TW200709230A - Process for producing articles having an electrically conductive coating - Google Patents
Process for producing articles having an electrically conductive coatingInfo
- Publication number
- TW200709230A TW200709230A TW095117185A TW95117185A TW200709230A TW 200709230 A TW200709230 A TW 200709230A TW 095117185 A TW095117185 A TW 095117185A TW 95117185 A TW95117185 A TW 95117185A TW 200709230 A TW200709230 A TW 200709230A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrically conductive
- conductive coating
- producing articles
- articles
- coating
- Prior art date
Links
- 239000012799 electrically-conductive coating Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002923 metal particle Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2601/00—Inorganic fillers
- B05D2601/20—Inorganic fillers used for non-pigmentation effect
- B05D2601/28—Metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The present invention relates to a process for producing articles having on at least part of their surface an electrically conductive coating by at least partly coating a substrate with a composition comprising finely divided electrically conductive metal particles and a binder and subjecting the coated substrate to at least one treatment with water in the presence of a halide ion source at a temperature in the range from ambient temperature to 200 DEG C. The process of the invention allows articles having an electrically conductive coating to be produced in a simple, rapid and mild way.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05018399 | 2005-08-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200709230A true TW200709230A (en) | 2007-03-01 |
TWI400718B TWI400718B (en) | 2013-07-01 |
Family
ID=35636958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095117185A TWI400718B (en) | 2005-08-24 | 2006-05-15 | Process for producing articles having an electrically conductive coating |
Country Status (13)
Country | Link |
---|---|
US (1) | US9603256B2 (en) |
EP (1) | EP1917111B1 (en) |
JP (1) | JP4943435B2 (en) |
CN (1) | CN101262957B (en) |
AU (1) | AU2006284245B2 (en) |
CA (1) | CA2619997C (en) |
DK (1) | DK1917111T3 (en) |
ES (1) | ES2535231T3 (en) |
PL (1) | PL1917111T3 (en) |
PT (1) | PT1917111E (en) |
RU (1) | RU2402385C2 (en) |
TW (1) | TWI400718B (en) |
WO (1) | WO2007022810A1 (en) |
Families Citing this family (26)
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DE102007041752A1 (en) * | 2007-09-04 | 2009-03-05 | Bielomatik Leuze Gmbh + Co Kg | Chip module for an RFID system |
JP5087384B2 (en) * | 2007-12-14 | 2012-12-05 | 三菱製紙株式会社 | Manufacturing method of conductive member and conductive member |
US8153203B2 (en) * | 2009-01-12 | 2012-04-10 | The United States Of America As Represented By The Secretary Of The Navy | Conductive microcylinder-based paints for integrated antennas |
US9127367B2 (en) * | 2010-09-02 | 2015-09-08 | Nippon Steel & Sumitomo Metal Corporation | Precoated metal sheet excellent in conductivity and corrosion resistance |
TWI481326B (en) * | 2011-11-24 | 2015-04-11 | Showa Denko Kk | A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating |
WO2013081664A1 (en) | 2011-12-02 | 2013-06-06 | E. I. Du Pont De Nemours And Company | Conductive metal composition |
RU2507301C1 (en) * | 2012-08-16 | 2014-02-20 | Закрытое акционерное общество "Галилео Нанотех" | Manufacturing method of rfid antennae operating in ultrahigh frequency range |
JP5765741B2 (en) | 2012-08-28 | 2015-08-19 | 日本ペイント・オートモーティブコーティングス株式会社 | High-design multilayer coating method |
RU2527458C1 (en) * | 2012-12-13 | 2014-08-27 | Открытое акционерное общество "Государственный оптический институт им. С.И. Вавилова" | Application of electrically conducting coating of sun shade |
JP6286448B2 (en) * | 2013-01-23 | 2018-02-28 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | Flexible conductive ink |
US8968824B2 (en) * | 2013-03-14 | 2015-03-03 | Dowa Electronics Materials Co., Ltd. | Method for producing silver conductive film |
WO2014186677A1 (en) | 2013-05-16 | 2014-11-20 | Lord Corporation | Aqueous conductive coating |
US9374907B2 (en) * | 2013-06-24 | 2016-06-21 | Xerox Corporation | Method of improving sheet resistivity of printed conductive inks |
US20140374672A1 (en) * | 2013-06-24 | 2014-12-25 | Xerox Corporation | Conductive metal inks with polyvinylbutyral binder |
US20140374671A1 (en) * | 2013-06-24 | 2014-12-25 | Xerox Corporation | Conductive metal inks with polyvinylbutyral and polyvinylpyrrolidone binder |
US20160215441A1 (en) * | 2013-08-09 | 2016-07-28 | Florida State University Research Foundation, Inc. | Conductive Composite Materials Containing Multi-Scale High Conductive Particles and Methods |
US20150240099A1 (en) * | 2014-02-24 | 2015-08-27 | Xerox Corporation | Silver flake conductive paste ink with nickel particles |
US10246599B2 (en) * | 2014-03-17 | 2019-04-02 | Xerox Corporation | Ink composition and method of determining a degree of curing of the ink composition |
RU2581084C2 (en) * | 2014-06-26 | 2016-04-10 | Федеральное государственное бюджетное учреждение науки Ордена Трудового Красного Знамени Институт нефтехимического синтеза им. А.В. Топчиева Российской академии наук (ИНХС РАН) | Method of producing composite lacquer for electroconductive material |
RU2580355C1 (en) * | 2014-11-24 | 2016-04-10 | Общество с ограниченной ответственностью "Энкон-сервис" (ООО "Энкон-сервис") | Method for application of metal coating on current-transmitting surfaces of contact joints |
US11189393B2 (en) * | 2015-03-23 | 2021-11-30 | Bando Chemical Industries, Ltd. | Conductive coated composite body and method for producing same |
RU2620435C1 (en) * | 2016-07-14 | 2017-05-25 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Башкирский государственный университет" | Electroducing metal-complete polymer compositions for 3d-printing |
CN106570959A (en) * | 2016-11-01 | 2017-04-19 | 通化师范学院 | Intelligent anti-theft electric control door-lock system based on GSM module |
CN107573745B (en) * | 2017-08-17 | 2018-09-11 | 北京梦之墨科技有限公司 | A kind of coating for EMI shielding material and preparation method thereof |
RU2710688C1 (en) * | 2019-04-24 | 2020-01-09 | Джамиля Викторовна Чайкина | Child constructor, electroconductive composition and method of its manufacturing (versions), method for formation of electroconductive tracks and hand tool (versions) |
WO2024181929A1 (en) * | 2023-03-02 | 2024-09-06 | Nanyang Technological University | Printed porous elastomeric conductors for stretchable electronics |
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US3498958A (en) * | 1968-06-27 | 1970-03-03 | Nat Starch Chem Corp | Water-and oil repellency agents |
US3779878A (en) * | 1969-06-16 | 1973-12-18 | Libbey Owens Ford Co | Method of producing antenna type windshields |
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DE2114934A1 (en) * | 1971-03-27 | 1972-10-05 | Remag Ag Zweigniederlassung Mu | Coating steel frame ends - to prevent rusting |
HU174316B (en) * | 1976-12-10 | 1979-12-28 | Hajtomuevek Es Festoberendeze | Method and surface coating line for coating surfaces |
US4522888A (en) * | 1980-12-29 | 1985-06-11 | General Electric Company | Electrical conductors arranged in multiple layers |
US4921755A (en) * | 1988-03-23 | 1990-05-01 | Eastman Kodak Company | Coating composition and coated article |
JP2606504B2 (en) * | 1991-10-07 | 1997-05-07 | 株式会社アドユニオン研究所 | Electromagnetic wave shielding material and method of manufacturing the same |
US5286415A (en) * | 1992-12-28 | 1994-02-15 | Advanced Products, Inc. | Water-based polymer thick film conductive ink |
DE69737328T2 (en) | 1997-02-20 | 2007-11-22 | Partnerships Ltd., Inc. | LOW TEMPERATURE PROCESSES AND COMPOSITIONS FOR THE PRODUCTION OF ELECTRIC LADDER |
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CA2451636A1 (en) | 2001-06-28 | 2003-01-09 | Parelec, Inc. | Low temperature method and compositions for producing electrical conductors |
US20030066756A1 (en) * | 2001-10-04 | 2003-04-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
DE10302596A1 (en) * | 2002-01-24 | 2003-08-28 | Shipley Company Marlborough | Treatment of metal surfaces with a modified oxide exchange compound |
US20030151028A1 (en) * | 2002-02-14 | 2003-08-14 | Lawrence Daniel P. | Conductive flexographic and gravure ink |
AU2002333686A1 (en) * | 2002-08-22 | 2004-03-11 | Agfa-Gevaert | Process for preparing a substantially transparent conductive layer configuration |
ITGE20020104A1 (en) | 2002-11-22 | 2004-05-23 | Fabrizio Parodi | QUICKLY HEATING POLYMERIC COMPOSITIONS |
US20040178391A1 (en) * | 2003-01-29 | 2004-09-16 | Conaghan Brian F. | High conductivity inks with low minimum curing temperatures |
US7881808B2 (en) * | 2006-03-29 | 2011-02-01 | Cardiac Pacemakers, Inc. | Conductive polymeric coating with optional biobeneficial topcoat for a medical lead |
JP2007284276A (en) * | 2006-04-14 | 2007-11-01 | Nippon Sheet Glass Co Ltd | Windowpane with conductive ceramic sintered compact, and its manufacturing method |
JP5087384B2 (en) * | 2007-12-14 | 2012-12-05 | 三菱製紙株式会社 | Manufacturing method of conductive member and conductive member |
-
2006
- 2006-05-15 PL PL06742922T patent/PL1917111T3/en unknown
- 2006-05-15 TW TW095117185A patent/TWI400718B/en active
- 2006-05-15 AU AU2006284245A patent/AU2006284245B2/en not_active Ceased
- 2006-05-15 CN CN2006800306735A patent/CN101262957B/en not_active Expired - Fee Related
- 2006-05-15 RU RU2008110957/05A patent/RU2402385C2/en not_active IP Right Cessation
- 2006-05-15 US US12/064,769 patent/US9603256B2/en active Active
- 2006-05-15 EP EP06742922.5A patent/EP1917111B1/en active Active
- 2006-05-15 JP JP2008527318A patent/JP4943435B2/en active Active
- 2006-05-15 PT PT67429225T patent/PT1917111E/en unknown
- 2006-05-15 DK DK06742922.5T patent/DK1917111T3/en active
- 2006-05-15 WO PCT/EP2006/004572 patent/WO2007022810A1/en active Application Filing
- 2006-05-15 ES ES06742922.5T patent/ES2535231T3/en active Active
- 2006-05-15 CA CA2619997A patent/CA2619997C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080246007A1 (en) | 2008-10-09 |
JP4943435B2 (en) | 2012-05-30 |
PT1917111E (en) | 2015-05-18 |
CN101262957B (en) | 2011-06-29 |
DK1917111T3 (en) | 2015-04-27 |
AU2006284245A1 (en) | 2007-03-01 |
RU2402385C2 (en) | 2010-10-27 |
CN101262957A (en) | 2008-09-10 |
RU2008110957A (en) | 2009-09-27 |
JP2009506524A (en) | 2009-02-12 |
WO2007022810A1 (en) | 2007-03-01 |
CA2619997C (en) | 2013-08-13 |
EP1917111B1 (en) | 2015-01-21 |
AU2006284245B2 (en) | 2010-11-18 |
ES2535231T3 (en) | 2015-05-06 |
EP1917111A1 (en) | 2008-05-07 |
US9603256B2 (en) | 2017-03-21 |
CA2619997A1 (en) | 2007-03-01 |
PL1917111T3 (en) | 2015-07-31 |
TWI400718B (en) | 2013-07-01 |
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