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TW200644742A - Warpage-preventing substrate - Google Patents

Warpage-preventing substrate

Info

Publication number
TW200644742A
TW200644742A TW094119652A TW94119652A TW200644742A TW 200644742 A TW200644742 A TW 200644742A TW 094119652 A TW094119652 A TW 094119652A TW 94119652 A TW94119652 A TW 94119652A TW 200644742 A TW200644742 A TW 200644742A
Authority
TW
Taiwan
Prior art keywords
warpage
substrate
preventing substrate
preventing
conductive traces
Prior art date
Application number
TW094119652A
Other languages
Chinese (zh)
Other versions
TWI259743B (en
Inventor
Tong-Hong Wang
Chang-Chi Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37873512&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200644742(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94119652A priority Critical patent/TWI259743B/en
Application granted granted Critical
Publication of TWI259743B publication Critical patent/TWI259743B/en
Publication of TW200644742A publication Critical patent/TW200644742A/en

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a warpage-preventing substrate. The warpage-preventing substrate includes a substrate, a plurality of conductive traces disposed on a surface of the substrate, and a plurality of non-functional wavy traces disposed on the surface of the substrate free of the conductive traces.
TW94119652A 2005-06-14 2005-06-14 Warpage-preventing substrate TWI259743B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94119652A TWI259743B (en) 2005-06-14 2005-06-14 Warpage-preventing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94119652A TWI259743B (en) 2005-06-14 2005-06-14 Warpage-preventing substrate

Publications (2)

Publication Number Publication Date
TWI259743B TWI259743B (en) 2006-08-01
TW200644742A true TW200644742A (en) 2006-12-16

Family

ID=37873512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94119652A TWI259743B (en) 2005-06-14 2005-06-14 Warpage-preventing substrate

Country Status (1)

Country Link
TW (1) TWI259743B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804169B (en) * 2022-01-20 2023-06-01 矽品精密工業股份有限公司 Electronic package and substrate structure thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6092572B2 (en) 2012-10-30 2017-03-08 株式会社日本マイクロニクス Multilayer wiring board and probe card using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804169B (en) * 2022-01-20 2023-06-01 矽品精密工業股份有限公司 Electronic package and substrate structure thereof

Also Published As

Publication number Publication date
TWI259743B (en) 2006-08-01

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Legal Events

Date Code Title Description
MC4A Revocation of granted patent