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TW200643193A - Solder alloy for producing sputtering target and sputtering target using the same - Google Patents

Solder alloy for producing sputtering target and sputtering target using the same

Info

Publication number
TW200643193A
TW200643193A TW095121366A TW95121366A TW200643193A TW 200643193 A TW200643193 A TW 200643193A TW 095121366 A TW095121366 A TW 095121366A TW 95121366 A TW95121366 A TW 95121366A TW 200643193 A TW200643193 A TW 200643193A
Authority
TW
Taiwan
Prior art keywords
sputtering target
solder alloy
backing plate
bonding
present
Prior art date
Application number
TW095121366A
Other languages
Chinese (zh)
Other versions
TWI321159B (en
Inventor
Naoki Ono
Taizo Morinaka
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200643193A publication Critical patent/TW200643193A/en
Application granted granted Critical
Publication of TWI321159B publication Critical patent/TWI321159B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The solder alloy of the present invention is used for bonding a target material with a backing plate made of copper or copper alloy when producing sputtering target, and contains Zn 3-9 wt% and the remaining part being consisting of Sn and inevitable impurities. According to the solder alloy of the present invention, the pealing off of target material from backing plate is preventable even under a severe sputtering condition, moreover, the copper corrosion amount by backing plate in bonding is considerably reduced, and the strength deterioration due to repeat use of said backing plate is preventable, because a bonding material layer having high bonding strength can be formed even under high temperature. In addition, according to the solder alloy of the present invention, the apparatus and procedure required for making lining film may be omitted and the productivity of sputtering target can be greatly promoted because the wettability with target material is such excellent as to the degree that the lining film becomes not necessary.
TW095121366A 2005-06-15 2006-06-15 Solder alloy for producing sputtering target and sputtering target using the same TWI321159B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005175628 2005-06-15

Publications (2)

Publication Number Publication Date
TW200643193A true TW200643193A (en) 2006-12-16
TWI321159B TWI321159B (en) 2010-03-01

Family

ID=37518842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121366A TWI321159B (en) 2005-06-15 2006-06-15 Solder alloy for producing sputtering target and sputtering target using the same

Country Status (3)

Country Link
KR (1) KR100785208B1 (en)
CN (1) CN100590213C (en)
TW (1) TWI321159B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612025B (en) * 2015-09-23 2018-01-21 住華科技股份有限公司 Solder for fabricating sputtering target and applying method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102409300B (en) * 2011-09-07 2013-08-14 三峡大学 Oxide ceramic sputtering target and preparation method thereof and used brazing alloy
CN103785911B (en) * 2012-10-30 2016-03-09 宁波江丰电子材料股份有限公司 The welding method of target material assembly
JP5773335B2 (en) * 2013-12-09 2015-09-02 三菱マテリアル株式会社 In or In alloy sputtering target and method for producing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0704272B1 (en) * 1994-09-30 2002-01-09 AT&T Corp. Lead-free alloys for use in solder bonding
JP3319740B2 (en) * 2000-06-02 2002-09-03 株式会社日鉱マテリアルズ Brazing material coating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612025B (en) * 2015-09-23 2018-01-21 住華科技股份有限公司 Solder for fabricating sputtering target and applying method thereof

Also Published As

Publication number Publication date
TWI321159B (en) 2010-03-01
KR100785208B1 (en) 2007-12-11
CN100590213C (en) 2010-02-17
CN1880492A (en) 2006-12-20
KR20060131625A (en) 2006-12-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees