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TW200703529A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
TW200703529A
TW200703529A TW095112353A TW95112353A TW200703529A TW 200703529 A TW200703529 A TW 200703529A TW 095112353 A TW095112353 A TW 095112353A TW 95112353 A TW95112353 A TW 95112353A TW 200703529 A TW200703529 A TW 200703529A
Authority
TW
Taiwan
Prior art keywords
bonding
section
wire
connection
overlapped
Prior art date
Application number
TW095112353A
Other languages
Chinese (zh)
Other versions
TWI332243B (en
Inventor
Tatsunari Mii
Toshihiko Toyama
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200703529A publication Critical patent/TW200703529A/en
Application granted granted Critical
Publication of TWI332243B publication Critical patent/TWI332243B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
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    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
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Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)

Abstract

The present invention provides a wire bonding method, which enables ball-less bonding, without having to modify an existing wire bonding device at all, and to improve junction properties in bonding. A tail section 11 is formed to a length, projecting slightly from the tip section of a capillary 6. In a first bonding process, the tail section 11 is bonded to a first bond point to form a first lower-bonding section 20, a wire 10 is overlapped to the first lower-bonding section 20 for connection, to form a first intermediate bonding section 22, and the wire 10 is overlapped onto the first intermediate bonding section 22 for connection to form a first upper-bonding section 24. In a second bonding process, the wire 10 is bonded to a second bond point to form a second lower-bonding section 30, and the wire 10 is overlapped to the second lower-bonding section 30 again for connection, to form a second upper-bonding section 32.
TW095112353A 2005-06-28 2006-04-07 Wire bonding method TW200703529A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005187517A JP4369401B2 (en) 2005-06-28 2005-06-28 Wire bonding method

Publications (2)

Publication Number Publication Date
TW200703529A true TW200703529A (en) 2007-01-16
TWI332243B TWI332243B (en) 2010-10-21

Family

ID=37750799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112353A TW200703529A (en) 2005-06-28 2006-04-07 Wire bonding method

Country Status (3)

Country Link
JP (1) JP4369401B2 (en)
KR (1) KR100808510B1 (en)
TW (1) TW200703529A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100932680B1 (en) 2007-02-21 2009-12-21 가부시키가이샤 신가와 Semiconductor device and wire bonding method
WO2013049965A1 (en) * 2011-10-08 2013-04-11 Sandisk Semiconductor (Shanghai) Co., Ltd. Dragonfly wire bonding
TWI585927B (en) * 2014-02-21 2017-06-01 新川股份有限公司 Semiconductor device manufacturing method, semiconductor device, and wire bonding device
JP2014140074A (en) * 2014-04-17 2014-07-31 Toshiba Corp Semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854232B2 (en) * 2003-02-17 2006-12-06 株式会社新川 Bump forming method and wire bonding method
JP2005159267A (en) * 2003-10-30 2005-06-16 Shinkawa Ltd Semiconductor and wire bonding method

Also Published As

Publication number Publication date
KR100808510B1 (en) 2008-02-29
KR20070000976A (en) 2007-01-03
TWI332243B (en) 2010-10-21
JP2007012642A (en) 2007-01-18
JP4369401B2 (en) 2009-11-18

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MM4A Annulment or lapse of patent due to non-payment of fees