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TW200741337A - Method for imprinting 3-D circuit patterns on curved surface - Google Patents

Method for imprinting 3-D circuit patterns on curved surface

Info

Publication number
TW200741337A
TW200741337A TW095114236A TW95114236A TW200741337A TW 200741337 A TW200741337 A TW 200741337A TW 095114236 A TW095114236 A TW 095114236A TW 95114236 A TW95114236 A TW 95114236A TW 200741337 A TW200741337 A TW 200741337A
Authority
TW
Taiwan
Prior art keywords
imprinting
technique
circuit patterns
curved substrate
imprint
Prior art date
Application number
TW095114236A
Other languages
Chinese (zh)
Other versions
TWI322331B (en
Inventor
Min-Hsiung Hon
Kuan-Zong Fung
Ing-Chi Leu
Chi-Feng Liu
Chau-Nan Hong
Original Assignee
Univ Nat Cheng Kung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Cheng Kung filed Critical Univ Nat Cheng Kung
Priority to TW095114236A priority Critical patent/TW200741337A/en
Publication of TW200741337A publication Critical patent/TW200741337A/en
Application granted granted Critical
Publication of TWI322331B publication Critical patent/TWI322331B/zh

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  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

This invention provides a 3-D imprinting technique on a curved substrate. The 3-D imprinting technique can imprint a circuit pattern with a resolution smaller than 100 nm without being restricted by light wavelength, and thus is a micro/nano device manufacturing technique with high potential. The method includes first imprinting the 3-D circuit patterns on a wafer by photolithography; duplicating the 3-D circuit patterns on the wafer onto a composite imprint mold by a pattern transferring technique with the same curvature of the curved substrate; and using a micro/nano imprinting technique to imprint the 3-D circuit patterns on the curved substrate so as to simplify the 3-D imprinting processes on the curved substrate with less manufacturing cost and higher production efficiency.
TW095114236A 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface TW200741337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095114236A TW200741337A (en) 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095114236A TW200741337A (en) 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface

Publications (2)

Publication Number Publication Date
TW200741337A true TW200741337A (en) 2007-11-01
TWI322331B TWI322331B (en) 2010-03-21

Family

ID=45073941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114236A TW200741337A (en) 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface

Country Status (1)

Country Link
TW (1) TW200741337A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414647B (en) * 2010-09-27 2013-11-11 私立中原大學 Method for fabricating submicro patterned-sapphire substrate
CN108008599A (en) * 2017-12-27 2018-05-08 青岛天仁微纳科技有限责任公司 Method, apparatus and mould preparation method for three-dimension curved surface nanoscale coining
CN112817209A (en) * 2020-12-28 2021-05-18 山东大学 Embossing equipment capable of realizing special-shaped curved surface embossing and using method
CN113238456A (en) * 2016-08-25 2021-08-10 李永春 Method for imprinting flexible mold core with variable thickness

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104360580A (en) * 2014-10-28 2015-02-18 北京航空航天大学 Rolling-forming manufacturing method for microstructure on curved surface

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414647B (en) * 2010-09-27 2013-11-11 私立中原大學 Method for fabricating submicro patterned-sapphire substrate
CN113238456A (en) * 2016-08-25 2021-08-10 李永春 Method for imprinting flexible mold core with variable thickness
CN113238456B (en) * 2016-08-25 2024-02-20 李永春 An imprinting method using a flexible mold core with varying thickness
CN108008599A (en) * 2017-12-27 2018-05-08 青岛天仁微纳科技有限责任公司 Method, apparatus and mould preparation method for three-dimension curved surface nanoscale coining
CN108008599B (en) * 2017-12-27 2024-01-26 青岛天仁微纳科技有限责任公司 Method and device for three-dimensional curved surface nanoscale imprinting and mold preparation method
CN112817209A (en) * 2020-12-28 2021-05-18 山东大学 Embossing equipment capable of realizing special-shaped curved surface embossing and using method

Also Published As

Publication number Publication date
TWI322331B (en) 2010-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees