TW200810920A - Multilayer sealant film - Google Patents
Multilayer sealant film Download PDFInfo
- Publication number
- TW200810920A TW200810920A TW96125826A TW96125826A TW200810920A TW 200810920 A TW200810920 A TW 200810920A TW 96125826 A TW96125826 A TW 96125826A TW 96125826 A TW96125826 A TW 96125826A TW 200810920 A TW200810920 A TW 200810920A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- multilayer film
- substrate
- pla
- adhesion promoter
- Prior art date
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- 239000000565 sealant Substances 0.000 title description 2
- 229920000747 poly(lactic acid) Polymers 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000004626 polylactic acid Substances 0.000 claims abstract description 30
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 229920001577 copolymer Polymers 0.000 claims abstract description 10
- 229920001519 homopolymer Polymers 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 88
- 238000000576 coating method Methods 0.000 claims description 31
- 239000011248 coating agent Substances 0.000 claims description 28
- 229920000642 polymer Polymers 0.000 claims description 27
- -1 polyethylene terephthalate Polymers 0.000 claims description 19
- 239000002904 solvent Substances 0.000 claims description 10
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 229920001634 Copolyester Polymers 0.000 claims description 8
- 238000007334 copolymerization reaction Methods 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 239000000052 vinegar Substances 0.000 claims description 8
- 239000012793 heat-sealing layer Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 235000021419 vinegar Nutrition 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000008199 coating composition Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000002425 crystallisation Methods 0.000 claims description 2
- 230000008025 crystallization Effects 0.000 claims description 2
- 241000270666 Testudines Species 0.000 claims 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Substances OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 150000002923 oximes Chemical class 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 235000013305 food Nutrition 0.000 abstract description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 15
- 239000002131 composite material Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 239000004310 lactic acid Substances 0.000 description 8
- 235000014655 lactic acid Nutrition 0.000 description 8
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 5
- 229930182843 D-Lactic acid Natural products 0.000 description 5
- JVTAAEKCZFNVCJ-UWTATZPHSA-N D-lactic acid Chemical compound C[C@@H](O)C(O)=O JVTAAEKCZFNVCJ-UWTATZPHSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 229940022769 d- lactic acid Drugs 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000005041 Mylar™ Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000007765 extrusion coating Methods 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- WHBMMWSBFZVSSR-UHFFFAOYSA-N 3-hydroxybutyric acid Chemical compound CC(O)CC(O)=O WHBMMWSBFZVSSR-UHFFFAOYSA-N 0.000 description 2
- FMHKPLXYWVCLME-UHFFFAOYSA-N 4-hydroxy-valeric acid Chemical compound CC(O)CCC(O)=O FMHKPLXYWVCLME-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000002632 lipids Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 1
- HBAQYPYDRFILMT-UHFFFAOYSA-N 8-[3-(1-cyclopropylpyrazol-4-yl)-1H-pyrazolo[4,3-d]pyrimidin-5-yl]-3-methyl-3,8-diazabicyclo[3.2.1]octan-2-one Chemical class C1(CC1)N1N=CC(=C1)C1=NNC2=C1N=C(N=C2)N1C2C(N(CC1CC2)C)=O HBAQYPYDRFILMT-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 208000034530 PLAA-associated neurodevelopmental disease Diseases 0.000 description 1
- 101000972349 Phytolacca americana Lectin-A Proteins 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 241000253623 Tabernaemontana persicariifolia Species 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000001167 anti-butyric effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- CLWGSKZGXLUNRY-UHFFFAOYSA-N benzoic acid;ethane-1,2-diol Chemical compound OCCO.OC(=O)C1=CC=CC=C1 CLWGSKZGXLUNRY-UHFFFAOYSA-N 0.000 description 1
- 229920002988 biodegradable polymer Polymers 0.000 description 1
- 239000004621 biodegradable polymer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010612 desalination reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ONIHPYYWNBVMID-UHFFFAOYSA-N diethyl benzene-1,4-dicarboxylate Chemical group CCOC(=O)C1=CC=C(C(=O)OCC)C=C1 ONIHPYYWNBVMID-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000012674 dispersion polymerization Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000002496 gastric effect Effects 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- JJTUDXZGHPGLLC-UHFFFAOYSA-N lactide Chemical compound CC1OC(=O)C(C)OC1=O JJTUDXZGHPGLLC-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004530 micro-emulsion Substances 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000000646 scanning calorimetry Methods 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/052—Forming heat-sealable coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/054—Forming anti-misting or drip-proofing coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
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Abstract
Description
200810920 ~ ~ ^ j--- 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種多層膜(multilayer film)的製造方 法’且特別是有關於一種多層密封膜(multilayer sealant film) 的製造方法。 【先前技術】200810920 ~ ~ ^ j--- IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a multilayer film and in particular to a multilayer sealant film Manufacturing method. [Prior Art]
♦孔酸(Polylactic acid,PL A )為可高度生物降解的 聚合物,其可來自於天然來源,諸如玉米。PLA用於製造 食物包裝盤之用途日漸普及,至少有部分原因是歸因於 PLA易於生物降解以及由pLA製造之盤具有極高透氧率 及透濕率,且因此PLA非常適於包裝新鮮產品。然而,由 PLA,造之盤在低至1〇4°F (40它)之溫度下傾向於軟化 以及變形。由於此缺點,所以對用於PLA盤上之覆芸蒱胺 為熱封必須在低溫™料阶^ 溫度下:封:習知密封薄膜未在足夠低之 :雖然*有;;==:度層隨=降 但此等 貝尸牙、商業使用所需之缝 于政月匕以 有益的。 而之,顿可加雄效㈣覆蓋薄膜將為 【發明内容】 方面,本發明提供一 種多層薄膜,其包括♦ Polylactic acid (PL A ) is a highly biodegradable polymer that can be derived from natural sources such as corn. The use of PLA for the manufacture of food packaging trays is gaining popularity, at least in part, due to the ease of biodegradability of PLA and the extremely high oxygen permeability and moisture permeability of discs made from pLA, and therefore PLA is well suited for packaging fresh products. . However, from PLA, discs tend to soften and deform at temperatures as low as 1 〇 4 ° F (40 Å). Due to this disadvantage, the cover resin used for the PLA disk must be heat-sealed at a low temperature TM temperature: sealing: the conventional sealing film is not sufficiently low: although * there;; ==: degree The layer is accompanied by = but these shells are used for commercial use, and the seams required for commercial use are beneficial. In addition, the invention can provide a multilayer film, which includes a multilayer film, which includes
200810920 a)包括聚合基質層之基板;以及 還包======熱封層 中還包括黏著促進;;基貝層砂合基f層表面上之層 封容: = =提供一種包括具有開口之容器的密 層之薄膜側上i封剛描述之多層薄膜在載有熱封 述方=Γ,本發明提供—種製造多層薄膜之方法。所 M j : 7塗佈液體至包括聚合基制之基板上,塗佈液 或者基板在聚合基質層表面上之層中尚包括;;: 進劑以接文塗佈液體;以及 b)移除溶劑以形成包括pLA聚合物之熱封層。 更進-步說明,本發明提供—種包括pLA聚合物、I 聚酯以及溶劑之塗佈組合物。 【實施方式】 本發明者發現,要使用習知方法將pLA聚合物適當堅 固地黏著至聚對笨二甲酸乙二酯(pdyeihylene terephthalate)(PET)以及多種其他基板非常困難。為解決 此問題及其他問題,本發明之多層薄膜包括包含聚合基質 層之基板以及在基板上之包含PLA聚合物之熱封層。熱封 層及基板中之一或兩者更包含增加pLA聚合物與聚合基 200810920 2之著,足進劑,同時保持良好的低溫熱封 二乳二:::說明’否則本文所用之術語“PLA聚合物,, =礼㈣來物以及包含至少3G莫耳%乳酸重複單 极共聚物。若基板包含呈層形式之黏著促進劑,則 層生產線上形成或者在聚合基質層製成ς 成(:在生產線外)。-般而言,將用於熱封層之聚合^ 麻’、即可熱封聚合物)應為具有比聚合 ;=5昨’通常低至少_,且更通常低至二 人化/皿度的熱塑性聚合物。軟化點以高於75下較佳。 若黏著促進劑分散於熱封層中,則分散可採用均質溶 ^之形式,或者_層可包含分散聚合物相以及具有不同200810920 a) a substrate comprising a polymeric matrix layer; and further comprising: ====== the heat sealing layer further comprises adhesion promoting;; the layer sealing of the base layer of the sand layer of the f layer: = = providing a The multi-layer film just described on the film side of the closed cell of the open container is loaded with heat sealing = Γ, and the present invention provides a method of producing a multilayer film. Mj: 7 coating liquid onto a substrate comprising a polymeric substrate, the coating liquid or substrate is further included in the layer on the surface of the polymeric substrate layer;;: the coating agent is applied to the liquid; and b) is removed The solvent is used to form a heat seal layer comprising a pLA polymer. Further, the present invention provides a coating composition comprising a pLA polymer, an I polyester, and a solvent. [Embodiment] The present inventors have found that it is very difficult to suitably adhere a pLA polymer to pdyeihylene terephthalate (PET) and various other substrates using a conventional method. To solve this and other problems, the multilayer film of the present invention comprises a substrate comprising a polymeric matrix layer and a heat seal layer comprising a PLA polymer on the substrate. One or both of the heat seal layer and the substrate further comprise an increase in the pLA polymer and the polymerizable group 200810920 2, the footing agent, while maintaining a good low temperature heat sealing the second milk 2::: Explain 'other terms used herein "PLA polymer,," (4), and a repeating monopolar copolymer comprising at least 3 G mol% of lactic acid. If the substrate comprises an adhesion promoter in the form of a layer, the layer is formed on the layer or formed in a polymeric matrix layer. (: outside the production line). - In general, the polymerization of the heat-sealing layer, ie, the heat-sealable polymer, should have a specific polymerization; =5 yesterday's usually at least _, and usually lower A thermoplastic polymer having a two-person/dish degree. The softening point is preferably higher than 75. If the adhesion promoter is dispersed in the heat-sealing layer, the dispersion may be in the form of a homogeneous solution, or the layer may contain a dispersion polymerization. Phase and difference
^合物相。在某些實施财,黏著促進劑構成 ^過。50 wt%之所述相中之一相,且pLA聚合物構成超過 私二/〇之所述相之另一相。黏著促進劑可分散於PLA聚合 ^中,或PLA聚合物可分散於黏著促進劑中。本發明之某 些^施例的熱封層中出現模糊外觀表明存在具有不同組成 ,聚合物相。一在基板上乾燥後提供所述外觀以及良好執 封效能的示範性調配物由30%非晶形pLA聚合物(pLA _0D,自 Minnetonka,麵的廳ureW〇rks LLC 麟得之 D,L-聚乳酸聚合物)以及70%共聚酯(壬二酸/對苯二曱酸 /乙二醇’45/55/100莫耳當量)組成。 本發明者已發現藉由謹慎選擇黏著促進劑,可製成可 在=LA不變形之足夠低的溫度下密封諸如pLA盤之物品 同%提供PLA聚合物層與基板之間之良好黏著的多層薄 200810920 1 ι^ιχ ;薄=:::=::=:合基質層 此 本發明可使用任何厚度之多層薄膜。通 厚度可在12 i m微米範_。熱封層厚度 0:5至20微米範圍内,更通常在2〇至1〇微米 在 等相對_熱封層通常可藉由溶液塗絲產生,且由^ ,擠壓塗佈或共浦塗佈之其他方法可能難以達成Compound phase. In some implementations, the adhesion promoter constitutes ^. 50 wt% of one of the phases, and the pLA polymer constitutes another phase of the phase that exceeds the private enthalpy. The adhesion promoter may be dispersed in the PLA polymerization, or the PLA polymer may be dispersed in the adhesion promoter. The appearance of a haze in the heat seal layer of some of the embodiments of the present invention indicates the presence of a different composition, polymer phase. An exemplary formulation that provides the appearance and good sealing performance after drying on a substrate consists of 30% amorphous pLA polymer (pLA _0D, from Minnetonka, face ureW〇rks LLC, D, L-poly Lactic acid polymer) and 70% copolyester (sebacic acid/terephthalic acid/ethylene glycol '45/55/100 molar equivalent). The present inventors have found that by carefully selecting an adhesion promoter, it is possible to produce a multilayer which can seal a good adhesion between a PLA polymer layer and a substrate at a temperature sufficiently low that =LA does not deform at a sufficiently low temperature. Thin 200810920 1 ι^ιχ; Thin =:::=::=: Combined substrate layer This invention can use multilayer films of any thickness. The thickness can be in the range of 12 μm. The thickness of the heat seal layer is in the range of 0: 5 to 20 microns, more usually in the range of 2 Å to 1 〇 in the opposite direction. The heat seal layer can usually be produced by solution coating, and is applied by ^, extrusion coating or co-coating. Other methods of cloth may be difficult to achieve
二PLA聚合物之_缺點為f要預先乾燥聚合物以^ 二、、卜解。此額外步驟可在PLA聚合物在典型條件 P ’在低於PLA聚合物之麟解溫度的加王 ’由 溶液塗佈來塗覆時省略。若PLA :乂^ 有單獨存在的黏著促進層,則物…上層之間 _至5«範_ ^促進狀厚度通常在 ^右熱封層包括溶解或分散於其巾之黏著促㈣,則黏 者促進劑之量通常為促進触pLA聚合物之組合重量的 至少1 wt〇/〇,更通常為至少10 wt%,且最通常為至少2〇 =或甚至至少3G Wt°/。。所述量通常為至多9Qwt%,更通 兩為至夕70 wt/〇,且最通常為至多仙。在本發明之 需要熱封層相對透明(不模糊)的彼等實施例中,黏著促 ,剑相對於PLA聚合物之相對量可適當略微低些。 舉例而 3 ’胃黏著促進劑之量通常可為促進劑與pLA聚合物之組合 重量之至少20 wt%,更通常為至少3〇械%,且最通常為 約。40 wt%。所述量通常為至多6〇树%,更通常為至多5〇 wt/〇。在需要預防水滴在薄膜表面上形成(當在促進所述 200810920 JL jjAj ^環境中使用時,諸如姆品之包裝)之彼等狀況 槿杰7夕、=用如下文進一步描述之防霧劑。現將詳細討論 型用^ ~膜之組份’接著描述薄膜如何製成及薄膜的典 ,封層包括至少_種pla聚合物。根據本發明所使用 t 口颁型的PLA聚合物可為此項技術中已知之任何種 _ Hi可包括魏均聚物以及共聚物。適合共聚單體包括 丫豕;、2H〇C(R〗)(R2)(CH2)nC〇〇H之彼等共聚單體,其中 R及尺各自為H或經取代或未經取代之CrC5基團,且n 為〇至10之整數。PLA聚合物可為非晶形(亦即,藉由 掃描量熱法測定至少90%為非晶形),或者其可具有 貫,結晶性。通常,PLA聚合物至多50%結晶,且更通常 至多t 2〇%結晶。PLA聚合物可為乳酸均聚物,其可為以下 形怨上不同之聚合物中的一或多者:D_聚乳酸、L_聚乳酸、 D,L·聚乳酸以及内消旋聚乳酸。聚乳酸以及[_聚乳酸為 ⑩ $舰對映異構酸之聚合物,且為光學活性聚合物。D,L· 聚乳酸由外消旋t酸製得,亦即具有定義明破之D_聚乳酸 及L-聚乳酸單元構形的D_聚乳酸與L_聚乳酸之共聚物。 .内消旋聚乳酸為等莫耳濃度之D-乳酸以及乳酸之無規 . 共聚物。已知pLA均聚物之形態由聚合物主鏈中D異構 體與L異構體之比率控制。通常,D-乳酸含量愈高,聚合 物結晶愈少。 可採用任何已知之聚合方法(諸如縮聚以及開環聚合) -10- 200810920 聚合乳酸。舉例而言,在縮聚方法中,藉由此項技術中已 知之方式使L -乳酸、D _乳酸或此等乳酸之混合物直接經受 脫水縮聚反應。在開環聚合方法中,在催化劑存在下使丙 交酉旨(亦即乳酸之環狀二聚物)經受聚合反應。丙交酯可 •為L乳酸之二聚物、D-乳酸之二聚物或L_乳酸與D_乳酸 之混合二聚物。該等異構體可混合且聚合以獲得具有任何 所需組成及結晶性之聚乳酸。 可使用少量增鏈劑(例如二異氰酸酯化合物、環氧化 物或酸酐)以增加PLA聚合物之分子量。雖然聚合物可在 任何分子量範圍内,但通常重量平均分子量應在 60,000-1,000,000道爾頓範圍内。通常,若分子量少於 6〇,000,則可能無法獲得適當的物理性質。另一方面,若 分子量大於1,000,000,則熔融黏度可能會極高,導致差的 成形性。 PLA聚合物亦可為乳酸與一或多種共聚單體之共聚 物。若存在共聚單體,則所述共聚單體總共構成少於5〇 _ m〇l% ’通常少於30 mol%,且更通常少於1〇励1%之PLA 聚合物。所述共聚單體之實例包括:己内酯;羥基羧酸, 諸如羥基乙酸、3-羥基丁酸、‘羥基丁酸、4-羥基戊酸以 • 及&爸基己酸,多元醇,諸如乙二醇、丙二醇、丁二醇、 • 新戊一醇、聚(乙二醇)、丙三醇以及季戊四醇;以及多元 酉欠,堵如丁二酸、己二酸、癸二酸、反丁稀二酸、對苯二 甲酸、間苯二曱酸、2,6-萘二曱酸、5-鈉磺基間苯二曱酸 (5_sodiosulfoisophthalic acid)以及 5-四丁基石黃基間苯二 200810920 -lf〇is〇phthalate) 0 存在)較佳H t’""具生物可降解性的共聚單體(若 消除之某些實施例中,薄膜包括防霧劑以減少或 在敎封芦薄助表面形成霧。防霧劑分散 可制㈣賴封狀娜物的部 ^ 量分散於熱封層中,或其可浮散至表面。The disadvantage of the two PLA polymer is that the polymer is pre-dried to be a second solution. This additional step can be omitted when the PLA polymer is applied by solution coating at a typical condition P' below the alloying temperature of the PLA polymer. If PLA: 乂^ has a separate adhesion promoting layer, then the thickness of the upper layer between the upper layer and the upper layer is usually in the right heat seal layer including the adhesion or dispersing in the towel (4), then the viscosity The amount of promoter is typically at least 1 wt〇/〇, more typically at least 10 wt%, and most typically at least 2〇= or even at least 3 G Wt°/, to promote the combined weight of the pLA polymer. . The amount is usually at most 9 Qwt%, more preferably 70 wt/〇, and most usually at most. In those embodiments of the invention where the heat seal layer is relatively transparent (not obscured), the adhesion, the relative amount of the sword relative to the PLA polymer, may be suitably somewhat lower. For example, the amount of the 3' gastric adhesion promoter can generally be at least 20 wt%, more typically at least 3 mechanical %, and most typically about the weight of the combination of the accelerator and the pLA polymer. 40 wt%. The amount is typically up to 6 〇%, more typically up to 5 〇 wt/〇. In the case where it is desired to prevent the formation of water droplets on the surface of the film (when used in the context of promoting the use of the 200810920 JL jjAj^ environment, such as packaging of the product), the antifogging agent is further described below. The composition of the type of film will now be discussed in detail, followed by a description of how the film is made and the film, and the sealing layer comprises at least pla polymer. The t-port type PLA polymer used in accordance with the present invention may be any of the species known in the art and may include a Wei homopolymer as well as a copolymer. Suitable comonomers include hydrazine; 2H〇C(R)(R2)(CH2)nC〇〇H of these comonomers, wherein R and each of the ruthenium are H or a substituted or unsubstituted CrC5 group Group, and n is an integer from 〇 to 10. The PLA polymer may be amorphous (i.e., at least 90% amorphous by scanning calorimetry), or it may be crystalline and crystalline. Typically, the PLA polymer will crystallize up to 50%, and more typically up to t 2% by weight. The PLA polymer may be a lactic acid homopolymer, which may be one or more of the following different polymers: D_polylactic acid, L-polylactic acid, D, L·polylactic acid, and mesopolylactic acid. . Polylactic acid and [_ polylactic acid are polymers of 10 $ ship enantiomers and are optically active polymers. D, L· Polylactic acid is prepared from racemic t acid, i.e., a copolymer of D_polylactic acid and L-polylactic acid having a defined D_polylactic acid and L-polylactic acid unit configuration. The meso-polylactic acid is a mono-concentration of D-lactic acid and a random lactic acid copolymer. The morphology of the pLA homopolymer is known to be controlled by the ratio of the D isomer to the L isomer in the polymer backbone. Generally, the higher the D-lactic acid content, the less the polymer crystallizes. Any known polymerization method (such as polycondensation and ring opening polymerization) can be employed. -10- 200810920 Polymeric lactic acid can be used. For example, in the polycondensation process, a mixture of L-lactic acid, D-lactic acid or such lactic acid is directly subjected to a dehydration polycondensation reaction by means known in the art. In the ring-opening polymerization method, a crosslinking reaction (i.e., a cyclic dimer of lactic acid) is subjected to a polymerization reaction in the presence of a catalyst. Lactide can be a dimer of L lactic acid, a dimer of D-lactic acid or a mixed dimer of L_lactic acid and D_lactic acid. The isomers may be mixed and polymerized to obtain a polylactic acid having any desired composition and crystallinity. A small amount of a chain extender such as a diisocyanate compound, an epoxide or an acid anhydride may be used to increase the molecular weight of the PLA polymer. While the polymer may be in any molecular weight range, typically the weight average molecular weight should be in the range of 60,000 to 1,000,000 Daltons. Generally, if the molecular weight is less than 6 〇 000, appropriate physical properties may not be obtained. On the other hand, if the molecular weight is more than 1,000,000, the melt viscosity may be extremely high, resulting in poor formability. The PLA polymer can also be a copolymer of lactic acid and one or more comonomers. If comonomer is present, the comonomer collectively constitutes less than 5 〇 〇 m 〇 1% 'typically less than 30 mol %, and more typically less than 1 〇 1% of the PLA polymer. Examples of the comonomer include: caprolactone; hydroxycarboxylic acid, such as glycolic acid, 3-hydroxybutyric acid, 'hydroxybutyric acid, 4-hydroxyvaleric acid, and & dadsonic acid, polyol, Such as ethylene glycol, propylene glycol, butanediol, • neopentyl alcohol, poly(ethylene glycol), glycerol and pentaerythritol; and multiple sufficiency, such as succinic acid, adipic acid, azelaic acid, anti- Butyric acid, terephthalic acid, isophthalic acid, 2,6-naphthalenediic acid, 5-sodium sulfoisophthalic acid, and 5-tetrabutyl feldsparin 200810920 - lf〇is〇phthalate) 0 is present) preferably H t '"" biodegradable comonomer (if some embodiments are eliminated, the film comprises an anti-fogging agent to reduce or seal The surface of the ruthenium helps the surface to form fog. The antifogging agent can be dispersed (4) the portion of the smear-like substance is dispersed in the heat-sealing layer, or it can be floated to the surface.
