噴嘴配設在處理液中的表面處理裝 置亦被開發。即，在充滿處理液的液槽中配設輸送機或噴 嘴，用以將極薄且柔軟的基板材，以在液中噴射之處理液 進行表面處理的表面處理裝置亦出現。 《習知技術文獻資訊》 作爲如此表面處理裝置，例如，可列舉下述專利文獻1、 2中所揭示。專利文獻1是有關空中噴射方式，專利文獻2 200824518 是有關液中噴射方式者。 專利文獻1 :日本專利特開2002 - 68435號公報 專利文獻2 :日本專利特開平1 0 — 079565號公報 《關於日本專利申請案特願2006 — 264 1 89號》 此外，本發明者及申請人關於液中噴射方式的表面處理 裝置，更進行硏究開發，而於2006年9月28日提出申請 日本專利特願2006 — 264189號。 本專利申請的主旨，係關於表面處理裝置的輸送機，採 用在基板材的電路形成面以無接觸挾持兩側端面的夾輥作 爲輸送輥。 而關於極薄且柔軟的基板材，既可消除關於空中噴射方 式被指摘由於噴射藥液引起的亂流、積液或由於壓力、重 量而造成的撓曲事故等，又，更可防止液中噴射方式被指 摘在電路形成面之損傷等優異效果是可期待的（本發明係 此專利申請的改良發明）。 【發明內容】 【發明所欲解決之課題】 可是，關於如此的習知例有如下的課題。即，在如此表 面處理裝置的處理室間，附著在運送之基板材的處理液， 作成使其不混合成爲重要的題目。 特別是在前過程之表面處理裝置的處理室被噴射而附著 在基板材的處理液被帶走而移動，作成使其不帶到下過程 之表面處理裝置的處理室成爲重要的課題。 然而特別是，液中噴射方式的表面處理裝置，基板材邊 在液中運送，邊以處理液進行表面處理，因此處理液朝基 200824518 板材的附著度高，基板材以處理液整體密切地濡濕。而且， 日本專利特願2006 - 264 1 89號，僅挾持基板材兩側端面運 送的夾輥，作爲運送輥使用，處理液容易附著、殘留在中 央部的電路形成面。由於因而使該等上述的課題特別受重 視。 而，如此處理液的帶出、移動、帶進、若發生混合時， 處理液性能的降低將顯著化。 例如，使用同一處理液（例如蝕刻液）之表面處理裝置 的處理室間，又，使用異種處理液（例如蝕刻液及剝離液、 鈾刻液及洗淨液）之表面處理裝置的處理室間，若發生處 理液的混合時，其處理液的性能將降低，壽命變短。所以， 防止這種處理液的混合，一向成爲重要的課題。 本發明之表面處理裝置的輸送機，係有鑑於如此的實 情，爲了解決上述往例的課題而開發者。 然而，本發明之目的係提案一種表面處理裝置的輸送 機，其於表面處理裝置間的間隔空間，第1，藉由使基板 材傾斜令附著之處理液流下，而可防止處理液的混合，第 2，藉由吸液、除去附著之處理液，從這方面亦可防止處理 液的混合。 【用以解決課題之手段】 用以解決如此課題之本發明的技術上手段如下。首先關 於申請專利範圍第1項如下。 申請專利範圍第1項之表面處理裝置的輸送機係在基板 製造過程使用。該表面處理裝置含有：處理液的液槽、配 設在該液槽內並將該基板材在液中運送的輸送機，以及配 200824518 設在該液槽內將該處理液於液中噴射的噴嘴。在該表面處 理裝置間，既形成間隔空間又配設將基板材朝液外運送的 該輸送機。 而兩個該輸送機，係在該基板材的電路形成面無接觸僅 挾持該基板材之兩側端面而輸送的夾輥，在輸送方向排列 設置，且，該間隔空間的該輸送機之該夾輥，係作爲防止 該表面處理裝置間之該處理液混合的機構。 關於申請專利範圍第2項，係針對申請專利範圍第1項 之表面處理裝置的輸送機，其中該輸送機將該基板材水平 運送，該夾輥既於上下成對又在左右配置，而將該基板材 的左右兩側端面從上下挾持輸送。 關於申請專利範圍第3項，係針對申請專利範圍第2項 之表面處理裝置的輸送機，其中該間隔空間的該輸送機， 將該基板材傾斜上升接著傾斜下降，以使附著在該基板材 的該處理液朝向其表面處理裝置流下，作爲特徵。 關於申請專利範圍第4項，係針對申請專利範圍第3項 之表面處理裝置的輸送機，其中該間隔空間之該輸送機具 備比其他該夾輥高度水平更高的凸狀形成用夾輥，該基板 材在凸狀形成用的該夾輥的位置高，而在其他該夾輥的位 置低，形成傾斜運送，作爲其特徵。 關於申請專利範圍第5項，係針對申請專利範圍第4項 之表面處理裝置的輸送機，其中該凸狀形成用的該夾輥， 其高度位準係可改變，且可設定成各種高度位準，作爲其 特徵。 關於申請專利範圍第6項，係針對申請專利範圍第2項 200824518 之表面處理裝置的輸送機，其中該間隔空間的該輸送機具 有具備該處理液之吸液性的該夾輥。 關於申請專利範圍第7項，係針對申請專利範圍第6項 之表面處理裝置的輸送機，其中具備有吸液性的該夾輥， 係配設於該間隔空間之運送方向的中央部，而將附著於該 基板材之該處理液吸收或除去。 關於申請專利範圍第8項，係針對申請專利範圍第7項 之表面處理裝置的輸送機，其中在具備吸液性之該夾輥的 前後間隔，配設有將附著於該基板材之該處理液乾燥、除 去的空氣噴嘴。 關於申請專利範圍第9項，係針對申請專利範圍第1、3、 或6項之表面處理裝置的輸送機，其中表面處理裝置係使 用於基板製造過程的顯像過程、蝕刻過程、剝離過程、或 洗淨過程，該處理液係由顯像液、蝕刻液、剝離液、或洗 淨液而成，而該基板材係由柔軟性基板材、或其他極薄的 軟性基板材而成。 《作用》 本發明藉由如此的手段而成，而有如下的作用。 (1) 表面處理裝置，係使用於基板製造過程，處理極薄柔軟 的基板材。 (2) 處理液的液槽中、配設有在液中運送用的輸送機，及在 液中噴射用的噴嘴。 (3) 基板材在各表面處理裝置間依序以輸送機運送。 (4) 使表面處理裝置間的間隔空間，在以輸送機運送液外之 基板材上附著有處理液。 -10- 200824518 (5) 更因基板材係以夾輥挾持兩側端面輸送，所以從這方面 於間隔空間，處理液容易以附著狀態殘留。 (6) 因而，間隔空間的輸送機具備凸狀形成用夾輥，附著之 處理液流下原來的表面處理裝置而回收。 (7) 更因間隔空間之輸送機具備吸液性的夾輥、或空氣噴 嘴，將附著之處理液吸收、乾燥或除去。 (8) 因此，本發明之表面處理裝置間的輸送機發揮如下效 果。 【發明效果】 第1、本發明之輸送機於表面處理裝置間的間隔空間， 將附著之處理液藉由凸狀形成用夾輥回收到表面處理裝 置。 因此，於表面處理裝置之處理室間，阻止處理液之帶出、 移動或帶進，可確實地防止處理液的混合。所以，關於各 表面處理裝置，可避免處理液的性能降低，處理液的壽命 比前述該種習知例大幅增長。 第2、本發明之輸送機更於表面處理裝置間的間隔空間， 將附著之處理液以吸液性的夾輥或空氣噴嘴，將附著之處 理液吸收或除去。 因此，從這方面亦可於表面處理裝置的處理室間阻止處 理液的帶出、移動或帶進，而可確實地防止處理液的混合。 從這方面亦可回避處理液的性能降低，處理液的壽命比該 種習知例大幅增長。 【實施方式】 【發明之最佳實施形態】 -11- 200824518 《圖式簡單說明》 以下本發明之表面處理裝置的輸送機，將根據圖面所示 發明之最佳實施形態而詳細說明。第1至3圖係供本發明 之最佳實施形態的說明。而第1圖係其中1例的側剖面說 明圖，第2圖係其他例的側剖面說明圖，第3圖係表面處 理裝置的側剖面圖。 《基板》 本發明之表面處理裝置1，係在基板的製造過程使用， 因此，首先對基板加以說明。 使用於電子機器之印刷配線基板等的電路基板，小型輕 量化、極薄化、微細電路化、高密度電路化、多層化等非 常進展。關於電路基板的硬軟，與習知之剛性基板等的硬 性基板比較，柔軟基板其他極薄且柔軟的軟性基板的進 展、增加異常顯著，半導體零件與電路形成一體組裝的半 導體封裝基板的普及也迅速。 而且，例如此基板係循其次之製造過程而製造。即，由 鍍銅之積層板而成之基板材A的外表面上、—塗布或貼上 感光性光阻後、―對電路的底片曝光之後、—將形成電路 以外的光阻、藉由顯像溶解除去、-將形成電路以外的銅 箔、藉由鈾刻溶解除去之後、—將形成電路部分的光阻、 藉由剝膜除去之後、—在基板材A的外表面上、以銅箔形 成電路、用以製造基板。 依此方式而形成基板。 《表面處理裝置1》 表面處理裝置1，係使用於如此基板的製造過程，將基 -12- 200824518 板材A在處理液B中進行表面處理。關於表面處理裝置1 參照第3圖詳述如下。 表面處理裝置1，係在基板的製造過程中，例如顯像過 程、蝕刻過程、剝離過程、或洗淨過程，作爲顯像裝置、 蝕刻裝置、剝離裝置、或洗淨裝置而使用。而且，在處理 室2內對於以輸送機3朝運送方向C在液中運送之基板材 A，從噴嘴4，噴射例如顯像液、蝕刻液、剝離液、或洗淨 液等處理液B，用以將基板材A進行藥液處理或洗淨處理 等表面處理。 又表面處理裝置1，係在1個過程大多連續配設多個， 例如鈾刻過程，多數的情況連續配設有複數台的蝕刻裝置。 而表面處理裝置1，在其處理室2內，具有液槽5、輸送 機3、噴嘴4，及蓄槽6等。液槽5形成於處理室2上部和 從噴嘴4噴射的處理液B同樣的處理液B充滿著。多數噴 嘴4配設在處理液B內，而位於運送基板材A之電路形成 面的對向，將處理液B向液中噴射。 ^ 處理液B，從處理室2下部的蓄槽6，透過泵7或配管8 壓送到各噴嘴4，而噴射到基板材A。而後從基板材A反 射、彈回的處理液B，雖被吸收於液槽5中的處理液B中， 但其結果，從液槽5溢流的處理液B，被回收到蓄槽6而 循環使用。 輸送機3，係在基板材A的電路形成面上無接觸而僅挾 持兩側端面運送之多數的夾輥9，在液槽5的處理液B內， 沿著輸送方向C列設多數。即基板材A係由中央部的電路 形成面，及其外周緣的前後端面或左右兩側端面所構成， -13- 200824518 前後端面或左右兩側端面，成爲被稱爲耳部之非電路形成 面。 而，上下的夾輥9作爲驅動運送輥，將如此基板材A的 左右兩側端面，既成爲上下對從上下挾持輸送、又在左右 列設。此外，圖示例之輸送機3，雖如此地將基板材A依 水平運送方式而成，但夾輥9亦可左右成對或傾斜成對， 而使基板材A被垂直輸送或傾斜輸送的方式均爲可能。 《間隔空間D的輸送機3》 以下參照第1、2圖加以說明。基板材A係在如此各表面 處理裝置1的處理室2間，以輸送機3連續的運送，用以 在各表面處理裝置1，依序實施規定的表面處理。 而在各表面處理裝置1的處理室2間，間隔空間D形成 空間，在此間隔空間D使基板材A在往液外運送之輸送機 3具有防止混合的機構。 即，在間隔空間D將基板材A，從前過程之表面處理裝 置1的處理室2,至下一過程之表面處理裝置1的處理室2 之液外運送輸送機3，在其上下的夾輥9 ’ ，設置有防止處 理液B的混合機構。 關於混合防止機構詳述如下。 《凸狀形成用夾輥9 ’》 首先’在第1圖所示之例，間隔空間D的輸送機3，具 備比其他夾輥9高度水平高的凸狀形成用夾輥9’ ，基板 材A在凸狀形成用夾輥9 ’的位置被舉高，而在其他夾輥9 的位置則變低，形成傾斜的運送。200824518 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a conveyor for a surface treatment apparatus. That is, a conveyor for a surface treatment apparatus which performs surface treatment of a substrate with a treatment liquid for use in a manufacturing process of a substrate. [Prior Art] The circuit board used in an electronic device has a remarkable progress in miniaturization, weight reduction, ultra-thinness, and softening, and the circuit is made finer and higher in density. In the manufacturing process of the substrate, a surface treatment apparatus is used, and the base material is subjected to surface treatment with a treatment liquid such as a chemical liquid or a cleaning liquid. "Prior Art" In such a surface treatment apparatus, a base material is conveyed in a processing chamber by a straight roll or a wheel-up conveying roller of a conveyor, and a processing liquid is sprayed from a nozzle for sequentially surface-forming. Processing forms a circuit to manufacture a substrate. However, in most cases, the conveyor or nozzle is disposed in the ambient gas/air, and the base material is surface treated by the treatment liquid sprayed in the ambient gas/air. On the other hand, a surface treatment apparatus in which a conveyor or a nozzle is disposed in a treatment liquid has also been developed. That is, a conveyor or a nozzle is disposed in a liquid tank filled with the treatment liquid, and a surface treatment apparatus for surface treatment of the extremely thin and flexible base material with the treatment liquid sprayed in the liquid also appears. In the case of such a surface treatment apparatus, for example, the following Patent Documents 1 and 2 can be cited. Patent Document 1 relates to an air jet method, and Patent Document 2 200824518 relates to a liquid jet method. Patent Document 1: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2006- 264565. The surface treatment apparatus for the liquid-injection method was further developed, and on September 28, 2006, the Japanese Patent Application No. 2006-264189 was filed. The gist of the present patent application relates to a conveyor for a surface treating apparatus which employs a nip roller which is held on both sides of a circuit forming surface of a base material without contact with both end faces as a conveying roller. With regard to the extremely thin and soft base plate, it is possible to eliminate the turbulence caused by the jetting liquid, the liquid accumulation or the deflection accident due to pressure and weight, etc., and prevent the liquid from being trapped. It is expected that the ejection method is excellent in damage such as damage on the circuit formation surface (this invention is an improved invention of this patent application). [Problem to be Solved by the Invention] However, such a conventional example has the following problems. That is, it is an important problem that the treatment liquid adhered to the substrate to be conveyed between the processing chambers of such a surface treatment apparatus is not mixed. In particular, in the processing chamber in which the processing chamber of the surface treatment apparatus of the preceding process is ejected and the processing liquid adhering to the substrate is carried away, it is an important problem that the processing chamber of the surface treatment apparatus which is not brought to the next process is formed. However, in particular, in the surface treatment apparatus of the liquid-injection type, the base material is transported in the liquid while being subjected to surface treatment with the treatment liquid, so that the adhesion of the treatment liquid to the base material of the base 200824518 is high, and the base material is closely wetted by the entire treatment liquid. Further, Japanese Patent Application No. 2006-264 1 89 only uses a nip roller that is conveyed on both end faces of the base material, and is used as a conveyance roller, and the treatment liquid easily adheres and remains on the circuit forming surface of the center portion. Therefore, these above-mentioned problems are particularly emphasized. However, when the treatment liquid is taken out, moved, brought in, and mixed, the deterioration of the performance of the treatment liquid is remarkable. For example, between the processing chambers of the surface treatment apparatus using the same treatment liquid (for example, an etching liquid), and between the treatment chambers of the surface treatment apparatus using the different treatment liquids (for example, etching liquid, peeling liquid, uranium engraving liquid, and washing liquid) When the mixing of the treatment liquid occurs, the performance of the treatment liquid is lowered, and the life is shortened. Therefore, prevention of mixing of such a treatment liquid has always been an important issue. The conveyor of the surface treatment apparatus of the present invention has been developed in order to solve the problems of the above-described conventional examples in view of such circumstances. However, an object of the present invention is to provide a conveyor for a surface treatment apparatus which, in the space between the surface treatment apparatuses, firstly prevents the mixing of the treatment liquid by causing the base material to be inclined to cause the treatment liquid to adhere thereto. Secondly, by aspirating and removing the adhered treatment liquid, mixing of the treatment liquid can also be prevented from this. [Means for Solving the Problem] The technical means for solving the problem of the present invention is as follows. First, the first item in the scope of patent application is as follows. The conveyor of the surface treatment apparatus of claim 1 is used in the substrate manufacturing process. The surface treatment apparatus includes: a liquid tank for treating the liquid, a conveyor disposed in the liquid tank and transporting the base material in the liquid, and a liquid in which the liquid is sprayed in the liquid tank with 200824518; nozzle. Between the surface treatment devices, both the space is formed and the conveyor for transporting the substrate to the outside of the liquid is provided. And the two conveyors are arranged on the circuit forming surface of the base plate without contact and only the end faces of the base plate are conveyed, arranged in the conveying direction, and the conveyor of the spacing space The nip roller serves as a mechanism for preventing mixing of the treatment liquid between the surface treatment apparatuses. A second aspect of the patent application scope is directed to a conveyor for a surface treatment apparatus according to claim 1, wherein the conveyor conveys the base plate horizontally, and the nip rolls are disposed in pairs on the upper and lower sides and on the left and right sides, and The left and right end faces of the base plate are conveyed from above and below. The third aspect of the patent application is directed to the conveyor of the surface treatment apparatus of claim 2, wherein the conveyor of the space is inclined to rise and then tilted downward to adhere to the base plate. The treatment liquid flows down toward its surface treatment device as a feature. The fourth aspect of the patent application is directed to the conveyor of the surface treatment apparatus of claim 3, wherein the conveyor of the space has a convex forming nip roller having a higher level than the other nip rollers. The base material is characterized in that the position of the nip roller for forming the convex shape is high, and the position of the other nip roller is low, and the inclined conveyance is formed. The fifth aspect of the patent application is directed to a conveyor for a surface treatment apparatus of claim 4, wherein the nip roller for forming the convex shape has a height level changeable and can be set to various height positions. Quasi, as its characteristics. The sixth aspect of the patent application is directed to a conveyor for a surface treatment apparatus of claim 2, wherein the conveyor has a nip roller having a liquid absorbing property of the treatment liquid. The seventh aspect of the invention is directed to a conveyor for a surface treatment apparatus according to claim 6, wherein the nip roller provided with liquid absorbing property is disposed at a central portion of the transport direction of the space, and The treatment liquid attached to the base material is absorbed or removed. The eighth aspect of the patent application is directed to a conveyor for a surface treatment apparatus according to claim 7, wherein the treatment for attaching the base sheet to the front and rear intervals of the nip roller having liquid absorbing property is provided Air dried, removed air nozzle. The ninth application patent scope is a conveyor for a surface treatment apparatus of the first, third or sixth aspect of the patent application, wherein the surface treatment apparatus is used for a development process, an etching process, a peeling process, and a peeling process of the substrate manufacturing process. Or a cleaning process, the treatment liquid is formed by a developing liquid, an etching liquid, a peeling liquid, or a cleaning liquid, and the base material is made of a flexible base material or other extremely thin soft base material. <<Action>> The present invention has such a means and has the following effects. (1) Surface treatment equipment is used in the substrate manufacturing process to process extremely thin and soft base sheets. (2) The liquid tank for the treatment liquid is provided with a conveyor for transporting the liquid, and a nozzle for spraying the liquid. (3) The base material is sequentially conveyed by the conveyor between the surface treatment apparatuses. (4) The treatment space is adhered to the space between the surface treatment equipment and the base material outside the conveyor. -10- 200824518 (5) Since the base plate is conveyed by the nip rollers at both end faces, the treatment liquid is likely to remain in the adhered state in this space. (6) Therefore, the conveyor of the space is provided with a nip roller for forming a convex shape, and the attached treatment liquid flows down the original surface treatment device and is recovered. (7) The nip roller or the air nozzle that has a liquid absorbing property in the conveyor of the space is used to absorb, dry, or remove the adhered treatment liquid. (8) Therefore, the conveyor between the surface treatment apparatuses of the present invention exerts the following effects. [Effect of the Invention] In the space between the surface treatment apparatuses of the first and third embodiments of the present invention, the adhered processing liquid is collected by the nip rollers for convex formation to the surface treatment apparatus. Therefore, it is possible to prevent the mixing of the processing liquid between the processing chambers of the surface treatment apparatus, and to prevent the handling liquid from being carried out, moved, or carried in. Therefore, with respect to each surface treatment apparatus, the performance of the treatment liquid can be prevented from being lowered, and the life of the treatment liquid is greatly increased as compared with the above-mentioned conventional examples. According to the second aspect of the invention, the conveyor of the present invention further absorbs or removes the adhering treatment liquid by a liquid-absorbent nip roller or an air nozzle in a space between the surface treatment apparatuses. Therefore, in this respect, it is possible to prevent the carry-out, movement or carry-in of the treatment liquid between the processing chambers of the surface treatment apparatus, and it is possible to surely prevent the mixing of the treatment liquid. In this respect, the performance of the treatment liquid can be avoided, and the life of the treatment liquid is greatly increased as compared with the conventional example. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION -11-200824518 DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a conveyor of a surface treatment apparatus according to the present invention will be described in detail based on a preferred embodiment of the invention shown in the drawings. 1 to 3 are views for explaining preferred embodiments of the present invention. 1 is a side cross-sectional view showing one example, and FIG. 2 is a side cross-sectional explanatory view of another example, and FIG. 3 is a side cross-sectional view of the surface treating apparatus. <<Substrate>> The surface treatment apparatus 1 of the present invention is used in the manufacturing process of a substrate. Therefore, the substrate will be described first. The circuit board used for a printed wiring board or the like of an electronic device is extremely small in size, lightness, thinness, fine circuit, high-density circuit, and multilayer. As for the hardness of the circuit board, compared with a rigid substrate such as a conventional rigid board, the development of the extremely thin and flexible flexible substrate of the flexible substrate is remarkable, and the semiconductor package in which the semiconductor component and the circuit are integrally assembled is also rapidly spread. Moreover, for example, the substrate is manufactured following the subsequent manufacturing process. That is, the outer surface of the base material A formed by the copper-plated laminated board, after coating or pasting the photosensitive photoresist, and after exposing the negative film of the circuit, will form a photoresist other than the circuit. Such as dissolution removal, - copper foil to be formed other than the circuit, after dissolution by uranium engraving, - formation of photoresist of the circuit portion, removal by stripping, - on the outer surface of the substrate A, with copper foil A circuit is formed for manufacturing the substrate. The substrate is formed in this manner. <<Surface Treatment Apparatus 1>> The surface treatment apparatus 1 is used for the surface preparation process of the substrate, and the surface layer of the substrate -12-200824518 is treated in the treatment liquid B. The surface treatment apparatus 1 will be described in detail below with reference to FIG. The surface treatment apparatus 1 is used as a developing device, an etching device, a peeling device, or a cleaning device in the manufacturing process of a substrate, such as a developing process, an etching process, a peeling process, or a cleaning process. Further, in the processing chamber 2, a processing liquid B such as a developing liquid, an etching liquid, a peeling liquid, or a cleaning liquid is ejected from the nozzle 4 to the base material A transported in the liquid in the transport direction C by the conveyor 3, The substrate A is subjected to a surface treatment such as a chemical treatment or a washing treatment. Further, in the surface treatment apparatus 1, a plurality of processes are continuously disposed in a plurality of processes, for example, an uranium engraving process, and in many cases, a plurality of etching apparatuses are continuously disposed. The surface treatment apparatus 1 has a liquid tank 5, a conveyor 3, a nozzle 4, a reservoir 6, and the like in the processing chamber 2. The liquid tank 5 is formed in the upper portion of the processing chamber 2 and the same processing liquid B as the processing liquid B ejected from the nozzle 4 is filled. A plurality of nozzles 4 are disposed in the processing liquid B, and are located opposite to the circuit forming surface of the carrier substrate A, and eject the processing liquid B into the liquid. ^ The treatment liquid B is sent from the reservoir 6 at the lower portion of the processing chamber 2 to the respective nozzles 4 through the pump 7 or the pipe 8, and is sprayed to the base material A. Then, the treatment liquid B which is reflected and rebounded from the base material A is absorbed into the treatment liquid B in the liquid tank 5, but as a result, the treatment liquid B overflowing from the liquid tank 5 is recovered into the storage tank 6 recycle. The conveyor 3 has a plurality of nip rolls 9 which are conveyed on the circuit forming surface of the base material A and which are only held by the both end faces, and are arranged in the processing liquid B of the liquid tank 5 in the transport direction C. That is, the base sheet A is composed of a circuit forming surface at the center portion, and front and rear end faces or left and right end faces of the outer peripheral edge, and the front and rear end faces or the left and right end faces of the -13-200824518 become non-circuit forming called ear portions. surface. On the other hand, the upper and lower nip rollers 9 serve as driving rollers, and the left and right end faces of the base material A are transported from the upper and lower sides to the upper and lower sides, and are arranged side by side. In addition, the conveyor 3 of the illustrated example is formed by the horizontal conveying method of the base plate A, but the nip rolls 9 may also be paired right or left in pairs, so that the base plate A is vertically conveyed or inclined. The way is all possible. <<Conveyor 3 of Spacer D>> Hereinafter, description will be made with reference to Figs. 1 and 2 . The base sheet A is continuously conveyed by the conveyor 3 between the processing chambers 2 of the surface treatment apparatuses 1 for performing predetermined surface treatments on the respective surface treatment apparatuses 1. Further, between the processing chambers 2 of the surface treatment apparatuses 1, a space is formed in the space D, and the space D in the space D is provided to the conveyor 3 which conveys the base material A to the outside of the liquid. That is, in the space D, the base sheet A, the processing chamber 2 of the surface treatment apparatus 1 of the previous process, the liquid-outlet conveying conveyor 3 of the processing chamber 2 of the surface treatment apparatus 1 of the next process, and the nip rollers above and below it 9 ', a mixing mechanism for preventing the treatment liquid B is provided. The mixing prevention mechanism is described in detail below. "Convex forming nip roller 9'" First, in the example shown in Fig. 1, the conveyor 3 in the space D has a convex forming nip roller 9' having a higher level than the other nip rollers 9, the base plate A is raised at the position of the ridge roller 9' for forming the convex shape, and becomes lower at the position of the other nip roller 9, and the inclined conveyance is formed.
即’間隔空間D之輸送機3的夾輥9’ ，係將基板材A -14- 200824518 向上傾斜接著向下傾斜，用以將附著在基板材A之處理液 B，朝向表面處理裝置1的處理室2流下而復原。 關於如該第1圖所示之間隔空間D用的輸送機3，更詳 述如下。首先，在前過程之表面處理裝置1的處理室2的 液槽5內，附著在基板材A表面之處理液B，即附著之狀 態下從處理室2的出口 1 0搬出間隔空間D的處理液B ,依 據藉由凸狀形成用之上下夾輥9 ’之基板材A的傾斜梯 度，朝向原來處理室2的出口 10沿著基板材A流下。而回 收到其處理室2的液槽5或蓄槽6。 又’在後過程之表面處理裝置1的處理室Ί、附著在基 板材A表面之處理液B，即從處理室2的入口 1 1溢出的處 理液B，依據藉由凸狀形成用之上下夾輥9’之基板材A 的傾斜梯度，朝向其處理室2的入口 1 1沿著基板材A流 下。而回收到其處理室2的液槽5或蓄槽6。 作爲如此間隔空間D之凸狀形成用的夾輥9 ’ ，可考慮 如下的各種樣式。 a ·圖示例的夾輥9 ’ ，上下皆由同一直徑形成，同時軸的 高度水平，在凸狀形成用依序由高而低地固定。 b·不依據圖示例，關於間隔空間D的構成，亦可能僅輸送 方向C的中央部採用如此夾輥9 ’ ，而其前後採用通常的 夾輥9。 c ·又，關於夾輥9 ’ ，亦可藉由採用直徑尺寸大於其他夾 輥9，而可形成凸狀。 d.更，夾輥9’的高度水平爲可變，亦可考慮設定各種高 度水平。即，上下夾輥9 ’附設升降機構，用以對應輸送 -15- 200824518 機3之輸送速度而可上下移動，藉由輸送速度越快傾斜越 陡使處理液B的流下速度更快速，致有使處理液B的回收 更加圓滑的優點。 此外，在第1圖中，E係架掛在下段之夾輥9，9 ’的外 周溝的鋼索，具有作爲防止基板材A下垂的機能。F係嵌 插在上段之夾輥9，9 ’的外周溝的環，具有作爲防止基板 材A捲入的機能。 《具備吸液性的夾輥9’等》 其次，在第2圖所示之例，間隔空間D的液外運送用輸 送機3，具備處理液B之吸液性的夾輥9 ’ 。 然後，在具備有吸液性之夾輥9 ’的前後間隔，配設有 乾燥、除去附著在基板材A之處理液B的空氣噴嘴1 2。 關於該第2圖所示之間隔空間D用的輸送機3，更詳述 之。具備有該吸液性之夾輥9 ’ ，例如，由外周部具備有 吸液部1 3的構造而成，採用硬質發泡材等作爲吸液部1 3。 在圖示之例，具備有吸液性的夾輥9 ’ ，被採用在間隔 I 空間D之輸送方向C的中央部，其前後則採用通常的夾輥 % 9。然後，將附著在基板材A之處理液B，從基板材A的兩 側端面側吸收、除去。 又，空氣噴嘴12，就上下夾輥9 ’而言，係分別在其前 後間隔、及夾輥9 ’與夾輥9間的前後間隔、對向於基板 材A之電路形成面或兩側端面，分別列設於左右。然後， 將附著在基板材A之處理液B，藉由空氣噴射乾燥、除去。 此外，若將空氣噴嘴1 2事先朝左右方向傾斜若干，附著 在基板材A之處理液B，將流向吸液性的夾輥9 ’而被聚 -16- 200824518 集，所以處理液B的除去將更順利。 依此方式形成具吸液性之夾輥9’ 。 《作用》 本發明之表面處理裝置1的輸送機3，係如以上說明所 構成。因此，具有如下的作用。 (1) 表面處理裝置1，係使用於基板的製造過程。即，使用 於極薄之軟性基板的製造過程，用以將極薄且柔軟基板材 A於輸送機3邊運送，邊從噴嘴4噴射處理液B，進行表面 f 處理以供電路形成用（參照第3圖）。 (2) 然後各表面處理裝置1，在充滿處理液B的液槽5中， 配設液中運送用輸送機3及液中噴射用的噴嘴4。輸送機3 係夾輥9挾持基板材A之非電路形成面的兩側端面而運送 (參照第3圖）。 (3) 而基板材A從前過程之表面處理裝置1的處理室2， 朝次一過程之表面處理裝置1的處理室2，然後更向下一 過程之表面處理裝置1的處理室2,以輸送機3依序運送， 通過處理室2的間隔空間D而交接（參照第1、2圖）。 (4) 且說，將如此表面處理裝置1的處理室2間之間隔空 間D，在以輸送機3運送之基板材A上，處理液B整體以 水滴狀附著。即基板材A在表面處理裝置1的處理室2內， 相對於液中運送，在間隔空間D被液外運送且被處理液B 沾濕著。 (5) 更，基板材A係以輸送機3的夾輥9挾持兩側端面運 送，所以從這方面於間隔空間D，在中央部的電路形成面 上處理液B容易附著、殘留。 -17- 200824518 (6) 因此，在該表面處理裝置1於間隔空間D的輸送機3 具備凸狀形成用的夾輥9 ’ ，基板材A是傾斜上升然後傾 斜下降地運送。因而在間隔空間D，附著在基板材A之處 理液B流下原來表面處理裝置1的處理室2而回收（參照 第1圖）。 (7) 更，在該表面處理裝置1，間隔空間D之輸送機3具 備吸液性的夾輥9 ’或空氣噴嘴1 2。因此在間隔空間D附 著在基板材A的處理液B，藉由如此的夾輥9 ’或空氣噴嘴 1 2以進行吸液、乾燥或除去（參照第2圖）。 (8) 此外，在圖示之例，凸狀形成用夾輥9’ （參照第1 圖）及吸液性夾輥9 ’等（參照第2圖）雖分別採用，但 當然亦可共同採用。即，將運送於間隔空間D之輸送機3 的夾輥9 ’之構成，亦可既作爲凸狀形成用又具備吸液更 附帶有空氣噴嘴1 2者。 【圖式簡單說明】 第1圖係本發明之表面處理裝置的輸送機，供實施發明 之最佳形態的說明之其中1例的側截面說明圖。 第2圖係提供實施同發明之最佳形態的說明用之其他例 的側截面說明圖。 第3圖係提供實施同發明之最佳形態的說明用之表面處 理裝置的側截面。 【主要元件符號說明】 1 表面處理裝置 2 處理室 3 輸送機 -18 - 200824518 4 噴嘴 5 液槽 6 蓄槽 7 泵 8 配管 9 夾輥 9， 夾輥 10 出口 11 入口 12 空氣噴嘴 1 3 吸液部 A 基板材 B 處理液 C 輸送方向 D 間隔空間 E 鋼索 F rm m -19That is, the nip roller 9' of the conveyor 3 of the space D is inclined upwardly and then inclined downward for the base material A - 14 - 200824518 to face the treatment liquid B adhering to the base material A toward the surface treatment apparatus 1. The processing chamber 2 flows down and is restored. The conveyor 3 for the space D shown in Fig. 1 will be described in more detail below. First, in the liquid tank 5 of the processing chamber 2 of the surface treatment apparatus 1 of the previous process, the processing liquid B adhering to the surface of the base material A, that is, the processing of moving out of the space D from the outlet 10 of the processing chamber 2 in a state of being adhered thereto The liquid B flows down the base sheet A toward the outlet 10 of the original processing chamber 2 in accordance with the inclination gradient of the base sheet A by the upper and lower nip rollers 9'. On the other hand, the liquid tank 5 or the tank 6 of the processing chamber 2 is received. Further, in the processing chamber of the surface treatment apparatus 1 in the subsequent process, the processing liquid B adhering to the surface of the substrate A, that is, the processing liquid B overflowing from the inlet 11 of the processing chamber 2, is formed by the convex formation. The inclined gradient of the base sheet A of the nip roller 9' flows down the base sheet A toward the inlet 11 of the processing chamber 2. The liquid tank 5 or the storage tank 6 of the processing chamber 2 is recovered. As the nip roller 9' for forming the convex shape of the space D, the following various forms can be considered. a The nip roller 9' of the illustrated example is formed of the same diameter both at the top and bottom, and the height level of the shaft is fixed in a high and low manner in order to form the convex shape. b. According to the example of the drawing, with respect to the configuration of the space D, it is also possible to use only the nip roller 9' in the center portion of the conveying direction C, and the nip roller 9 is used in the front and rear. c. Further, regarding the nip roller 9', a convex shape can be formed by using a diameter larger than the other nip rollers 9. d. Further, the height level of the nip roller 9' is variable, and various height levels may be considered. That is, the upper and lower nip rollers 9' are provided with an elevating mechanism for moving up and down correspondingly to the conveying speed of the machine -15-200824518, and the faster the conveying speed, the steeper the inclination of the processing liquid B is, and the lowering speed of the processing liquid B is faster. The advantage of making the recovery of the treatment liquid B more rounded. Further, in Fig. 1, the E is attached to the outer circumferential groove of the nip rolls 9, 9' of the lower stage, and has a function of preventing the base material A from sagging. F is a ring that is inserted into the outer circumferential groove of the nip rolls 9, 9' of the upper stage, and has a function of preventing the substrate material A from being caught. "The liquid-absorbent nip roller 9' and the like" Next, in the example shown in Fig. 2, the liquid-outlet transporting conveyor 3 of the space D has the nip roller 9' of the liquid absorbing property of the processing liquid B. Then, an air nozzle 1 2 which is dried and removes the treatment liquid B adhering to the base material A is disposed at a space before and after the nip roller 9' having the liquid absorbing property. The conveyor 3 for the space D shown in Fig. 2 will be described in more detail. The nip roller 9' having the liquid absorbing property is provided, for example, a structure in which the liquid absorbing portion 13 is provided in the outer peripheral portion, and a hard foaming material or the like is used as the liquid absorbing portion 13. In the illustrated example, the nip roller 9' having the liquid absorbing property is used in the center portion of the transport direction C of the space I of the space I, and the normal nip roller %9 is used for the front and rear. Then, the treatment liquid B adhering to the base material sheet A is absorbed and removed from both side end faces of the base material sheet A. Further, the air nozzle 12, in terms of the upper and lower nip rollers 9', is spaced apart from the front and rear, and the space between the nip roller 9' and the nip roller 9 and the circuit forming surface or both end faces of the base sheet A. , listed separately. Then, the treatment liquid B adhering to the base material A is dried by air jet and removed. In addition, when the air nozzles 1 2 are inclined in the left-right direction in advance, the treatment liquid B adhering to the base material sheet A flows to the liquid-absorbent nip roller 9' and is collected by the -16-200824518, so that the treatment liquid B is removed. It will be smoother. In this way, a liquid absorbing nip roller 9' is formed. <<Operation>> The conveyor 3 of the surface treatment apparatus 1 of the present invention is constructed as described above. Therefore, it has the following effects. (1) The surface treatment apparatus 1 is used in the manufacturing process of a substrate. That is, it is used in the manufacturing process of an extremely thin flexible substrate for transporting the extremely thin and flexible substrate A on the conveyor 3, and the processing liquid B is ejected from the nozzle 4 to perform surface f treatment for circuit formation (refer to Figure 3). (2) Each of the surface treatment apparatuses 1 is provided with a liquid transporting conveyor 3 and a liquid-injecting nozzle 4 in the liquid tank 5 filled with the processing liquid B. The conveyor 3 nip roller 9 holds the both end faces of the non-circuit forming surface of the base material A and transports it (see Fig. 3). (3) The base sheet A is processed from the processing chamber 2 of the surface treatment apparatus 1 of the previous process, to the processing chamber 2 of the surface treatment apparatus 1 of the next process, and then to the processing chamber 2 of the surface treatment apparatus 1 of the next process, The conveyors 3 are sequentially transported and delivered through the space D of the processing chamber 2 (see FIGS. 1 and 2). (4) In the case where the space D between the processing chambers 2 of the surface treatment apparatus 1 is applied to the base material A conveyed by the conveyor 3, the entire processing liquid B adheres in a teardrop shape. That is, the base material A is conveyed in the processing chamber 2 of the surface treatment apparatus 1 with respect to the liquid, and is transported outside the liquid in the space D and wetted by the liquid B to be treated. (5) Further, the base material A is conveyed by the nip rollers 9 of the conveyor 3, and the processing liquid B adheres and remains on the circuit forming surface of the center portion in the space D in this respect. -17- 200824518 (6) Therefore, the conveyor 3 of the surface treatment apparatus 1 in the space D has a nip roller 9' for forming a convex shape, and the base material A is inclined and then conveyed obliquely. Therefore, in the space D, the chemical solution B adheres to the base material A, and the processing chamber 2 of the original surface treatment apparatus 1 flows down (see Fig. 1). (7) Further, in the surface treatment apparatus 1, the conveyor 3 of the space D has a liquid-absorbent nip roller 9' or an air nozzle 12. Therefore, the treatment liquid B attached to the base material A in the space D is sucked, dried or removed by the nip roller 9' or the air nozzle 12 (refer to Fig. 2). (8) In the example shown in the figure, the ridge roller 9' for convex formation (see Fig. 1) and the liquid absorbing roller 9' (see Fig. 2) are used separately, but they can of course be used together. . In other words, the nip roller 9' of the conveyor 3 transported in the space D can be configured to have a convex shape and a liquid nozzle 1 with liquid absorption. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side cross-sectional explanatory view showing an example of a conveyor for a surface treatment apparatus of the present invention, which is one of the best modes for carrying out the invention. Fig. 2 is a side cross-sectional explanatory view showing another example for explaining the best mode of the invention. Fig. 3 is a side cross-sectional view showing a surface treatment apparatus for carrying out the description of the best mode of the invention. [Main component symbol description] 1 Surface treatment device 2 Processing chamber 3 Conveyor-18 - 200824518 4 Nozzle 5 Tank 6 Reservoir 7 Pump 8 Piping 9 Clamp roller 9, nip roller 10 outlet 11 inlet 12 air nozzle 1 3 pipetting Part A Base plate B Treatment liquid C Conveying direction D Space separation E Cable F rm m -19