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TW200639213A - Epoxy resin composition, cured article, semiconductor encapsulating material, novel epoxy resin, novel polyhydric compound and method of manufacturing the same - Google Patents

Epoxy resin composition, cured article, semiconductor encapsulating material, novel epoxy resin, novel polyhydric compound and method of manufacturing the same

Info

Publication number
TW200639213A
TW200639213A TW095113395A TW95113395A TW200639213A TW 200639213 A TW200639213 A TW 200639213A TW 095113395 A TW095113395 A TW 095113395A TW 95113395 A TW95113395 A TW 95113395A TW 200639213 A TW200639213 A TW 200639213A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
novel
resin composition
cured article
semiconductor encapsulating
Prior art date
Application number
TW095113395A
Other languages
Chinese (zh)
Inventor
Yutaka Sato
Ichirou Ogura
Yoshiyuki Takahashi
Kunihiro Morinaga
Kazuo Arita
Original Assignee
Dainippon Ink & Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals filed Critical Dainippon Ink & Chemicals
Publication of TW200639213A publication Critical patent/TW200639213A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

The present invention relates to an epoxy resin composition, a cured article, a semiconductor encapsulating material, a novel epoxy resin, a novel polyhydric compound and a method of manufacturing the same, wherein the epoxy resin composition has superior curing characteristics, and the cured article has good flame retardancy and heat resistant properties. The epoxy resin composition is suitable and useful in semiconductor encapsulating materials, print circuit substrates, coatings, and for injection use, and appropriately applicable to curing substances and curing agents of epoxy resin compositions.
TW095113395A 2005-04-15 2006-04-14 Epoxy resin composition, cured article, semiconductor encapsulating material, novel epoxy resin, novel polyhydric compound and method of manufacturing the same TW200639213A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005118201 2005-04-15
JP2005127829 2005-04-26
JP2005127828 2005-04-26
JP2005129423 2005-04-27

Publications (1)

Publication Number Publication Date
TW200639213A true TW200639213A (en) 2006-11-16

Family

ID=37115153

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113395A TW200639213A (en) 2005-04-15 2006-04-14 Epoxy resin composition, cured article, semiconductor encapsulating material, novel epoxy resin, novel polyhydric compound and method of manufacturing the same

Country Status (3)

Country Link
JP (1) JP5354309B2 (en)
TW (1) TW200639213A (en)
WO (1) WO2006112438A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7269665B2 (en) * 2018-08-06 2023-05-09 大八化学工業株式会社 Thermosetting resin composition containing flame retardant for thermosetting resin containing aromatic phosphate ester, cured product thereof, and use thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3587570B2 (en) * 1994-10-20 2004-11-10 三井化学株式会社 Benzylated polyphenols, their epoxy resins, their production methods and uses
JP4184109B2 (en) * 2003-02-14 2008-11-19 ジャパンエポキシレジン株式会社 Curing agent for epoxy resin and epoxy resin composition
JP4096806B2 (en) * 2003-05-13 2008-06-04 ジャパンエポキシレジン株式会社 Phenol resin, epoxy resin curing agent, and epoxy resin composition

Also Published As

Publication number Publication date
JP5354309B2 (en) 2013-11-27
WO2006112438A1 (en) 2006-10-26
JP2012067301A (en) 2012-04-05

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