200814873 七、指定代表圖： (一） 本案指定代表圖為：第（1)圖。 (二) 本代表圖之元件符號簡單說明：， 6 1、步驟一 6 2、步驟二 6 3、步驟三 6 4、步驟四 6 5、步驟五 6 6、步驟六 6 7、步驟七 6 8、步驟八 6 9、步驟九 7 〇、步驟十 71、步驟十一 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式： — 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電路板之定位組合裝置及方法，尤指一種藉由一 Φ 真空吸附機構、一調整機構、至少四台攝影機及一控制台相互組合之設計， 以供侧母板之光學點及子板之量泰，進而比對定位，以完成定位結合 作業，使得本發明具有操作簡便快速及方便定位等效果，而適用於電路板 "母板巾之各>1子板雜婦誠其_似之定絲置者。 【先前技術】 由於近年來通訊、電腦、網路…等益 當容易，故Μ及各錢子翻較關來越多，然 子里1運各類貧訊之取得變的相 而電腦及各式電子儀 200814873 器都少不了路板的使用，業界常見的電路基板（panel)中係内含有 數個電路板，若在電路基板製程中測得内含之電路板有不良品 %，則將该電路基板報廢，造成該電路基板上其他良品電路板的 浪費，同時為翻報廢電路基板的數量，則需重新生產電路基板 •-以達到目標產量。為了不造成浪費並節省重新生產電路基板所須 ，之時間與成本’目前已有不少相_發明案件被揭露，例如中華 民國發明專利證書號第1228_號之「不良多聯片印刷電路板替換重 .置之方法」t，揭露-種不良多聯片印刷電路板替換重置之方法，該方 法包括： ^ a.利用-多則印織路板上之複數定位赠作-基準模板，並在該 模板上依該多· _電路板上之該定位孔製作複數鋪，該插梢係固定/ 於模板上當作定位孔之基準； b·將已切除不良單片印刷電路板的不良多聯片印刷電路板依該插梢定 位置於該模板上； c.再將自其他多聯片印刷電路板上所切除下來之良品單片印刷電路 板’置聯良多聯片印刷電路板的待補空間内，利用該模板之該鋪將 忒良品單片印刷電路板置入正確位置；200814873 VII. Designated representative map: (1) The representative representative of the case is: (1). (2) A brief description of the component symbols of this representative figure: 6, 1 1, step 1 6 2, step 2 6 3, step 3 6 4, step 4 6 5, step 5 6 6 , step 6 6 7 , step 7 6 8 Step 8:9, Step 9:7, Step 1071, Step 11: If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: - Nine, invention description: [Technical field of invention] The invention relates to a positioning assembly device and method for a circuit board, in particular to a design in which a Φ vacuum suction mechanism, an adjustment mechanism, at least four cameras and a console are combined with each other for the optical point of the side motherboard. And the amount of the sub-board, and then the positioning to complete the positioning and combining operation, so that the invention has the advantages of simple and quick operation and convenient positioning, and is suitable for the circuit board " mother board towel> Sincerely, it seems to be fixed. [Prior Art] Since communication, computer, internet, etc. have been easy to use in recent years, the more money and money are turned over, the more the computers and the various computers have changed. The electronic instrument 200814873 is indispensable for the use of the circuit board. The circuit board commonly used in the industry contains several circuit boards. If the circuit board contained in the circuit substrate process has a defective product%, the The circuit substrate is scrapped, causing waste of other good circuit boards on the circuit board. At the same time, in order to reverse the number of waste circuit boards, it is necessary to reproduce the circuit board to achieve the target output. In order not to cause waste and save the need to reproduce the circuit board, the time and cost 'has been a lot of _ invention cases have been exposed, such as the Republic of China Invention Patent No. 1228_" "bad multi-chip printed circuit board Replacing the method of "replacement", revealing a method for replacing a defective multi-piece printed circuit board replacement method, the method comprising: ^ a. utilizing - a plurality of positioning positioning on the printed board - a reference template, And forming a plurality of paving on the template according to the positioning hole on the multi-_ circuit board, the plug is fixed/referenced on the template as a reference hole; b·there is a lot of defective single-chip printed circuit board The printed circuit board is placed on the template according to the position of the plug; c. The good single-chip printed circuit board cut off from the other multi-piece printed circuit board is connected to a plurality of printed circuit boards. In the space to be replenished, the shop using the template puts the good single-chip printed circuit board into the correct position;
d·在該良品單片印刷電路板與該不良多聯片 膠接合作業； P刷電路板間縫隙進行注 e.將注膠 化處理。 完成之料«刺印猶路板置於雖環射·最佳固 200814873 而口而先细―多聯片印刷電路板上之複數定位孔製作—基準模 板，並在賴板上依够聯以卩输上之該定魏製作他插梢，以 供固定於模板上當作定位孔之基準，俾利已切除不良單片印刷電路板的不 良多聯片印刷電路板依該插梢定位置於該模板上，最後才能將其他多聯片 ·.印刷電路板上所切除下來之良品單片印刷電路板置入該不良多聯片印刷電 ..路板的待補空_，岭使用上需另外設置配合多聯片印刷電路板上之複 數疋位孔所设置之基準模板及複數插梢，致使使用上相當繁瑣不便，且配 鲁合不同形式之電路板時’需再對應製作不同的基準模板及複數插梢，徒增 製作成本及時間，故於實際使用上仍不符合所需。 【發明内容】 、附b ’本伽之轉目的錄於提供—種電路板之定她合裝置及方 法，藉由-真空吸附機構、—調整機構、至少四台攝影機及—控制台相互 =合=攻計’以供細母板之光學點及子板之制點，進邮對定位，以 鲁〜成德結合健，使縣㈣具有操作騎快歧雜雜等效果，增 加其實用性及便利性。 為達上述之目的，本發明係—種電路板之定位組合裝置及方法，包括 下列步驟： ::n、紅糊碌得母缺學職子板量_座標值； b .依實物1路板之母板光學點調整至少二台彡齡光學點正 上方固定； v驟二、依貫物電路板之子板量_調整至少三台攝影機到量測點正 9 200814873 上方固定； 步驟四、敵卫雜面取狀母板光學點及子板量靡座標值與實物 電路板之誤差值並比對出實際誤差； 步驟五、將誤差值輸入控制台運算； 步驟六、輸入所需調整的參數及座標值； ·, 步驟七、雜具有缺部之母板光學點好板量靡至所紐標值，並 固定於台面上； 鲁 〆驟人㉟路板之子板及母板均完成正面量測後即以膠帶固定正面完 成對位作業； 步驟九、在電路板之子板及母板之背面接合處上膠； 步驟十、將上膠後之電路板之子板及母板進行烘烤固化；以及 〜 步針―、剝除電路板之子板及母板正面之·，進而完成定位結合 作業者。 該電路板之定位組合裝置包括有—真空吸附機構、—調整機構、至少 _四台攝影機及—控制台。該真空蘭機構係設有-真空吸附平台，該真空 吸附平台上係設有複數個孔洞，而該真空吸附平台係連接複數個真空生產 器，以供控制電路板之母板吸附定位，且該真空吸附平台係設有一貫穿開 *，口，摘整機構係對應設置於真空吸附平台之貫穿，處，喊調整麟 一係供吸附電路板之子板做三軸方向作動調整；該二台攝影機係對應電路板 之母板设置’ *另二台攝影機储應電路板之子板設置，以供_母板之 光+』及子板之i測點，該控制台係電性連結各台攝影機，以供彳貞測比對 200814873 定位；藉此，以完成定位結合作業，而具有操作簡便快速及方便定位者。 【實施方式】 請參閱第1〜5圖，本發明之電路板之定位組合方法，包括下列步驟·· _ 步驟一 6 1、依工程圖面（CAD/CAM)取得母板5 1光學點5丄丄及子板5 2 量測點5 2 1座標值；該依工程圖面（CAD/CAM)取得之母板5q光學點 51 1及子板5 2量測點5 21座標值係儲存於控制台4 〇者。 _ 步驟二6 2、依實物電路板之母板5丨光學點5丄i調整至少二台攝影機 3 0至光學點5 1 ；[正上方固定。 步驟三6 3、依實物電路板之子板5 2量測點5 21調整至少二台攝影機 3 0到量測點5 21正上方固定。 步驟四6 4、調校工程圖面（CAD/CAM)取得之母板5 !光學點5工工及子板 5 2篁測點5 21座標值與實物電路板之誤差值並比對出實際誤差。 步驟五6 5、將誤差值輸入控制台4 〇運算。 _ 步驟六6 6、輸入所需調整的參數及座標值。 V驟七6 7、碰具有缺部之母板5 i光學點5 i丄及子板5 2量測點5 21至所需座標值，並固定於台面上。 一 乂驟八6 8電路板之子板5 2及母板51均完成正面量測後即以膠帶固 定正面完成對位作業。 —* 步驟九6 9、在電路板之子板5 2及母板51之背面接合處上膠（該膠係 可為環氧樹酯接著劑、矽膠…者）。 乂驟十7 Q、將上膠後之電路板之子板5 2及母板51進行烘烤固化。 200814873 步驟十一71、剝除電路板之子板5 2及母板51正面之膠帶，進而完成 定位結合作業者。 其中，該具有缺部之電路板母板51係固定於一真空吸附機構i 〇之 真空吸附平台11上，並將電路板之母板51抵靠定位於真空吸附平台工 ^ 1上之定位塊13，以供調整電路板之母板51光學點5 i i至所需座標 ^ 值，而該電路板之子板5 2係對應設置於電路板之母板5 i缺部下方之調 整機構2 0上，以供調整電路板之子板5 2量測點5 2 i至所需座標值 _ 者。而该調整機構20係設有三軸調整控制組及一吸附平台24，該三軸 調整控制組係設有一X軸調整鈕2工、一γ軸調整鈕2 2及_旋轉軸調整 鈕2 3 (該調整機構之三軸調整控制組亦可採用具有χ軸、γ軸及旋轉軸 、之三軸自動調整控做者。），以供吸_路板之子板5 2做三軸方向作動 _調整。另，該電路板反面係可重覆步驟一 61〜步驟六β β，以供二度定 位確認者。 本發明之電路板之定位組合裝置，包括： 馨 一真空吸附機構1〇，該真空吸附機構1〇係設有-真空吸附平台1 1，該真空吸附平台ί1上係設有複數個孔洞111，而該真空吸附平台 1 1係連接複數個真空生產器12，該複數個真空生產H!2係分別設有 …一真空生絲關1 2 1，以供控繼路板之母板5丨吸附定位，且該真 …空吸附平台1 1係設有-貫穿開口1 12 ;其中，該真空吸附機構10上 系χ有至疋位塊1 3 (該定位塊1 3係呈L形，以對應電路板之母板 5 1外形者），以提供電路板之母板5 1抵靠定位者。 12 200814873 馮疋機構2 〇，該調整機構2 〇係對應設置於真空吸附平台1. 貫穿開口 1 1 9 _ 二 < “肩整機構2 G係設有三軸調整控制組及—吸附平 > ㈣整控制組係設有—⑽調整紐2丄、—Y軸調整紐2 2d. Engage the good single-chip printed circuit board with the defective multi-ply glue; P-print the gap between the circuit boards to e-ject the gel. The finished material «The smear-printed road plate is placed in the ring, the best solid 200814873, and the mouth is fine--multiple locating holes on the multi-chip printed circuit board - the reference template, and on the board The Ding Wei made the tip of the pin to be fixed on the template as the reference hole, and the defective multi-piece printed circuit board on which the defective single-chip printed circuit board has been removed is placed according to the pin position. On the template, in the end, the good single-chip printed circuit board cut off from the other multi-chip printed circuit board can be placed in the bad multi-chip printed circuit. The road board is to be filled _, the ridge needs to be used separately. The reference template and the plurality of plugs provided in the plurality of clamping holes on the multi-chip printed circuit board are arranged, which is quite cumbersome and inconvenient to use, and when the circuit boards of different forms are combined, the corresponding reference templates need to be correspondingly produced. And a number of inserts, increase production costs and time, so it still does not meet the needs in actual use. [Summary of the Invention], attached b 'Benga's transfer purpose is provided in the provision of a circuit board to determine her device and method, by - vacuum adsorption mechanism, - adjustment mechanism, at least four cameras and - console mutual = = Attack 'for the optical point of the fine mother board and the sub-board's manufacturing point, the postal positioning, with Lu ~ Chengde combined with health, so that the county (four) has the effect of riding fast and mixed, etc., increasing its practicability and Convenience. For the purpose of the above, the present invention relates to a positioning assembly device and method for a circuit board, comprising the following steps: ::n, a red paste, a mother, a student, a board, a quantity, a coordinate value; b. The optical point of the mother board is adjusted to be fixed at least two optical points at the top of the aging age; v. Second, the amount of the sub-board of the compliant board _ adjust at least three cameras to the measuring point. 9 200814873 Fixed above; Step 4: Enemy The optical point of the miscellaneous surface and the error value of the sub-plate 靡 coordinate value and the physical circuit board are compared with the actual error; Step 5, the error value is input into the console operation; Step 6. Input the parameters to be adjusted and Coordinate value; ·, Step VII, the optical plate with the missing part of the board has a good plate amount to the value of the new standard, and is fixed on the table; Lu Xun, the 35-way board and the mother board are all positively measured. After the tape is fixed on the front side to complete the alignment operation; Step 9. Glue the joint between the daughter board of the circuit board and the back side of the motherboard; Step 10. Bake and solidify the daughter board and the mother board of the board after the glue is glued; ~ Step needle - strip the board And · the front of the motherboard, and then complete the positioning in conjunction with the operator. The positioning assembly of the circuit board includes a vacuum suction mechanism, an adjustment mechanism, at least four cameras, and a console. The vacuum blue mechanism is provided with a vacuum adsorption platform, wherein the vacuum adsorption platform is provided with a plurality of holes, and the vacuum adsorption platform is connected to a plurality of vacuum producers for adsorbing and positioning the mother board of the control circuit board, and the The vacuum adsorption platform is provided with a through-opening*, port, and the finishing mechanism is correspondingly disposed at the penetration of the vacuum adsorption platform, and the sub-board for the adsorption circuit board is adjusted to adjust the three-axis direction; the two camera systems are The motherboard of the corresponding circuit board is set to '* the other two camera storage board's daughter board settings, for the _ mother board light +』 and the sub-board i measurement point, the console is electrically connected to each camera to It is used for the positioning of the 200814873; in order to complete the positioning and combining operations, it is easy and quick to operate and convenient to locate. [Embodiment] Please refer to Figures 1 to 5, the positioning combination method of the circuit board of the present invention, including the following steps: · Step 1-6, obtaining the mother board 5 1 optical point 5 according to the engineering drawing (CAD/CAM)丄丄 and daughter board 5 2 measuring point 5 2 1 coordinate value; the mother board 5q optical point 51 1 and the daughter board 5 2 measuring points obtained according to the engineering drawing (CAD/CAM) are stored in Console 4 leader. _ Step 2 6 2, according to the mother board of the physical circuit board 5 丨 optical point 5 丄 i adjust at least two cameras 3 0 to optical point 5 1 ; [fixed directly above. Step 3 6 3. Adjust at least two cameras according to the daughter board of the physical circuit board 5 2 measuring points 5 21 3 0 to the measuring point 5 21 is fixed directly above. Step 4 6 4, adjust the master drawing of the engineering drawing (CAD / CAM) 5! Optical point 5 engineering and daughter board 5 2 篁 measuring point 5 21 coordinate value and the physical circuit board error value and compare the actual error. Step 5 6 5. Enter the error value into the console 4 〇 operation. _ Step 6 6 6. Enter the parameters and coordinate values to be adjusted. V Step 7 6 7. Touch the motherboard with the missing part 5 i Optical point 5 i丄 and the daughter board 5 2 Measure the point 5 21 to the desired coordinate value and fix it on the table. After the front side measurement is completed, the sub-board 5 2 and the mother board 51 of the circuit board are completed with the tape to fix the front side. —* Step IX 6. 9. Glue at the back joint of the daughter board 5 2 of the board and the mother board 51 (this glue can be epoxy resin adhesive, silicone rubber...). Step 10: Q. The sub-board 5 2 and the mother board 51 of the board after the sizing are baked and cured. 200814873 Step 11 71. Strip the sub-board 5 2 of the circuit board and the tape on the front side of the motherboard 51 to complete the positioning and bonding operation. The circuit board mother board 51 having the missing portion is fixed on the vacuum adsorption platform 11 of the vacuum suction mechanism i, and the mother board 51 of the circuit board is abutted on the positioning block positioned on the vacuum adsorption platform. 13, for adjusting the optical point 5 ii of the motherboard 51 of the circuit board to the required coordinate value, and the daughter board 52 of the circuit board is corresponding to the adjustment mechanism 20 disposed under the missing portion of the motherboard 5 i of the circuit board For adjusting the board 5 2 of the board to measure the point 5 2 i to the desired coordinate value _. The adjustment mechanism 20 is provided with a three-axis adjustment control group and an adsorption platform 24, and the three-axis adjustment control unit is provided with an X-axis adjustment button 2, a γ-axis adjustment button 2 2 and a _ rotation axis adjustment button 2 3 ( The three-axis adjustment control group of the adjustment mechanism can also adopt a three-axis automatic adjustment controller with a χ axis, a γ axis and a rotary axis.), for the sub-board 5 2 of the suction _ road plate to be operated in three-axis direction _ adjustment . In addition, the reverse side of the circuit board can repeat step 61 to step 6 β β for the second degree of confirmation. The positioning assembly device of the circuit board of the present invention comprises: a vacuum adsorption mechanism 1〇, the vacuum adsorption mechanism 1 is provided with a vacuum adsorption platform 1 1 , and the vacuum adsorption platform ί1 is provided with a plurality of holes 111, The vacuum adsorption platform 1 1 is connected to a plurality of vacuum producers 12, and the plurality of vacuum production H! 2 systems are respectively provided with a vacuum raw silk shutoff 1 2 1 for controlling the adsorption and positioning of the mother board of the relay board. And the air suction platform 11 is provided with a through opening 1 12; wherein the vacuum suction mechanism 10 is coupled to the clamp block 13 (the positioning block 13 is L-shaped to correspond to the circuit The motherboard of the board 5 1 is configured to abut the locator of the motherboard 5 1 of the circuit board. 12 200814873 Feng Wei mechanism 2 〇, the adjustment mechanism 2 〇 is correspondingly set on the vacuum adsorption platform 1. Through-opening 1 1 9 _ 2 < “Shoulder mechanism 2 G system is equipped with three-axis adjustment control group and — adsorption flat” (4) The whole control group is equipped with - (10) adjustment button 2, - Y axis adjustment button 2 2
及紅轉輛调整紐23 (該調整機構之三軸調整控制組亦可採用具有X 一 鱗軸之二軸自動調整控做者。），以供韻電路板之子板5 ·』2做二軸方向作動調整。 Q攝〜機3Q ’該二台攝影機3〇係對應電路板之母板5工設 ，置而另一台攝影機30係對應電路板之子板5 2設置，以供偵測母板5 1之光予點511及子板5 2之量測點5 21。 控制台4 0，該控制台4〇係電性連結各台攝影機3〇，以供偵測 - 比對定位者。 、 \ 藉以上各凡件及步驟以構成一種電路板之定位組合裝置及方法；請參 閱第1 R 0 / 圖’本發明之特點係在於藉由該依工程圖面（CAD/C施)取得之母 板51光學點s Ί， ”、、〇丄1及子板5 2量測點5 2 1座標值係先儲存於控制台4 _ 〇並依貝物電路板之母板51光學點511及子板52量測點521分 別各自&至少二台攝影機3 0至光學點51 1及量測點5 21之正上方 J後將具有缺部之電路板母板51固定於一真空吸附機構1〇之真 • · 空吸附平么1 1 l 、， " • * σ 上’並將電路板之母板51抵靠定位於真空吸附平台1 1 上之定位換1 q 一 ^ ’以供快速調整電路板之母板51光學點51 1至所需座 A 電路板之子板5 2係對應設置於電路板之母板51缺部下方之 调正機構2 0上’藉由該調整機構2 0所設置之X軸調整鈕21、γ軸調 13 200814873 整鈕2 2、旋轉軸調整鈕2 3 (或具有χ軸、γ轴及旋轉軸之三軸自動調 整控制組）及吸附平台2 4，以供吸附電路板之子板5 2做三軸方向作動 調整，進而調整電路板之子板5 2量測點5 2 i至所需座標值者。而當電 路板之子板5 2及母板51均完成正面量測後即以膠帶固定正面完成對位 “ 作業，隨後再於電路板之子板5 2及母板51之背面接合處上膠，上膠後 ·☆再進行烘烤固化，最後剝除電路板之子板5 2及母板5 1正面之膠帶，進 而完成定位結合作業者。使得本發明具有操作簡便快速及方便定位等效 • 果’增加其實用性及便利性。 I*隹以上所述者，僅為本發明之一較佳實施例而已，並非用來限定本 纟明之實施_，舉凡依本發明巾請專利翻及發明說明書内容所作之簡 •早的等效變化與修飾，均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 第1圖，係本發明之使用步驟示意圖。 φ 第2圖，係本發明之使用狀態示意圖。 第3圖，係本發明真空吸附機構與調整機構之立體外觀圖。 第4圖，係本發明具缺部之電路板母板之平面示意圖。 第5圖，係本發明具缺部之電路板母板與子板之結合平面示意圖。 … 【主要元件符號說明】 · 10、真空吸附機構 1 11、孔洞 12、真空生產器 11、真空吸附平台 1 1 2、開口 121、真空生產器開關 14 200814873 13、定位塊 2 0、調整機構 2 1 、X軸調整鈕 2 2、Y軸調整鈕 2 3 、旋轉轴調整鈕 2 4、吸附平台 3 0、攝影機 40 、控制台 5 1、母板 5 1 1、光學點- 5 2、子板 52 1、量測點 61、步驟一 62 、步驟二 6 3、步驟三 64 、步驟四 6 5、步驟五 66 、步驟六 6 7、步驟七 6 8 、步驟八 6 9、步驟九 70 、步驟十 71、步驟十一 15And the red turn adjustment button 23 (The three-axis adjustment control group of the adjustment mechanism can also be used as the two-axis automatic adjustment controller with the X-scale axis.), for the sub-board of the rhyme circuit board 5 ·』2 to do the two-axis Direction adjustment. Q camera ~ machine 3Q 'The two cameras 3 对应 corresponds to the motherboard 5 of the corresponding circuit board, and the other camera 30 is set to the sub-board 5 2 of the corresponding circuit board for detecting the light of the motherboard 5 1 Point 511 and the measurement point 5 21 of the sub-board 5 2 . Console 40, the console 4 is electrically connected to each camera 3 侦测 for detection - comparison locator. And \ by the above various parts and steps to form a circuit board positioning assembly device and method; please refer to the 1st R 0 / Figure 'The invention is characterized by the engineering drawing (CAD / C application) Motherboard 51 optical point s Ί, ”, 〇丄1 and daughter board 5 2 measuring point 5 2 1 coordinate value is stored in the console 4 _ 〇 and according to the motherboard board 51 optical point 511 And the sub-board 52 measuring points 521 respectively fix the circuit board mother board 51 having the missing portion to a vacuum suction mechanism after the at least two cameras 30 to the optical point 51 1 and the measuring point 5 21 1〇真• · 空吸平平1 1 l , , " • * σ上 ' and the board's motherboard 51 is positioned against the vacuum adsorption platform 1 1 position for 1 q a ^ ' for Quickly adjust the optical plate 51 1 of the motherboard of the circuit board to the required seat A. The daughter board 5 2 of the circuit board is corresponding to the adjustment mechanism 20 disposed under the missing portion of the motherboard 51 of the circuit board. 0 X-axis adjustment knob 21, γ-axis adjustment 13 200814873 Full-button 2 2. Rotary-axis adjustment knob 2 3 (or three-axis with χ, γ, and rotary axes) Adjusting the control group) and the adsorption platform 2 4, for the sub-board 5 2 of the adsorption circuit board to be adjusted in three-axis direction, and then adjusting the sub-board 5 2 of the circuit board to measure the point 5 2 i to the desired coordinate value. After the front side measurement of the board sub-board 5 2 and the mother board 51 is completed, the front side of the board is fixed by the adhesive tape, and then the glue is applied to the back joint of the daughter board 52 and the mother board 51 of the circuit board. ☆ Then bake and solidify, and finally strip the front side of the circuit board 5 2 and the front side of the mother board 5 1 to complete the positioning and bonding operation. The invention has the advantages of simple and quick operation and convenient positioning and positioning. The above is only a preferred embodiment of the present invention, and is not intended to limit the implementation of the present invention, and the simple equivalent of the invention according to the invention and the content of the invention. Variations and modifications are intended to be included within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the steps of use of the present invention. φ Fig. 2 is a schematic view showing the state of use of the present invention. Fig. 3 is a perspective view showing the vacuum suction mechanism and the adjustment mechanism of the present invention. Figure 4 is a plan view showing a circuit board mother board having a missing portion of the present invention. Figure 5 is a schematic plan view showing the combination of the mother board and the daughter board of the circuit board having the missing portion of the present invention. ... [Main component symbol description] · 10, vacuum adsorption mechanism 1 11, hole 12, vacuum producer 11, vacuum adsorption platform 1 1 2, opening 121, vacuum producer switch 14 200814873 13, positioning block 2 0, adjustment mechanism 2 1, X-axis adjustment button 2, Y-axis adjustment button 2 3, rotary axis adjustment button 2 4, adsorption platform 3 0, camera 40, console 5 1, motherboard 5 1 1 , optical point - 5 2, daughter board 52 1. Measurement point 61, step one 62, step two 6 3, step three 64, step four 6 5, step five 66, step six 6 7, step seven 6 8 , step eight 6 9 , step nine 70, step Ten 71, step eleven 15