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TW200644148A - Electrostatic chuck apparatus - Google Patents

Electrostatic chuck apparatus

Info

Publication number
TW200644148A
TW200644148A TW095102287A TW95102287A TW200644148A TW 200644148 A TW200644148 A TW 200644148A TW 095102287 A TW095102287 A TW 095102287A TW 95102287 A TW95102287 A TW 95102287A TW 200644148 A TW200644148 A TW 200644148A
Authority
TW
Taiwan
Prior art keywords
areas
electrostatic chuck
power supply
electrode
electrode patterns
Prior art date
Application number
TW095102287A
Other languages
Chinese (zh)
Other versions
TWI381479B (en
Inventor
Yoshikazu Ohtani
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200644148A publication Critical patent/TW200644148A/en
Application granted granted Critical
Publication of TWI381479B publication Critical patent/TWI381479B/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

An electrostatic chuck apparatus is recovered to attract a work in a short time by a simple process. An electrode (1) is divided into a plurality of areas (1a) within a plane parallel to the work (W), independent electrode patterns (1b) are arranged for the areas (1a), respectively, power supply sections (1c) for the electrode patterns (1b) are arranged in the areas (1a), respectively, and power supply to the electrode pattern (1b) arranged on the discretionary area (1a) is partially stopped by cutting the discretionary power supply section (1c). Thus, even when a part of a film plane in the areas (1a) is destroyed, though the electrode pattern (1b) in the destroyed area (1a) selectively does not function as an electrostatic chuck, the electrode patterns (1b) in other areas (1a) function as electrostatic chucks.
TW095102287A 2005-04-28 2006-01-20 Electrostatic chuck device TWI381479B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/008227 WO2006117871A1 (en) 2005-04-28 2005-04-28 Electrostatic chuck apparatus

Publications (2)

Publication Number Publication Date
TW200644148A true TW200644148A (en) 2006-12-16
TWI381479B TWI381479B (en) 2013-01-01

Family

ID=37307678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102287A TWI381479B (en) 2005-04-28 2006-01-20 Electrostatic chuck device

Country Status (5)

Country Link
JP (1) JP3995706B2 (en)
KR (1) KR100940549B1 (en)
CN (1) CN100481369C (en)
TW (1) TWI381479B (en)
WO (1) WO2006117871A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495536B (en) * 2008-10-20 2015-08-11 Creative Tech Corp Electrostatic suction cup inspection method and electrostatic sucker device

Families Citing this family (31)

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JP4976915B2 (en) 2007-05-08 2012-07-18 新光電気工業株式会社 Electrostatic chuck and method of manufacturing electrostatic chuck
JP5328726B2 (en) 2009-08-25 2013-10-30 三星ディスプレイ株式會社 Thin film deposition apparatus and organic light emitting display device manufacturing method using the same
JP5677785B2 (en) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． Thin film deposition apparatus and organic light emitting display device manufacturing method using the same
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101084184B1 (en) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 Thin film deposition apparatus
KR101174875B1 (en) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
KR101193186B1 (en) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
KR101156441B1 (en) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 Apparatus for thin layer deposition
KR101202348B1 (en) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101223723B1 (en) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
KR101678056B1 (en) 2010-09-16 2016-11-22 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
KR101723506B1 (en) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same
KR101738531B1 (en) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 Method for manufacturing of organic light emitting display apparatus, and organic light emitting display apparatus manufactured by the method
KR20120045865A (en) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 Apparatus for organic layer deposition
KR20120065789A (en) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 Apparatus for organic layer deposition
KR101760897B1 (en) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 Deposition source and apparatus for organic layer deposition having the same
KR101923174B1 (en) 2011-05-11 2018-11-29 삼성디스플레이 주식회사 ESC, apparatus for thin layer deposition therewith, and method for manufacturing of organic light emitting display apparatus using the same
KR101852517B1 (en) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same
KR101840654B1 (en) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 Apparatus for organic layer deposition and method for manufacturing of organic light emitting display apparatus using the same
KR101857249B1 (en) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 Patterning slit sheet assembly, apparatus for organic layer deposition, method for manufacturing organic light emitting display apparatus and organic light emitting display apparatus
KR101826068B1 (en) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 Apparatus for thin layer deposition
KR20130004830A (en) 2011-07-04 2013-01-14 삼성디스플레이 주식회사 Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same
KR20130069037A (en) 2011-12-16 2013-06-26 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus
KR101959974B1 (en) 2012-07-10 2019-07-16 삼성디스플레이 주식회사 Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
KR102013318B1 (en) 2012-09-20 2019-08-23 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus
KR102108361B1 (en) 2013-06-24 2020-05-11 삼성디스플레이 주식회사 Apparatus for monitoring deposition rate, apparatus for organic layer deposition using the same, method for monitoring deposition rate, and method for manufacturing of organic light emitting display apparatus using the same
KR102162797B1 (en) 2013-12-23 2020-10-08 삼성디스플레이 주식회사 Method for manufacturing of organic light emitting display apparatus
KR102155583B1 (en) * 2018-06-25 2020-09-14 (주) 엔피홀딩스 Back electrodes type electro static chuck of laminating apparatus, its manufacturing method and laminating apparatus
KR102155584B1 (en) * 2018-06-25 2020-09-14 (주) 엔피홀딩스 preventing diffused reflection type electro static chuck of laminating apparatus and laminating apparatus

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
JPH05291562A (en) * 1992-04-09 1993-11-05 Toshiba Corp Electrostatic chuck device
US5801915A (en) * 1994-01-31 1998-09-01 Applied Materials, Inc. Electrostatic chuck having a unidirectionally conducting coupler layer
JP4493251B2 (en) * 2001-12-04 2010-06-30 Ｔｏｔｏ株式会社 Electrostatic chuck module and substrate processing apparatus
KR100511854B1 (en) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 Electrostatic chuck device
CN100345274C (en) * 2003-02-27 2007-10-24 株式会社日立高新技术 Method of producing electrostatic suction cup
JP5004436B2 (en) * 2005-05-23 2012-08-22 東京エレクトロン株式会社 Electrostatic adsorption electrode and processing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495536B (en) * 2008-10-20 2015-08-11 Creative Tech Corp Electrostatic suction cup inspection method and electrostatic sucker device

Also Published As

Publication number Publication date
TWI381479B (en) 2013-01-01
JPWO2006117871A1 (en) 2008-12-18
KR20080009285A (en) 2008-01-28
CN101167174A (en) 2008-04-23
CN100481369C (en) 2009-04-22
KR100940549B1 (en) 2010-02-10
JP3995706B2 (en) 2007-10-24
WO2006117871A1 (en) 2006-11-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees