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TW200704329A - Printed wiring board and semiconductor testing device - Google Patents

Printed wiring board and semiconductor testing device

Info

Publication number
TW200704329A
TW200704329A TW095117277A TW95117277A TW200704329A TW 200704329 A TW200704329 A TW 200704329A TW 095117277 A TW095117277 A TW 095117277A TW 95117277 A TW95117277 A TW 95117277A TW 200704329 A TW200704329 A TW 200704329A
Authority
TW
Taiwan
Prior art keywords
distance
hole
wiring board
printed wiring
wiring layer
Prior art date
Application number
TW095117277A
Other languages
Chinese (zh)
Inventor
Shuji Uchiyama
Akifumi Sato
Original Assignee
Japan Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Engineering Co Ltd filed Critical Japan Engineering Co Ltd
Publication of TW200704329A publication Critical patent/TW200704329A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The disclosed printed wiring board comprises a first wiring layer formed by spacing only a first distance from the through hole, a second wiring layer formed by spacing only a smaller second distance than the first distance from the through hole, a contact layer electrically connected to a connection pin inserted in the through hole, a third wiring layer electrically connected to the contact layer, a fourth wiring layer formed by spacing only a third distance from the through hole, and a fifth wiring layer formed separated by a distance larger by fourth distance than the third distance from the through hole. Therefore, a printed wiring board for transmitting and receiving a device to be tested and ideal waveform via a through hole can be provided.
TW095117277A 2005-06-01 2006-05-16 Printed wiring board and semiconductor testing device TW200704329A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005161783A JP2006337159A (en) 2005-06-01 2005-06-01 Printed wiring board and semiconductor testing device

Publications (1)

Publication Number Publication Date
TW200704329A true TW200704329A (en) 2007-01-16

Family

ID=37484840

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117277A TW200704329A (en) 2005-06-01 2006-05-16 Printed wiring board and semiconductor testing device

Country Status (4)

Country Link
JP (1) JP2006337159A (en)
KR (1) KR20060125563A (en)
CN (1) CN1874647B (en)
TW (1) TW200704329A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101394246B1 (en) 2012-08-20 2014-05-16 (주) 예스티 Burn-in-board rack of vertical type
JP6873217B1 (en) * 2019-12-05 2021-05-19 三菱電機株式会社 Power converter

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6319282U (en) * 1986-07-21 1988-02-08
JPH0720943Y2 (en) * 1989-05-18 1995-05-15 株式会社東芝 Multilayer printed wiring board
JPH0463086U (en) * 1990-10-05 1992-05-29
JPH0968557A (en) * 1995-08-31 1997-03-11 Mitsubishi Electric Corp Burn-in board
JP3206561B2 (en) * 1998-10-01 2001-09-10 日本電気株式会社 Multilayer wiring board
JP3539331B2 (en) * 2000-02-28 2004-07-07 日本電気株式会社 Multilayer printed wiring board

Also Published As

Publication number Publication date
JP2006337159A (en) 2006-12-14
CN1874647A (en) 2006-12-06
KR20060125563A (en) 2006-12-06
CN1874647B (en) 2010-12-08

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