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TW200712089A - Epoxy resin composition for sealing up optical semiconductor - Google Patents

Epoxy resin composition for sealing up optical semiconductor

Info

Publication number
TW200712089A
TW200712089A TW095124238A TW95124238A TW200712089A TW 200712089 A TW200712089 A TW 200712089A TW 095124238 A TW095124238 A TW 095124238A TW 95124238 A TW95124238 A TW 95124238A TW 200712089 A TW200712089 A TW 200712089A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
sealing
optical semiconductor
resin composition
alkyl
Prior art date
Application number
TW095124238A
Other languages
Chinese (zh)
Inventor
Michiharu Okubo
Shinji Yamashita
Jiro Yamamoto
Original Assignee
San Apro Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Apro Ltd filed Critical San Apro Ltd
Publication of TW200712089A publication Critical patent/TW200712089A/en

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

This invention provides an epoxy resin composition, inter alia, for sealing up the optical semiconductor materials; wherein the said composition has excellent humid-thermal resistance against metal erosion under high temperature and high humidity and has no coloration and less color change during heating and curing. The composition comprises (A) an epoxy resin, (B) an acid anhydride-based curing agent, and (C) a quaternary ammonium organic acid-based curing acceleration agent represented as formula (1): (wherein R1 is C1-12 alkyl; R2 is C1-3 alkyl; X- is conjugate base of organic acid).
TW095124238A 2005-07-05 2006-07-04 Epoxy resin composition for sealing up optical semiconductor TW200712089A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005196073A JP2007016063A (en) 2005-07-05 2005-07-05 Epoxy resin composition for sealing semiconductor

Publications (1)

Publication Number Publication Date
TW200712089A true TW200712089A (en) 2007-04-01

Family

ID=37753510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124238A TW200712089A (en) 2005-07-05 2006-07-04 Epoxy resin composition for sealing up optical semiconductor

Country Status (2)

Country Link
JP (1) JP2007016063A (en)
TW (1) TW200712089A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106941098A (en) * 2015-11-02 2017-07-11 联发科技股份有限公司 Semiconductor package and method of manufacturing the same
US10847488B2 (en) 2015-11-02 2020-11-24 Mediatek Inc. Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
CN112420532A (en) * 2019-02-22 2021-02-26 西安航思半导体有限公司 Packaging process of integrated circuit device
CN112435975A (en) * 2019-02-22 2021-03-02 西安航思半导体有限公司 Chip packaging structure
CN113451226A (en) * 2019-03-06 2021-09-28 西安航思半导体有限公司 Heat-resistant QFN (quad Flat No lead) packaged semiconductor device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080655A (en) * 2008-09-25 2010-04-08 Asahi Kasei Electronics Co Ltd Semiconductor element
JP2012077257A (en) * 2010-10-06 2012-04-19 Daicel Corp Method for producing cured product, and cured product
JP6401041B2 (en) * 2014-12-19 2018-10-03 株式会社ダイセル Curable epoxy resin composition
JP6072138B2 (en) * 2015-05-28 2017-02-01 株式会社ダイセル Method for producing cured product and cured product

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716643B2 (en) * 1993-03-04 1998-02-18 住友ベークライト株式会社 Liquid epoxy resin composition
JP2002105291A (en) * 2000-07-27 2002-04-10 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing photosemiconductor and photosemiconductor device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106941098A (en) * 2015-11-02 2017-07-11 联发科技股份有限公司 Semiconductor package and method of manufacturing the same
US10037936B2 (en) 2015-11-02 2018-07-31 Mediatek Inc. Semiconductor package with coated bonding wires and fabrication method thereof
US10847488B2 (en) 2015-11-02 2020-11-24 Mediatek Inc. Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
US11257780B2 (en) 2015-11-02 2022-02-22 Mediatek Inc. Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
CN112420532A (en) * 2019-02-22 2021-02-26 西安航思半导体有限公司 Packaging process of integrated circuit device
CN112435975A (en) * 2019-02-22 2021-03-02 西安航思半导体有限公司 Chip packaging structure
CN112420532B (en) * 2019-02-22 2022-07-19 西安航思半导体有限公司 Packaging process of pin-free DFN packaging device
CN112435975B (en) * 2019-02-22 2022-07-19 西安航思半导体有限公司 Heat dissipation DFN semiconductor device packaging structure
CN113451226A (en) * 2019-03-06 2021-09-28 西安航思半导体有限公司 Heat-resistant QFN (quad Flat No lead) packaged semiconductor device
CN113451227A (en) * 2019-03-06 2021-09-28 西安航思半导体有限公司 High-reliability QFN (quad Flat No lead) packaging device structure
CN113451226B (en) * 2019-03-06 2022-07-19 西安航思半导体有限公司 Heat-resistant QFN (quad Flat No lead) packaging semiconductor device
CN113451227B (en) * 2019-03-06 2022-07-19 西安航思半导体有限公司 High-reliability QFN (quad Flat No lead) packaging device structure

Also Published As

Publication number Publication date
JP2007016063A (en) 2007-01-25

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