[go: up one dir, main page]

TW200705512A - Protective film forming method - Google Patents

Protective film forming method

Info

Publication number
TW200705512A
TW200705512A TW095101459A TW95101459A TW200705512A TW 200705512 A TW200705512 A TW 200705512A TW 095101459 A TW095101459 A TW 095101459A TW 95101459 A TW95101459 A TW 95101459A TW 200705512 A TW200705512 A TW 200705512A
Authority
TW
Taiwan
Prior art keywords
wafer
processed
protective film
film forming
center area
Prior art date
Application number
TW095101459A
Other languages
Chinese (zh)
Other versions
TWI368254B (en
Inventor
Nobuyasu Kitahara
Hitoshi Hoshino
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200705512A publication Critical patent/TW200705512A/en
Application granted granted Critical
Publication of TWI368254B publication Critical patent/TWI368254B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

A method of forming a protective film of a resin on the surface to be processed of a wafer, comprising a wafer holding step for holding the wafer on a spinner table in such a manner that the surface to be processed faces up; a resin dropping step for dropping a predetermined amount of a liquid resin onto the center area of the surface to be processed of the wafer held on the spinner table; and a protective film forming step for blowing air toward the periphery through the center area of the surface to be processed of the wafer while rotating the spinner table, to cause the liquid resin dropped on the center area of the surface to be processed of the wafer to flow toward the periphery.
TW095101459A 2005-01-18 2006-01-13 Protective film forming method TWI368254B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005009820A JP4666583B2 (en) 2005-01-18 2005-01-18 Protective coating method

Publications (2)

Publication Number Publication Date
TW200705512A true TW200705512A (en) 2007-02-01
TWI368254B TWI368254B (en) 2012-07-11

Family

ID=36746128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101459A TWI368254B (en) 2005-01-18 2006-01-13 Protective film forming method

Country Status (3)

Country Link
JP (1) JP4666583B2 (en)
DE (1) DE102006002240B4 (en)
TW (1) TWI368254B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105405753A (en) * 2014-09-09 2016-03-16 株式会社迪思科 Covering method of protective coverage film
TWI594808B (en) * 2013-02-01 2017-08-11 Disco Corp Resin coating device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130818A (en) * 2006-11-21 2008-06-05 Disco Abrasive Syst Ltd Laser processing equipment
JP6655881B2 (en) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 Manufacturing method of lens with light-shielding layer
JP6655882B2 (en) * 2015-03-31 2020-03-04 日本電産サンキョー株式会社 Manufacturing equipment for lenses with light-blocking layers
JP6987448B2 (en) * 2017-11-14 2022-01-05 株式会社ディスコ Manufacturing method for small diameter wafers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501361B1 (en) 1991-02-25 2002-05-15 Canon Kabushiki Kaisha Electrical connecting member and method of manufacturing the same
JPH10294252A (en) * 1997-04-17 1998-11-04 Sony Corp Spin coating device
JP2001176775A (en) * 1999-12-16 2001-06-29 Mitsumi Electric Co Ltd Method for forming coating film on semiconductor wafer
JP2003037053A (en) 2001-07-26 2003-02-07 Toshiba Corp Coating type film forming method, coating type film forming apparatus, and method of manufacturing semiconductor device
JP4724988B2 (en) * 2001-09-05 2011-07-13 ソニー株式会社 Method of manufacturing a pseudo wafer for manufacturing a multichip module
JP2004322168A (en) 2003-04-25 2004-11-18 Disco Abrasive Syst Ltd Laser processing equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594808B (en) * 2013-02-01 2017-08-11 Disco Corp Resin coating device
CN105405753A (en) * 2014-09-09 2016-03-16 株式会社迪思科 Covering method of protective coverage film
CN105405753B (en) * 2014-09-09 2020-09-18 株式会社迪思科 Method for covering protective cover film

Also Published As

Publication number Publication date
TWI368254B (en) 2012-07-11
DE102006002240B4 (en) 2014-08-21
JP4666583B2 (en) 2011-04-06
DE102006002240A1 (en) 2006-08-17
JP2006198450A (en) 2006-08-03

Similar Documents

Publication Publication Date Title
TW200705512A (en) Protective film forming method
TW200715396A (en) Manufacturing method for a semiconductor device
SG126885A1 (en) Semiconductor wafer and processing method for same
TW200715488A (en) Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
KR102326457B1 (en) Method of producing protective member
SG115843A1 (en) Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
WO2003082542A1 (en) Parting method for fragile material substrate and parting device using the method
TW200704791A (en) Device and method of forming film
WO2007067348A3 (en) A molded rotatable base for a porous pad
SG122969A1 (en) Protective film agent for laser dicing and wafer processing method using the protective film agent
SG157327A1 (en) Substrate table, lithographic apparatus and device manufacturing method
MY143700A (en) Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension
EP1865546A4 (en) ABRASIVE FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD FOR POLISHING SAID DEVICE AND METHOD FOR MANUFACTURING THE SAME
SG157999A1 (en) Protective film forming apparatus and laser processing apparatus
CN207593516U (en) A kind of semiconductor wafer polishing apparatus vacuum suction template and burnishing device
CN108356684A (en) A kind of semiconductor wafer polishing apparatus vacuum suction template and burnishing device
WO2010117405A3 (en) Semiconductor processing
TW200520084A (en) Method and apparatus for joining protective tape to semiconductor wafer
TW200710967A (en) Method of manufacturing semiconductor device
AU2001292642A1 (en) Temporary protective covers
CN104505337B (en) Irregular wafer thinning method
CN205668654U (en) A kind of mobile phone glass touch screen processing protecting film and touch screen
EP1837901A4 (en) Process for producing abrasive material, abrasive material produced by the same, and process for producing silicon wafer
TWI601643B (en) Plate affixed to the method
EP1595979A4 (en) Substrate for forming magnetic garnet single-crystal film, process for producing the same, optical device and process for producing the same