TW200745187A - Protecting agent - Google Patents
Protecting agentInfo
- Publication number
- TW200745187A TW200745187A TW096114900A TW96114900A TW200745187A TW 200745187 A TW200745187 A TW 200745187A TW 096114900 A TW096114900 A TW 096114900A TW 96114900 A TW96114900 A TW 96114900A TW 200745187 A TW200745187 A TW 200745187A
- Authority
- TW
- Taiwan
- Prior art keywords
- atom
- protecting agent
- substituted
- alkyl group
- oxygen atom
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C49/00—Ketones; Ketenes; Dimeric ketenes; Ketonic chelates
- C07C49/04—Saturated compounds containing keto groups bound to acyclic carbon atoms
- C07C49/175—Saturated compounds containing keto groups bound to acyclic carbon atoms containing ether groups, groups, groups, or groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07B—GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
- C07B51/00—Introduction of protecting groups or activating groups, not provided for in the preceding groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
- C07C323/10—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton
- C07C323/11—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton
- C07C323/12—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Abstract
The present invention provides a hydroxyl group or a carboxyl group protecting agent shown by formula (0). (in which, X1 represents a hydrogen atom, X2 represents a halogen atom, or X1 and X2 together forms a bond; R1 and R2 may be different or the same represent a substituted or unsubstituted alkyl group; A represents a oxygen atom or sulfur atom; R3 represents a alkyl group substituted by oxygen atom and/or sulfur atom.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006122820 | 2006-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200745187A true TW200745187A (en) | 2007-12-16 |
Family
ID=38655571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096114900A TW200745187A (en) | 2006-04-27 | 2007-04-27 | Protecting agent |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2007126050A1 (en) |
TW (1) | TW200745187A (en) |
WO (1) | WO2007126050A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI731037B (en) * | 2016-03-31 | 2021-06-21 | 日商東京應化工業股份有限公司 | Method for forming wiring or terminal on substrate |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009081852A1 (en) * | 2007-12-20 | 2009-07-02 | Kyowa Hakko Chemical Co., Ltd. | Protective agent |
WO2013141376A1 (en) * | 2012-03-23 | 2013-09-26 | 富士フイルム株式会社 | Protectant, method for producing compound protected by protectant, resin protected by protectant, photosensitive resin composition containing resin protected by protectant, pattern-forming material, photosensitive film, cured relief pattern, method for producing same, and semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000226340A (en) * | 1999-02-04 | 2000-08-15 | Mitsubishi Chemicals Corp | Production of phenolic compound having blocked hydroxyl group and positive type radiation sensitive compound |
JP4048171B2 (en) * | 2001-07-13 | 2008-02-13 | 協和発酵ケミカル株式会社 | Method for producing ether compounds |
JPWO2005023880A1 (en) * | 2003-09-03 | 2006-11-02 | 協和発酵ケミカル株式会社 | Method for producing compound having acid labile group |
-
2007
- 2007-04-27 JP JP2008513290A patent/JPWO2007126050A1/en not_active Withdrawn
- 2007-04-27 TW TW096114900A patent/TW200745187A/en unknown
- 2007-04-27 WO PCT/JP2007/059161 patent/WO2007126050A1/en active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI731037B (en) * | 2016-03-31 | 2021-06-21 | 日商東京應化工業股份有限公司 | Method for forming wiring or terminal on substrate |
Also Published As
Publication number | Publication date |
---|---|
JPWO2007126050A1 (en) | 2009-09-10 |
WO2007126050A1 (en) | 2007-11-08 |
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