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TW200737292A - System for providing conducting pad and fabrication method thereof - Google Patents

System for providing conducting pad and fabrication method thereof

Info

Publication number
TW200737292A
TW200737292A TW095111013A TW95111013A TW200737292A TW 200737292 A TW200737292 A TW 200737292A TW 095111013 A TW095111013 A TW 095111013A TW 95111013 A TW95111013 A TW 95111013A TW 200737292 A TW200737292 A TW 200737292A
Authority
TW
Taiwan
Prior art keywords
fabrication method
conducting pad
conductive layer
providing conducting
grooves
Prior art date
Application number
TW095111013A
Other languages
Chinese (zh)
Other versions
TWI300240B (en
Inventor
Hong-Pin Ko
Chien-Chih Chen
Chia-Cheng Lin
Wen-Chieh Teng
Ping Luo
Original Assignee
Toppoly Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppoly Optoelectronics Corp filed Critical Toppoly Optoelectronics Corp
Priority to TW95111013A priority Critical patent/TWI300240B/en
Publication of TW200737292A publication Critical patent/TW200737292A/en
Application granted granted Critical
Publication of TWI300240B publication Critical patent/TWI300240B/en

Links

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)

Abstract

A system for providing conducting pads of a display panel has a base layer on a substrate, a first insulator on the base layer having a plurality of grooves, a second conductive layer inside the grooves, and a patterned third conductive layer covering the second conductive layer. The first insulator serves as a barricade for fixing the second conductive layer in the grooves.
TW95111013A 2006-03-29 2006-03-29 Systems for providing conducting pad and fabrication method thereof TWI300240B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95111013A TWI300240B (en) 2006-03-29 2006-03-29 Systems for providing conducting pad and fabrication method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95111013A TWI300240B (en) 2006-03-29 2006-03-29 Systems for providing conducting pad and fabrication method thereof

Publications (2)

Publication Number Publication Date
TW200737292A true TW200737292A (en) 2007-10-01
TWI300240B TWI300240B (en) 2008-08-21

Family

ID=45069917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95111013A TWI300240B (en) 2006-03-29 2006-03-29 Systems for providing conducting pad and fabrication method thereof

Country Status (1)

Country Link
TW (1) TWI300240B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872780A (en) * 2009-04-23 2010-10-27 统宝光电股份有限公司 Display panel and image display system using the display panel
US8716927B2 (en) 2009-04-13 2014-05-06 Chimei Innolux Corporation Display panel and system for displaying images utilizing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8716927B2 (en) 2009-04-13 2014-05-06 Chimei Innolux Corporation Display panel and system for displaying images utilizing the same
US9035544B2 (en) 2009-04-13 2015-05-19 Innolux Corporation Display panel and system for displaying images utilizing the same
US9263508B2 (en) 2009-04-13 2016-02-16 Innolux Corporation Display panel and system for displaying images utilizing the same
US9960217B2 (en) 2009-04-13 2018-05-01 Innolux Corporation Display panel and system for displaying images utilizing the same
CN101872780A (en) * 2009-04-23 2010-10-27 统宝光电股份有限公司 Display panel and image display system using the display panel
CN101872780B (en) * 2009-04-23 2013-11-27 群创光电股份有限公司 Display panel and image display system using the display panel

Also Published As

Publication number Publication date
TWI300240B (en) 2008-08-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees