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TW200722702A - Heat pipe and method for manufacturing the same - Google Patents

Heat pipe and method for manufacturing the same

Info

Publication number
TW200722702A
TW200722702A TW095135116A TW95135116A TW200722702A TW 200722702 A TW200722702 A TW 200722702A TW 095135116 A TW095135116 A TW 095135116A TW 95135116 A TW95135116 A TW 95135116A TW 200722702 A TW200722702 A TW 200722702A
Authority
TW
Taiwan
Prior art keywords
recessed parts
side lattice
intermediate plate
member side
upper member
Prior art date
Application number
TW095135116A
Other languages
Chinese (zh)
Other versions
TWI409425B (en
Inventor
Kenji Ohsawa
Katsuya Tsuruta
Original Assignee
Fuchigami Micro Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2006/301925 external-priority patent/WO2007029359A1/en
Application filed by Fuchigami Micro Co filed Critical Fuchigami Micro Co
Publication of TW200722702A publication Critical patent/TW200722702A/en
Application granted granted Critical
Publication of TWI409425B publication Critical patent/TWI409425B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

To provide a small-sized and thin heat pipe (1) enabling a remarkable increase in heat conductivity. An upper intermediate plate (7) and a lower intermediate plate (8) in which a plurality of steam diffusing flow passages (10) in a horizontal direction communicating with the upper member side lattice-like recessed parts (21) in an upper member (2) and lower member side lattice-like recessed parts (17) in a lower member (3) are formed are interposed between the upper member (2) having the upper member side lattice-like recessed parts (21) in its lower inner surface and the lower member (3) having the lower member side lattice-like recessed parts (17) in its upper inner surface, and a refrigerant is sealed in sealed spaces between the upper member (2) and the lower member (3). Capillary tube flow passages (11) in a vertical direction or in both vertical and horizontal directions communicating with the upper member side lattice-like recessed parts (21) in the upper member (2) and the lower member side lattice-like recessed parts (17) in the lower member (3) are formed in those portions of the upper intermediate plate (7) and the lower intermediate plate (8) other than the portions where the steam diffusing flow passages (10) are formed.
TW095135116A 2005-12-05 2006-09-22 Heat pipe TWI409425B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005350157 2005-12-05
PCT/JP2006/301925 WO2007029359A1 (en) 2005-09-01 2006-01-31 Heat pipe and method for manufacturing same
PCT/JP2006/317249 WO2007026833A1 (en) 2005-09-01 2006-08-31 Heat pipe and method of manufacturing the same

Publications (2)

Publication Number Publication Date
TW200722702A true TW200722702A (en) 2007-06-16
TWI409425B TWI409425B (en) 2013-09-21

Family

ID=49626756

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135116A TWI409425B (en) 2005-12-05 2006-09-22 Heat pipe

Country Status (1)

Country Link
TW (1) TWI409425B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486116B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI486114B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI486115B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI486117B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI588438B (en) * 2014-06-06 2017-06-21 超眾科技股份有限公司 Sealing method of heat conducting plate and structures thereof
TWI648512B (en) * 2016-07-01 2019-01-21 古河電氣工業股份有限公司 Steam room
TWI750694B (en) * 2020-06-12 2021-12-21 維峰科技股份有限公司 Cooling module and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3890685B2 (en) * 1997-07-11 2007-03-07 株式会社デンソー Boiling cooler
JP4424883B2 (en) * 2000-02-25 2010-03-03 富士通株式会社 Thin heat pipe and manufacturing method thereof
JP2004353902A (en) * 2003-05-27 2004-12-16 Sony Corp Cooling system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486116B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI486114B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI486115B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI486117B (en) * 2012-12-12 2015-05-21 Inventec Corp Electronic device
TWI588438B (en) * 2014-06-06 2017-06-21 超眾科技股份有限公司 Sealing method of heat conducting plate and structures thereof
TWI648512B (en) * 2016-07-01 2019-01-21 古河電氣工業股份有限公司 Steam room
US10667430B2 (en) 2016-07-01 2020-05-26 Furukawa Electric Co., Ltd. Vapor chamber
TWI750694B (en) * 2020-06-12 2021-12-21 維峰科技股份有限公司 Cooling module and manufacturing method thereof

Also Published As

Publication number Publication date
TWI409425B (en) 2013-09-21

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