200807675 九、發明說明： 【發明所屬之技術領域】 右明ί有關於電子微小構裝技術，特別是有關於一種具 有月r電防護、電磁隔離、以及抗氧化之封裝結構及其製造方法。 【先前技術】 現今模組積體電路封裝SIP(System in package) ic (/曰=伽Clrcuits)方式，不論是單—晶片、抑或是整合 古且(m〇dule),大抵係採用鑄模(molding component) p ^著模組積體電路技術的進步，模組積體電路日益微小 化：即f越來越多的技術問題尚須克服，而主要的技術問題有 ς ·二是靜電防護的問題，由於電子树的縮小化趨勢漸漸明 以兀件所承受的靜電傷害的預防也要加強；二是電 欠由於元件的縮小化，所以電磁干擾也要特別的處理， =以=止電磁波訊號彼此之間的干擾；三s封裝接點氧化的 二由於兀件的縮小，元件的輸入/輸出接點氧化問 會造成量產良率無法提昇。 j就解決電磁干擾-事，習知技術係在模組频電路所設 、舟#電路板上，利用金屬零組件將模組積體電路包覆其内，以 ^蔽方式（shielding)獲致電磁隔離之效。惟，金屬遮]罩係用 於包覆模組積體電路，面積必須比模組積體電路大；又，金. J罩需按模組積體電路的尺寸另行製造，故生產成本亦二再 孟屬遮罩僅解決電磁干擾的問題，卻無法靜電 氧化的問題。 ' 【發明内容】 電 、因此，本發明之一目的，在於提供一種具有靜電防護 磁隔離、以及抗氧化之微小封裝結構及其製造方法。' 200807675 n上述目的，本發明可藉由提供一種 構包括：一基底’·至少—零件，設置於基底上^ 上方设置鄰近於基底邊緣處；—包覆層，設置於基底 於署件，並露出導電接點之接觸部；以及，-導電層， ί電声d!上t並與導電接點之接觸部呈電性柄接。表面的 同樣ϋί㈣接‘时時不需要剌雜祕也可達到 =尚可提供裝結構之製造方 【實施方式】 理適用。 电峪对衣結構，或疋多晶片封裝亦可同 而输—聰_的頂視圖； 和第二圖所示，標號10^!=圖即顯示於第二圖。第一圖 FR4,、LTcc、FR5或是底’此基底3(3可以是ΒΤ、 0.1mm〜Ιιμ或更厚。板材質所構成，厚度約為 組積體電路晶片%日=二代表，，可以是模 11C係固定於基底10上。1電谷,、’,此等苓件11A、UB-、 pad)，設置於基底1〇 6A怠"1^儿12代表導電接點（conductive P ) 絲1Q喊_域，通常錢接维也電位。 200807675 層（mQldinglayer)，可以利用模組積體電路 ^匕覆材貝或疋其它的絕緣材制構成，覆於基底lG之全般 ΓΓ之Γ、Λβ、llc等覆蓋起來，惟需將導、電接點 ^口^刀路出，疋為接觸部15。標號14代表導電層 !Tr)、，覆蓋於包覆層13表面及侧面；較佳而 L曰讀導電接點12之接觸部15呈電性連接；此 屬由，膠、導電油墨、導電碳粉、或是金 P〇lypyr；〇le fPPy)^Sp^R- ' 1， yj P〇ly-para-phenylene (PPP)、 P$〇 （PT)等。較佳而言，若導電層14採用導電油 5質為佳塑電，粉等材質，與包覆層13附著性較金屬 蔣徂ί3好；另外，導電油墨、導電塑膠、專電碳 扣#了以k供較金屬為佳的抗氧化性。 根據本發明，先在固定雷 、 電接點12，後續在覆土 ^邊、、彖處設置有導 接點1?上復層13，再接者做切割時露出導電 13之全“ ^，ίίΓ 15，然後將導電層14形成於包覆層 之王瓜表面，而與導電接點12之接觸部15成總. 靜電防護的效果’·又’導電層 ^ 分不易歲^匕， 可ΐί略fr圖所不之導電接點12係屬選擇性組成要件，亦 割道(scribe line) 32 ^為®^個^'「基f 30上，係按切 34D f^ 30 ρΓΓτ^ ?〇34A'34B'34C ' 構成’厚度約為 8 200807675 件料元區域輝内設有;=耗==有零 基底30之方式，可以焊接、表 午、6D❿各零件固設於 之插座等方式為之。第三财，“若於基底 基底上’位於切割道μ處，此導fC38設置於 物it材質構成，可以是長條狀或片狀等犬金屬、導電 將絕緣材質覆蓋基底3Q表面 式(moWmg) 覆; ；ί；^ 40A-40D〇 ^200807675 IX. Description of the invention: [Technical field to which the invention pertains] 右明ί relates to electronic micro-architecture technology, and in particular to a package structure having a monthly electrical protection, electromagnetic isolation, and oxidation resistance, and a method of manufacturing the same. [Prior Art] Today's module integrated circuit package SIP (System in package) ic (/曰 = gamma Clrcuits), whether it is single-wafer, or integrated ancient (m〇dule), is basically a mold (molding Component) p ^ The advancement of modular integrated circuit technology, the modular integrated circuit is increasingly miniaturized: that is, more and more technical problems have to be overcome, and the main technical problems are ς · Second, the problem of static protection As the shrinking trend of the electronic tree is gradually becoming clear, the prevention of static damage caused by the components is also strengthened. Second, the electrical owing is reduced due to the reduction of components, so the electromagnetic interference must be specially treated. Interference between the three s package contacts oxidation due to the shrinkage of the components, the input / output contact oxidation of the component will cause mass production yield can not be improved. j solves the electromagnetic interference-things, the conventional technology is in the module frequency circuit set, the boat # circuit board, the metal integrated circuit is used to cover the module integrated circuit, and the electromagnetic is obtained by shielding. The effect of isolation. However, the metal cover is used to cover the integrated circuit of the module, and the area must be larger than the integrated circuit of the module; in addition, the gold cover must be separately manufactured according to the size of the integrated circuit of the module, so the production cost is also two. The Monzon mask only solves the problem of electromagnetic interference, but it cannot solve the problem of electrostatic oxidation. SUMMARY OF THE INVENTION [Electricity] Therefore, it is an object of the present invention to provide a micro-package structure having electrostatic protection magnetic isolation and oxidation resistance and a method of manufacturing the same. '200807675 n The above object, the present invention can provide a structure comprising: a substrate 'at least a part, disposed on the substrate ^ disposed adjacent to the edge of the substrate; - a cladding layer, disposed on the substrate, and Exposing the contact portion of the conductive contact; and, the conductive layer, is electrically connected to the contact portion of the conductive contact. The same 表面 ( 四 四 四 四 四 四 四 四 四 时 时 时 时 时 时 时 时 时 时 = = = = = = = = = = = = = The top view of the electric pick-up structure, or the multi-chip package, can also be transferred to the same. As shown in the second figure, the figure 10^!= is shown in the second figure. The first figure FR4, LTcc, FR5 or the bottom 'this substrate 3 (3 can be ΒΤ, 0.1mm~Ιιμ or thicker. The plate material is composed, the thickness is about the assembly circuit wafer %% = two represents, The die 11C may be fixed on the substrate 10. 1 electric valley, ', these pieces 11A, UB-, pad) are disposed on the substrate 1〇6A怠"1^儿12 represents a conductive contact (conductive P ) Silk 1Q shouts _ domain, usually money is also connected to the potential. 200807675 layer (mQldinglayer), can be constructed by using the module integrated circuit ^ 匕 材 疋 or other insulating materials, covering the entire substrate lG ΓΓ Λ, Λ β, llc, etc., but the need to guide, electricity The contact ^ mouth ^ knife exits, and the contact portion 15. Reference numeral 14 denotes a conductive layer! Tr), covering the surface and the side surface of the cladding layer 13; preferably, the contact portion 15 of the L-reading conductive contact 12 is electrically connected; the genus, the adhesive, the conductive ink, the conductive carbon Powder, or gold P〇lypyr; 〇le fPPy)^Sp^R- ' 1, yj P〇ly-para-phenylene (PPP), P$〇(PT), etc. Preferably, if the conductive layer 14 is made of conductive oil, it is preferably made of plastic, powder or the like, and the adhesion to the coating layer 13 is better than that of the metal 徂 徂 3 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; It is better to use zinc for better oxidation resistance. According to the present invention, the fixed lightning and electrical contacts 12 are first provided, and then the guiding points 1 and the upper layer 13 are disposed at the side of the covering soil, and the upper layer 13 is exposed, and then the whole of the conductive 13 is exposed when cutting. ^, ίίΓ 15, then the conductive layer 14 is formed on the surface of the king layer of the cladding layer, and the contact portion 15 with the conductive contact 12 is formed. The effect of the electrostatic protection '·and the conductive layer ^ is not easy to be old, can be slightly The conductive contacts 12 of the fr diagram are optional components, and the scribe line 32 ^ is ® ^ ^ ' on the base f 30, the system is cut 34D f^ 30 ρΓΓτ^ ? 34A' 34B'34C 'construction' thickness is about 8 200807675. The material area is provided in the area; = consumption == there is zero base 30, which can be welded, noon, 6D, each part is fixed in the socket. The third fiscal, "if the base substrate" is located at the cutting path μ, the guide fC38 is set in the material of the material it can be a long strip or sheet of dog metal, conductive covering the base material 3Q surface type (moWmg );; ί;^ 40A-40D〇 ^
StiitiJ 38!f m 34A # 34B 38 ^ 接點與_之導電 間之導電接點38經切割範圍34C與34D 後’可藉由切割所產生二，38D °經過切割處理 部分，諸如：經由溝槽42募^42=4=6露出導電接點抑之 溝槽44可露出導^&4328==電接點观和38B，經由 接點38C和38D等等。 和38C ’經由溝槽46可露‘出導電 之上_48編咖惠_ 48 438A4V«R46 " 〇 ^ ? ^ 等呈電性_。此導電層 =是 200807675 導電碳粉、或是金屬等材質所構成；導電塑膠可以是 polyaniline (PAn) 、 polypyrrole (PPy) 、 poly-para-phenylene (PPP)、p〇lythiophene (PT)等，並可 以喷鑛(spraying)、濺銀(sputtering)、蒸鑛（evap〇rati〇n)、 沈積（deposition)、塗佈（coating)、或印刷（printing)等方 ，，成。接著，按照各切割道32的位置進行切割處理，將 單Try區域範圍34A-34D予以切割分離成為獨立之封裝結往 參照第七圖，即是單元區域範圍34B之封裝結構。 月 因此，如第七圖所示，根據本發明製造方法所得之:士 構’士係在目定電子零狀基底3〇雜處設置有導電接點^ 後績在覆上包覆層權時露出導電接點38β之部分 〇，，將導電層48覆蓋於於包覆層_之表面 接點38Β之接觸部50成電性接觸。由於導電 ϊί，位，故可將靜電導出，獲致靜電防護的效果;ii 蔽面，可獲致電磁隔離之J 屏 撕、識、38C、38D等之形成步驟3即中可接點38.、 【圖式簡單說明】 圖;第一圖係顯報據本發明縣結構—較㈣施例之頂視 第二圖係顯示第一圖之ii-ii綠 面ίίΓ第七_示根據本發明封裝 200807675 【主要元件符號說明】 1〜封裝結構；10〜基底；11A、11B、11C〜零件；12〜導電接 點；13〜包覆層；14〜導電層；15〜接觸部；30〜基底；3ν2〜切割 道；34Α、34Β、34C、34D〜單元區域範圍；36Α、36Β、36C、36D〜 零件；38、38Α、38Β、38C、38D〜導電接點；40、40Α、40Β、 40C、40D〜包覆層；42、44、46〜溝槽；48〜導電層；以及，50〜 接觸部。StiitiJ 38!fm 34A # 34B 38 ^ The conductive contact 38 between the junction and the conductive layer 38 is cut by the range 34C and 34D, which can be generated by cutting. The 38D ° passes through the cutting processing part, such as via the groove 42. The recruitment of 42=4=6 exposes the conductive contacts and the trenches 44 can expose the junctions & 4328 == electrical junctions and 38B, via junctions 38C and 38D, and the like. And 38C ' can be exposed through the trench 46 ‘Outside the conductive _48 编咖惠 _ 48 438A4V «R46 " 〇 ^ ? ^ and so on. The conductive layer is composed of 200807675 conductive carbon powder or metal; the conductive plastic may be polyaniline (PAn), polypyrrole (PPy), poly-para-phenylene (PPP), p〇lythiophene (PT), etc. It can be sprayed, sputtered, evaporated, deposited, coated, or printed. Next, the dicing process is performed in accordance with the position of each dicing street 32, and the single Try region ranges 34A-34D are diced and separated into individual package junctions. Referring to the seventh figure, the package structure of the cell region range 34B. Therefore, as shown in the seventh figure, according to the manufacturing method of the present invention, the conductive structure is provided in the noisy portion of the electronic zero-shaped substrate 3, and the performance is exposed when the cladding layer is covered. The portion of the conductive contact 38β is electrically connected to the contact portion 50 of the surface contact 38 of the cladding layer. Due to the conductive ϊ, position, the static electricity can be derived, and the electrostatic protection effect can be obtained; ii, the shielding surface can be obtained, and the J screen tearing, the identification, the 38C, the 38D, etc. forming the electromagnetic isolation can be formed in the step 3, that is, the medium contact point 38. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a report showing the structure of the county according to the present invention - the top view of the fourth embodiment shows the ii-ii green face of the first figure ίίΓ seventh_showing the package according to the present invention 200807675 [Description of main components] 1~ package structure; 10~ substrate; 11A, 11B, 11C~ parts; 12~ conductive contacts; 13~ cladding layer; 14~ conductive layer; 15~ contact part; 30~ substrate; 3ν2 ~Cleaning track; 34Α, 34Β, 34C, 34D~ unit area range; 36Α, 36Β, 36C, 36D~ parts; 38, 38Α, 38Β, 38C, 38D~ conductive contacts; 40, 40Α, 40Β, 40C, 40D~ Coating layer; 42, 44, 46~ trench; 48~ conductive layer; and, 50~ contact portion.