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TW200715672A - Adhesive reel - Google Patents

Adhesive reel

Info

Publication number
TW200715672A
TW200715672A TW095132019A TW95132019A TW200715672A TW 200715672 A TW200715672 A TW 200715672A TW 095132019 A TW095132019 A TW 095132019A TW 95132019 A TW95132019 A TW 95132019A TW 200715672 A TW200715672 A TW 200715672A
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive tape
reel
adhesive reel
winding core
Prior art date
Application number
TW095132019A
Other languages
Chinese (zh)
Other versions
TWI301339B (en
Inventor
Mitsuru Hirao
Kouichi Kawamata
Takashi Seki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200715672A publication Critical patent/TW200715672A/en
Application granted granted Critical
Publication of TWI301339B publication Critical patent/TWI301339B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)

Abstract

The present invention is an adhesive reel 3, which has the adhesive tape 20 formed by applying an adhesive layer 1 to a first surface 2b of a support film 2 which has the first surface 2b and a second surface 2a on an opposite side thereof and is composed so that the adhesive tape 20 is wound on a winding core 13 of a structure in which the reel plates 5a, 5b are mounted on both ends of the winding core 13 so as to face each other. Further, a pressure-sensitive adhesive member 7 is positioned on the second surface 2a of the support film 2 at a starting end part 4 of the adhesive tape 20.
TW095132019A 2005-08-31 2006-08-30 Adhesive reel TW200715672A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005251268 2005-08-31
JP2006179765A JP4238885B2 (en) 2005-08-31 2006-06-29 Adhesive reel and adhesive tape

Publications (2)

Publication Number Publication Date
TW200715672A true TW200715672A (en) 2007-04-16
TWI301339B TWI301339B (en) 2008-09-21

Family

ID=37978091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132019A TW200715672A (en) 2005-08-31 2006-08-30 Adhesive reel

Country Status (4)

Country Link
JP (1) JP4238885B2 (en)
KR (1) KR100889648B1 (en)
CN (5) CN101792075A (en)
TW (1) TW200715672A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050832B2 (en) * 2007-12-19 2012-10-17 日立化成工業株式会社 Reel for adhesive tape
JP4985700B2 (en) * 2008-04-28 2012-07-25 日立化成工業株式会社 Adhesive reel
EP2315314B1 (en) * 2009-02-27 2012-10-31 Hitachi Chemical Company, Ltd. Reel for adhesive tape
WO2013024544A1 (en) * 2011-08-18 2013-02-21 日立化成工業株式会社 Adhesive material reel
KR101568659B1 (en) * 2013-03-29 2015-11-12 제일모직주식회사 Anisotropic conducting film comprising conductive adhesive layer and a semiconductor device connected by the film
KR101991190B1 (en) * 2015-02-27 2019-06-19 데쿠세리아루즈 가부시키가이샤 Reel, film connecting body, film winding mounting body and manufacturing method of film connecting body
JP2016160027A (en) * 2015-02-27 2016-09-05 デクセリアルズ株式会社 Reel for adhesive film, and connected body used for the same
CN107298330B (en) * 2016-04-14 2020-06-12 康菲德斯合股公司 Method for arranging a material web on a core
JP6668164B2 (en) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 Adhesive tape structure
CN109575829B (en) * 2017-12-29 2021-05-07 宁波大榭开发区综研化学有限公司 Segment difference multilayer composite film and coiled material and preparation method thereof
WO2021039565A1 (en) * 2019-08-26 2021-03-04 リンテック株式会社 Laminate manufacturing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04332782A (en) * 1991-05-07 1992-11-19 Sekisui Chem Co Ltd Rolled tacky tape
JPH05330722A (en) * 1992-05-25 1993-12-14 Nitto Denko Corp Tape dispenser
JPH0724947U (en) * 1993-10-07 1995-05-12 祐久 小松 Adhesive tape
CH689482A5 (en) * 1995-07-31 1999-05-14 Tela Papierfabrik Ag Paper-roll with closed end
JP4465788B2 (en) * 2000-03-28 2010-05-19 日立化成工業株式会社 Anisotropic conductive tape and reel
EP1249729A3 (en) * 2001-04-12 2005-07-13 Fuji Photo Film Co., Ltd. Rolled article, and method of and apparatus for processing rolled article
DE10123980B4 (en) * 2001-05-17 2008-01-10 Tesa Ag final insulation
JP4239585B2 (en) * 2002-12-24 2009-03-18 日立化成工業株式会社 Adhesive tape connection method and adhesive tape connector
KR100838880B1 (en) * 2002-07-30 2008-06-16 히다치 가세고교 가부시끼가이샤 Adhesive tape, its connecting method, manufacturing method, crimping method
JP2004077789A (en) * 2002-08-19 2004-03-11 Konica Minolta Holdings Inc Light-shielding flange member

Also Published As

Publication number Publication date
CN102514986A (en) 2012-06-27
KR20070026029A (en) 2007-03-08
CN1923654A (en) 2007-03-07
JP4238885B2 (en) 2009-03-18
CN101792075A (en) 2010-08-04
CN101683934A (en) 2010-03-31
CN101665195B (en) 2012-07-25
KR100889648B1 (en) 2009-03-19
CN101683934B (en) 2012-06-13
CN101665195A (en) 2010-03-10
CN102514986B (en) 2016-04-27
TWI301339B (en) 2008-09-21
JP2007092028A (en) 2007-04-12

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