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TW200700911A - Radiation-sensitive resin composition, layered product, and process for producing the same - Google Patents

Radiation-sensitive resin composition, layered product, and process for producing the same

Info

Publication number
TW200700911A
TW200700911A TW095118972A TW95118972A TW200700911A TW 200700911 A TW200700911 A TW 200700911A TW 095118972 A TW095118972 A TW 095118972A TW 95118972 A TW95118972 A TW 95118972A TW 200700911 A TW200700911 A TW 200700911A
Authority
TW
Taiwan
Prior art keywords
radiation
resin composition
layered product
sensitive resin
producing
Prior art date
Application number
TW095118972A
Other languages
Chinese (zh)
Inventor
Hiroaki Shindou
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Publication of TW200700911A publication Critical patent/TW200700911A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)

Abstract

A radiation-sensitive resin composition which comprises a cycloolefin polymer, a radiation-sensitive compound, and 10-60 parts by weight of an alkoxysilane compound per 100 parts by weight of the cycloolefin polymer; a layered product which comprises a base and, superposed thereon, a resinous film formed from the composition; and a process for producing a layered product which comprises the step of forming a resinous film on a base from the composition. The radiation-sensitive resin composition gives a resinous film having excellent high-temperature shape retention. It has a wide temperature margin for melt flowing in forming a patterned resinous film and is suitable for use also as a resist material.
TW095118972A 2005-06-01 2006-05-29 Radiation-sensitive resin composition, layered product, and process for producing the same TW200700911A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005161891 2005-06-01

Publications (1)

Publication Number Publication Date
TW200700911A true TW200700911A (en) 2007-01-01

Family

ID=37481778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118972A TW200700911A (en) 2005-06-01 2006-05-29 Radiation-sensitive resin composition, layered product, and process for producing the same

Country Status (5)

Country Link
JP (1) JPWO2006129875A1 (en)
KR (1) KR20080013963A (en)
CN (1) CN101189552A (en)
TW (1) TW200700911A (en)
WO (1) WO2006129875A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636883B (en) * 2013-11-28 2018-10-01 日本瑞翁股份有限公司 Laminated body

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007078820A (en) * 2005-09-12 2007-03-29 Sumitomo Bakelite Co Ltd Photosensitive resin composition, and semiconductor device and display device using same
JP5369420B2 (en) * 2007-10-23 2013-12-18 Ｊｓｒ株式会社 Photosensitive resin composition for insulating film formation
JP5516844B2 (en) * 2008-03-24 2014-06-11 Ｊｓｒ株式会社 Radiation-sensitive resin composition, spacer, method for producing the same, and liquid crystal display device
TWI559079B (en) * 2008-11-18 2016-11-21 Sumitomo Chemical Co Photosensitive resin composition and display device
CN103069339B (en) * 2010-08-27 2015-11-25 住友电木株式会社 Photoresist resin combination
JP5640864B2 (en) * 2011-03-31 2014-12-17 日本ゼオン株式会社 Negative photosensitive resin composition and electronic component
JP6094228B2 (en) * 2013-01-15 2017-03-15 住友ベークライト株式会社 Photosensitive resin composition
JP6094229B2 (en) * 2013-01-15 2017-03-15 住友ベークライト株式会社 Photosensitive resin composition
WO2018012534A1 (en) * 2016-07-14 2018-01-18 日本ゼオン株式会社 Infrared led
JP7131499B2 (en) * 2018-08-09 2022-09-06 信越化学工業株式会社 Resist material and pattern forming method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339115A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Photosensitive recording medium
JP3387195B2 (en) * 1994-03-31 2003-03-17 ジェイエスアール株式会社 Thermosetting resin composition and protective film formed therefrom
JPH10307388A (en) * 1997-05-06 1998-11-17 Jsr Corp Radiation-sensitive resin composition
JPH11143072A (en) * 1997-11-06 1999-05-28 Jsr Corp UV sensitive resin composition
JP2001064357A (en) * 1999-08-25 2001-03-13 Hitachi Chem Co Ltd Curable composition, insutating film using the same, color filter protective film, color filter, and liquid crystal display element
WO2004029720A1 (en) * 2002-09-30 2004-04-08 Zeon Corporation Radiation-sensitive resin composition, patterned resin film, method for formation of the film, and use thereof
TWI295410B (en) * 2002-11-29 2008-04-01 Zeon Corp Radiation-sensitive resin composition
JP2005041172A (en) * 2003-07-25 2005-02-17 Nippon Zeon Co Ltd Laminate and use thereof
JP4228858B2 (en) * 2003-09-25 2009-02-25 日本ゼオン株式会社 Process for producing hydrogenated cycloaliphatic olefin polymer and use thereof
JP4170277B2 (en) * 2004-09-30 2008-10-22 住友ベークライト株式会社 Photosensitive resin composition and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636883B (en) * 2013-11-28 2018-10-01 日本瑞翁股份有限公司 Laminated body

Also Published As

Publication number Publication date
JPWO2006129875A1 (en) 2009-01-08
WO2006129875A1 (en) 2006-12-07
KR20080013963A (en) 2008-02-13
CN101189552A (en) 2008-05-28

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