Pti」可猎由通常自適合溶劑浸潰、噴霧或另外塗佈,將 ^背直接塗覆至熱封層表面。適合防霧劑之實例包括烷 ^化脂肪ϋ,例如atme_502 ;脫水山梨糖醇醋二 =R® 103,其他已知之非離子、陰離子及陽離子表 面f性制,、例如聚氧伸烧基脂肪酸酯、烧氧基化驗、混合 ί:、二或三甘油酯、多元醇之脂肪酸酯、其他聚烷氧I 化物及其類似物。ATMER⑧產品得自τ__η,胃之Pti can be applied directly to the surface of the heat seal layer by dipping, spraying or otherwise coating from a suitable solvent. Examples of suitable antifogging agents include alkaneized fat mash, such as atme 502; sorbitan vinegar II = R® 103, other known nonionic, anionic and cationic surface f-types, such as polyoxyalkylene fatty acids Ester, alkoxylation assay, mixing ί:, di- or triglyceride, fatty acid esters of polyhydric alcohols, other polyalkoxyides and the like. ATMER8 products are derived from τ__η, stomach
Specialty Chemicals C〇rp·。若防霧劑包括在熱封層中 ^霧劑通常將構成約(U wt%至約15爾之熱封層,更通 常約0.5 *%至約1G wt%。若直接塗覆至熱封層“; 相對於熱封層重量而言,所述量通f在約Q1 至約5 wt/o範圍内’ J_更通常在、約Q. 1 wt%至約^ _%範圍内。 熱封層可包括諸如二氧化矽之無機顆粒及/或諸如蠟 及/或聚四氟乙烯分散液之滑爽添加劑。在某些應用中亦可 包括抗氧化劑。在某些實施例中,熱封層可不含增塑劑(例 如聚二醇或聚醚,或此等聚合物之§旨)、增黏劑及/或無機 •12- 200810920 填充劑。在某些實施射,_ 外之脂族聚酯。 ㈢$不含除PLA聚合物 黏著促進_丨 如本文所用之術語“黏著促進劑”音袖 中之PLA聚合物中或用作熱至熱封層 間層時,根據實例之測試方法測s基貝層之間的中 公克/吋之熱封強度的物質。通常 1 其可提供至少200 吋,且更通常為至少400公克/^。奢強土度為至少300公克/ 分離薄膜時’熱封層仍與各H佳地,在根據方法(ii) 在熱封層⑽㈣情況下,而分離是 式。適合黏著促進劑包括(但不 、内聚失效模 EVA (乙烯·乙酸乙烯醋)及_: : ) ^烯共聚物,諸如 以及增黏劑樹脂,諸如松香樹俨 烯-丙烯酸曱酯);Specialty Chemicals C〇rp·. If the antifogging agent is included in the heat seal layer, the aerosol will typically constitute about (U wt% to about 15 Å of the heat seal layer, more typically from about 0.5 * % to about 1 G wt %. If directly applied to the heat seal layer The heat flux is in the range of from about Q1 to about 5 wt/o, and is generally in the range of from about Q. 1 wt% to about _%. The layer may comprise inorganic particles such as cerium oxide and/or a slip additive such as a wax and/or polytetrafluoroethylene dispersion. Antioxidants may also be included in certain applications. In certain embodiments, the heat seal layer Can be free of plasticizers (such as polyglycols or polyethers, or the § of these polymers), tackifiers and / or inorganic · 12-200810920 fillers. In some implementations, _ outside the aliphatic (3) $ does not contain PLA polymer adhesion promotion _, as used herein, in the term "adhesion promoter" in the PLA polymer or used as a heat to heat seal interlayer, according to the test method of the example a material having a heat-sealing strength between the base layers of the base layer. Usually 1 can provide at least 200 吋, and more usually at least 400 gram / ^. 300 g / separation film when 'heat seal layer is still good with each H, in the case of heat seal layer (10) according to method (ii), and the separation formula is suitable. Adhesive accelerator includes (but not, cohesive failure mode EVA) (ethylene vinyl acetate) and _: : ) ene copolymers, such as and tackifier resins, such as rosin tree terpene - decyl acrylate;
在某些實施例中,黏著促進 文所用之術語“共聚『意謂衍生自至少=㈣脂。如本 種)芳族二舰以及至少_種( ^且較佳僅— 酸或其低碳絲(亦即至多14個碳原子= 二醇的《。共以旨之形成便利地藉由縮 ^知方法在-般高達約275。。之溫度下進行 私一羧酸包括對笨二曱酸、間 ^方 一购二曱酸。示範:脂 如丁二酸、癸二醆、己二酸、壬1:==酸:諸 較佳為癸二酸、己二酸以及壬二酸,且更佳為:::了 ’ -13- 200810920 (諸如ϊίΐϊϋ中’聚s旨含有不超過9g%的芳族二缓酸 為聚酯中總:酸:少1〇%的脂族二羧酸,百分比 濃度為至少55 。通常,芳族二魏之 以共聚_巾-可為6G莫耳°錢6G莫耳%以上。 通常不超比來看,芳族二舰之濃度 最通當X I 、耳且更通常不大於70莫耳%,且 看,共聚酉旨。以共聚醋中的二舰之濃度來 更通常為至少3 之濃度通常為至少2°莫耳%,且 量百分比為= 時時^通常至多45莫耳%。當以重 將視各自 以及至多細。之脂存在至少55 wt%之芳族二酸 -ιτΪί之二醇包括脂族二醇’諸如烷二醇。因此,'商入 族二醇’諸如乙二醇'二乙二醇二b4合 知1,3-丁二醇、丨斗丁二醇 曰日形(亦即藉由差示掃描量熱法測定至少9()%為= 如先前指明,共聚酯可與PLA聚人物一鈀八 :rr一分,亦即;可在以;上 聚—合義赁層 聚合基質層可包含此項技術中已知之任何成瞑聚合 -14- 200810920 物,其限制條件為所开^ + 物製成之_強。賴在機械上比僅由PLA均聚 (Nylon)薄膜、用;乙:二::限於)聚酯薄膜、耐綸 婦薄難及由錄叙紐、聚丙 声,某些實施例中,聚合基質層包含線性聚酯 二。t^ ΐ向線性聚㈣ '線性聚酷通常具有約0.5 膜之度’最通常約G.6之特性黏度。聚醋薄In certain embodiments, the term "copolymerization" as used in the context of adhesion promotion means derived from at least = (tetra) lipids, as in this species, aromatic two ships and at least _ (and preferably only - acid or low carbon filaments thereof). (ie, up to 14 carbon atoms = diol.) The purpose of forming a private carboxylic acid, including stupid acid, by a method of shrinking at a temperature of about 275. Desalination of diterpenic acid. Demonstration: lipids such as succinic acid, indole, adipic acid, hydrazine 1:==acid: preferably azelaic acid, adipic acid and azelaic acid, and more佳为:::了' -13- 200810920 (such as ϊ ΐϊϋ ' ' poly s s intended to contain no more than 9g% of aromatic diacidic acid in the polyester total: acid: less than 1% by weight of aliphatic dicarboxylic acid, percentage The concentration is at least 55. Usually, the copolymerization of aromatic Weiwei can be 6G Moire and 6G Moore% or more. Generally speaking, the concentration of the aromatic second ship is the most suitable for XI, ear and More typically no more than 70% by mole, and see, copolymerization. The concentration of the second ship in the copolymerized vinegar is more usually at least 3, usually at least 2% by mole, and the percentage is = ^ usually up to 45 mol%. When at least 5 wt% of the aromatic diacid- ιτΪί diol is present, including aliphatic diols such as alkane diols. The diols such as ethylene glycol 'diethylene glycol di b4 are known as 1,3-butanediol, 丨 丁 曰 曰 ( ( (ie, by differential scanning calorimetry at least 9 () % = = as previously indicated, the copolyester can be combined with the PLA poly-palladium: rr, that is, the polymer layer can be included in the poly-synthesis layer, and any layer known in the art can be included.瞑Polymerization-14- 200810920, the restriction condition is _ strong made by the open material. Lai is mechanically more than only the PLA homopolymerized (Nylon) film, used; B: 2:: limited) polyester film In some embodiments, the polymeric matrix layer comprises linear polyester 2. t ^ ΐ linear poly (4) 'linear poly cool usually has about 0.5 membrane degree' Usually about G.6 characteristic viscosity.
心’雔:&軸取向聚對苯二甲酸乙二§| (PET)薄膜 ,雙轴取向聚間苯二甲酸乙二醋(ι㈣ naphthalate,PEN)薄膜。 尤其適用的是雙軸取向及熱固性之聚對苯二曱酸乙二 酯。所述材料在此項技術中熟知,且描述於(例如)頒^Heart '雔:& axis oriented polyethylene terephthalate §| (PET) film, biaxially oriented poly(ethylene) phthalate (1) naphthalate, PEN film. Particularly suitable are biaxially oriented and thermosetting polyethylene terephthalate. Such materials are well known in the art and are described, for example, in the awarding of ^
Stokes之美國專利第七375,·號(以弓|用的方式併入本 文)中。 水對苯一曱酸乙二酯聚合物之製備技術為熟習此項技 術者所熟知,且揭露於多篇文章中,諸如Encydapedia QfStokes, U.S. Patent No. 7,375, (incorporated herein by the name of the bow). The preparation of water to benzoic acid ethylene glycol polymer is well known to those skilled in the art and is disclosed in various articles, such as Encydapedia Qf.
Polymer Science and Engineering,第 2 版,第 12 卷,wiley, Ν·Υ· ’第1-313頁。通常藉由使適合二羧酸或其低碳烷基 二酯與乙二醇縮合來獲得該聚合物。聚對苯二甲酸乙二醋 由對苯二甲酸或其酯形成,且聚萘二甲酸乙二醇醋由26-萘二曱酸或其酯形成。 在共擠壓雙層聚酯/共聚醋薄膜用作在其上塗佈PLA 聚合物之基板的狀況下’猎由包括以下步驟之方法便利地 製造雙層薄膜複合物:經由多孔模具多次擠壓或共擠壓複 -15- 200810920 合物層(例如,如美國專利第3,δ71,947號中廣泛描述), 接著藉由朝二或多個方向拉伸進行分子取向且熱固化。用 於共擒壓(稱,單通道共松壓)之便利方法以及裝置描述 •於美國專利第4,165,21〇號以及英國專利說明書第 ,1,115,007號=。所述方法包含同時擠壓來自兩個不同擠壓 機之第-及第-聚醋流,在通向擠屢模具之歧管的管中使 兩股流合為-體’且在流線型流動條件下經由模具將兩種 ㈣旨減在-起,使得在不進行混合的情盯兩種聚醋佔 據不同流動區域,藉此產生薄膜複合物。 薄膜複合物之聚對笨二甲酸乙二酉旨部分的雙轴取向可 藉由通常在約78t至之範_的溫度下依次朝兩個 彼此垂直之方向拉伸複合物來完成。一般而言,拉伸複合 物所用之條件可用以部分結晶第一熱黏合層,且在所述二 況下,較佳在尺寸限制下在高於第一熱黏合層之結晶溶融 溢度但低於聚對苯二甲酸乙二酉旨部分之結晶炫融溫度的溫 度下熱固化賴複合物。接著使複合物或促使複合物冷 • 卻:致使第一熱黏合層基本上為非晶形,而附部分中; 留高度結晶性。因此,較佳在尺寸限制下熱固化後通常在 15叱至25(TC之範圍_溫度下進行拉伸操作。用於拉伸 . 及熱固化之便利方法描述於美國專利第3,107,139號中。 ,併入聚醋基質層(基質層上之共聚醋層)之本文所述類別 的共擠壓薄膜複合物可由DuP〇nt Tdjin Fiims '吋Polymer Science and Engineering, 2nd Edition, Volume 12, wiley, Ν·Υ· ‘pp. 1-133. The polymer is usually obtained by condensing a suitable dicarboxylic acid or a lower alkyl diester thereof with ethylene glycol. Polyethylene terephthalate is formed from terephthalic acid or an ester thereof, and polyethylene naphthalate is formed from 26-naphthalenedicarboxylic acid or an ester thereof. In the case where a co-extruded double-layer polyester/co-vinegar film is used as a substrate on which a PLA polymer is coated, a double-layer film composite is conveniently manufactured by a method including the following steps: multiple extrusion through a porous mold The layer of -15-200810920 is pressed or coextruded (for example, as described in U.S. Patent No. 3, δ 71,947), followed by molecular orientation and thermal curing by stretching in two or more directions. Convenient method and device description for co-compression (referred to as single-channel co-pulling) • U.S. Patent No. 4,165,21 and British Patent Specification No. 1,115,007. The method comprises simultaneously extruding a first- and a first-poly condensate stream from two different extruders, causing the two streams to be in a body-body in a tube leading to a manifold of the extrusion die and in a streamlined flow condition The two (4) intentions are reduced by the mold, so that the two kinds of polyesters occupy different flow regions without mixing, thereby producing a film composite. The biaxial orientation of the poly(p-diethyl phthalate) moiety of the film composite can be accomplished by stretching the composite in two directions perpendicular to each other, usually at a temperature of from about 78 t to about 10,000 Å. In general, the conditions used for stretching the composite may be used to partially crystallize the first thermal bonding layer, and in both cases, preferably at a size limit, higher than the crystalline melt solubility of the first thermal bonding layer but low The composite is thermally cured at a temperature at the crystallization temperature of the polyethylene terephthalate. The composite is then allowed to cool or the composite is caused to: cause the first thermal bond layer to be substantially amorphous, while in the attached portion; leaving a high degree of crystallinity. Therefore, it is preferred to carry out the stretching operation generally after 15 to 25 (the range of TC) after heat curing under the size limitation. A convenient method for stretching and thermal curing is described in U.S. Patent No. 3,107,139. The coextruded film composite of the type described herein incorporated into the polyester matrix layer (the copolymerized vinegar layer on the substrate layer) may be by DuP〇nt Tdjin Fiims '吋
Wilmington,DE 以名稱 MELINEX® 301H 市隹。如上浐 明,此等薄膜可塗佈有本發明之PLA聚合物^在該 -16- 200810920, :酯 塗佈調配物中包括或不包括其他共聚^ ΜΜΛΛΜΜΜ 本發明之多層薄膜可藉由用pla 有黎著促進劑)於溶劑中之溶液塗佈聚況亦含 .本文所用之術語“溶劑,,意謂ΡΙ^合得。如 ,-或兩者的揮發性载劑,且所得混合 U促進劑之 或其他分散液,且在嚴格意義上亦可為直、1=/之、微乳液 純(但不限於)水、四跡甲:二:。適合溶劑 當水用作溶劑時,乳化劑可用以製成乳液等。 上具有黏著促進劑。舉例而言4使須在基板 常兩層)聚_旨薄膜,不過二:⑵(通 共聚酯層的聚醋薄膜。在每一種狀況下,似二^創之 而塗佈於基板上以提供多層薄膜。 來5物可繼 塗佈可藉由此項技術中已知之任—方每 龜2=)逆轉計量塗佈及凹版塗佈。本發明者。現包ί • 使用溶液塗佈方法可製備具有相對薄之熱‘ ^20«} 他方法(诸如擠壓或共擠壓塗佈)庐 ^ "由/、 .成與由諸如層壓或擠壓塗佈之其他^製成之明製 •有局面積重量比率的可用多層薄膜。而且:冓相比具 口口谷益之某些應用中可為優點。 了匕衣食 封膜之用途 17 200810920 哭罗雲膜才日?本备明之缚膜尤其可用作密封容器中的容 ^傻孤版’例如PLA盤。通常,雖_述盤或复他 聚物製成’但根據本發明亦可使用乳酸與丑^ Γ (Ϊ括(但不限於)上文關於熱封層中所用之PLA-人 =所提及的彳转躲單體)的絲物^ = ^可用此等_密封,絲據本發明亦涵蓋所述 本上任何具有開口之容器均可用本發明之 + 土 熱封層之薄膜侧上密封。 & ,在載有 實例 樣品測g 以下測試方法用於隨後實例中·· (i)量测對盤之熱封強度方法如 2〇〇卞下在35磅/平方吋之厭士 ^ — 在熱封機上於 切副出松封_及盤之帶(25 奶木州 作以每分鐘0.25八尺M +a- /、 使用Instron操 需的負Γ頭速度量測拉動封條分離所 贿下,Γ 在一起且在35磅/平方吋之壓力下於 下加心兩薄膜樣品的熱封層 、' 自身的熱封強度。使密封薄膜“至 以每分鐘心見^錯由里測母早位寬度封條線性牽力下 、.里0.25公尺的固定速度剥 厗 力來測定熱封強度。 。物各層分離所需的Wilmington, DE under the name MELINEX® 301H Market. As described above, the films may be coated with the PLA polymer of the present invention. In the -16-200810920, : ester coating formulation, with or without other copolymerizations, the multilayer film of the present invention may be used by using pla The solution coating in a solvent also contains the term "solvent," meaning a volatile carrier such as - or both, and the resulting mixed U promotes Or other dispersions, and in the strict sense can also be straight, 1 = /, microemulsion pure (but not limited to) water, four traces: two: suitable solvent when water is used as a solvent, emulsifier It can be used to make an emulsion, etc. It has an adhesion promoter. For example, 4 is required to be laminated on two layers of the substrate. However, two: (2) (a polyester film of a common polyester layer. In each case) It can be applied to the substrate to provide a multilayer film. The coating can be subsequently applied by any of the techniques known in the art to reduce the metering and gravure coating. The present inventor. Now package ί • Using a solution coating method to prepare a method having a relatively thin heat '^20«} (such as extrusion or co-extrusion coating) 庐 ^ " from /, into a composite film made of other materials such as lamination or extrusion coating; : 冓 冓 冓 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 某些 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 A singular 'for example, a PLA disk. Usually, although it is made of a disk or a complex polymer', it is also possible to use lactic acid and ugly according to the invention (including but not limited to those used in the heat seal layer above). Filaments of PLA-human = mentioned 彳 躲 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The film is sealed on the side of the film. &, in the sample sample test g, the following test method is used in the subsequent examples. (i) Measuring the heat-sealing strength of the disk, such as 2 在 at 35 psi吋 厌 ^ ^ — on the heat sealing machine in the cut out of the loose seal _ and the belt of the belt (25 milkwood state to 0.25 8 feet per minute M + a- /, so Instron's required negative head speed measurement pulls the seal apart and smashes it together and under the pressure of 35 psi to lower the heat seal layer of the two film samples, 'the heat seal strength of the own. The sealing film "to the point of view per minute" is determined by the linear force of the inner width seal of the inner measuring strip, and the fixed speed peeling force of 0.25 meters in the strip is used to determine the heat seal strength.
Ul)可猎由差示掃描量熱法量測結晶度百分比。在 -18- 200810920Ul) can be used to measure the percentage of crystallinity by differential scanning calorimetry. At -18- 200810920
Perkin Elmer DSC7B差示掃描量熱計上將取自薄膜之5毫 克樣品以80°C/分鐘自〇。〇加熱至300°C。由結晶度百分比 可推出存在於所有樣品中的結晶度。 樣品製備 塗佈溶液#1之製備:將99公克PLA 4060D (低結晶 性’自 Minnetonka,MN 之 NatureWorks LLC 購得之A 5 gram sample taken from the film was self-twisted at 80 ° C/min on a Perkin Elmer DSC7B differential scanning calorimeter. Heat to 300 ° C. The degree of crystallinity present in all samples can be derived from the percentage of crystallinity. Sample Preparation Preparation of Coating Solution #1: 99 grams of PLA 4060D (low crystallinity) was purchased from NatureWorks LLC of Minnetonka, MN.
