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TW200702921A - Alkali-developable resin composition - Google Patents

Alkali-developable resin composition

Info

Publication number
TW200702921A
TW200702921A TW095116579A TW95116579A TW200702921A TW 200702921 A TW200702921 A TW 200702921A TW 095116579 A TW095116579 A TW 095116579A TW 95116579 A TW95116579 A TW 95116579A TW 200702921 A TW200702921 A TW 200702921A
Authority
TW
Taiwan
Prior art keywords
alkali
resin composition
acid anhydride
compound
developable
Prior art date
Application number
TW095116579A
Other languages
Chinese (zh)
Other versions
TWI384326B (en
Inventor
Tomohito Ishiguro
Masaaki Shimizu
Satoru Kanda
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW200702921A publication Critical patent/TW200702921A/en
Application granted granted Critical
Publication of TWI384326B publication Critical patent/TWI384326B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)

Abstract

To provide an alkali-developable resin composition giving an alkali-developable photosensitive resin composition which is excellent in sensitivity, resolution, transparency, an adhesion property, alkali resistance and so on, and which forms a fine pattern with excellent accuracy. The alkali-developable resin composition contains a reaction product obtained by esterifying an epoxy addition product having a structure resulting from addition of an unsaturated monobasic acid (B) and a cyclic terpene skeleton containing phenolic compound (C-1) obtained by adding phenol or an alkylphenol compound to a cyclic terpene compound and/or an aliphatic alkylphenol compound (C-2) to a polyfunctional epoxy resin (A) with a polybasic acid anhydride (D), and has a structure resulting from addition conducted so as to have at least one ethylenically unsaturated group in the molecule, wherein the esterification is conducted with a ratio of 0.2-0.8 acid anhydride structure of the polybasic acid anhydride (D) to one hydroxyl group of the epoxy addition product.
TW095116579A 2005-05-11 2006-05-10 Alkaline developing resin composition TWI384326B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005138282A JP4641861B2 (en) 2005-05-11 2005-05-11 Alkali developable resin composition

Publications (2)

Publication Number Publication Date
TW200702921A true TW200702921A (en) 2007-01-16
TWI384326B TWI384326B (en) 2013-02-01

Family

ID=37538325

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116579A TWI384326B (en) 2005-05-11 2006-05-10 Alkaline developing resin composition

Country Status (4)

Country Link
JP (1) JP4641861B2 (en)
KR (1) KR101236851B1 (en)
CN (1) CN1896871B (en)
TW (1) TWI384326B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101370818B1 (en) * 2006-12-20 2014-03-07 미쓰비시 가가꾸 가부시키가이샤 Oxime ester compound, photopolymerization initiator, photopolymerizable composition, color filter, and liquid crystal display device
CN102858884B (en) * 2010-09-22 2015-10-21 株式会社艾迪科 Dye well coloring photosensitive combination

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3148429B2 (en) * 1992-02-04 2001-03-19 新日本製鐵株式会社 Photopolymerizable unsaturated compound and alkali-developable photosensitive resin composition
JP2684948B2 (en) * 1993-02-03 1997-12-03 株式会社日本触媒 Liquid photosensitive resin composition
JP3274545B2 (en) * 1993-07-16 2002-04-15 株式会社日本触媒 Liquid photosensitive resin composition
JP3156559B2 (en) * 1994-09-14 2001-04-16 株式会社日本触媒 Method for producing photosensitive resin and liquid photosensitive resin composition
DE69534788T2 (en) * 1994-09-14 2006-11-02 Nippon Shokubai Co. Ltd. PROCESS FOR PREPARING PHOTO SENSITIVE RESIN AND LIQUID PHOTO SENSITIVE RESIN COMPOSITION
JPH08208805A (en) * 1995-01-30 1996-08-13 Asahi Denka Kogyo Kk Polyol resin composition
JP3686699B2 (en) * 1995-03-31 2005-08-24 太陽インキ製造株式会社 Alkali-developable photocurable / thermosetting resin composition
JP3496674B2 (en) * 1997-11-28 2004-02-16 日立化成工業株式会社 Photocurable resin composition and photosensitive element using the same
JP3659825B2 (en) * 1997-12-19 2005-06-15 太陽インキ製造株式会社 Photocurable / thermosetting composition capable of alkali development and cured film obtained therefrom
JP3541136B2 (en) * 1997-12-19 2004-07-07 太陽インキ製造株式会社 Alkali-developable photocurable / thermocurable composition and cured film obtained therefrom
WO2001053890A1 (en) * 2000-01-17 2001-07-26 Showa Highpolymer Co., Ltd. Photosensitive resin composition
ATE427519T1 (en) * 2000-09-16 2009-04-15 Goo Chemical Co Ltd UV CURED RESIN COMPOSITION AND PHOTOLÍT RESIST DYE COMPRISING THE COMPOSITION
JP3996802B2 (en) * 2002-05-15 2007-10-24 太陽インキ製造株式会社 Low radiation photocurable / thermosetting resin composition and cured film thereof
JP2004359890A (en) * 2003-06-06 2004-12-24 Japan U-Pica Co Ltd Photocurable resin composition, photosensitive thermosetting resin composition and its cured product
WO2006030631A1 (en) * 2004-09-17 2006-03-23 Toppan Printing Co., Ltd. Colored alkali developable photosensitive resin composition, and color filter using said colored alkali developable photosensitive resin composition

Also Published As

Publication number Publication date
JP2006317574A (en) 2006-11-24
JP4641861B2 (en) 2011-03-02
CN1896871B (en) 2013-06-12
KR20060116744A (en) 2006-11-15
TWI384326B (en) 2013-02-01
KR101236851B1 (en) 2013-02-26
CN1896871A (en) 2007-01-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees