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TW200641055A - Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet - Google Patents

Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet

Info

Publication number
TW200641055A
TW200641055A TW095104939A TW95104939A TW200641055A TW 200641055 A TW200641055 A TW 200641055A TW 095104939 A TW095104939 A TW 095104939A TW 95104939 A TW95104939 A TW 95104939A TW 200641055 A TW200641055 A TW 200641055A
Authority
TW
Taiwan
Prior art keywords
addition
sensitive adhesive
pressure
curable silicone
silicone rubber
Prior art date
Application number
TW095104939A
Other languages
Chinese (zh)
Other versions
TWI379870B (en
Inventor
Noriyuki Meguriya
Tsutomu Nakamura
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200641055A publication Critical patent/TW200641055A/en
Application granted granted Critical
Publication of TWI379870B publication Critical patent/TWI379870B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

To provide an addition-curable silicone rubber composition that is excellent in moldability and gives a cured product having surface tackiness, appropriate rubber hardness and rubber strength, and heat resistance, and a pressure-sensitive adhesive rubber sheet obtained by curing the composition. The addition-curable silicone rubber composition comprises (A) an organopolysiloxane containing at least two alkenyl groups bonded to a silicon atom in one molecule, (B) a resinous copolymer mainly composed of an R3SiO1/2 unit (wherein R is a monovalent hydrocarbon group) and an SiO2 unit with a molar ratio [R3SiO1/2/SiO2] of 0.5-1.5 and the total amount of R of 0-0.0001 mol/g, (C) an organohydrogenpolysiloxane containing at least two Si-H groups in one molecule, (D) a fine powder silica, (E) a heat resistance-imparting agent and (F) an addition reaction catalyst, and gives the cured product having surface tackiness. The pressure-sensitive adhesive rubber sheet is obtained by curing the same.
TW095104939A 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet TW200641055A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037444A JP4525914B2 (en) 2005-02-15 2005-02-15 Addition-curing silicone rubber composition and adhesive rubber sheet

Publications (2)

Publication Number Publication Date
TW200641055A true TW200641055A (en) 2006-12-01
TWI379870B TWI379870B (en) 2012-12-21

Family

ID=36987076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104939A TW200641055A (en) 2005-02-15 2006-02-14 Addition-curable silicone rubber composition and pressure-sensitive adhesive rubber sheet

Country Status (3)

Country Link
JP (1) JP4525914B2 (en)
KR (1) KR101225391B1 (en)
TW (1) TW200641055A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102341469A (en) * 2009-03-04 2012-02-01 德莎欧洲公司 Adhesive tapes, especially adhesive tapes for bonding photovoltaic laminates
CN109863207A (en) * 2016-10-28 2019-06-07 信越化学工业株式会社 Heat resistance mixed milling type silicon rubber composition

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100839780B1 (en) * 2006-01-18 2008-06-19 주식회사 엘지화학 Adhesive for conveying flexible substrate
KR100831562B1 (en) 2006-03-23 2008-05-21 주식회사 엘지화학 Adhesive composition for conveying flexible substrate
KR100804359B1 (en) * 2006-12-04 2008-02-15 엘에스전선 주식회사 Automotive Rubber Hose
JP2008247812A (en) * 2007-03-30 2008-10-16 Gc Corp Silicone composition
JP5243775B2 (en) * 2007-11-14 2013-07-24 東海ゴム工業株式会社 Dielectric film and actuator, sensor, and transducer using the same
JP6024839B2 (en) 2014-01-31 2016-11-16 信越化学工業株式会社 Organopolysiloxane compound, method for producing the same, and addition-curable silicone composition
JP6733241B2 (en) 2016-03-18 2020-07-29 信越化学工業株式会社 Addition curable silicone rubber composition, method for producing the same and cured product
JP7046196B2 (en) 2018-08-10 2022-04-01 ダウ・東レ株式会社 Pressure-sensitive adhesive layer-forming organopolysiloxane composition and its use
JP7046198B2 (en) 2018-08-10 2022-04-01 ダウ・東レ株式会社 Pressure-sensitive adhesive layer-forming organopolysiloxane composition and its use
KR102525733B1 (en) 2018-08-10 2023-04-27 다우 도레이 캄파니 리미티드 Pressure-sensitive adhesive layer-forming organopolysiloxane composition and use thereof
EP3841178A4 (en) * 2018-08-23 2022-06-08 3M Innovative Properties Company TACKED AND FILLED SILICONE ADHESIVE COMPOSITIONS
EP4015216A4 (en) 2019-08-13 2023-08-16 Dow Toray Co., Ltd. Organopolysiloxane composition having pressure-sensitive adhesive layer formation properties, and use of said composition
KR20220045010A (en) 2019-08-13 2022-04-12 다우 도레이 캄파니 리미티드 Pressure-sensitive adhesive layer-forming organopolysiloxane composition and use thereof
EP4015215A4 (en) 2019-08-13 2023-08-23 Dow Toray Co., Ltd. Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof
CN114729190A (en) * 2019-11-25 2022-07-08 美国陶氏有机硅公司 Flame retardant polysiloxane compositions

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082886A (en) * 1989-08-28 1992-01-21 General Electric Company Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber
JP3712054B2 (en) * 2001-04-13 2005-11-02 信越化学工業株式会社 Sealing material for polymer electrolyte fuel cell separator
JP4140758B2 (en) * 2002-08-08 2008-08-27 大日本印刷株式会社 Blanket for offset printing and offset printing method
JP3912525B2 (en) * 2002-12-12 2007-05-09 信越化学工業株式会社 Addition-curing silicone rubber composition and adhesive rubber sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102341469A (en) * 2009-03-04 2012-02-01 德莎欧洲公司 Adhesive tapes, especially adhesive tapes for bonding photovoltaic laminates
CN109863207A (en) * 2016-10-28 2019-06-07 信越化学工业株式会社 Heat resistance mixed milling type silicon rubber composition
US10954385B2 (en) 2016-10-28 2021-03-23 Shin-Etsu Chemical Co., Ltd. Heat-resistant millable silicone rubber composition

Also Published As

Publication number Publication date
TWI379870B (en) 2012-12-21
KR101225391B1 (en) 2013-01-22
JP4525914B2 (en) 2010-08-18
KR20060092089A (en) 2006-08-22
JP2006225420A (en) 2006-08-31

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