聚乳酸聚合物)、0.5公克KEMAMIDE E防結塊劑(購自 Witco)以及8丫乙01〇244增滑劑(購自111.0咖6)添加 至500公克四氫呋喃(THF)中。攪拌混合物30分鐘以製 成塗佈溶液#1。 塗佈溶液#2之製備:將69公克PLA4060D、30公克 壬二酸/對苯二曱酸/乙二醇(45/55/100莫耳當量)之共聚 酯、〇·5 公克 KEMAMIDE E 以及 〇·5 公克 SYL0ID 244 添 加至400公克THF中。攪拌混合物3〇分鐘以製成塗佈溶 液#2 〇 4 樣品1 :藉由向前滾塗方法將塗佈溶液#1塗佈至% 型MYLAR E薄膜(雙軸取向聚對苯二甲酸乙二醋薄膜, 由DuPont Teijin Films製成)±。調整輥間隙以達成8公 克/平方公尺之乾塗層重量。在1(Κ)ΐτ乾燥濕塗料i分鐘。 樣品广藉由向前滾塗方法將塗佈溶液# MYLAR !隱薄膜(載有共聚g旨層之雙軸取向聚對苯二 甲=乙二醋溥膜,由DuP_ Tei細FUms製成)上。調整 達成8公克/平方公尺之乾塗層重量 乾燥濕塗料1分鐘。 # 卜 -19- 200810920 樣品3:藉由向前滾塗方法將塗佈溶液#2塗佈至由 DuPont Teijin Films製成之92型MYLAR E薄膜上。調整 輥間隙以達成8公克/平方公尺之乾塗層重量。在丨㈨它下 乾燥濕塗料1分鐘。 樣品4:藉由向前滾塗方法將塗佈溶液幻塗佈至由 DuPont Teijin Films 製成之 MYLAR 1〇〇〇L 薄膜上。調整 輥間隙以達成8公克/平方公尺之乾塗層重量 乾燥濕塗料1分鐘。 u ^ 別根據上文方法⑴以及W將樣品M中製備 f溥膜熱封至製成PLA盤之原料以及其自身。所得熱封強 度的結果表示於下表卜以公克/_為單位。 ’、、、Polylactic acid polymer), 0.5 g of KEMAMIDE E anti-caking agent (available from Witco), and 8 丫B 01〇244 slip agent (available from 111.0 coffee 6) were added to 500 g of tetrahydrofuran (THF). The mixture was stirred for 30 minutes to prepare a coating solution #1. Preparation of Coating Solution #2: 69 grams of PLA4060D, 30 grams of azelaic acid/terephthalic acid/ethylene glycol (45/55/100 mole equivalent) of copolyester, 〇·5 grams of KEMAMIDE E and 〇·5 g SYL0ID 244 was added to 400 g THF. The mixture was stirred for 3 minutes to prepare a coating solution #2 〇4 Sample 1: Coating solution #1 was applied to a %-type MYLAR E film by a forward roll coating method (biaxially oriented polyethylene terephthalate) Vinegar film, made by DuPont Teijin Films) ±. The roll gap was adjusted to achieve a dry coating weight of 8 gram per square meter. Dry the wet paint for 1 minute at 1 (Κ) ΐτ. The sample was coated by a forward roll coating method on a MYLAR® hidden film (a biaxially oriented polyparaphenylene phthalate film, which was made of DuP_Tei fine FUms). . Adjust to achieve a dry coating weight of 8 g/m2 Dry wet paint for 1 minute. #卜 -19- 200810920 Sample 3: Coating solution #2 was applied to a Type 92 MYLAR E film made of DuPont Teijin Films by a forward roll coating method. The roll gap was adjusted to achieve a dry coating weight of 8 grams per square meter. Dry the wet paint for 1 minute under 丨(9). Sample 4: The coating solution was magically applied to a MYLAR 1〇〇〇L film made by DuPont Teijin Films by a forward roll coating method. Adjust the roll gap to achieve a dry coating weight of 8 g/m2. Dry the wet paint for 1 minute. u ^ The heat-prepared f-film of Sample M was heat-sealed to the raw material of the PLA disk and itself according to the above method (1) and W. The results of the obtained heat seal strength are shown in the following table in grams per gram. ',,,
*在樣品藉由Instron剝落前用手開始密封。 =二與2之比較說明僅含有pLA之熱封 ,二層之基底薄膜(樣品2)上比在無 .p H )具有更好熱封魏。此外,比較 I口 1與3,可見在缺乏中間共聚酉旨層下 比車乂 —至PLA熱封層(樣品3 )中產,、水自日添加 品收的熱封強度。最終,比較^^口^層(樣 可見中包括共聚_及共品3’ 生比任-單獨者好的效能。 /、_作為中間層產 -20- 200810920, 雖然在本文中已參照特定實施例說明及描述本發明, 然並非用以使本發明限於所示的詳細描述中。而且,在不 脫離本發明下,在與申請專利範圍相等之範疇及範圍内, 可在詳細描述中作些許更改。 【圖式簡單說明】 無 【主要元件符號說明】 .益* Start sealing by hand before the sample is peeled off by Instron. = Comparison of 2 and 2 indicates that the heat seal containing only pLA has a better heat seal on the base film of the second layer (sample 2) than at .p H). In addition, comparing the mouths 1 and 3, it can be seen that in the absence of the intermediate copolymerization layer, the heat seal strength of the water is increased from that of the rut-to-PLA heat seal layer (sample 3). Finally, compare the ^^ mouth layer (the sample can be seen in the copolymerization _ and the common product 3' life is better than the individual - alone. /, _ as the intermediate layer production -20- 200810920, although reference has been made herein to specific implementations The invention is not limited to the detailed description of the invention, and may be made in the detailed description without departing from the scope of the invention. Change. [Simple description of the diagram] No [Main component symbol description]
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- 2007-07-11 JP JP2009520763A patent/JP5437801B2/en not_active Expired - Fee Related
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- 2007-07-11 KR KR1020097002798A patent/KR101470353B1/en not_active Expired - Fee Related
- 2007-07-11 EP EP07810340.5A patent/EP2046873B1/en not_active Not-in-force
- 2007-07-11 BR BRPI0713180-1A patent/BRPI0713180A2/en not_active IP Right Cessation
- 2007-07-16 TW TW96125826A patent/TW200810920A/en unknown
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WO2008008381A2 (en) | 2008-01-17 |
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JP5437801B2 (en) | 2014-03-12 |
US20110163101A1 (en) | 2011-07-07 |
EP2046873B1 (en) | 2017-05-03 |
CN101563405A (en) | 2009-10-21 |
WO2008008381A3 (en) | 2008-10-09 |
BRPI0713180A2 (en) | 2012-04-17 |
KR101470353B1 (en) | 2014-12-09 |
US8507084B2 (en) | 2013-08-13 |
JP2009543718A (en) | 2009-12-10 |
EP2046873A2 (en) | 2009-04-15 |
CN101563405B (en) | 2012-08-22 |
JP5728442B2 (en) | 2015-06-03 |
US9073674B2 (en) | 2015-07-07 |
JP2013018549A (en) | 2013-01-31 |
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