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TW200803054A - Micro USB flash drive with card reading capability - Google Patents

Micro USB flash drive with card reading capability Download PDF

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Publication number
TW200803054A
TW200803054A TW095122769A TW95122769A TW200803054A TW 200803054 A TW200803054 A TW 200803054A TW 095122769 A TW095122769 A TW 095122769A TW 95122769 A TW95122769 A TW 95122769A TW 200803054 A TW200803054 A TW 200803054A
Authority
TW
Taiwan
Prior art keywords
usb
memory
card
circuit board
brick
Prior art date
Application number
TW095122769A
Other languages
Chinese (zh)
Other versions
TWI289371B (en
Inventor
Hong-Chi Yu
Original Assignee
Walton Advanced Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walton Advanced Eng Inc filed Critical Walton Advanced Eng Inc
Priority to TW095122769A priority Critical patent/TWI289371B/en
Application granted granted Critical
Publication of TWI289371B publication Critical patent/TWI289371B/en
Publication of TW200803054A publication Critical patent/TW200803054A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

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  • Credit Cards Or The Like (AREA)

Abstract

A micro USB flash drive with card reading capability, mainly includes a front USB joint, a memory encapsulated brick, and a rear plug. The brick is disposed inside the joint and includes an encapsulant, a wiring substrate on the encapsulant, and at least a flash memory chip encapsulated in the encapsulant. The substrate has an outside surface with a plurality of USB contact fingers and a plurality of card-reading contact fingers exposed. The plug is fixed to the rear opening of the joint. The plug has a memory card socket and a tail fastener, wherein the fastener wedges a side of the brick to prevent the brick escaped from the joint. Accordingly, the flash drive is configured for insertion of a memory card.

Description

200803054 九、發明說明： 【發明所屬之技術領域】 本發明係有關於可攜式儲存裝置，特別係有關於—200803054 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a portable storage device, and in particular to

種可讀卡之微i USB隨身碟，其整體尺寸接近傳 USB隨身碟之前置uSB接頭。 H 【先前技術】 按，USB隨身碟（USB £1心，其中曰 —Serial Bus的簡寫，其中文為通用串列匯： 排）已是相當普遍的可攜式儲存裝置，卿隨身碟又; 稱為小型行動碟（mini walking dHve)、大拇哥、快閃 碟等等。一般而言，USB隨身碟係具有一 usb接頭， 可插接至一如電腦主機、筆記型電腦等電子產品之 USB插槽或疋轉接器之USB插槽，以儲存或讀取數位 資料。目前USB隨身碟的USB接頭主要是由一方形金 屬殼與-塑膠絕緣子所構成，且該塑膠絕緣子内設有 複數们USB鳊子。在USB接頭之後端焊接有一印刷電 路板’板上表面結合有記憶體封裝件與各式電子元 件，並以一塑膠外殼包覆該印刷電路板。整個USB隨 身碟的尺寸約在USB接頭之尺寸三倍以上。 如同Lee等人在美國專利第6,854,984號所揭示的 USB隨身碟，USB接頭可焊接在一印刷電路板，或者， USB接頭之塑膠絕緣子與USB端子可由印刷電路板之 一延伸側所構成。快閃記憶體封裝件是表面接合在該 印刷電路板上且位在USB接頭之外，故USB隨身碟的 200803054 尺寸是遠大於USB接頭，且不呈右$ 卜，、有Z k體擴充之功能。 【發明内容】 為了解決上述之問題，本發明夕士 φ 个货咧之主要目的係在於提 供一種可讀卡之微型USB隨身磾，鈐收战ώ 思牙’，犯將隨身碟包含記 憶體之主要元件整合並縮小尺寸如η你^ 人了如同傳統之USB接 頭’更兼具有讀卡以擴充記憶體容量的功能。、A micro-i USB flash drive with a readable card, the overall size of which is close to the USB connector before the USB flash drive. H [Prior Art] Press, USB flash drive (USB £1 heart, which is the abbreviation of Serial Bus, its Chinese is a universal serial: row) is a fairly common portable storage device, and the Qing floppy disk; It is called mini walking dHve, big thumb, flash disc and so on. In general, the USB flash drive has a usb connector that can be plugged into a USB slot of an electronic product such as a computer mainframe or a notebook computer or a USB slot of the 疋 Adapter to store or read digital data. At present, the USB connector of the USB flash drive is mainly composed of a square metal shell and a plastic insulator, and the plastic insulator has a plurality of USB dice. A printed circuit board is soldered to the rear end of the USB connector. The upper surface of the board is bonded with a memory package and various electronic components, and the printed circuit board is covered with a plastic outer casing. The size of the entire USB flash drive is about three times larger than the size of the USB connector. The USB connector can be soldered to a printed circuit board, or the plastic insulator and USB terminal of the USB connector can be formed by an extended side of the printed circuit board, as in the USB flash drive disclosed in U.S. Patent No. 6,854,984. The flash memory package is surface bonded to the printed circuit board and is located outside the USB connector, so the 200803054 size of the USB flash drive is much larger than the USB connector, and is not right, and has Z k expansion. Features. SUMMARY OF THE INVENTION In order to solve the above problems, the main purpose of the present invention is to provide a micro-USB portable readable card, which is a slap in the face, and contains a memory. The main components are integrated and reduced in size, such as η you ^ people like the traditional USB connector 'more with a card to expand the memory capacity. ,

本發明之次一目的係在於提供—種可讀卡之微型 USB隨身碟，能限制一記憶體封襞磚塊在一前置υ§Β接 口不可脫出，並能重複插拔一如微型保全數位+ (Μία〇 sd card)之記憶卡至該前置USB接口内。 本發明的目的及解決其技術問題是採用以下技術 方案來實現的。本發明揭示一種可讀卡之微型usb隨 身碟，主要包含一前置USB接口、一記憶體封裝碑塊以 及一尾塞封蓋。該記憶體封裝磚塊係容置於該前置USB 接口内，該記憶體封裝磚塊係包含一封膠體與一在該封膠體 表面之電路板，該封膠體内封設有至少一快閃記憶體晶片， 該電路板之外表面形成有複數個USB接觸指與複數個讀卡 接指。該尾塞封蓋係結合於該前置USB接口之後端，該尾 塞封蓋係具有一記憶卡插接槽與一扣接尾，該扣接尾係卡扣 該記憶體封裝磚塊之一側緣，以防止該記憶體封裝磚塊由該 前置USB接口脫出。另揭示該微型USB隨身碟之記憶體 封裝砵塊之具體結構。 本發明的目的及解決其技術問題還可採用以下技 術措施進一步實現。 6 200803054 前述的可讀卡之微型USB隨身碟，其中該些讀卡接 指係顯露且位於由該記憶體封裝磚塊與該尾塞封蓋之該記 憶卡插接槽所構成的空間内。 前述的可讀卡之微型USB隨身碟，其中由該記憶體 封裝磚塊與該尾塞封蓋之該記憶卡插接槽所構成的空間大 小係可容許一微型保全數位卡（Micro SD card)之插置。 前述的可讀卡之微型USB隨身碟，其中該前置USB 接口係具有一前插置端，其係形成有一播唇。The second object of the present invention is to provide a micro USB flash drive with a readable card, which can limit a memory sealed brick from being unplugged in a front-end interface, and can be repeatedly inserted and removed as a micro-preservation. The memory card of the digit + (Μία〇sd card) is connected to the front USB interface. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a miniature USB flash drive for a readable card, which mainly comprises a front USB interface, a memory package block and a tail plug cover. The memory package brick is disposed in the front USB interface, and the memory package brick comprises a glue body and a circuit board on the surface of the seal body, and the seal body is sealed with at least one flash The memory chip has a plurality of USB contact fingers and a plurality of card reader fingers formed on the outer surface of the circuit board. The tail plug cover is coupled to the rear end of the front USB interface, the tail plug cover has a memory card insertion slot and a buckle tail, and the buckle tail buckles a side edge of the memory package brick To prevent the memory package brick from coming off the front USB interface. The specific structure of the memory package of the micro USB flash drive is also disclosed. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. 6 200803054 The aforementioned micro-USB flash drive of a readable card, wherein the read card fingers are exposed and located in a space formed by the memory package brick and the memory card insertion slot of the tail plug cover. The micro USB flash drive of the aforementioned readable card, wherein a space formed by the memory package brick and the memory card insertion slot of the tail plug cover allows a micro SD card to be used. Interposed. The aforementioned micro-USB flash drive of the readable card, wherein the front USB interface has a front insertion end, which is formed with a sowing lip.

前述的可讀卡之微型USB隨身碟，其中該前置USB 接口係為防靜電金屬方殼。 前述的可讀卡之微型USB隨身碟，其中該尾塞封蓋 於該兄憶卡插接槽之一侧係裝設有一扣接彈片。 W述的可讀卡之微型USB隨身碟，其中該封膠體係 為方塊狀，其周邊尺寸係平齊於該電路板之側邊。 ’其中該封膠體係 ’其中該記憶體封 前述的可讀卡之微型USB隨身碟 以轉移模製（transfer molding)方式形成。 前述的可讀卡之微型USB隨身碟 裝磚塊之該電路板係為c〇B封裝基板。 【實施方式】 鉍爹閱第1及2圖，在本發明之 , _ 开Μ頁呃例 可項卡之微型USB隨身碟1〇〇主要包含一前 置USB接口 11〇、一 士户辨 13〇。 4體封裝碑塊120以及_尾塞封蓋 該前置USB接 110係為導電金屬材質 如不銹鋼，可 7 200803054 由一金屬板經裁切後一體彎折成形，可成為一防靜電金屬方 殼。該刖置USB接口 1 1 〇係具有一前插置端與一後開口端， 其中該前插置端110係形成有一擋唇丨i i，以防止該記憶體 封裝磚塊120由該前插置端脫出。 該§己憶體封裝磚塊120係容置於該前置1^8；8接 内。如第3圖所示，該記憶體封裝磚塊12〇係包含一封膠體 121與一在該封膠體121表面之電路板122。該封膠體i2i 内封設有至少一快閃記憶體晶片123,其係設置於該電路板 122之内表面122B。另該電路板122之外表面122八形成有 複數個USB接觸指124與複數個讀卡接指125。在本實施例 中，該記憶體封裝磚土鬼120之該電路122係為 COB(Chip-〇n-Board)封裝基板，該封膠體ΐ2ι内可另封設有 所需要的被動元件126與控制器晶片m，亦可設置於該電 路板122之内表面122B。此外，可制目前已知的轉接卡 讀卡機制，將其内建於該記憶體封袭磚塊m内，便可經由 該些讀卡接指丨25達到讀卡電性傳遞功能，在此*予贊述。 ^本實施例中，該封膠體121係為方塊狀，其周邊尺寸係平 背於該電路板122之側邊’其尺寸可等同傳統刪接頭之 絕緣子。通常該封_121係以轉移模製方式形成，以符合 更為準確的尺寸要求。此外，該㈣卡接指125上係可 ㈣㈣化8’譬㈣⑽焊方式㈣在該些讀卡接指125 中’接觸—記憶卡之接觸指（圖未纷出）。在本實施例 接觸:⑽插:觸複數㈣ 8 200803054 該尾塞封蓋130係結合於該前置USB接口 110之後端， a玄尾塞封蓋130係具有一記憶卡插接槽丨3丨與一扣接尾 132 ’該扣接尾132係卡扣該記憶體封裝磚塊丨2()之一側緣， 以防止該記憶體封裝碑塊120由該前置USB接口 11〇脫出。 在本實施例中，該尾塞封蓋130於該纪憶卡插接槽131之一 側係裝設有一扣接彈片133。在結合之後，該些讀卡接指125 係顯露且位於由該記憶體封裝碑塊12〇與該尾塞封蓋13〇之The aforementioned micro-USB flash drive of the readable card, wherein the front USB interface is an anti-static metal square shell. The micro-USB flash drive of the aforementioned readable card, wherein the tail plug cover is provided with a fastening elastic piece on one side of the brother memory card insertion slot. The micro USB flash drive of the readable card described in the figure, wherein the encapsulation system is in the shape of a square, and its peripheral dimension is flush with the side of the circuit board. The micro-USB flash drive in which the memory seals the aforementioned readable card is formed by transfer molding. The aforementioned micro-USB flash drive of the readable card is a c〇B package substrate. [Embodiment] Referring to Figures 1 and 2, in the present invention, the _ Μ Μ 呃 可 可 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型Hey. 4 body package block 120 and _ tail plug cover The front USB connection 110 is made of conductive metal material such as stainless steel, can be 7 200803054 by a metal plate after cutting and integrally bent to form an anti-static metal square shell . The USB interface 1 1 has a front insertion end and a rear open end, wherein the front insertion end 110 is formed with a lip 丨 ii to prevent the memory package brick 120 from being inserted by the front The end is out. The § hex fabric package block 120 is housed in the front portion 1 8 8; As shown in FIG. 3, the memory package block 12 includes a glue body 121 and a circuit board 122 on the surface of the sealant body 121. The encapsulant i2i is internally provided with at least one flash memory chip 123 disposed on the inner surface 122B of the circuit board 122. In addition, the outer surface 122 of the circuit board 122 is formed with a plurality of USB contact fingers 124 and a plurality of card reader fingers 125. In this embodiment, the circuit 122 of the memory package brick-and-mortar 120 is a COB (Chip-〇n-Board) package substrate, and the required passive component 126 and control can be additionally sealed in the sealant ΐ2ι. The wafer m may also be disposed on the inner surface 122B of the circuit board 122. In addition, the currently known adapter card reading mechanism can be built into the memory-encapsulated brick m, and the card-reading power transmission function can be achieved via the card-reading fingers 25, This * is a comment. In this embodiment, the encapsulant 121 is in the shape of a square, and its peripheral dimension is flat on the side of the circuit board 122. The size of the encapsulant 121 is equivalent to that of a conventional connector. Typically, the seal _121 is formed by transfer molding to meet more accurate dimensional requirements. In addition, the (four) card fingers can be attached to the (four) (four) 8' (four) (10) welding mode (4) in the card reader fingers 125 contact-memory card contact fingers (not shown). In this embodiment, the contact is: (10) plug: the haptic number (four) 8 200803054 The tail plug cover 130 is coupled to the rear end of the front USB interface 110, and the aft plug cover 130 has a memory card insertion slot 丨3丨. And a buckle tail 132' buckles one side edge of the memory package brick 丨 2 () to prevent the memory package block 120 from being detached from the front USB interface 11 . In the embodiment, the tail plug cover 130 is attached with a fastening elastic piece 133 on one side of the memory card insertion slot 131. After the bonding, the card reader fingers 125 are exposed and located in the memory package block 12 and the tail plug cover 13

該記憶卡插接槽ni所構成的空間内。如第4圖所示，該記 憶體封裝磚塊120與該尾塞封蓋13〇之該記憶卡插接槽i3i 所構成的空間大小係可容許一微型保全數位卡2〇〇(·α〇 SD card)之插置。 因此，該耵置USB接口 110、該記憶體封裝碑塊12〇該 尾塞封蓋130前述三者可一體結合而不可脫出，且整體尺寸 如同傳統之励接頭，達到微匕，更兼具有讀卡以 擴充記憶體容量的功能。 在本實施例中，如第2圖所示，該前置USB接口 11〇係 具有複數個倒勾扣片112，且該扣接尾132係H㈣Μ 置對應之扣孔134。當該扣接尾132插置定位時，該些倒勾 扣片112係滑入該些扣孔134且不可脫出。 以上所述，僅是本發明的較佳實施例而已，並非對 本發明作任何形式上的限制，雖然本發明已以較佳實 施例揭露如上，然而並非用以限定本發明，任何孰来 本項技街者，在不脫離本發明之技術範圍 任何簡單修改、等效性變化與修錦，均仍屬於本發： 9 200803054 的技術範圍内。 【圖式簡單說明】 第1圖：依據本發明之第一具體實施例，一種可讀卡 之微型USB隨身碟之立體圖。 第2圖：依據本發明之第一具體實施例，該微型usb 隨身碟之元件分解圖。 第3圖：依據本發明之第一具體實施例，該微型usb 隨身碟之記憶體封裝碑塊之截面示意圖。The memory card is inserted into the space formed by the slot ni. As shown in FIG. 4, the size of the space formed by the memory package brick 120 and the memory card insertion slot i3i of the tail plug cover 13 can allow a miniature security digital card 2〇〇 (·α〇 Insertion of SD card). Therefore, the USB interface 110, the memory package block 12, and the tail plug cover 130 can be integrally combined without being detached, and the overall size is the same as that of the conventional splicing joint. There is a function of reading the card to expand the memory capacity. In this embodiment, as shown in FIG. 2, the front USB port 11 has a plurality of undercut pieces 112, and the buckle tail 132 is a button hole 134 corresponding to the H (four). When the buckle tails 132 are inserted and positioned, the barb fasteners 112 are slid into the buttonholes 134 and are not detachable. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modification, equivalence change and repair of the technical scope of the present invention are still within the scope of the present invention: 9 200803054. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a micro USB flash drive of a readable card in accordance with a first embodiment of the present invention. Figure 2: An exploded view of the components of the micro usb flash drive in accordance with a first embodiment of the present invention. Figure 3 is a cross-sectional view showing the memory package of the mini usb flash drive according to the first embodiment of the present invention.

