TW200715672A - Adhesive reel - Google Patents
Adhesive reelInfo
- Publication number
- TW200715672A TW200715672A TW095132019A TW95132019A TW200715672A TW 200715672 A TW200715672 A TW 200715672A TW 095132019 A TW095132019 A TW 095132019A TW 95132019 A TW95132019 A TW 95132019A TW 200715672 A TW200715672 A TW 200715672A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- adhesive tape
- reel
- adhesive reel
- winding core
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
- Winding, Rewinding, Material Storage Devices (AREA)
Abstract
The present invention is an adhesive reel 3, which has the adhesive tape 20 formed by applying an adhesive layer 1 to a first surface 2b of a support film 2 which has the first surface 2b and a second surface 2a on an opposite side thereof and is composed so that the adhesive tape 20 is wound on a winding core 13 of a structure in which the reel plates 5a, 5b are mounted on both ends of the winding core 13 so as to face each other. Further, a pressure-sensitive adhesive member 7 is positioned on the second surface 2a of the support film 2 at a starting end part 4 of the adhesive tape 20.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005251268 | 2005-08-31 | ||
JP2006179765A JP4238885B2 (en) | 2005-08-31 | 2006-06-29 | Adhesive reel and adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715672A true TW200715672A (en) | 2007-04-16 |
TWI301339B TWI301339B (en) | 2008-09-21 |
Family
ID=37978091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132019A TW200715672A (en) | 2005-08-31 | 2006-08-30 | Adhesive reel |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4238885B2 (en) |
KR (1) | KR100889648B1 (en) |
CN (5) | CN101792075A (en) |
TW (1) | TW200715672A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5050832B2 (en) * | 2007-12-19 | 2012-10-17 | 日立化成工業株式会社 | Reel for adhesive tape |
JP4985700B2 (en) * | 2008-04-28 | 2012-07-25 | 日立化成工業株式会社 | Adhesive reel |
EP2315314B1 (en) * | 2009-02-27 | 2012-10-31 | Hitachi Chemical Company, Ltd. | Reel for adhesive tape |
WO2013024544A1 (en) * | 2011-08-18 | 2013-02-21 | 日立化成工業株式会社 | Adhesive material reel |
KR101568659B1 (en) * | 2013-03-29 | 2015-11-12 | 제일모직주식회사 | Anisotropic conducting film comprising conductive adhesive layer and a semiconductor device connected by the film |
KR101991190B1 (en) * | 2015-02-27 | 2019-06-19 | 데쿠세리아루즈 가부시키가이샤 | Reel, film connecting body, film winding mounting body and manufacturing method of film connecting body |
JP2016160027A (en) * | 2015-02-27 | 2016-09-05 | デクセリアルズ株式会社 | Reel for adhesive film, and connected body used for the same |
CN107298330B (en) * | 2016-04-14 | 2020-06-12 | 康菲德斯合股公司 | Method for arranging a material web on a core |
JP6668164B2 (en) * | 2016-05-20 | 2020-03-18 | デクセリアルズ株式会社 | Adhesive tape structure |
CN109575829B (en) * | 2017-12-29 | 2021-05-07 | 宁波大榭开发区综研化学有限公司 | Segment difference multilayer composite film and coiled material and preparation method thereof |
WO2021039565A1 (en) * | 2019-08-26 | 2021-03-04 | リンテック株式会社 | Laminate manufacturing method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04332782A (en) * | 1991-05-07 | 1992-11-19 | Sekisui Chem Co Ltd | Rolled tacky tape |
JPH05330722A (en) * | 1992-05-25 | 1993-12-14 | Nitto Denko Corp | Tape dispenser |
JPH0724947U (en) * | 1993-10-07 | 1995-05-12 | 祐久 小松 | Adhesive tape |
CH689482A5 (en) * | 1995-07-31 | 1999-05-14 | Tela Papierfabrik Ag | Paper-roll with closed end |
JP4465788B2 (en) * | 2000-03-28 | 2010-05-19 | 日立化成工業株式会社 | Anisotropic conductive tape and reel |
EP1249729A3 (en) * | 2001-04-12 | 2005-07-13 | Fuji Photo Film Co., Ltd. | Rolled article, and method of and apparatus for processing rolled article |
DE10123980B4 (en) * | 2001-05-17 | 2008-01-10 | Tesa Ag | final insulation |
JP4239585B2 (en) * | 2002-12-24 | 2009-03-18 | 日立化成工業株式会社 | Adhesive tape connection method and adhesive tape connector |
KR100838880B1 (en) * | 2002-07-30 | 2008-06-16 | 히다치 가세고교 가부시끼가이샤 | Adhesive tape, its connecting method, manufacturing method, crimping method |
JP2004077789A (en) * | 2002-08-19 | 2004-03-11 | Konica Minolta Holdings Inc | Light-shielding flange member |
-
2006
- 2006-06-29 JP JP2006179765A patent/JP4238885B2/en not_active Expired - Fee Related
- 2006-08-23 KR KR1020060079857A patent/KR100889648B1/en active Active
- 2006-08-30 CN CN201010003397A patent/CN101792075A/en active Pending
- 2006-08-30 TW TW095132019A patent/TW200715672A/en unknown
- 2006-08-30 CN CNA2006101219806A patent/CN1923654A/en active Pending
- 2006-08-30 CN CN2009101684040A patent/CN101665195B/en active Active
- 2006-08-30 CN CN2009101682990A patent/CN101683934B/en active Active
- 2006-08-30 CN CN201110307866.3A patent/CN102514986B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN102514986A (en) | 2012-06-27 |
KR20070026029A (en) | 2007-03-08 |
CN1923654A (en) | 2007-03-07 |
JP4238885B2 (en) | 2009-03-18 |
CN101792075A (en) | 2010-08-04 |
CN101683934A (en) | 2010-03-31 |
CN101665195B (en) | 2012-07-25 |
KR100889648B1 (en) | 2009-03-19 |
CN101683934B (en) | 2012-06-13 |
CN101665195A (en) | 2010-03-10 |
CN102514986B (en) | 2016-04-27 |
TWI301339B (en) | 2008-09-21 |
JP2007092028A (en) | 2007-04-12 |
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