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TW200640278A - Electret condenser silicon microphone and fabrication method of the same - Google Patents

Electret condenser silicon microphone and fabrication method of the same

Info

Publication number
TW200640278A
TW200640278A TW094114718A TW94114718A TW200640278A TW 200640278 A TW200640278 A TW 200640278A TW 094114718 A TW094114718 A TW 094114718A TW 94114718 A TW94114718 A TW 94114718A TW 200640278 A TW200640278 A TW 200640278A
Authority
TW
Taiwan
Prior art keywords
pcb
diaphragm
silicon chip
metal
metal perforated
Prior art date
Application number
TW094114718A
Other languages
Chinese (zh)
Other versions
TWI312638B (en
Inventor
Fang-Ching Lee
Dar-Ming Chiang
Wen-Ching Ko
Show-Hwai Chou
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW94114718A priority Critical patent/TWI312638B/en
Publication of TW200640278A publication Critical patent/TW200640278A/en
Application granted granted Critical
Publication of TWI312638B publication Critical patent/TWI312638B/en

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  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

An electret condenser silicon microphone having a silicon chip with diaphragm, a metal perforated plate, a printed circuit board (PCB), and a metal shell is provided. The silicon chip and the metal perforated plate are assembled as a parallel plate condenser having a predetermined bias by applying a electret layer within. The diaphragm is formed by using Micro-Electro-Mechanical System (MEMS) technology. The metal perforated plate having at least one hole is positioned under the silicon chip and separated from the diaphragm with a preset distance. The PCB is positioned under the metal perforated board and electrically connected to it. The metal shell is assembled on the PCB and contains the silicon chip and the metal perforated board assembled within. A through hole is formed on the shell to have the ambient acoustic pressure vibrate the diaphragm. So the parallel plate condenser generates a corresponding electric signal, which is processed and out put by the PCB.
TW94114718A 2005-05-06 2005-05-06 Electret condenser silicon microphone and fabrication method of the same TWI312638B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94114718A TWI312638B (en) 2005-05-06 2005-05-06 Electret condenser silicon microphone and fabrication method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94114718A TWI312638B (en) 2005-05-06 2005-05-06 Electret condenser silicon microphone and fabrication method of the same

Publications (2)

Publication Number Publication Date
TW200640278A true TW200640278A (en) 2006-11-16
TWI312638B TWI312638B (en) 2009-07-21

Family

ID=45072629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94114718A TWI312638B (en) 2005-05-06 2005-05-06 Electret condenser silicon microphone and fabrication method of the same

Country Status (1)

Country Link
TW (1) TWI312638B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090175477A1 (en) * 2007-08-20 2009-07-09 Yamaha Corporation Vibration transducer
TWI477156B (en) * 2008-12-17 2015-03-11 Goertek Inc Miniature condenser microphone
TWI486069B (en) * 2010-05-18 2015-05-21 Taiwan Carol Electronics Co Ltd Capacitive microphone process
US9258662B2 (en) 2013-02-18 2016-02-09 National Tsing Hua University Condenser microphone and manufacturing method thereof
TWI553884B (en) * 2013-06-05 2016-10-11 應美盛股份有限公司 Capacitive sensing structure with embedded acoustic channels and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9491531B2 (en) 2014-08-11 2016-11-08 3R Semiconductor Technology Inc. Microphone device for reducing noise coupling effect

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090175477A1 (en) * 2007-08-20 2009-07-09 Yamaha Corporation Vibration transducer
TWI477156B (en) * 2008-12-17 2015-03-11 Goertek Inc Miniature condenser microphone
TWI486069B (en) * 2010-05-18 2015-05-21 Taiwan Carol Electronics Co Ltd Capacitive microphone process
US9258662B2 (en) 2013-02-18 2016-02-09 National Tsing Hua University Condenser microphone and manufacturing method thereof
US9729990B2 (en) 2013-02-18 2017-08-08 National Tsing Hua University Manufacturing method of a condenser microphone
TWI553884B (en) * 2013-06-05 2016-10-11 應美盛股份有限公司 Capacitive sensing structure with embedded acoustic channels and method of manufacturing the same

Also Published As

Publication number Publication date
TWI312638B (en) 2009-07-21

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