[go: up one dir, main page]

TW200726563A - Laser processing device, program preparation device, and laser processing method - Google Patents

Laser processing device, program preparation device, and laser processing method

Info

Publication number
TW200726563A
TW200726563A TW095102772A TW95102772A TW200726563A TW 200726563 A TW200726563 A TW 200726563A TW 095102772 A TW095102772 A TW 095102772A TW 95102772 A TW95102772 A TW 95102772A TW 200726563 A TW200726563 A TW 200726563A
Authority
TW
Taiwan
Prior art keywords
irradiation position
laser processing
laser beam
irradiation
laser
Prior art date
Application number
TW095102772A
Other languages
Chinese (zh)
Other versions
TWI296219B (en
Inventor
Toshiyuki Hokodate
Atsuhiro Kaneda
Shigeo Kawano
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW200726563A publication Critical patent/TW200726563A/en
Application granted granted Critical
Publication of TWI296219B publication Critical patent/TWI296219B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

This invention provides a laser processing device (1) for performing an operation of making a plurality of holes in a work in a processing mode by repeating a plurality of times of a processing cycle of irradiating a plurality of processing positions of the work with one to several shots of laser beam while varying the irradiation positions of the laser beam. The laser processing device (1) has irradiation position moving units 35X, 35Y, a control unit (10) for controlling the oscillation timing of laser beam generated by a laser oscillating unit (21) and the irradiation positions of the laser beam moved by the irradiation position moving units 35X, 35Y. The control unit (10) is adapted to control the irradiation position moving units 35X, 35Y in such a manner that the path of the movement of the irradiation position moved by the irradiation position moving unit to the position of making a first hole when the laser beam is irradiated to the first hole at the beginning falls in the same path of the movement of the irradiation position by the irradiation position moving unit to the position of making the first hole after a second cycle.
TW095102772A 2006-01-06 2006-01-25 Laser processing device, program preparation device, and laser processing method TWI296219B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/300094 WO2007077630A1 (en) 2006-01-06 2006-01-06 Laser material processing system, program creating device and laser material processing method

Publications (2)

Publication Number Publication Date
TW200726563A true TW200726563A (en) 2007-07-16
TWI296219B TWI296219B (en) 2008-05-01

Family

ID=38227994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102772A TWI296219B (en) 2006-01-06 2006-01-25 Laser processing device, program preparation device, and laser processing method

Country Status (4)

Country Link
JP (1) JP4800939B2 (en)
CN (1) CN101142052B (en)
TW (1) TWI296219B (en)
WO (1) WO2007077630A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511822B (en) * 2013-01-04 2015-12-11 Mitsubishi Electric Corp Processing control device, laser processing device and processing control method
TWI759130B (en) * 2020-03-11 2022-03-21 日商住友重機械工業股份有限公司 Processing order determination device, laser processing device and laser processing method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5808267B2 (en) * 2012-02-20 2015-11-10 住友重機械工業株式会社 Laser processing apparatus and laser processing method
CN102615281B (en) * 2012-04-09 2013-10-16 西安交通大学 Regional mobile light source scanning system for laser rapid prototyping technology
CN103084733A (en) * 2012-12-06 2013-05-08 芜湖华力金属制品有限公司 Method for cutting steel plate with thickness of 5mm by using 500W laser cutting machine
JP6199585B2 (en) * 2013-03-21 2017-09-20 住友化学株式会社 Laser light irradiation apparatus and optical member bonding body manufacturing apparatus
TWI608323B (en) * 2013-05-29 2017-12-11 Via Mechanics Ltd Laser processing method, device and program
EP2824699A1 (en) * 2013-07-08 2015-01-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Providing a chip die with electrically conductive elements
CN103978315B (en) * 2014-05-23 2015-12-30 孙树峰 A kind of nozzle opening laser high-efficiency and precision automatic machining device and method
CN105034608A (en) * 2015-07-10 2015-11-11 辽宁科技大学 Industrial robot laser marking machine
CN106881525B (en) * 2015-12-15 2019-06-18 新代科技股份有限公司 laser processing control system and control method thereof
JP6464213B2 (en) * 2017-02-09 2019-02-06 ファナック株式会社 Laser processing system having laser processing head and imaging device
JP6514278B2 (en) * 2017-07-04 2019-05-15 ファナック株式会社 Laser processing robot system
JP2020091576A (en) * 2018-12-04 2020-06-11 株式会社ディスコ Wiring board processing apparatus and wiring board processing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09122945A (en) * 1995-10-27 1997-05-13 Miyachi Technos Corp Laser beam machine
JP3853499B2 (en) * 1998-01-07 2006-12-06 松下電器産業株式会社 Laser processing equipment
JP3407715B2 (en) * 2000-06-06 2003-05-19 松下電器産業株式会社 Laser processing equipment
JP2004164083A (en) * 2002-11-11 2004-06-10 Sumitomo Heavy Ind Ltd Working planning method and device for the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511822B (en) * 2013-01-04 2015-12-11 Mitsubishi Electric Corp Processing control device, laser processing device and processing control method
TWI759130B (en) * 2020-03-11 2022-03-21 日商住友重機械工業股份有限公司 Processing order determination device, laser processing device and laser processing method

Also Published As

Publication number Publication date
JPWO2007077630A1 (en) 2009-06-04
CN101142052A (en) 2008-03-12
CN101142052B (en) 2010-08-25
WO2007077630A1 (en) 2007-07-12
TWI296219B (en) 2008-05-01
JP4800939B2 (en) 2011-10-26

Similar Documents

Publication Publication Date Title
TW200726563A (en) Laser processing device, program preparation device, and laser processing method
JP2015529161A5 (en)
GB2431371A (en) Methods for processing holes by moving precisely timed laser pulses in circularand spriral trajectories
WO2006078920A3 (en) High-speed, precise, laser-based material processing method and system
DE502005006998D1 (en) WITH LASER POWER CONTROLLED DEPENDING ON LASER MOVEMENT
WO2007014353A3 (en) System and method for forming staple pockets of a surgical stapler
WO2008005129A3 (en) Four-dimensional target modeling and radiation treatment
ATE474257T1 (en) ROBOT CONTROL AND ROBOT CONTROL METHOD
DK1736272T3 (en) Method and apparatus for laser cutting articles, especially sanitary products and components thereof, having a laser point diameter between 0.1 and 0.3 mm.
ATE482050T1 (en) MACHINE FOR PROCESSING WORKPIECES AND METHOD FOR MACHINE PROCESSING WORKPIECES
TW200739995A (en) Laser irradiation apparatus
TW200801832A (en) Laser processing device and its processing method
WO2006012947A3 (en) Apparatus for correcting presbyopia
TW200716289A (en) Laser machining method and laser machining apparatus
ATE511940T1 (en) DEVICE FOR DRILLING AND MATERIAL REMOVING USING A LASER BEAM
GB2443587A (en) Energy monitoring or control of individual vias formed during laser micromachining
MX2013012263A (en) Method for controlling a laser cutting process and laser cutting system implementing the same.
JP2016516585A5 (en)
JP2014223671A5 (en) Laser processing method and laser processing apparatus
JP2016516585A (en) Control of beam positioner based on laser emission
WO2008102635A1 (en) Charged particle beam apparatus and charged particle optical system adjusting method
ATE552066T1 (en) LASER PROCESSING DEVICE AND LASER PROCESSING METHOD WITH DOUBLE OR MULTIPLE SPOT USING A GALVANOSCANNER
WO2019176632A1 (en) Cutting machine and cutting method
TW200603930A (en) Method of providing consistent quality of target material removal by lasers having different output performance characteristics
FI20060049A0 (en) Laser Welding Procedure