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TW200643403A - Inspection device, inspection method, and positioning method - Google Patents

Inspection device, inspection method, and positioning method

Info

Publication number
TW200643403A
TW200643403A TW095106064A TW95106064A TW200643403A TW 200643403 A TW200643403 A TW 200643403A TW 095106064 A TW095106064 A TW 095106064A TW 95106064 A TW95106064 A TW 95106064A TW 200643403 A TW200643403 A TW 200643403A
Authority
TW
Taiwan
Prior art keywords
stage
inspection
angle
axis
alignment mark
Prior art date
Application number
TW095106064A
Other languages
Chinese (zh)
Inventor
Yukinari Maeyama
Shuji Yamaoka
Shogo Ishioka
Original Assignee
Oht Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oht Inc filed Critical Oht Inc
Publication of TW200643403A publication Critical patent/TW200643403A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

An inspection device and inspection method, where, even if an object to be inspected is changed, an inspection probe can be automatically in contact with a desired portion of the object. The θ-axis of a stage of a jig positioning device (400), on which alignment section ((40), inspection jig (300)) is placed, is moved in a plus direction (S5) to recognize the position of an alignment mark, and the recognized position is recorded together with the angle (θ Angle) of rotation of the stage (S6). Then, the θ-axis of the stage is moved, for example, in a minus direction (S7), the position of the alignment mark is recognized, and the recognized position is recorded together with the angle of (θ Angle) rotation of the stage (S8). The positional coordinates of imaging cameras (500, 600) measured from the θ-axis center of the stage are obtained by calculation based on the position of the alignment mark relative to the centers of the cameras and on the angle of the θ-axis (S10). The positions (displacement amount) of the imaged position of the alignment mark on a tape substrate relative to the imaging center positions of the cameras are measured (S11), and the amount of movement of the stage is calculated to positionally control the inspection jig (S12).
TW095106064A 2005-02-23 2006-02-23 Inspection device, inspection method, and positioning method TW200643403A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005047937A JP4799880B2 (en) 2005-02-23 2005-02-23 Inspection apparatus, inspection method, and positioning method

Publications (1)

Publication Number Publication Date
TW200643403A true TW200643403A (en) 2006-12-16

Family

ID=36927518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106064A TW200643403A (en) 2005-02-23 2006-02-23 Inspection device, inspection method, and positioning method

Country Status (3)

Country Link
JP (1) JP4799880B2 (en)
TW (1) TW200643403A (en)
WO (1) WO2006090891A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550373B (en) * 2011-11-14 2016-09-21 鴻海精密工業股份有限公司 System and method for automatically replacing measuring probes

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120027B2 (en) 2007-09-28 2013-01-16 東京エレクトロン株式会社 Probe apparatus and probing method
WO2009147712A1 (en) * 2008-06-02 2009-12-10 株式会社アドバンテスト Tcp handling apparatus and tcp test apparatus
JP4725650B2 (en) * 2009-01-07 2011-07-13 東京エレクトロン株式会社 Probe device
JP4878385B2 (en) * 2009-12-07 2012-02-15 コグネックス・コーポレイション Object control system, object control method, program, and rotation center position specifying device
KR101891681B1 (en) * 2016-11-07 2018-08-24 (주)하이비젼시스템 Apparatus for alignment of pivot point using vision
TWI794324B (en) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 Substrate inspection device, inspection position correction method, position correction information generation method, and position correction information generation system
CN107806844B (en) * 2017-11-24 2023-08-01 成都瑞戈科技有限公司 Automatic detector for dust cover framework deviation
JP7018784B2 (en) * 2018-02-23 2022-02-14 東京エレクトロン株式会社 Contact accuracy assurance method and inspection equipment
CN111102940B (en) * 2018-10-29 2022-07-05 北京金风科创风电设备有限公司 Blade pitch angle deviation detection method, device, storage medium and system
KR102153910B1 (en) * 2019-04-09 2020-09-09 주식회사 이엘피 Inspection apparatus capable of aligning and inspecting both sides of display panel
CN112683422A (en) * 2020-12-02 2021-04-20 昆山广钰德智能装备有限公司 Exhaust temperature sensor detection equipment
CN116060329A (en) * 2023-02-17 2023-05-05 苏州天准科技股份有限公司 Electromagnetic valve detection equipment of automobile air shock absorber ware

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0662380U (en) * 1993-01-29 1994-09-02 安藤電気株式会社 Measuring mechanism for TAB
JPH11326229A (en) * 1998-05-21 1999-11-26 Hitachi Electron Eng Co Ltd Foreign matter inspection apparatus
JP4119137B2 (en) * 2002-02-27 2008-07-16 ヤマハ発動機株式会社 Parts testing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550373B (en) * 2011-11-14 2016-09-21 鴻海精密工業股份有限公司 System and method for automatically replacing measuring probes

Also Published As

Publication number Publication date
JP4799880B2 (en) 2011-10-26
JP2006234510A (en) 2006-09-07
WO2006090891A1 (en) 2006-08-31

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