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TW200741845A - Method for separating support plate - Google Patents

Method for separating support plate

Info

Publication number
TW200741845A
TW200741845A TW096107688A TW96107688A TW200741845A TW 200741845 A TW200741845 A TW 200741845A TW 096107688 A TW096107688 A TW 096107688A TW 96107688 A TW96107688 A TW 96107688A TW 200741845 A TW200741845 A TW 200741845A
Authority
TW
Taiwan
Prior art keywords
support plate
reacted
adhesive
separating support
photocatalyst
Prior art date
Application number
TW096107688A
Other languages
Chinese (zh)
Inventor
Yoshihiro Inao
Atsushi Miyanari
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200741845A publication Critical patent/TW200741845A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

A lifting/lowering device (2) is lowered, and an ultraviolet lamp (22) is located immediately above a support plate (11). In this state, the lamp is lighted to allow the ultraviolet light to reach a photocatalyst layer (13) through the support plate (11). This excites the photocatalyst to generate electrons which are reacted with O2 to form O2-. O2- is reacted with organic matter (adhesive) to evolve gas, for example, H2O and CO2, and this gas is spread between the photocatalyst layer (13) and the adhesive (12) to render the support plate (11) separable easily from a substrate (W).
TW096107688A 2006-03-30 2007-03-06 Method for separating support plate TW200741845A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006093548A JP4781874B2 (en) 2006-03-30 2006-03-30 Support plate peeling method

Publications (1)

Publication Number Publication Date
TW200741845A true TW200741845A (en) 2007-11-01

Family

ID=38580910

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107688A TW200741845A (en) 2006-03-30 2007-03-06 Method for separating support plate

Country Status (3)

Country Link
JP (1) JP4781874B2 (en)
TW (1) TW200741845A (en)
WO (1) WO2007116608A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512876B (en) * 2011-07-01 2015-12-11 Tokyo Electron Ltd Detachment apparatus and detachment system and detachment method and non-transitory computer readable storage medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5074940B2 (en) * 2008-01-30 2012-11-14 東京応化工業株式会社 Substrate processing method
JP6244183B2 (en) * 2013-11-20 2017-12-06 東京応化工業株式会社 Processing method
CN112820194A (en) * 2021-01-05 2021-05-18 深圳市华星光电半导体显示技术有限公司 Flexible display panel and preparation method thereof
WO2024190671A1 (en) * 2023-03-10 2024-09-19 デンカ株式会社 Method for processing plate-shaped base material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004253483A (en) * 2003-02-18 2004-09-09 Dainippon Printing Co Ltd Method of manufacturing semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512876B (en) * 2011-07-01 2015-12-11 Tokyo Electron Ltd Detachment apparatus and detachment system and detachment method and non-transitory computer readable storage medium

Also Published As

Publication number Publication date
JP4781874B2 (en) 2011-09-28
JP2007273500A (en) 2007-10-18
WO2007116608A1 (en) 2007-10-18

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