春 第4圖：依據本發明之第一具體實施例，該微型U S B 隨身碟在可擴充狀態之示意圖。 【主要元件符號說明】 100 微型USB隨身碟 110 前置USB接 π 111 擋唇 112 倒勾扣片 120 記憶體封裝磚塊 121 封膠體 122 電路板 122A外表面 122E •内表面 123 快閃記憶體 晶片 124 USB接觸指 125 讀卡接指 126 被動元件 127 控制器晶片 128 彈片 130 尾塞封蓋 131 記憶卡插接槽 132 扣接尾 133 扣接彈片 134 扣孔 200 微型保全數位卡 10Spring Figure 4: Schematic diagram of the micro-U S B flash drive in an expandable state in accordance with a first embodiment of the present invention. [Main component symbol description] 100 Micro USB flash drive 110 Front USB connection π 111 Lip lip 112 Barbed buckle 120 Memory package brick 121 Sealant 122 Circuit board 122A outer surface 122E • Inner surface 123 Flash memory chip 124 USB contact finger 125 Card reader finger 126 Passive component 127 Controller chip 128 Shrapnel 130 Tail plug cover 131 Memory card insertion slot 132 Fastener tail 133 Fastener shrapnel 134 Buttonhole 200 Miniature security digital card 10

Claims (1)

