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TW200708749A - Substrate inspection device and substrate inspection method - Google Patents

Substrate inspection device and substrate inspection method

Info

Publication number
TW200708749A
TW200708749A TW095122773A TW95122773A TW200708749A TW 200708749 A TW200708749 A TW 200708749A TW 095122773 A TW095122773 A TW 095122773A TW 95122773 A TW95122773 A TW 95122773A TW 200708749 A TW200708749 A TW 200708749A
Authority
TW
Taiwan
Prior art keywords
substrate
tested
substrate inspection
cooling
heating
Prior art date
Application number
TW095122773A
Other languages
Chinese (zh)
Other versions
TWI405983B (en
Inventor
Hikari Ogata
Norihiro Ota
Ryota Amakawa
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005245060A external-priority patent/JP2007059727A/en
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW200708749A publication Critical patent/TW200708749A/en
Application granted granted Critical
Publication of TWI405983B publication Critical patent/TWI405983B/en

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention provides a substrate inspection device and a substrate inspection method. According to an objective of the present invention, a temperature stress is applied to a substrate to be tested the time needed in inspecting the substrate is reduced. The invented substrate inspection device includes: a cooling keeper (22) including a cooling pan (221) for cooling on a substrate to be tested (8); a heating keeper (24) including a heating pan (241) for heating the substrate to be tested (8); a transport part (32) for transporting the substrate to be tested (8) to the above-mentioned loading positions of the cooling pan (221) and the heating pan (241) according to a preset sequence; and movable probes (37, 38) for inspecting the substrate to be tested (8) after being cooled by the cooling keeper (22) and the substrate to be tested (8) after being heated by the heating keeper (24).
TW95122773A 2005-08-25 2006-06-23 Substrate inspection device and substrate inspection method TWI405983B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005245060A JP2007059727A (en) 2005-08-25 2005-08-25 Substrate inspection device and substrate inspection method

Publications (2)

Publication Number Publication Date
TW200708749A true TW200708749A (en) 2007-03-01
TWI405983B TWI405983B (en) 2013-08-21

Family

ID=49484541

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95122773A TWI405983B (en) 2005-08-25 2006-06-23 Substrate inspection device and substrate inspection method

Country Status (1)

Country Link
TW (1) TWI405983B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470245B (en) * 2011-12-05 2015-01-21 Nihon Micronics Kk A probe assembly for inspecting a semiconductor element for power, and an inspection apparatus using the same
CN112849866A (en) * 2019-11-27 2021-05-28 株式会社大福 Article conveying device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD589322S1 (en) 2006-10-05 2009-03-31 Lowe's Companies, Inc. Tool handle

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727819A (en) * 1993-07-13 1995-01-31 Minato Electron Kk Carrier board having heating, cooling and heat keeping function means
JPH07294595A (en) * 1994-04-28 1995-11-10 Ando Electric Co Ltd Automatic handler with carrier circulating in high/low temperature baths
US5708222A (en) * 1994-08-01 1998-01-13 Tokyo Electron Limited Inspection apparatus, transportation apparatus, and temperature control apparatus
JP3494871B2 (en) * 1997-02-12 2004-02-09 東京エレクトロン株式会社 Probe device and probe method
JP2000174416A (en) * 1998-12-07 2000-06-23 Matsushita Electric Ind Co Ltd Method of inspecting printed wiring board and inspecting device thereof
JP2000329809A (en) * 1999-05-17 2000-11-30 Advantest Corp Testing device for electronic part substrate and testing method therefor
JP2003028918A (en) * 2001-05-10 2003-01-29 Shinano Electronics:Kk Handling equipment for testing electronic component, ic test handler, and pump for liquid nitrogen
JP3786091B2 (en) * 2002-03-22 2006-06-14 セイコーエプソン株式会社 Electronic device manufacturing apparatus, electronic device manufacturing method, and electronic device manufacturing program
JP4659328B2 (en) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 Probe device for controlling the temperature of an object to be inspected

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470245B (en) * 2011-12-05 2015-01-21 Nihon Micronics Kk A probe assembly for inspecting a semiconductor element for power, and an inspection apparatus using the same
CN112849866A (en) * 2019-11-27 2021-05-28 株式会社大福 Article conveying device

Also Published As

Publication number Publication date
TWI405983B (en) 2013-08-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees