TW200706662A - Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof - Google Patents
Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereofInfo
- Publication number
- TW200706662A TW200706662A TW095110265A TW95110265A TW200706662A TW 200706662 A TW200706662 A TW 200706662A TW 095110265 A TW095110265 A TW 095110265A TW 95110265 A TW95110265 A TW 95110265A TW 200706662 A TW200706662 A TW 200706662A
- Authority
- TW
- Taiwan
- Prior art keywords
- tin
- strip
- based alloy
- peeling resistance
- mass
- Prior art date
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 4
- 229910006680 Si—Zn—Sn Inorganic materials 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 title abstract 2
- 239000000956 alloy Substances 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title abstract 2
- 229910052718 tin Inorganic materials 0.000 abstract 5
- 230000001105 regulatory effect Effects 0.000 abstract 3
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- 229910052785 arsenic Inorganic materials 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Conductive Materials (AREA)
Abstract
To provide a Cu-Ni-Si-Zn-Sn based alloy strip improved in the thermal peeling resistance of tin plating, and to provide a tin plated strip thereof. The copper alloy strip contains, by mass, Ni of 1.0 to 4.5%, Si of 1/6 to 1/4 to the mass% of Ni, Zn of 0.1 to 2.0% and Sn of 0.05 to 2.0% Sn, and, if required, comprising one or more kinds selected from Ag, Cr, Co, Mn and Mo by 0.01 to 0.5% in total, wherein the total of P, As, Sb and Bi concentrations is regulated to be below 100 mass ppm, the total of Ca and Mg concentrations is regulated to be below 100 mass ppm, O and S concentrations are regulated to be below15 mass ppm, respectively, and further, its electric conductivity EC (%LACS) is controlled to the range in the following inequality: 50< EC+(22×[%Sn]+4.5×[%Zn])< 60 ([%I] represents the mass% concentration of the element I).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005096487 | 2005-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200706662A true TW200706662A (en) | 2007-02-16 |
| TWI323287B TWI323287B (en) | 2010-04-11 |
Family
ID=37030538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095110265A TW200706662A (en) | 2005-03-29 | 2006-03-24 | Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100774226B1 (en) |
| CN (1) | CN100576366C (en) |
| TW (1) | TW200706662A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI505900B (en) * | 2012-06-19 | 2015-11-01 | Murata Manufacturing Co | Joint member |
| TWI561688B (en) * | 2011-08-12 | 2016-12-11 | Mitsubishi Materials Corp |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8698002B2 (en) * | 2009-01-20 | 2014-04-15 | Mitsubishi Shindoh Co., Ltd. | Conductive member and method for producing the same |
| JPWO2011039875A1 (en) | 2009-09-30 | 2013-02-21 | Jx日鉱日石金属株式会社 | Cu-Ni-Si alloy tin-plated strip with excellent heat-resistant peelability for tin plating |
| CN103014409B (en) * | 2011-09-21 | 2016-04-06 | 三菱伸铜株式会社 | The Cu-Ni-Si series copper alloy of projection welding excellent and manufacture method thereof |
| CN105112715B (en) * | 2015-09-08 | 2017-10-20 | 长沙中工新材料有限公司 | The method that CuZnNiSi alloys and preparation method thereof and the alloy prepare band |
| CN105695797A (en) * | 2016-04-20 | 2016-06-22 | 苏州市相城区明达复合材料厂 | Bronze alloy for casting parts |
| DE102016008753B4 (en) * | 2016-07-18 | 2020-03-12 | Wieland-Werke Ag | Copper-nickel-tin alloy, process for their production and their use |
| KR101900793B1 (en) | 2017-06-08 | 2018-09-20 | 주식회사 풍산 | A method for tin plating copper alloy for electrical and electronic and car components, and tin plated copper alloy therefrom |
| CN115233131A (en) * | 2022-06-17 | 2022-10-25 | 武汉凌云光电科技有限责任公司 | A method for laser cladding and polishing after non-ferrous metal immersion tin plating |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0830235B2 (en) * | 1991-04-24 | 1996-03-27 | 日鉱金属株式会社 | Copper alloy for conductive spring |
| JP3391427B2 (en) * | 1996-05-14 | 2003-03-31 | 三菱伸銅株式会社 | Plated copper alloy sheet and connector manufactured from the sheet |
-
2006
- 2006-03-24 TW TW095110265A patent/TW200706662A/en unknown
- 2006-03-29 KR KR1020060028172A patent/KR100774226B1/en active Active
- 2006-03-29 CN CN200610068327A patent/CN100576366C/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI561688B (en) * | 2011-08-12 | 2016-12-11 | Mitsubishi Materials Corp | |
| TWI505900B (en) * | 2012-06-19 | 2015-11-01 | Murata Manufacturing Co | Joint member |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100576366C (en) | 2009-12-30 |
| KR20060105509A (en) | 2006-10-11 |
| CN1841570A (en) | 2006-10-04 |
| TWI323287B (en) | 2010-04-11 |
| KR100774226B1 (en) | 2007-11-07 |
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