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TW200644273A - Package structure of light emitting diode chip with high thermal conduction and the manufacturing method thereof - Google Patents

Package structure of light emitting diode chip with high thermal conduction and the manufacturing method thereof

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Publication number
TW200644273A
TW200644273A TW094118713A TW94118713A TW200644273A TW 200644273 A TW200644273 A TW 200644273A TW 094118713 A TW094118713 A TW 094118713A TW 94118713 A TW94118713 A TW 94118713A TW 200644273 A TW200644273 A TW 200644273A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
diode chip
manufacturing
high thermal
Prior art date
Application number
TW094118713A
Other languages
Chinese (zh)
Other versions
TWI281272B (en
Inventor
Zong-Jie Chen
Rong-Sheng Lin
Li-Wei Chen
Ching-Hsien Lin
qing-long Cai
Original Assignee
Alliance Optotek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alliance Optotek Corp filed Critical Alliance Optotek Corp
Priority to TW94118713A priority Critical patent/TWI281272B/en
Publication of TW200644273A publication Critical patent/TW200644273A/en
Application granted granted Critical
Publication of TWI281272B publication Critical patent/TWI281272B/en

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Abstract

The invention provides a package structure of light emitting diode chip with high thermal conduction and the manufacturing method. It provides a printed circuit board with plural penetrable holes spaced at interval. One surface of the printed circuit board is arranged with plural circuit wires. The other surface of the printed circuit board is bonded with a metal substrate by a glue layer. At least one light emitting diode chip is placed into each penetrable hole to stick on the metal substrate. Each light emitting diode chip and the circuit trace of printed circuit board is electrically connected via wire bonding. Finally, each penetrable hole is encapsulated to seal each light emitting diode chip into each penetrable hole. It can achieve high thermal conduction by the invented structure and the manufacturing method so as to obtain the effects of reducing the manufacturing hours as well as cost and raising the output.
TW94118713A 2005-06-07 2005-06-07 Package structure of light emitting diode chip with high thermal conduction and the manufacturing method thereof TWI281272B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94118713A TWI281272B (en) 2005-06-07 2005-06-07 Package structure of light emitting diode chip with high thermal conduction and the manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94118713A TWI281272B (en) 2005-06-07 2005-06-07 Package structure of light emitting diode chip with high thermal conduction and the manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200644273A true TW200644273A (en) 2006-12-16
TWI281272B TWI281272B (en) 2007-05-11

Family

ID=38741682

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94118713A TWI281272B (en) 2005-06-07 2005-06-07 Package structure of light emitting diode chip with high thermal conduction and the manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI281272B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422079B (en) * 2010-09-07 2014-01-01 Univ Kun Shan Method for manufacturing a heat dissipation bulk of a semiconductor light-emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422079B (en) * 2010-09-07 2014-01-01 Univ Kun Shan Method for manufacturing a heat dissipation bulk of a semiconductor light-emitting device

Also Published As

Publication number Publication date
TWI281272B (en) 2007-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees