200809101 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種散絲置組合，制係_種適用於發 熱電子元件之散熱裝置組合及其組裝方法。 【先前技術】 當前，隨著電腦產業之迅速發展，微處理晶片等發熱 電子元件產生之熱量愈來愈多’爲將該多餘之熱量有效^ 發，習知之方法係在發熱電子元件之表面貼設一散熱器， 並利用扣具對該散熱H進行固定，將發熱電子元件產生之 熱量强制散去。例如，台灣專利公告第1255692號公開一 種彈性接固裝置，該彈性接固裝置包括一背板、一散熱器、 二套筒及-翻元件’該散熱紅設有—透孔，該套筒插 設於該透孔内，該接固元件穿過該套筒而將該散熱器固定 至該背板上。 然而，由於該套筒係插設在該散熱器之透孔内，未與 該散熱器形成穩固結合，導致在包裝運輸時，該套筒及套 筒内之接固元件易從該散熱器之透孔内脫出，難於整理。 【發明内容】 有鑒於此，有必要提供一種便於整理之散熱裝置組合 及其組裝方法。 該政熱裝置組合包括一散熱器及複數扣具，該散熱器 =括—基座，該基座上設有複數穿孔，每一扣具包括一套 筒’該等套筒穿設於該等穿孔π，該基座於每一穿孔附近 200809101 设有一檔止部，該套筒向外凸伸設有一凸緣，該凸緣定位 • 於該擋止部内。 該散熱裝置組合之組裝方法包括如下步驟：在一散熱 器之基座上4置複數穿孔，並於每—穿孔之附近形成一擔 止。[5 ’將—套筒設置於每—穿孔内，該套筒具有向外凸伸 之凸緣，轉動該套筒，將該套筒之凸緣定位於該等擔止部 内；穿設-鎖釘於該套筒内，使該鎖釘伸出該套筒之底部， 該鎖釘上連接有-彈性體；及套設—擒圈於該鎖釘上。 與習知技術相比，藉由該擔止部之設置，使該扣具可 預先穩固地組裝至該散熱器上，不純落，從而具有便於 整理之優點。 ' 【實施方式】 圖1所不爲本發明散絲置組合第—實之立體 解=散_組合,。。包括複數扣具i。、一散熱器20、 一風扇30及一熱管4〇。 熱片複數綱24,該等散 芙座22盘— 該基座22由紹合金製成，該 ί複數、發熱電子70件(圖未連接，該基座22上設 供該等扣具10穿設，每一穿孔22 =::止部22b ’該擋止部22b 破形成，該擋止部22b爲—向上凸起 。上之熱量傳遞至該等散熱二:散二:= 200809101 基座22上並位於該等散熱片24之侧邊，用於對該等散熱 -片24進行强制散熱。 · • 請參照圖2及圖3，該扣具1〇包括一鎖釘12、一彈性 體14、一套筒16及一擋圈18,該擋圈18爲一 〇型環。該 鎖釘12爲一圓柱體，其具有兩段式結構。該鎖釘12之上 段12a具有比下段12|5更大之直徑。該上段12&之頂端設 有一頭部122，該頭部122之外徑大於該上段12a之直徑。 _ 該上段12a於罪近該下段i2b處沿外表面設有一環形之容 置槽124,該檔圈18可套置於該容置槽124内。該下段1沘 <有螺紋’以便於同電路板(圖未示)等元件鎖合。該彈性體 14爲一彈黃，該彈性體14套設於該鎖釘12之上段丨仏， 且該彈性體14之上端可抵壓在該頭部122上。 該套筒16爲金屬件一體衝壓成型之筒狀結構，其具有 一開口 162、一底部164及一侧壁166。其中，爲成型方便， 該側壁166上留有相對之兩缺口施。該開口 162之周緣 • 水平向外延伸設有凸緣麻，該凸緣162a上設有相對之兩 切口 162b。該底部164上設有一穿孔164a，該鎖釘12可 穿過該穿孔164a，同時，套置在該鎖釘12之上段12&之彈 性體14可抵頂在該底部164上。 請參照圖1至圖5 ’歡裝時，將該套筒16置於該基 座22之穿孔22a内’使套筒16之缺口 16处正對基座u 之擋止部22b ’該套筒16之凸緣職抵接在該基座22之 上表面(如圖3所示），然後，轉動該套筒16，使該套筒16 之凸緣隐伸入該擋止部挪R並使該擋止部]緊密失 200809101 持該凸緣162a(如® 4所示）。由於該套筒16與該穿孔22a 之間爲緊配合，兩者直徑相當’故藉由該擔止部既即可 固定該套筒16。 該鎖釘12穿過該彈性體14後置於該套筒16内，該鎖 釘12同時穿過該套筒16底部164之穿孔施並使該彈性 體14之下端與套筒16之底部164抵接。藉由該鎖釘12之 頭部122及該套筒16之底部164將該彈性體14 _，使 該鎖釘之容置槽124穿過該穿孔触而伸出底部鳩 之下方，接著，將該擋圈18套置在該容置槽124上，阻止 該彈性體轉，從㈣該扣具1G肋|至該散熱器2〇 上(如圖5所示）。 由以上叙述可知，藉由該擋止部22b之設置，使得該 扣具10可以預先穩固地組裝至該散熱器2〇上，使該扣具 1〇不易脫篆’便於該散熱裝置組合咖之包裝及運輪，使 其具有便於整理之優點。 綜上所述’本發明符合發明專利要件，爰依法提出專 利申請。惟’以上所述者僅為本發明之較佳實施例，舉凡 #悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1爲本發明散熱裝置組合其中-實施例之立體分解 圖。 圖2爲圖1所示散錄置組合中扣具之立體分解圖。 圖3爲圖1所示散熱裝置組合中套筒預組裝前之上視 200809101200809101 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a combination of a plurality of filaments, a system for dissipating heat sinks for heating electronic components, and an assembly method thereof. [Prior Art] At present, with the rapid development of the computer industry, heat generated by heat-generating electronic components such as micro-processed wafers is increasing. In order to effectively dissipate the excess heat, the conventional method is applied to the surface of the heat-generating electronic component. A heat sink is disposed, and the heat sink H is fixed by the buckle to forcibly dissipate heat generated by the heat generating electronic component. For example, Taiwan Patent Publication No. 1256692 discloses an elastic joint device comprising a back plate, a heat sink, two sleeves and a flip element. The heat sink is provided with a through hole, and the sleeve is inserted. Provided in the through hole, the fixing component passes through the sleeve to fix the heat sink to the backboard. However, since the sleeve is inserted into the through hole of the heat sink, it does not form a stable joint with the heat sink, so that the fastening component in the sleeve and the sleeve is easy to be removed from the heat sink during packaging transportation. It is difficult to arrange in the through hole. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink assembly and an assembly method thereof that are easy to organize. The thermal device assembly includes a heat sink and a plurality of fasteners, the heat sink includes a base, the base is provided with a plurality of perforations, and each of the fasteners includes a sleeve through which the sleeves are inserted Perforation π, the base is provided with a stop at the vicinity of each perforation 200809101, and the sleeve protrudes outwardly with a flange, and the flange is positioned in the stop. The assembly method of the heat sink assembly includes the steps of: placing a plurality of perforations on a base of a heat sink and forming a support in the vicinity of each of the perforations. [5'] a sleeve is disposed in each perforation, the sleeve has an outwardly projecting flange, the sleeve is rotated, the flange of the sleeve is positioned in the support portions; In the sleeve, the locking nail extends out of the bottom of the sleeve, and the locking nail is connected with an elastic body; and the sleeve is looped on the locking nail. Compared with the prior art, the fastener can be stably assembled to the heat sink in advance by the arrangement of the supporting portion, and is not purely fallen, thereby having the advantage of being easy to organize. [Embodiment] FIG. 1 is not the first embodiment of the present invention. . Includes multiple buckles i. A heat sink 20, a fan 30 and a heat pipe 4〇. The thermal film is 24, and the slabs are 22 disks. The susceptor 22 is made of smelting alloy. The phantom is 70 pieces of heat-generating electrons (the figure is not connected, and the pedestal 22 is provided for the fasteners 10 to be worn. It is assumed that each of the perforations 22 =:: the stop portion 22b 'the stop portion 22b is broken, and the stop portion 22b is - upwardly convex. The heat on the heat is transmitted to the heat dissipation two: two: = 200809101 base 22 The upper side of the heat sink 24 is disposed on the side of the heat sink 24 for forced heat dissipation. · Please refer to FIG. 2 and FIG. 3, the buckle 1 includes a lock pin 12 and an elastic body 14. a sleeve 16 and a retaining ring 18, the retaining ring 18 is a cymbal ring. The locking pin 12 is a cylinder having a two-stage structure. The upper portion 12a of the locking pin 12 has a lower portion 12|5 The upper end of the upper section 12& is provided with a head 122 having an outer diameter larger than the diameter of the upper section 12a. _ the upper section 12a is provided with a ring shape along the outer surface at the lower section i2b. The groove 124 can be sleeved in the accommodating groove 124. The lower portion 1 沘 is threaded to facilitate the locking of components such as a circuit board (not shown). The elastic body 14 is a Yellow, the elastic body 14 is sleeved on the upper portion of the locking pin 12, and the upper end of the elastic body 14 can be pressed against the head portion 122. The sleeve 16 is a cylindrical structure in which a metal piece is integrally stamped and formed. The utility model has an opening 162, a bottom 164 and a side wall 166. wherein, for the convenience of molding, the side wall 166 has two opposite gaps. The periphery of the opening 162 is horizontally extended with a flanged hemp. The flange 162a is provided with two opposite slits 162b. The bottom portion 164 is provided with a through hole 164a through which the locking pin 12 can pass, and at the same time, the elastic body 14 of the upper portion 12& The top is on the bottom 164. Referring to Figures 1 to 5, the sleeve 16 is placed in the perforation 22a of the base 22 so that the notch 16 of the sleeve 16 faces the base u. The flange portion of the sleeve 16 abuts against the upper surface of the base 22 (as shown in FIG. 3), and then the sleeve 16 is rotated to make the flange of the sleeve 16 conceal The stop portion moves R and causes the stop portion to be tightly lost. 200809101 holds the flange 162a (as shown in Fig. 4). Since the sleeve 16 and the through hole 22a are The two diameters are equivalent to each other. Therefore, the sleeve 16 can be fixed by the supporting portion. The locking pin 12 passes through the elastic body 14 and is placed in the sleeve 16, and the locking pin 12 passes through the same at the same time. The perforation of the bottom portion 164 of the sleeve 16 causes the lower end of the elastomer 14 to abut the bottom 164 of the sleeve 16. The elastomer 14 is _ by the head 122 of the locking pin 12 and the bottom 164 of the sleeve 16. The accommodating groove 124 of the locking nail passes through the perforation and protrudes below the bottom cymbal. Then, the retaining ring 18 is sleeved on the accommodating groove 124 to prevent the elastic body from rotating. With 1G rib | to the heat sink 2 ( (as shown in Figure 5). It can be seen from the above that, by the arrangement of the blocking portion 22b, the buckle 10 can be stably assembled to the heat sink 2〇 in advance, so that the buckle 1 is not easily dislocated. Packing and transporting wheels make it easy to organize. In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view of a heat dissipating device in accordance with the present invention. 2 is an exploded perspective view of the buckle in the scatter assembly shown in FIG. 1. Figure 3 is a top view of the pre-assembly of the sleeve in the heat sink assembly shown in Figure 1. 200809101
圖4爲圖1所示散熱裝置組合中套筒預組裝後之上視 圖。 圖5爲圖1所示散熱裝置組合之立體組裝圖。 【主要元件符號說明】 散熱裝.置組合 100 扣具 10 鎖釘 12 上段 12a 下段 12b 頭部 122 容置槽 124 彈性體 14 套筒 16 開口 162 凸緣 162a 切口 162b 底部 164 穿孔 164a 側壁 166 缺口 166 a 擋圈 18 散熱器 20 基座 22 穿孔 22a 擋止部 22b 散熱片 24 風扇 30 埶管 ”、、 40Figure 4 is a top plan view of the sleeve in the heat sink assembly of Figure 1 after pre-assembly. FIG. 5 is an assembled, isometric view of the heat sink assembly of FIG. 1. FIG. [Main component symbol description] Heat sink assembly 100 clamp 10 lock pin 12 upper segment 12a lower segment 12b head 122 accommodating groove 124 elastic body 14 sleeve 16 opening 162 flange 162a slit 162b bottom 164 perforation 164a side wall 166 notch 166 a retaining ring 18 heat sink 20 base 22 perforation 22a stop 22b heat sink 24 fan 30 manifold ",, 40