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TW200806978A - Pattern inspection device - Google Patents

Pattern inspection device Download PDF

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Publication number
TW200806978A
TW200806978A TW096116158A TW96116158A TW200806978A TW 200806978 A TW200806978 A TW 200806978A TW 096116158 A TW096116158 A TW 096116158A TW 96116158 A TW96116158 A TW 96116158A TW 200806978 A TW200806978 A TW 200806978A
Authority
TW
Taiwan
Prior art keywords
illumination
pattern
image
lens
substrate
Prior art date
Application number
TW096116158A
Other languages
Chinese (zh)
Inventor
Hiroki Hayashi
Ryozo Matsuda
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200806978A publication Critical patent/TW200806978A/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/70Determining position or orientation of objects or cameras
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0002Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

To provide a pattern inspection device capable of obtaining both of a transmitted illumination image and a reflected illumination image only by once scanning an imaging means and an illumination means without lowering a resolving power. When the inspection pattern 5a of a TAB tape 5 is fed, transmitted illumination light and reflected illumination light are thrown by a transmission illumination means 1a and a reflecting illumination means 1b and the whole of the inspection pattern 5a is scanned so as to pass the region under an inspection part 1 by a scanning means 2. By this constitution, the transparent illumination image of the inspection pattern 5a and the reflected illumination image thereof are stored in a control part 4. The control part 4 compares the stored transmitted illumination image and a reference pattern for transmission illumination to inspect whether the wiring pattern of the transmitted illumination image is within a predetermined dimension range with respect to the reference pattern, that is, whether there is "thickening" or "thinning" in a wiring pattern to judge the quality of the inspection pattern 5a.

Description

200806978 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於圖案檢測裝置,特別是關於藉由反射照 明與透過照明來照明形成於 TAB ( Tape Automated Bonding:捲帶自動接合)捲帶等之基板的配線圖案,並 . 比較所獲得的反射照明畫像與透過照明畫像,來進行良藏 之判定的配線圖案檢測裝置。 【先前技術】 在配線圖案之檢測中,作爲區別附著於基板表面或背 面之粉塵(異物)與配線圖案之缺陷以防止錯誤檢測之方 法及裝置,例如專利文獻1、專利文獻2、專利文獻3等 被提出。 於前述公報中,記載有:比較接受形成有配線圖案之 基板的反射照明光之影像而獲得的反射照明畫像、及接受 ® 透過照明光之影像而獲得的透過照明畫像,將兩方之畫像 所共通顯現的不良當成配線圖案的缺陷。 _ [專利文獻1 ]日本專利特開2 0 0 4 - 6 1 4 9 1號公報 [專利文獻2]日本專利特開2005-24386號公報 [專利文獻3]日本專利特開2004-21 21 59號公報 【發明內容】 [發明所欲解決之課題] 前述專利文獻2的段落0014-0015中,獲得反射(投 200806978 (2) 射)照明畫像與透過照明畫像之順序,係如下述般表示。 (i )對於基板照射透過照明光,掃瞄攝像手段 (CCD線感測器1 c )與透過照明手段1 a,獲得基板的透 過照明畫像。 (ii )將照明切換爲反射(投射)照明,掃瞄攝像手 段(C C D線感測器1C )與反射(投射)照明手段1 b,獲 得基板的反射照明畫像。 胃 如此,在專利文獻2所記載者中,爲了獲得透過照明 畫像與反射照明畫像之二種類的畫像,在1個檢測區域 中,必須掃瞄攝像手段與照明手段2次。因此,產生檢測 要花時間之問題。 作爲前述問題之解決手段,記載於前述專利文獻3之 技術,給了重要的啓示。在該公報中,係表示改變透過照 明光與反射照明光的波長,藉由使用可以獨立地檢測個別 的波長之感測器,能過同時獲得透過照明畫像與反射照明 0畫像。 如使用此技術,於檢測區域同時照射透過照明光與反 . 射照明光,只掃瞄攝像手段與照明手段1次,可以獲得透 β 過照明畫像與反射照明畫像之兩方。 但是,此方法存在有如下之問題。 在實際之配線圖案檢測裝置中,於攝像手段(CCD 感測器)之光射入側設置有將檢測知區域放大而投影於攝 像手段上用之透過(組合複數透過之透鏡單元)。最近, 爲了高精度地檢測年年微細化之配線圖案,要求更高解析 -5- 200806978 (3) 度的透過。 在透過照明光與反射照明光的波長不同之情形時,此 透過單元也必須使透過照明光及反射照明光相等地成像投 影於攝像手段上。即透過單元對於波長不同的光線,需要 具有同等的光學特性。 但是’一般對於波長不同的光線,要具有同等的光學 特性之設計,比起使某一波長之光線(單色光)成像之光 ® 學系統的設計更爲困難,解析度也降低。爲了使解析度變 好,透鏡的材料變得高貴等,使得裝置的成本變高。 本發明係有鑑於前述情況所完成者,本發明之目的在 於提供:不使解析度降低,且只掃瞄攝像手段與照明手段 1次’可以獲得透過照明畫像與反射照明畫像之兩方的圖 案檢測裝置。 [解決課題之手段] ® ( 1 )將藉由透鏡所投影之基板的檢測區域(透鏡之 視野區域)分成照射反射照明光之第1區域、及照射透過 照明光之第2區域之2區域,設置:對位於前述透鏡的視 野內之基板區域的一部份之第1區域,照射反射照明光之 反射照明手段、及對位於前述透鏡的視野內,且未藉由前 述反射照明光所照明之其他一部份區域之第2區域,照射 透過照明光之透過照明手段。另外,設置:攝取第1區域 之影像的第1攝像手段、及攝取第2區域之影像的第2攝 像手段。 -6 - 200806978 (4) 然後,於第1區域與第2區域所排列之方向,使前述 基板與2個攝像手段及透鏡相對地掃瞄移動,藉由1次之 掃瞄移動,來獲得檢測區域之反射照明畫像與透過照明畫 像,依據兩畫像來判定前述圖案之良窳。 ' (2 )在前述(1 )中,前述基板係於樹脂薄膜上形成 ^ 有藉由金屬之配線圖案的長帶狀TAB(捲帶自動接合)捲 帶;前述移動手段,係使前述TAB捲帶朝捲帶長邊方向 # 搬運。 (3 )於前述(1 )中,前述基板係於樹脂薄膜上形成 有藉由金屬之配線圖案的長帶狀TAB捲帶;前述移動手 段,係使前述2個攝像手段及前述透鏡成一套而朝前述 TAB捲帶的長邊方向移動。 (4 )於前述(1 )中,前述基板係於樹脂薄膜上形成 有藉由金屬之配線圖案的長帶狀TAB(捲帶自動接合)捲 帶;前述移動手段,係使前述2個攝像手段及前述透鏡成 ® 一套而朝前述TAB捲帶的寬度方向移動。 (5 )使反射照明光的波長與透過照明光的波長成爲 相同。 [發明效果] 本發明中可以獲得以下之效果。 (1 )將透過的視野區域分成照明透過照明光之區 域、及照射反射照明光之區域之2區域,對個別區域照射 反射照明光與透過照明光,藉由對應各別所設置的攝像手 (5) 200806978 段來接受影像而構成,只需掃瞄攝像手段與照明手段1 次,可以獲得透過照明畫像與反射照明畫像之兩方。 (2 )透過照明光與反射照明光係使用相同波長,藉 此,透鏡可以進行只是特定波長成像之設計,可以使所攝 取影像之畫像的解析度變高。 ' (3)透過可以只有1個,不需要使用高貴的透鏡材 料,能夠防止裝置成本的上昇。 【實施方式】 第1圖係本發明之第1實施例的配線圖案檢測裝置之 區塊圖。另外,於以下所示之任何一個實施例中,雖針對 基板爲TAB捲帶之情形作說明,但是,本發明在TAB捲 帶之外,也可以適用於透過照明可行之種種的基板的圖案 檢測。例如,矽晶圓可以透過紅外線,反射照明光及透過 照明光如使用紅外線,對於前述及形成於矽晶圓上之配線 ® 圖案,可以進行同樣的檢測。 本實施例之圖案檢測裝置,係如該圖所示般,爲具 備:由搬運TAB捲帶5之送出捲軸11與捲取捲軸12所 形成之捲帶搬運機構1 〇、及對從送出捲軸1 1所被送出之 TAB捲帶照射透過照明光、反射照明光來攝取圖案5 a之 檢測部1、及於TAB捲帶的檢測圖案5a上掃瞄檢測部1 之掃瞄手段2、及對不良的圖案加上標記之標記部3。 在標記部3中,對於被判定爲不良的圖案,進行沖床 之穿孔,或以可以目視即刻確認其爲不良品之方式,來加 -8 - 200806978 (6) 上塗色等之標記。 另外,本實施例之配線圖案檢測裝置,係具備:比較 攝取之透過照明畫像圖案、反射照明畫像圖案與成爲基準 之主圖案,來判定產品的良窳,並且控制檢測部1、掃瞄 * 手段2、標記部3、以及捲帶搬運機構1 〇的動作之控制部 ' 4。於控制部4事先輸入有成爲圖案檢測的基準之基準圖 案。基準圖案係有反射照明用者與透過照明用者之2種。 H 另外’基準圖案也可以是攝取被判定爲良品之實際的配線 圖案的畫像,也可以是利用CAD資料者。 接著,說明前述檢測部的構成例。 如第1圖所示般,檢測部1係具備:將進行TAB捲 帶5的檢測之區域予以放大而投影之1個透鏡(透鏡單 元)6、及對於爲在此透鏡6的視野內之基板的區域,即 藉由透鏡被放大之基板的區域之一部份,從TAB捲帶5 的背面側藉由透過光所照明之透過照明手段1 a、及在位 ® 於透鏡6的視野內之基板的區域之未藉由透過照明光所照 明之區域,從表面側藉由反射光(投射光)所照明之反射 照明手段1 b。進而具備:設置於透鏡6的TAB捲帶5之 相反側之攝取藉由透過照明光之檢測圖案5a的影像之攝 像手段1 c、及攝取藉由反射照明光之檢測圖案5a之影像 的攝像手段1 d。 透過照明手段la的光源係適當地選擇會透過TAB捲 帶5的樹脂薄膜,且放射在形成於TAB捲帶5的圖案中 被反射之波長者。在本實施例中,係使用放射波長8 5 0nm 200806978 (7) 以上的光之LED,反射照明手段lb的光源也使用相同 者。 透鏡6係由複數透鏡所組合而被收容於鏡筒者,設計 成對於波長8 5 Gum之光具有所期望的光學特性。 攝像手段U、1 d係對前述照明光的波長具有受光感 度。例如,爲CCD線感測器或區域感測器,在以下,作 爲攝像手段1 c、1 d係針對使用CCD線感測器之情形作說 _ 明。 第2圖係將檢測部1的附近予以放大表示者。第2 (a )圖係表示從攝像手段側來觀看TAB捲帶側之樣子, 第2 ( b )圖係側面圖。 如第2 ( a )圖所示般,位於透鏡6的視野內之基板 的區域(藉由透鏡6所被放大的基板之區域)係被分成: 藉由反射照明手段1 b而被照射反射照明光之區域X (反 射照明區域X )、及藉由透過照明手段1 a而被照射透過 ® 照明光之基板的區域Y (透過照明區域Y )之2個區域。 另外,將該圖之箭頭所示方式(TAB捲帶5的長邊方向) 定義爲反射照明區域X與透過照明區域Y排列之方向。 另外,於透鏡6之與基板的相反側,於透過照明區域 Y被投影之位置設置有攝取透過照明像之第1攝像手段 1 c,於反射照明區域X被投影之位置設置有攝取反射照明 像之第2攝像手段1 d。 以透過照明光與反射照明光於進行檢測之基板上不相 互混雜之方式,於透過照明手段1 a與反射照明手段1 b的 -10- 200806978 (8) 照明光之反射側配置有對應兩照明手段之長度的圓 le,照明光被聚光於照明手段的寬度方向。另外, 由將照明光予以聚光,可以使透過照明區域Y與 明區域X接近’能使透鏡6及檢測部1小型化。 另外,如第3圖所示般,對應2個照明區域與 — 段1c、ld,雖也可以考慮設置2台的透鏡6a、 是,基於以下理由,並不實際。 Φ 透鏡係高解析度之故,要求高的光學性能,因 高價。透鏡變成2台時,透鏡的成本變成2倍,裝 的成本變得高價。 