200803054 十、申請專利範圍： 1、一種可讀卡之微型USB隨身碟，包含： 一前置USB接口； 一記憶體封裝磚塊，其係容置於該前置USB接口内，該 記憶體封裝碑塊係包含一封膝體與一在該封膠體表面之 電路板，該封膠體内封設有至少一快閃記憶體晶片，該 電路板之外表面形成有複數個USB接觸指與複數個讀卡 接指；以及 鲁 尾塞封蓋’其係結合於該前置U S B接口之後端，該尾 塞封蓋係具有一記憶卡插接槽與一扣接尾，該扣接尾係 卡扣該圮憶體封裝磚塊之一側緣，以防止該記憶體封裝 碑塊由該前置USB接口脫出。 2、如申凊專利範圍第1項所述之可讀卡之微型usb隨身 碟，其中該些讀卡接指係顯露且位於由該記憶體封裝磚 塊與該尾基封蓋之該圯憶卡插接槽所構成的空間内。200803054 X. Patent application scope: 1. A micro USB flash drive with a readable card, comprising: a front USB interface; a memory package brick, the system is placed in the front USB interface, the memory package The tablet comprises a knee body and a circuit board on the surface of the sealant. The seal body is sealed with at least one flash memory chip, and the outer surface of the circuit board is formed with a plurality of USB contact fingers and a plurality of a card reader connector; and a tail plug cover is coupled to the rear end of the front USB port, the tail plug cover has a memory card insertion slot and a buckle tail, and the buckle tail buckles the buckle The side of one of the bricks is encapsulated to prevent the memory package from being detached from the front USB interface. 2. The micro USB usb drive of the readable card of claim 1, wherein the read card contacts are exposed and located in the memory packaged by the memory package and the tail cover The space formed by the card insertion slot. 碟，其中該前置USB接口係具有 有一播唇。 5、如申請專利範園第4項所述之 碟，其中該前置USB接口 4項所述之可讀卡之微型USB隨身 多接口係為防靜電金屬方殼。 200803054 ό、如申請專利範圍第i項所述之可讀卡之微型USB隨身 碟’其中該尾塞封蓋於該記憶卡插接槽之一侧係裝設有 一扣接彈片。 7、 如申請專利範圍第1項所述之可讀卡之微型USB隨身 碟，其中該封膠體係為方塊狀，其周邊尺寸係平齊於該 電路板之側邊。 8、 如申请專利範圍第7項所述之可讀卡之微型USB隨身 碟’其中該封膠體係以轉移模製方式形成。 9、 如申凊專利範圍第1項所述之可讀卡之微型usb隨身 碟’其中該記憶體封裝磚塊之該電路板係為C〇B封裝基 板。 10、 一種§己憶體封農磚塊，用以容置於一隨身碟之前置 USB接口内，該記憶體封裝碑塊係包含一封朦體與一在 該封膠體表面之電路板，該封膠體内封設有至少一快閃 口己憶體晶片，該電路板之外表面形成有複數個USB接觸 指與複數個讀卡接指。 11、 如申請專利範圍第10項所述之記憶體封裝磚塊，其 中該封膠體係A方塊狀，#料尺寸係平齊於該電路板 之側邊。 12、 如申請專利範圍第丨i項所述之記憶體封裝磚塊，其 屮該封膠體係以轉移模製方式形成。 、 13、 如申請專利範圍第1〇項所述之記憶體封裝碑塊，其 中^己憶體封裝磚塊之該電路板係為c〇B封裝基板。 14、 如申请專利範圍第1〇項所述之記憶體封裝磚塊，其 12 200803054 中該些讀卡接指上係設有複數個彈片。 15、如申請專利範圍第14項所述之記憶體封裝磚塊，其 中該些USB接觸指上亦設有複數個彈片。The disc, wherein the front USB interface has a lip. 5. For example, the disc described in claim 4, wherein the micro USB portable interface of the readable card of the front USB interface is an anti-static metal square shell. 200803054 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型 微型7. The micro USB portable disc of the readable card of claim 1, wherein the encapsulation system is in the form of a block having a peripheral dimension flush with the side of the circuit board. 8. A micro USB portable disk of a readable card as claimed in claim 7 wherein the sealing system is formed by transfer molding. 9. The micro USB usb disk of the readable card of claim 1, wherein the circuit board of the memory package brick is a C〇B package substrate. 10. A § 忆 体 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封 封The sealant body is sealed with at least one flash memory memory chip, and the outer surface of the circuit board is formed with a plurality of USB contact fingers and a plurality of card reader fingers. 11. The memory package brick according to claim 10, wherein the sealant system A is square-shaped, and the material size is flush with the side of the circuit board. 12. The memory-packaged brick according to item 丨i of the patent application, wherein the sealant system is formed by transfer molding. 13. The memory package block as described in claim 1 , wherein the circuit board of the package body is a c〇B package substrate. 14. The memory-packaged bricks as described in claim 1 of the patent application, wherein the plurality of shrapnels are disposed on the card reader fingers in the 2008 200803054. 15. The memory package brick of claim 14, wherein the USB contact fingers are also provided with a plurality of shrapnel. 1313
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CN102737698A (en) * 2011-04-15 2012-10-17 华东科技股份有限公司 Thin data storage device

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TWI384690B (en) * 2010-06-29 2013-02-01 Zhen Ding Technology Co Ltd Printed circuit board module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102737698A (en) * 2011-04-15 2012-10-17 华东科技股份有限公司 Thin data storage device
CN102737698B (en) * 2011-04-15 2015-02-04 华东科技股份有限公司 Thin data storage device

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