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TW200726582A - Rotary tool for processing flexible materials - Google Patents

Rotary tool for processing flexible materials

Info

Publication number
TW200726582A
TW200726582A TW095134041A TW95134041A TW200726582A TW 200726582 A TW200726582 A TW 200726582A TW 095134041 A TW095134041 A TW 095134041A TW 95134041 A TW95134041 A TW 95134041A TW 200726582 A TW200726582 A TW 200726582A
Authority
TW
Taiwan
Prior art keywords
scrubbing
rotary tool
processing
slant surface
workpiece
Prior art date
Application number
TW095134041A
Other languages
Chinese (zh)
Inventor
Yoshitada Ataka
Akira Osada
Ryuichi Matsuki
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of TW200726582A publication Critical patent/TW200726582A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/18—Wheels of special form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention provides a rotary tool for processing flexible materials which is adapted for stably processing and conditioning the surface of a workpiece grinding pad even in a case that the rotary tool pushes against the workpiece being moved for processing, wherein the workpiece constituted with flexible material is processed in moving state, more than two scrubbing protrusions are formed in upward projecting manner on the surface of base plate, the upper surfaces of scrubbing protrusions are made a slant surface 15, a scrubbing ridge 16 is formed at the highest projecting part of side ridge of the slant surface 15, the slant surface 15 of a part of scrubbing protrusion 14 is so arranged as to face at least one side of peripheral direction of rotation of said base plate, while the slant surface 15 of at least a part of the remaining scrubbing protrusion 14 is such arranged to face the other side of said peripheral direction.
TW095134041A 2005-10-04 2006-09-14 Rotary tool for processing flexible materials TW200726582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005290793 2005-10-04

Publications (1)

Publication Number Publication Date
TW200726582A true TW200726582A (en) 2007-07-16

Family

ID=37902511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134041A TW200726582A (en) 2005-10-04 2006-09-14 Rotary tool for processing flexible materials

Country Status (4)

Country Link
US (1) US20070077874A1 (en)
KR (1) KR20070038010A (en)
CN (1) CN1943991A (en)
TW (1) TW200726582A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10166653B2 (en) 2011-07-18 2019-01-01 Ehwa Diamond Industrial Co., Ltd. CMP pad conditioner
TWI896083B (en) * 2023-04-24 2025-09-01 南韓商謝索爾鑽石工業股份有限公司 Pad conditioner

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102089383B1 (en) 2012-08-02 2020-03-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Abrasive articles with precisely shaped features and method of making thereof
WO2014022453A1 (en) 2012-08-02 2014-02-06 3M Innovative Properties Company Abrasive element precursor with precisely shaped features and method of making thereof
CN106463379B (en) * 2014-03-21 2019-08-06 恩特格里斯公司 Chemical-mechanical planarization pad adjuster with elongated cut edge
KR102466715B1 (en) * 2020-10-13 2022-11-14 김영환 Cmp pad conditioner and manufacturing method thereof
KR102878322B1 (en) * 2023-04-24 2025-10-29 새솔다이아몬드공업 주식회사 Pad conditioner
CN117124371B (en) * 2023-10-26 2024-03-15 成都飞机工业（集团）有限责任公司 Ultrasonic disc cutter and processing method thereof

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US5709598A (en) * 1993-06-02 1998-01-20 Dai Nippon Printing Co., Ltd. Abrasive tape and method of producing the same
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US5921856A (en) * 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same
US5931719A (en) * 1997-08-25 1999-08-03 Lsi Logic Corporation Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
JP2000037713A (en) * 1998-07-24 2000-02-08 Ciba Specialty Chemicals Kk Rotational trowel for molding ceramics and its manufacture
US6206759B1 (en) * 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
US7204917B2 (en) * 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US6319108B1 (en) * 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
JP3387858B2 (en) * 1999-08-25 2003-03-17 理化学研究所 Polishing pad conditioner
US6328632B1 (en) * 1999-08-31 2001-12-11 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
US6238273B1 (en) * 1999-08-31 2001-05-29 Micron Technology, Inc. Methods for predicting polishing parameters of polishing pads and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization
US6419574B1 (en) * 1999-09-01 2002-07-16 Mitsubishi Materials Corporation Abrasive tool with metal binder phase
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
USD444483S1 (en) * 2000-02-08 2001-07-03 Sanwa Kenma Kogyo Co., Ltd. Grinding disk
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US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6872127B2 (en) * 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
US6602123B1 (en) * 2002-09-13 2003-08-05 Infineon Technologies Ag Finishing pad design for multidirectional use

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10166653B2 (en) 2011-07-18 2019-01-01 Ehwa Diamond Industrial Co., Ltd. CMP pad conditioner
TWI896083B (en) * 2023-04-24 2025-09-01 南韓商謝索爾鑽石工業股份有限公司 Pad conditioner

Also Published As

Publication number Publication date
KR20070038010A (en) 2007-04-09
US20070077874A1 (en) 2007-04-05
CN1943991A (en) 2007-04-11

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