另外,如背景技術所示般,在檢測中,比較反 畫像與透過照明畫像,兩畫像必須具有同等的解析 此’雖然需要使兩個透鏡的光學特性變得一致,但 際上要使兩者高精度地變得一致,有其困難,另外 要使其一致,成本變高。 ® 進而’如前述般,透鏡係將複數透鏡予以組合 者,透鏡變成2台時,重量變重,且裝置會大型化 第4圖係說明攝取檢測圖案5a之動作圖,該 示使攝像手段lc、Id、透鏡6、透過照明手段la 照明手段1 b (檢測部1 ) 一體地朝向TAB捲帶的 向移動之情形。 ‘ 在此情形時,反射照明區域X與透過照明區ί 排列於TAB捲帶5的長邊方向而形成,藉由掃瞄相 的掃瞄手段2,在TAB捲帶5的檢測圖案5 a上, 筒透鏡 如此藉 反射照 攝像手 6b,但 此變成 置整體 射照明 度。因 是,實 ,如想 所構成 〇 圖係表 與反射 搬運方 I Y係 〖測部1 使攝像 -11 - 200806978 (9) 手段(CCD線感測器)1 c、1 d、透鏡6、透過照明手段1 a 與反射照明手段lb於該圖的箭頭所示方向掃瞄。 檢測圖案5a係首先藉由透過照明而被照明,藉由第 1攝像手段1 c而獲得透過照明畫像。接著,藉由反射照 ' 明而被照明,藉由第2攝像手段1 d而獲得反射照明畫 像。 藉由使檢測部1的整體通過檢測圖案5a上,可以獲 # 得檢測圖案5a整體之透過照明畫像與反射照明畫像。 另外,藉由反射照明手段lb之反射照明區域X與藉 由透過照明手段1 a之透過照明區域Y、及第1攝像手段 1 c、第2攝像手段1 d,其對掃瞄方向正交之方向的長 度,需要設定在1次的掃瞄中能覆蓋檢測圖案5a的寬度 之長度。 透過照明手段1 a、反射照明手段1 b的光源例如係將 LED予以複數排列所構成。因此,透過照明區域Y、反射 ® 照明區域X的長度之調節,係藉由改變個別之照明手段 1 a、1 b之LED之排列於檢測圖案5 a的寬度方向的個數來 進行。 另一'方面,弟1攝像手段1c、第2攝像手段Id所使 用之CCD線感測器,市售者其長度已定。因此,爲了攝 取寬度寬大之檢測圖案,係如第 5圖所示般,將複數 CCD線感測器排列而配置。 接著藉由前述第1圖、第2圖、第4圖來說明本實施 例之圖案檢測裝置的動作。另外,圖案之檢測用的控制 -12- 200806978 (10) (演算法)基本上係與前述專利文獻2所記載者相同。 於TAB捲帶5連續地製作有複數的相同配線圖案, 控制部4係驅動捲帶搬運機構1 0而將TAB捲帶5搬運至 檢測部1。 TAB捲帶5之成爲檢測對象的檢測圖案5 a於藉由前 述捲帶搬運機構1 0而被搬運至檢測部1的特定位置時, TAB捲帶5停止在該位置。 # 藉由透過照明手段1 a,從TAB捲帶5之下方(沒有 設置檢測圖案5 a之側)對透鏡6的視野內之基板區域中 之捲帶搬運方向下游側照射反射照明光。 藉由掃瞄手段2於反射照明區域X及透過照明區域γ 排列之方向,即以檢測圖案5 a整體通過TAB捲帶5的長 邊方向之方式,來掃瞄檢測部1 (透過照明手段1 a、反射 照明手段1 b、攝像手段1 c、1 d、透鏡6 )。 藉此,從透過照明手段1 a所射出之照明光透過TAB β 捲帶5,以攝像手段(CCD線感測器)1 c受光,檢測圖案 5 a之透過照明畫像被取入控制部4而記憶。 另外,從反射照明手段1 b所射出之照明光於TAB捲 帶5反射而以攝像手段(c C D線感測器)1 d受光,檢測 圖案5 a的反射照明畫像被取入控制部4而記憶。第6圖 係表示有細部、粗部、異物等之情形的透過照明畫像及反 射照明畫像之一例圖。 控制部4係比較所記憶的透過照明畫像及透過照明用 之基準圖案,並檢測透過照明畫像之配線圖案對基準圖 -13- 200806978 (11) 案,是否位於特定的尺寸範圍內,即配線圖案是否有「粗 部」或「細部」。 然後,在配線圖案沒有檢測出不良之情形時,所檢測 之配線圖案則被判定爲良品。 另一方面,如第6(a)圖所示般,透過照明畫像與 ' 透過照明用之配線圖案對於基準圖案爲細之情形,則檢測 之配線圖案被判定爲配線缺陷之不良。 # 另外,透過照明用之配線圖案例如如第6 ( b )圖所 示般,對於基準圖案爲粗之情形時,則檢測之配線圖案被 判定爲不良候補。記憶包含不良候補之配線圖案之有粗的 部分的區域A之位置。 接著,比較對應前述區域A之位置的周邊的特定範 圍之反射照明畫像之畫像與反射照明用之基準圖案的相同 位置之畫像,進行細部及粗部之檢測。 如第6 ( b )圖所示般,此檢測之結果與藉由透過照 ® 明畫像之檢測結果相同,在反射照明畫像檢測到有粗部之 情形,則配線圖案被判定爲不良品。 另一方面,藉由透過照明畫像,儘管有檢測出粗部, 但是如第6 ( c )圖所示般,在反射照明畫像中,與藉由 透過照明畫像之檢測結果相反而檢測到細部之情形時,則 將藉由透過照明畫像之粗部的原因判定爲圖案上之「異 物」,配線圖案被判定爲良品。 另外,藉由透過照明畫像,儘管檢測出粗部,但是如 第6 ( d )圖所示般,在反射照明畫像中,也沒有檢測到 -14- 200806978 (12) 粗部或細部之情形時,則將藉由透過照明畫像之粗部的原 因當成在圖案下側之粗部(根部殘留)所導致者,配線圖 案被判定爲不良品。 所檢測之圖案如被判訂爲不良品,該圖案之位置則被 記憶於控制部,該圖案藉由捲帶搬運機構1 〇而被搬運至 ' 標記部3時,進行穿孔或塗色等之標記。 檢測圖案5 a的檢測如結束時,TAB捲帶5係藉由捲 ® 帶搬運機構1 〇而被搬運,成爲下一檢測對象之檢測圖案 被搬運至檢測部1的特定位置。 第7圖係本發明之第2實施例的配線圖案檢測裝置之 區塊圖。在本實施例中,於檢測部1並沒有設置掃瞄手段 而被係被固定。因此,檢測部1攝取檢測圖案5 a之影像 用的檢測部1與TAB捲帶5之相對移動,係藉由捲帶搬 運機構1 〇來進行。 檢測部1的構成基本上與第1實施例相同,係具備: ^ 透鏡6、對於爲在此透鏡6的視野內之基板之區域的一部 份’從TAB捲帶5的背面側藉由透過光來照明之透過照 、 明手段1 a、及對於位在透鏡6的視野內之基板的其他一 部份之區域,從TAB捲帶5的表面側藉由反射光照明之 反射照明手段lb、及攝取藉由透過照明光之檢測圖案5a 的影像之攝像手段1 c、及攝取藉由反射照明光之檢測圖 案5 a的影像之攝像手段〗d。 接著’利用第8圖來說明攝取檢測圖案5a之動作。 與第1實施例相同,反射照明區域X及透過照明區 -15- 200806978 (13) 域Y係於TAB捲帶5的長邊方向排列形成,於透鏡6之 上設置有:攝取透過照明區域γ之第1攝像手段1c及攝 取反射照明區域X之第2攝像手段1 d。 在藉由第1及第2攝像手段1c、Id來攝取TAB捲帶 ‘ 5的檢測圖案5 a時,TAB捲帶5係藉由捲帶搬運機構10 ' 而於該圖之箭頭所示方向(T的長邊方向,即反射照明區 域X與透過照明區域γ排列之方向)被掃瞄。 Φ 藉由檢測圖案5a的整體通過檢測部1之下部,可以 獲得檢測圖案5a之整體的透過照明畫像與反射照明畫 像。 本實施例的裝置之動作,基本上係與第1實施例相 同,以不同部分爲中心進行說明。 TAB捲帶5係藉由捲帶搬運機構10而被搬運至檢測 部1 〇 TAB捲帶5之成爲檢測對象的檢測圖案5 a如被搬運 ® 至檢測部1的特定位置(檢測部1的搬運方向之上游側) 時,TAB捲帶5的搬運在該位置暫時停止。 藉由透過照明手段1 a與反射照明手段1 b,透鏡6的 視野內被分開照明,透過照明區域Y與反射照明區域X 係於TAB捲帶5的搬運方向排列而形成。 TAB捲帶5藉由捲帶搬運機構1 0而被搬運,檢測圖 案5a整體於反射照明區域X與透過照明區域Y。 排列方向被掃瞄。藉此,藉由CCD線感測器1 c,檢 測圖案5 a的透過照明畫像被取入而記憶於控制部4,藉 -16- 200806978 (14) 由CCD線感測器1 d,檢測圖案5 a的反射照明畫像被取入 而記憶於控制部4。 控制部4係比較記憶的透過照明畫像與透過照明用之 基準圖案,並藉由第1實施例中所示之步驟,來判定檢測 • 圖案5 a的良窳,在不良之情形時,藉由標記部3施以標 . 記。 檢測圖案5 a之檢測如結束,TAB捲帶5則藉由捲帶 • 搬運機構1 〇而被搬運,成爲下一檢測對象之檢測圖案被 搬運至檢測部1的特定位置。 第9圖係本發明之第3實施例的配線圖案檢測裝置之 區塊圖。在本實施例中,與第1實施例相同,雖於檢測部 1設置有掃瞄手段2’,但是,掃瞄手段2’係使檢測部1 朝向與TAB捲帶5的搬運方向正交的方向(TAB捲帶5 的寬度方向)移動者。 因此,檢測部1的透過照明手段1 a、1及對應彼等之 • 攝像手段lc、Id的配置,對於第1、第2實施例而言, 係以透鏡6的光軸爲中心而配置成90°旋轉之狀態。另 外,在第9圖中,爲了避免圖變得繁雜,雖只表示透過照 明手段1 a與接受透過照明畫像之第1攝像手段1 c,但是 實際上,在其深處設置有:反射照明手段1 b、及接受反 射照明畫像之第2攝像手段1 d。 利用第1 0圖來說明攝取檢測圖案5 a之動作。 與第1、第2實施例不同,反射照明區域X與透過照 明區域透過照明區域Y係排列形成於與TAB捲帶5的長 -17- 200806978 (15) 邊方向正交之方向(TAB捲帶5的寬度方向)。於透鏡6 之上設置有:攝取透過照明區域Y之第1攝像手段1c、 及攝取反射照明區域X之第2攝像手段1 d。 藉由掃瞄手段2’ ,使透過照明手段1 a、反射照明手 * 段1 b、攝像手段(CCD線感測器);^、1(!於反射照明區 ' 域X與透過照明區域Y排列之方向,即與TAB捲帶5的 長邊方向正交之方向(TAB捲帶5的寬度方向)掃瞄。 • 藉由使檢測圖案5a的整體通過檢測部1.之下部,可 以獲得檢測圖案5 a之整體的透過照明畫像與反射照明畫 像。 本實施例之裝置的動作,基本上係與第1實施例相 同,以不同部分爲中心來說明。 TAB捲帶5藉由捲帶搬運機構1 0而被搬運至檢測部 1。TAB捲帶5之成爲檢測對象的檢測圖案5 a,如被搬運 至檢測部1的特定位置(檢測部1之搬運方向上游側) ® 時,T的搬運暫時停止於該位置。 藉由透過照明手段1 a與反射照明手段1 b,透鏡6的 視野內被分開照明,透過照明區域Y與反射照明區域X 係於TAB捲帶5的寬度方向排列而形成。 藉由掃瞄手段2 ’ ,檢測部1係於反射照明區域X與 透過照明區域透過照明區域Y排列之方向,即TAB捲帶 5的寬度方向,以TAB捲帶5整體通過檢測部1之下部的 方式來進行。 藉此,藉由攝像手段(CCD線感測器)1 c,檢測圖案 -18- 200806978 (16) 5a的透過照明畫像被取入而記憶於控制部4,藉由攝像手 段(CCD線感測器)Id,檢測圖案5a的反射照明畫像被 取入而記憶於控制部4。 控制部4比較記憶的透過照明畫像與透過照明用之基 準圖案,並藉由第1實施例中所示之步驟,來判定檢測圖 ' 案5 a的良窳,在不良之情形時,藉由標記部3施以標 記。 φ 檢測圖案5 a之檢測如結束,TAB捲帶5則藉由捲帶 搬運機構1 〇而被搬運,成爲下一檢測對象之檢測圖案被 搬運至檢測部1的特定位置。 另外,如第1實施例所述般,反射照明區域X與透 過照明區域Y、及第1攝像手段1 C、第2攝像手段1 d, 其對掃瞄方向正交之方向的長度,需要設定爲覆蓋以1次 之掃瞄所檢測之區域的長度。如前述第5圖所示般,如將 複數CCD線感測器加以排列而配置時,以1次之檢測部 # 1之掃瞄來取入畫像之檢測區域變寬,可以使TAB捲帶整 體之檢測時間變短。 【圖式簡單說明】 第1圖係本發明之第1實施例的配線圖案檢測裝置之 區塊圖。 第2圖係將檢測部的附近予以放大而表示之圖。 第3圖係表示使對應2個照明區域與攝像元件而設置 2台透鏡之情形圖。 -19- 200806978 (17) 第4圖係說明在第1實施例中,攝取檢測圖案之動作 圖。 第5圖係表示爲了攝取寬度寬之檢測圖案,將複數 CCD線感測器予以排列而配置之情形圖。 ' 第6圖係表示透過照明區域與反射照明畫像之例子 • 圖。 第7圖係本發明之第2實施例之配線圖案檢測裝置之 Φ 區塊圖。 第8圖係說明在第2實施例中,攝取檢測圖案之動作 圖。 第9圖係本發明之第3實施例之配線圖案檢測裝置之 區塊圖。 第1 〇圖係說明在第3實施例中,攝取檢測圖案之動 作圖。 【主要元件對照表】 1 :檢測部 1 a :透過照明手段 1 b :反射照明手段 1 c、1 d :攝像手段(c C D線感測器) 1 e :圓筒透鏡 2、2’ :掃瞄手段 3 :標記部 4 :控制部 -20- 200806978 (18) 5 : TAB捲帶 5a :檢測圖案 6 :透鏡 1 1 :送出捲軸 1 2 :捲取捲軸 1 〇 :捲帶搬運機構200806978 (1) Nine, the invention belongs to the technical field of the invention. The present invention relates to a pattern detecting device, in particular to a TAB ( Tape Automated Bonding) tape formed by illumination by reflection and illumination. The wiring pattern of the substrate is compared with the obtained reflected illumination image and the wiring pattern detecting device for transmitting the illumination image. [Prior Art] In the detection of the wiring pattern, a method and apparatus for preventing erroneous detection by distinguishing between defects of dust (foreign matter) and wiring patterns adhering to the surface or the back surface of the substrate, for example, Patent Document 1, Patent Document 2, and Patent Document 3 Etc. In the above-mentioned publication, a reflection illumination image obtained by receiving an image of reflected illumination light on a substrate on which a wiring pattern is formed, and a transmission illumination image obtained by receiving an image of the illumination light are described. Common defects appear as defects in the wiring pattern. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. 2005-24386 [Patent Document 3] Japanese Patent Laid-Open No. 2004-21 21 59 [Invention] [Problems to be Solved by the Invention] In the paragraphs 001-0015 of the above-mentioned Patent Document 2, the order of reflection (injection of the 200806978 (2)) illumination image and the transmission of the illumination image is obtained as follows. (i) The substrate is irradiated with illumination light, and the scanning imaging means (CCD line sensor 1c) and the transmission illumination means 1a are used to obtain a transparent illumination image of the substrate. (ii) switching the illumination to reflection (projection) illumination, scanning the imaging means (C C D line sensor 1C) and reflecting (projecting) illumination means 1 b to obtain a reflected illumination image of the substrate. In the case of the patent document 2, in order to obtain two types of images of the illumination image and the reflection illumination image, it is necessary to scan the imaging means and the illumination means twice in one detection area. Therefore, it takes time to generate a test. As a means for solving the above problems, the technique described in the above Patent Document 3 gives important revelation. In this publication, it is shown that the wavelengths of the transmitted illumination light and the reflected illumination light are changed, and by using a sensor capable of independently detecting individual wavelengths, it is possible to simultaneously obtain a transmission illumination image and a reflection illumination 0 image. According to this technique, both the illumination means and the illumination illumination are simultaneously irradiated in the detection area, and only the imaging means and the illumination means are scanned once, and both the illuminating image and the reflected illumination image can be obtained. However, this method has the following problems. In the actual wiring pattern detecting device, the light-injecting side of the image capturing means (CCD sensor) is provided with a lens for amplifying the detected area and projecting it onto the image capturing means (combining a plurality of lens units). Recently, in order to accurately detect the wiring pattern that is miniaturized every year, it is required to have a higher resolution -5-200806978 (3) degree of transmission. When the wavelength of the transmitted illumination light and the reflected illumination light are different, the transmission unit must also image the transmission illumination light and the reflected illumination light equally to the imaging means. That is, the transmission unit needs to have the same optical characteristics for light having different wavelengths. However, the design of optical properties with different wavelengths is generally more difficult and the resolution is reduced compared to the design of optical systems that image light of a certain wavelength (monochromatic light). In order to make the resolution better, the material of the lens becomes noble, etc., so that the cost of the device becomes high. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a pattern in which both the illumination illumination image and the reflection illumination image can be obtained by scanning the imaging means and the illumination means once without reducing the resolution. Detection device. [Means for Solving the Problem] ® (1) The detection region (the field of view of the lens) projected by the lens is divided into a first region that illuminates the reflected illumination light and a region that illuminates the second region that transmits the illumination light. Providing that a first region of a portion of the substrate region located in the field of view of the lens is irradiated with a reflective illumination means for reflecting the illumination light, and is disposed within the field of view of the lens and is not illuminated by the reflected illumination light In the second area of the other part of the area, the illumination is transmitted through the illumination light. Further, a first imaging means for capturing the image of the first region and a second imaging means for capturing the image of the second region are provided. -6 - 200806978 (4) Then, in the direction in which the first region and the second region are arranged, the substrate is scanned and moved relative to the two imaging means and the lens, and the scanning is performed by scanning once. The reflection illumination image of the area and the illumination image are used to determine the quality of the pattern based on the two images. (2) In the above (1), the substrate is formed on a resin film by a long strip-shaped TAB (tape automatic bonding) tape having a wiring pattern of metal; and the moving means is to make the TAB roll Belt to the tape with the long side direction # Handling. (3) In the above (1), the substrate is formed of a long strip-shaped TAB tape by a metal wiring pattern on the resin film, and the moving means is to form the two imaging means and the lens. Move toward the long side of the aforementioned TAB tape. (4) In the above (1), the substrate is formed of a long strip-shaped TAB (tape automatic bonding) tape by a metal wiring pattern on the resin film; and the moving means is to cause the two imaging means And the aforementioned lens is moved into a set to move in the width direction of the aforementioned TAB tape. (5) The wavelength of the reflected illumination light is made the same as the wavelength of the transmitted illumination light. [Effect of the Invention] In the present invention, the following effects can be obtained. (1) Dividing the transmitted field of view into two regions of the region where the illumination is transmitted through the illumination light and the region where the illumination light is reflected, and the individual regions are irradiated with the reflected illumination light and the transmitted illumination light, and the camera hands are provided