[go: up one dir, main page]

TW200733149A - Manufacturing method of chip resistor - Google Patents

Manufacturing method of chip resistor

Info

Publication number
TW200733149A
TW200733149A TW095105899A TW95105899A TW200733149A TW 200733149 A TW200733149 A TW 200733149A TW 095105899 A TW095105899 A TW 095105899A TW 95105899 A TW95105899 A TW 95105899A TW 200733149 A TW200733149 A TW 200733149A
Authority
TW
Taiwan
Prior art keywords
device area
master electrode
resistor
chip resistor
manufacturing
Prior art date
Application number
TW095105899A
Other languages
English (en)
Other versions
TWI313876B (zh
Inventor
xiu-qiang Lu
Jun-Xiong Guo
Original Assignee
Walsin Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walsin Technology Corp filed Critical Walsin Technology Corp
Priority to TW095105899A priority Critical patent/TW200733149A/zh
Priority to US11/640,373 priority patent/US20070197000A1/en
Publication of TW200733149A publication Critical patent/TW200733149A/zh
Application granted granted Critical
Publication of TWI313876B publication Critical patent/TWI313876B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
TW095105899A 2006-02-22 2006-02-22 Manufacturing method of chip resistor TW200733149A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095105899A TW200733149A (en) 2006-02-22 2006-02-22 Manufacturing method of chip resistor
US11/640,373 US20070197000A1 (en) 2006-02-22 2006-12-18 Method of manufacturing chip resistors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095105899A TW200733149A (en) 2006-02-22 2006-02-22 Manufacturing method of chip resistor

Publications (2)

Publication Number Publication Date
TW200733149A true TW200733149A (en) 2007-09-01
TWI313876B TWI313876B (zh) 2009-08-21

Family

ID=38428761

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105899A TW200733149A (en) 2006-02-22 2006-02-22 Manufacturing method of chip resistor

Country Status (2)

Country Link
US (1) US20070197000A1 (zh)
TW (1) TW200733149A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102810441A (zh) * 2011-06-01 2012-12-05 岛津分析技术研发（上海）有限公司 离子光学器件的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104715875A (zh) * 2015-03-06 2015-06-17 蚌埠市德瑞特电阻技术有限公司 有失效率等级的片式膜固定电阻器的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5580384A (en) * 1989-09-22 1996-12-03 Balzers Aktiengesellschaft Method and apparatus for chemical coating on opposite surfaces of workpieces
JP3095296B2 (ja) * 1991-12-19 2000-10-03 株式会社日立製作所 レジスト剥離方法、これを用いた薄膜回路素子の製造方法、および、レジスト剥離液
JPH10189318A (ja) * 1996-12-27 1998-07-21 Hokuriku Electric Ind Co Ltd ネットワーク抵抗器の製造方法
TW424245B (en) * 1998-01-08 2001-03-01 Matsushita Electric Ind Co Ltd Resistor and its manufacturing method
KR100468373B1 (ko) * 2000-01-17 2005-01-27 마쯔시다덴기산교 가부시키가이샤 저항기 및 그 제조 방법
US20040231978A1 (en) * 2001-09-19 2004-11-25 White Tamara L Electrode attachment to anode assembly
JP3846312B2 (ja) * 2002-01-15 2006-11-15 松下電器産業株式会社 多連チップ抵抗器の製造方法
JP4493284B2 (ja) * 2003-05-26 2010-06-30 キヤノンアネルバ株式会社 スパッタリング装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102810441A (zh) * 2011-06-01 2012-12-05 岛津分析技术研发（上海）有限公司 离子光学器件的制备方法
WO2012163268A1 (zh) * 2011-06-01 2012-12-06 岛津分析技术研发（上海）有限公司 离子光学器件的制备方法
CN102810441B (zh) * 2011-06-01 2016-07-06 岛津分析技术研发（上海）有限公司 离子光学器件的制备方法

Also Published As

Publication number Publication date
TWI313876B (zh) 2009-08-21
US20070197000A1 (en) 2007-08-23

Similar Documents

Publication Publication Date Title
WO2009020349A3 (en) Method for manufacturing thin film type solar cell, and thin film type solar cell made by the method
IL199769A0 (en) Method for the production of structured, electrically conductive surfaces
WO2012125481A3 (en) Thin film through-glass via and methods for forming same
TW200711181A (en) Light-emitting device and manufacturing method thereof
WO2009143026A3 (en) Method of forming an electronic device using a separation technique
EP1795574A4 (en) PHOSPHORUS, METHOD OF ITS MANUFACTURE AND LIGHT-EMITTING DEVICE
EP2172320A4 (en) MOLDING TOOL, METHOD FOR PRODUCING THE MOLDING TOOL AND METHOD FOR PRODUCING A SUBSTRATE WITH REPRODUCTION OF A FINE PATTERN
WO2012040019A3 (en) Flexible distributed led-based light source and method for making the same
EP2061041A4 (en) LADDERING FILM AND METHOD FOR PRODUCING A CONDUCTIVE FILM
WO2010117818A3 (en) Controlled localized defect paths for resistive memories
TW200728107A (en) Multi-layer body and method for producing the same
WO2008098272A8 (de) Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte
WO2009150546A3 (en) Interior trim piece with electrical circuit path made from conductive ink/paint, and production process
WO2010065301A3 (en) Method of enabling selective area plating on a substrate
TW200714154A (en) Multilayered structure forming method
WO2009056235A3 (de) Mehrschichtsystem mit kontaktelementen und verfahren zum erstellen eines kontaktelements für ein mehrschichtsystem
WO2008084524A1 (ja) 半導体装置の製造方法、および半導体装置の製造装置
WO2007059391A3 (en) Method for an element using two resist layers
WO2008114341A1 (ja) 半導体装置およびその製造方法
WO2008073524A3 (en) Improved method for making an elastomeric sealing device
WO2012143460A3 (de) Verfahren zur herstellung einer solarzelle
TW200733149A (en) Manufacturing method of chip resistor
GB2486345B (en) Method of making a bit for a rotary drill
TW200733148A (en) Method of manufacturing chip resistor
EP2179808B8 (en) Process for producing electrode for discharge surface treatment.