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TW200736001A - Polishing pad, method of polishing and polishing apparatus - Google Patents

Polishing pad, method of polishing and polishing apparatus

Info

Publication number
TW200736001A
TW200736001A TW095132442A TW95132442A TW200736001A TW 200736001 A TW200736001 A TW 200736001A TW 095132442 A TW095132442 A TW 095132442A TW 95132442 A TW95132442 A TW 95132442A TW 200736001 A TW200736001 A TW 200736001A
Authority
TW
Taiwan
Prior art keywords
polishing
pad
polishing pad
support surface
apertures
Prior art date
Application number
TW095132442A
Other languages
Chinese (zh)
Inventor
Yasutada Nakagawa
Eijiro Koike
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200736001A publication Critical patent/TW200736001A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predetermined angle with respect to a radial direction of the polishing pad.
TW095132442A 2006-03-27 2006-09-01 Polishing pad, method of polishing and polishing apparatus TW200736001A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006086087 2006-03-27

Publications (1)

Publication Number Publication Date
TW200736001A true TW200736001A (en) 2007-10-01

Family

ID=38534094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132442A TW200736001A (en) 2006-03-27 2006-09-01 Polishing pad, method of polishing and polishing apparatus

Country Status (4)

Country Link
US (1) US20070224920A1 (en)
KR (1) KR100862130B1 (en)
CN (1) CN101045290A (en)
TW (1) TW200736001A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8845395B2 (en) 2008-10-31 2014-09-30 Araca Inc. Method and device for the injection of CMP slurry
US8197306B2 (en) * 2008-10-31 2012-06-12 Araca, Inc. Method and device for the injection of CMP slurry
US20110039485A1 (en) * 2009-06-19 2011-02-17 Benner Stephen J Apertured Abrasive Disk Assembly With Improved Flow Dynamics
KR20100138358A (en) * 2009-06-25 2010-12-31 신한다이아몬드공업 주식회사 Machining wheels
KR101102710B1 (en) * 2010-01-15 2012-01-05 주식회사 엘지실트론 Wafer Unloading System and Wafer Duplex Processing Apparatus Comprising the Same
JP5375895B2 (en) * 2011-08-17 2013-12-25 旭硝子株式会社 Polishing system
JP6027454B2 (en) * 2013-02-05 2016-11-16 株式会社荏原製作所 Polishing equipment
USD787768S1 (en) * 2016-04-11 2017-05-23 Linda Daoud Sponge
JP7113626B2 (en) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 polishing pad
WO2020119779A1 (en) * 2018-12-14 2020-06-18 大连理工大学 Semiconductor wafer photoelectrochemical mechanical polishing processing device and processing method
CN110744444B (en) * 2019-10-29 2022-02-15 武汉新芯集成电路制造有限公司 Polishing pad and polishing apparatus
CN114589620B (en) * 2020-12-03 2023-05-23 中国科学院微电子研究所 Semiconductor polishing pad and preparation method thereof
CN113561039B (en) * 2021-09-27 2021-12-03 大隆节能液压科技启东有限公司 Polishing device for inner wall surface of metal pipe joint
USD1010415S1 (en) * 2021-10-27 2024-01-09 Mirka Ltd Backing pad for sander
USD1029602S1 (en) * 2022-01-04 2024-06-04 Noritake Co., Limited Polishing pad dresser
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2647046B2 (en) * 1995-02-28 1997-08-27 日本電気株式会社 Polishing cloth and polishing method
US5893754A (en) * 1996-05-21 1999-04-13 Micron Technology, Inc. Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
JPH10277927A (en) * 1997-04-07 1998-10-20 Toshiba Mach Co Ltd Flat surface polishing device
JPH1158218A (en) * 1997-08-12 1999-03-02 Nikon Corp Abrasive pad and polishing device
US6331137B1 (en) * 1998-08-28 2001-12-18 Advanced Micro Devices, Inc Polishing pad having open area which varies with distance from initial pad surface
KR20000025003A (en) * 1998-10-07 2000-05-06 윤종용 Polishing pad used for chemical and mechanical polishing of semiconductor substrate
US6702866B2 (en) 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad

Also Published As

Publication number Publication date
KR20070096934A (en) 2007-10-02
US20070224920A1 (en) 2007-09-27
CN101045290A (en) 2007-10-03
KR100862130B1 (en) 2008-10-09

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