correspondingly to each other (5) ) The 200806978 segment is composed of images, and it is only necessary to scan the imaging means and the illumination means once, and both the illumination image and the reflection illumination image can be obtained. (2) The same wavelength is used for the illumination light and the reflected illumination light. Therefore, the lens can be designed to image only at a specific wavelength, and the resolution of the image of the captured image can be increased. ' (3) There is only one pass, and it is possible to prevent the cost of the device from rising without using a noble lens material. [Embodiment] FIG. 1 is a block diagram of a wiring pattern detecting device according to a first embodiment of the present invention. In addition, in any of the embodiments shown below, although the case where the substrate is a TAB tape is described, the present invention can be applied to pattern detection of various substrates that are feasible through illumination, in addition to the TAB tape. . For example, the germanium wafer can transmit infrared light, reflect illumination light, and transmit illumination light, such as infrared light, to perform the same detection on the wiring pattern formed on the germanium wafer. As shown in the figure, the pattern detecting device of the present embodiment includes a tape transport mechanism 1 that is formed by the feed reel 11 and the take-up reel 12 that transports the TAB tape 5, and a pair of feed reels 1 The TAB tape to be sent is irradiated with illumination light, reflected illumination light to capture the pattern 5a, and the scan means 2 of the scan detection unit 1 on the detection pattern 5a of the TAB tape and the defective pair The pattern is marked with the marking portion 3. In the marking unit 3, a punch is punched into a pattern determined to be defective, or a mark such as a coloring on -8 - 200806978 (6) is added so as to be visually confirmed as a defective product. In addition, the wiring pattern detecting device of the present embodiment is configured to: compare the ingested through illumination image pattern, the reflected illumination image pattern, and the reference main pattern to determine the quality of the product, and control the detecting unit 1 and the scanning * means 2. The marking unit 3 and the control unit '4 of the operation of the tape transport mechanism 1 〇. A reference pattern that serves as a reference for pattern detection is input in advance from the control unit 4. The reference pattern is two types of the person who reflects the illumination and the person who transmits the illumination. Further, the 'reference pattern' may be an image in which the actual wiring pattern judged to be a good product is taken, or a CAD material may be used. Next, a configuration example of the above-described detecting unit will be described. As shown in Fig. 1, the detecting unit 1 includes one lens (lens unit) 6 that enlarges and projects a region where the TAB tape 5 is detected, and a substrate that is in the field of view of the lens 6 The area, that is, a portion of the area of the substrate that is enlarged by the lens, from the back side of the TAB tape 5, through the illumination means 1 a illuminated by the transmitted light, and in the field of view of the lens 6 The area of the substrate is not reflected by the illumination light, and the illumination means 1b illuminated by the reflected light (projected light) from the surface side. Further, the imaging means 1 c for capturing the image of the detection pattern 5a for transmitting the illumination light on the opposite side of the TAB tape 5 of the lens 6 and the imaging means for capturing the image of the detection pattern 5a for reflecting the illumination light are provided. 1 d. The light source transmitted through the illumination means 1 is appropriately selected from the resin film which passes through the TAB tape 5 and is radiated in the pattern formed in the pattern of the TAB tape 5. In the present embodiment, an LED of a light having a wavelength of 850 nm 200806978 (7) or more is used, and the light source of the reflection illumination means 1b is also used. The lens 6 is a combination of a plurality of lenses and is housed in a lens barrel, and is designed to have desired optical characteristics for light having a wavelength of 8 5 Gum. The imaging means U, 1 d have a light receiving sensitivity to the wavelength of the illumination light. For example, it is a CCD line sensor or an area sensor, and hereinafter, as an image pickup means 1 c, 1 d, a case where a CCD line sensor is used is described. Fig. 2 is an enlarged view of the vicinity of the detecting unit 1. Fig. 2(a) is a view showing the state of the TAB tape side viewed from the image pickup means side, and the second (b) side view. As shown in Fig. 2(a), the area of the substrate (the area of the substrate magnified by the lens 6) located in the field of view of the lens 6 is divided into: illuminated illumination by the illumination means 1b The light region X (reflected illumination region X) and two regions of the region Y (transmitted illumination region Y) that are transmitted through the substrate of the illumination light by the illumination means 1a. Further, the manner shown by the arrow in the figure (the long-side direction of the TAB tape 5) is defined as the direction in which the reflection illumination region X and the transmission illumination region Y are arranged. Further, on the opposite side of the lens 6 from the substrate, a first imaging means 1c for capturing and transmitting the illumination image is provided at a position where the illumination illumination region Y is projected, and an intake and reflection illumination image is provided at a position where the reflection illumination region X is projected. The second imaging means 1 d. Between the illumination illumination means 1a and the reflection illumination means 1b, the reflection side of the illumination light is disposed on the reflection side of the illumination light 1a and the reflection illumination means 1b so that the illumination light and the reflection illumination light are not mixed with each other. The circle le of the length of the means, the illumination light is concentrated in the width direction of the illumination means. Further, by condensing the illumination light, the transmission illumination region Y can be made close to the bright region X, and the lens 6 and the detection portion 1 can be miniaturized. Further, as shown in Fig. 3, it is also conceivable to provide two lenses 6a for the two illumination regions and the segments 1c and 1d, and it is not practical for the following reasons. The high resolution of the Φ lens system requires high optical performance due to high price. When the number of lenses becomes two, the cost of the lens is doubled, and the cost of the package becomes high. Further, as shown in the background art, in the detection, comparing the reverse image with the transmitted illumination image, the two images must have the same resolution. Although it is necessary to make the optical characteristics of the two lenses uniform, it is necessary to make both It becomes difficult to be consistent with high precision, and it is necessary to make it consistent and costly. In addition, as described above, when a lens is used to combine a plurality of lenses, when the number of lenses is two, the weight is increased, and the apparatus is enlarged. FIG. 4 is an operation diagram for taking the detection pattern 5a, which shows the imaging means lc. Id, lens 6, and illumination means la illumination means 1b (detection unit 1) integrally move toward the direction of the TAB tape. In this case, the reflected illumination area X and the transmitted illumination area ί are arranged in the longitudinal direction of the TAB tape 5, and by the scanning means 2 of the scanning phase, on the detection pattern 5a of the TAB tape 5 The cylinder lens absorbs the camera 6b by reflection, but this becomes the overall illumination. Because it is true, if you want to form a map and a reflection carrier IY system 〖Measurement unit 1 Make imaging -11 - 200806978 (9) Means (CCD line sensor) 1 c, 1 d, lens 6, through The illumination means 1a and the reflective illumination means 1b are scanned in the direction indicated by the arrow of the figure. The detection pattern 5a is first illuminated by transmission of illumination, and the transmitted illumination image is obtained by the first imaging means 1c. Then, it is illuminated by the reflection, and the reflected illumination image is obtained by the second imaging means 1d. By passing the entire detection unit 1 through the detection pattern 5a, the transmission illumination image and the reflection illumination image of the entire detection pattern 5a can be obtained. Further, the reflected illumination region X of the reflected illumination means lb and the transmitted illumination region Y by the transmission illumination means 1a, and the first imaging means 1c and the second imaging means 1d are orthogonal to the scanning direction. The length of the direction needs to be set to cover the length of the width of the detection pattern 5a in one scan. The light source that reflects the illumination means 1b through the illumination means 1a is configured by, for example, arranging the LEDs in plural. Therefore, the adjustment of the length of the illumination area Y and the reflection illumination area X is performed by changing the number of LEDs of the individual illumination means 1a, 1b arranged in the width direction of the detection pattern 5a. On the other hand, the CCD line sensor used by the first imaging means 1c and the second imaging means Id is commercially available. Therefore, in order to take a detection pattern having a wide width, as shown in Fig. 5, a plurality of CCD line sensors are arranged and arranged. Next, the operation of the pattern detecting device of the present embodiment will be described with reference to Figs. 1, 2, and 4. Further, the control for detecting the pattern -12-200806978 (10) (algorithm) is basically the same as that described in the above Patent Document 2. The TAB tape 5 is continuously formed with a plurality of identical wiring patterns, and the control unit 4 drives the tape transport mechanism 10 to transport the TAB tape 5 to the detecting unit 1. When the detection pattern 5a to be detected by the TAB tape 5 is transported to a specific position of the detecting unit 1 by the above-described tape transport mechanism 10, the TAB tape 5 is stopped at this position. # By the illumination means 1a, the illumination illumination light is irradiated to the downstream side of the tape conveyance direction in the substrate area in the field of view of the lens 6 from below the TAB tape 5 (the side on which the detection pattern 5a is not provided). The scanning means 2 scans the detecting portion 1 in the direction in which the reflective illumination region X and the transmitted illumination region γ are arranged, that is, the detection pattern 5 a as a whole passes through the longitudinal direction of the TAB tape 5 (through the illumination means 1) a. Reflective illumination means 1 b, imaging means 1 c, 1 d, lens 6). Thereby, the illumination light emitted from the transmission illumination means 1a is transmitted through the TAB β tape 5, and the imaging means (CCD line sensor) 1c receives light, and the transmitted illumination image of the detection pattern 5a is taken into the control unit 4 memory. Further, the illumination light emitted from the reflective illumination means 1 b is reflected by the TAB tape 5 and received by the imaging means (c CD line sensor) 1 d, and the reflected illumination image of the detection pattern 5 a is taken into the control unit 4 memory. Fig. 6 is a view showing an example of a transmission illumination image and a reflection illumination image in the case of a detail, a thick portion, a foreign object, and the like. The control unit 4 compares the stored transmitted illumination image and the reference pattern for transmission illumination, and detects whether or not the wiring pattern of the transmission illumination image is in a specific size range, that is, the wiring pattern, in the reference figure-13-200806978 (11). Is there a "thickness" or "detail"? Then, when the wiring pattern is not detected to be defective, the detected wiring pattern is judged to be good. On the other hand, as shown in Fig. 6(a), when the illumination pattern and the wiring pattern for the transmission illumination are thin with respect to the reference pattern, the detected wiring pattern is determined to be a defect of the wiring defect. When the wiring pattern for illumination is as thick as the reference pattern, for example, as shown in Fig. 6(b), the detected wiring pattern is judged to be a defective candidate. The position of the area A having the thick portion of the wiring pattern of the defective candidate is memorized. Next, an image corresponding to the position of the reflected illumination image in a specific range around the position of the region A and the reference pattern for the reflection illumination are compared, and the thin portion and the thick portion are detected. As shown in Fig. 6(b), the result of this detection is the same as the detection result by the transmission image, and when the reflected illumination image is detected to have a thick portion, the wiring pattern is judged to be defective. On the other hand, although the illuminating image is detected, although the thick portion is detected, as shown in the sixth (c), in the reflected illumination image, the detail is detected contrary to the detection result of the transmitted illuminating image. In the case of the case, the "foreign matter" on the pattern is determined by the reason for transmitting the thick portion of the illumination image, and the wiring pattern is judged to be a good product. In addition, when the illuminating image is detected, although the thick portion is detected, as shown in Fig. 6 (d), when the reflected illumination image is not detected, the case of the thick or thin part is not detected -14-200806978 (12) Then, the wiring pattern is judged to be defective by causing the thick portion (the root portion) on the lower side of the pattern to pass through the thick portion of the illumination image. If the detected pattern is determined as a defective product, the position of the pattern is stored in the control unit. When the pattern is transported to the 'marking unit 3 by the tape transport mechanism 1 ,, the pattern is punched or painted. mark. When the detection of the detection pattern 5a is completed, the TAB tape 5 is transported by the roll ® tape transport mechanism 1 ,, and the detection pattern to be the next detection target is transported to a specific position of the detecting unit 1. Fig. 7 is a block diagram showing a wiring pattern detecting device of a second embodiment of the present invention. In the present embodiment, the detecting unit 1 is not provided with a scanning means and is fixed. Therefore, the relative movement of the detecting unit 1 for capturing the image of the detection pattern 5a by the detecting unit 1 and the TAB tape 5 is performed by the tape transport mechanism 1A. The configuration of the detecting unit 1 is basically the same as that of the first embodiment, and includes: a lens 6 for transmitting a portion of the region of the substrate in the field of view of the lens 6 from the back side of the TAB tape 5 a light-illuminating illumination illumination means 1a, and a region of the other portion of the substrate positioned in the field of view of the lens 6, from the surface side of the TAB tape 5 by means of reflected illumination illumination lb, And an imaging means 1c for capturing an image of the detection pattern 5a through the illumination light, and an imaging means d for capturing an image of the detection pattern 5a for reflecting the illumination light. Next, the operation of the ingestion detection pattern 5a will be described using Fig. 8 . Similarly to the first embodiment, the reflective illumination area X and the transmission illumination area -15-200806978 (13) are formed by arranging the longitudinal direction of the TAB tape 5, and the lens 6 is provided with an absorption illumination area γ. The first imaging means 1c and the second imaging means 1d for capturing the reflected illumination area X. When the detection pattern 5a of the TAB tape '5 is taken by the first and second imaging means 1c, Id, the TAB tape 5 is in the direction indicated by the arrow of the figure by the tape conveying mechanism 10' ( The long side direction of T, that is, the direction in which the reflected illumination area X is aligned with the illumination area γ is scanned. Φ By detecting that the entire pattern 5a passes through the lower portion of the detecting portion 1, the transmitted illumination image and the reflected illumination image of the entire detection pattern 5a can be obtained. The operation of the apparatus of the present embodiment is basically the same as that of the first embodiment, and the description will be centered on different parts. The TAB tape 5 is transported to the detection unit 1 by the tape transport mechanism 10, and the detection pattern 5a to be detected is the specific position of the detection unit 5 to be conveyed to the detection unit 1 (the conveyance of the detection unit 1) When the upstream side of the direction is), the conveyance of the TAB tape 5 is temporarily stopped at this position. By the illumination means 1a and the reflected illumination means 1b, the field of view of the lens 6 is separately illuminated, and the illumination area Y and the reflection illumination area X are arranged in the direction in which the TAB tape 5 is conveyed. The TAB tape 5 is conveyed by the tape transport mechanism 10, and the pattern 5a is detected as a whole in the reflected illumination region X and the transmitted illumination region Y. The alignment direction is scanned. Thereby, the illuminating illumination image of the detection pattern 5 a is taken in by the CCD line sensor 1 c and stored in the control unit 4, by -16-200806978 (14) by the CCD line sensor 1 d, detecting the pattern The reflection illumination image of 5 a is taken in and memorized in the control unit 4. The control unit 4 compares the stored transmitted illumination image with the reference pattern for transmission illumination, and determines the goodness of the detection/pattern 5a by the procedure shown in the first embodiment, and in the case of a defect, The marking portion 3 is given a mark. When the detection of the detection pattern 5a is completed, the TAB tape 5 is transported by the tape transport mechanism 1 ,, and the detection pattern to be the next detection target is transported to a specific position of the detecting unit 1. Figure 9 is a block diagram of a wiring pattern detecting device according to a third embodiment of the present invention. In the present embodiment, as in the first embodiment, the scanning unit 2' is provided in the detecting unit 1, but the scanning unit 2' is such that the detecting unit 1 is oriented orthogonal to the conveying direction of the TAB tape 5. The direction (the width direction of the TAB tape 5) is moved. Therefore, in the first and second embodiments, the arrangement of the transmission means 1a, 1 and the corresponding imaging means lc, Id of the detecting unit 1 is arranged such that the optical axis of the lens 6 is centered. 90° rotation state. In addition, in the ninth figure, in order to avoid the complication of the figure, only the first imaging means 1c that transmits the illumination image and the illumination means 1a are shown, but in fact, a reflection illumination means is provided in the depth 1 b and a second imaging means 1 d that receives a reflected illumination image. The operation of the ingestion detection pattern 5a will be described using FIG. Unlike the first and second embodiments, the reflective illumination area X and the transmitted illumination area are arranged in the direction orthogonal to the long side of the TAB tape 5 (TAB tape). 5 width direction). On the lens 6, a first imaging means 1c that picks up the illumination area Y and a second imaging means 1d that picks up the reflection illumination area X are provided. By means of the scanning means 2', the illumination means 1a, the reflection illumination hand* section 1b, the imaging means (CCD line sensor); ^, 1 (! in the reflection illumination area 'field X and the transmission illumination area Y The direction of the alignment, that is, the direction orthogonal to the longitudinal direction of the TAB tape 5 (the width direction of the TAB tape 5) is scanned. • By detecting the entirety of the detection pattern 5a through the lower portion of the detecting portion 1. The illumination illumination image and the reflection illumination image of the entire pattern 5 a. The operation of the apparatus of the present embodiment is basically the same as that of the first embodiment, and the description will be centered on the different parts. The TAB tape 5 is driven by the tape transport mechanism. The detection unit 1 is transported to the detection unit 1. The detection pattern 5 a to be detected by the TAB tape 5 is transported to a specific position of the detection unit 1 (upstream side of the conveyance direction of the detection unit 1) ® Temporarily stopped at this position. By the illumination means 1a and the reflected illumination means 1b, the field of view of the lens 6 is separately illuminated, and the illumination illumination area Y and the reflection illumination area X are arranged in the width direction of the TAB tape 5 to form. By scanning means 2 ', detection department 1 is performed in a direction in which the reflective illumination region X and the transmission illumination region are transmitted through the illumination region Y, that is, in the width direction of the TAB tape 5, and the TAB tape 5 as a whole passes through the lower portion of the detection portion 1. Imaging means (CCD line sensor) 1 c, detection pattern -18- 200806978 (16) The transmitted illumination image of 5a is taken in and stored in the control unit 4, and is detected by an imaging means (CCD line sensor) Id. The reflected illumination image of the pattern 5a is taken in and stored in the control unit 4. The control unit 4 compares the stored transmitted illumination image with the reference pattern for transmission illumination, and determines the detection pattern by the procedure shown in the first embodiment. In the case of the case 5 a, the mark is applied by the mark portion 3. When the detection of the φ detection pattern 5 a is completed, the TAB tape 5 is carried by the tape transport mechanism 1 . The detection pattern to be the next detection target is transported to a specific position of the detecting unit 1. Further, as described in the first embodiment, the reflected illumination area X and the transmitted illumination area Y, and the first imaging means 1 C and the second imaging are used. Means 1 d, which is orthogonal to the scanning direction The length of the direction needs to be set to cover the length of the area detected by the scan of one time. As shown in the above fifth figure, when the plurality of CCD line sensors are arranged and arranged, the detection unit is once used. The scanning area of the image taken in #1 is widened, and the detection time of the entire TAB tape can be shortened. [Simplified description of the drawings] Fig. 1 is a wiring pattern detecting device according to the first embodiment of the present invention. Fig. 2 is a diagram showing an enlarged view of the vicinity of the detecting unit. Fig. 3 is a view showing a situation in which two lenses are provided corresponding to two illumination areas and an imaging element. -19- 200806978 (17) Fig. 4 is a view showing the operation of the ingest detection pattern in the first embodiment. Fig. 5 is a view showing a state in which a plurality of CCD line sensors are arranged in order to take a detection pattern having a wide width. 'Figure 6 shows an example of a light-emitting area and a reflected illumination image. Fig. 7 is a Φ block diagram of the wiring pattern detecting device of the second embodiment of the present invention. Fig. 8 is a view showing the operation of the ingest detection pattern in the second embodiment. Figure 9 is a block diagram of a wiring pattern detecting device according to a third embodiment of the present invention. Fig. 1 is a view showing an operation diagram of an ingest detection pattern in the third embodiment. [Main component comparison table] 1 : Detection unit 1 a : Transmission illumination means 1 b : Reflection illumination means 1 c, 1 d : Imaging means (c CD line sensor) 1 e : Cylindrical lens 2, 2': Scan Sighting means 3: Marking section 4: Control section -20- 200806978 (18) 5: TAB tape 5a: Detection pattern 6: Lens 1 1 : Feeding reel 1 2 : Winding reel 1 〇: Tape handling mechanism

-21 --twenty one -

Claims (1)

200806978 (1) 十、申請專利範圍 1 · 一種圖案檢測裝置’係藉由對形成有圖案之基板照 射:透過該基板之透過照明光、及在該基板所反射之之反 射照明光,來獲得前述基板之透過照明畫像與反射照明畫 • 像,依據兩畫像來判定前述圖案之良窳的圖案檢測裝置, • 其特徵爲具備有: 將進行檢測之基板的區域予以放大而投影之1個透 ⑩ 鏡、及 對位於前述透鏡的視野內之基板區域的一部份之第1 區域,照射反射照明光之反射照明手段、及 對位於前述透鏡的視野內之基板區域的另外一部份之 區域的第2區域,照射透過照明光的透過照明手段、及 攝取藉由前述反射照明手段而被照明,且藉由前述透 鏡而被放大之第1區域的第1攝像手段、及 攝取藉由前述透過照明手段而被照明,且藉由前述透 • 鏡而被放大之第2區域的第2攝像手段、及 與前述第1區域與前述第2區域所排列方向平行,使 前述基板與前述2個攝像手段及前述透鏡相對地移動之移 動手段。 2 .如申請專利範圍第1項所記載之圖案檢測裝置,其 中,前述基板係於樹脂薄膜上形成有藉由金屬之配線圖案 的長帶狀TAB(捲帶自動接合)捲帶; 前述移動手段,係使前述TAB捲帶朝捲帶長邊方向 搬運之搬運機構。 -22- 200806978 (2) 3 ·如申請專利範圍第1項所記載之圖案檢測裝置,其 中,前述基板係於樹脂薄膜上形成有藉由金屬之配線圖案 的長帶狀TAB(捲帶自動接合)捲帶; 前述移動手段,係使前述2個攝像手段及前述透鏡成 ' 一套而朝前述TAB捲帶的長邊方向移動之攝像及透鏡單 " 元移動機構。 4 .如申請專利範圍第1項所記載之圖案檢測裝置, # 其中,前述基板係於樹脂薄膜上形成有藉由金屬之配線圖 案的長帶狀TAB (捲帶自動接合)捲帶; 前述移動手段,係使前述2個攝像手段及前述透鏡成 一套而朝前述TAB捲帶的寬度方向移動之攝像及透鏡單 元移動機構。 5.如申請專利範圍第1、2、3或4項所記載之圖案檢 測裝置,其中,由前述反射照明手段所照射之反射照明光 的波長與由前述透過照明手段所照射之透過照明光的波 • 胃,係相同波長。 -23-200806978 (1) X. Patent Application No. 1 · A pattern detecting device ′ is obtained by irradiating a substrate on which a pattern is formed: transmitted illumination light transmitted through the substrate, and reflected illumination light reflected on the substrate The image-detecting device that determines the pattern of the pattern based on the two images, and the image detecting device that magnifies and projects the region of the substrate to be detected. a mirror, and a first region of a portion of the substrate region located within the field of view of the lens, the reflective illumination means for reflecting the illumination light, and the region of the other portion of the substrate region located within the field of view of the lens The second region is configured to transmit a illuminating means for transmitting the illuminating light, and to receive the first imaging means of the first region that is illuminated by the reflective illuminating means and that is amplified by the lens, and to receive the illuminating illumination a second imaging device that is illuminated by means and that is enlarged by the transmissive mirror, and the first region And the second region are arranged parallel to the direction of movement of the substrate so that the moving means relatively with the two imaging means and the lens. The pattern detecting device according to the first aspect of the invention, wherein the substrate is formed of a long strip-shaped TAB (tape automatic bonding) tape wound by a metal wiring pattern on the resin film; A transport mechanism that transports the TAB tape to the longitudinal direction of the tape. The pattern detecting device according to the first aspect of the invention, wherein the substrate is formed of a long strip-shaped TAB (wire-wrap automatic bonding) formed of a metal wiring pattern on a resin film. The moving means is an imaging and lens unit moving mechanism that moves the two imaging means and the lens into a set in the longitudinal direction of the TAB tape. 4. The pattern detecting device according to claim 1, wherein the substrate is formed with a long strip-shaped TAB (tape automatic bonding) tape wound by a metal wiring pattern on the resin film; In the meantime, the imaging means and the lens unit moving mechanism that move the two imaging means and the lens in the width direction of the TAB tape are formed. 5. The pattern detecting device according to claim 1, 2, 3 or 4, wherein the wavelength of the reflected illumination light irradiated by the reflective illumination means and the transmitted illumination light irradiated by the transparent illumination means Wave • Stomach, the same wavelength. -twenty three-
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010032562A1 (en) 2008-09-18 2010-03-25 インターナショナル・ビジネス・マシーンズ・コーポレーション System and method for supporting finding of defect in object to be inspected
US8144973B2 (en) * 2009-03-24 2012-03-27 Orbotech Ltd. Multi-modal imaging
KR101198406B1 (en) 2010-04-21 2012-11-07 (주)에이앤아이 Pattern inspection device
KR101115010B1 (en) * 2010-07-13 2012-03-06 한미반도체 주식회사 Apparatus for Wafer Inspection
JP5559644B2 (en) * 2010-09-03 2014-07-23 株式会社トプコン Inspection device
JP5885477B2 (en) * 2011-11-30 2016-03-15 日立造船株式会社 Multilayer substrate inspection apparatus and inspection method
CN103364412A (en) * 2012-04-10 2013-10-23 北京兆维电子(集团)有限责任公司 Online offset plate testing and stacking system
KR102023581B1 (en) * 2012-11-23 2019-09-24 해성디에스 주식회사 Reel-to-Reel inspection apparatus and inspection method using the same
JP6085188B2 (en) * 2013-02-15 2017-02-22 株式会社Screenホールディングス Pattern inspection device
KR101464251B1 (en) * 2014-05-20 2014-11-25 테크밸리 주식회사 Registration method for tape reel of semiconductor and display system thereof
CN104330419A (en) * 2014-11-20 2015-02-04 北京凌云光技术有限责任公司 Method and device for detecting film
JP2018009800A (en) * 2016-07-11 2018-01-18 住友化学株式会社 Defect inspection imaging device, defect inspection system, film manufacturing apparatus, defect inspection imaging method, defect inspection method, and film manufacturing method
CN106249517B (en) * 2016-09-29 2019-04-19 长春理工大学 Single-camera full-view line number recognition device
KR102611983B1 (en) * 2018-10-29 2023-12-08 삼성전자주식회사 Apparatus and method for testing interconnect circuit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057192A (en) * 2001-08-10 2003-02-26 Dainippon Screen Mfg Co Ltd Image acquiring apparatus
JP2005024386A (en) * 2003-07-02 2005-01-27 Ushio Inc Wiring pattern inspection equipment
JP4025859B2 (en) * 2004-09-03 2007-12-26 レーザーテック株式会社 Inspection apparatus, inspection method, and pattern substrate manufacturing method
US7528943B2 (en) * 2005-12-27 2009-05-05 Kla-Tencor Technologies Corporation Method and apparatus for simultaneous high-speed acquisition of multiple images

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