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TW200637673A - Method of producing copper powder and copper powder - Google Patents

Method of producing copper powder and copper powder

Info

Publication number
TW200637673A
TW200637673A TW095108088A TW95108088A TW200637673A TW 200637673 A TW200637673 A TW 200637673A TW 095108088 A TW095108088 A TW 095108088A TW 95108088 A TW95108088 A TW 95108088A TW 200637673 A TW200637673 A TW 200637673A
Authority
TW
Taiwan
Prior art keywords
cuprous oxide
copper powder
water
copper salt
protective colloid
Prior art date
Application number
TW095108088A
Other languages
English (en)
Other versions
TWI309590B (en
Inventor
Tomoya Yamada
Koji Hirata
Original Assignee
Dowa Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co filed Critical Dowa Mining Co
Publication of TW200637673A publication Critical patent/TW200637673A/zh
Application granted granted Critical
Publication of TWI309590B publication Critical patent/TWI309590B/zh

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C5/00—Reinforcing elements, e.g. for concrete; Auxiliary elements therefor
    • E04C5/16—Auxiliary parts for reinforcements, e.g. connectors, spacers, stirrups
    • E04C5/162—Connectors or means for connecting parts for reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0002—Preliminary treatment
    • C22B15/001—Preliminary treatment with modification of the copper constituent
    • C22B15/0021—Preliminary treatment with modification of the copper constituent by reducing in gaseous or solid state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B7/00—Connections of rods or tubes, e.g. of non-circular section, mutually, including resilient connections
    • F16B7/04—Clamping or clipping connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Non-Insulated Conductors (AREA)
TW095108088A 2005-03-22 2006-03-10 Method of producing copper powder and copper powder TWI309590B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005081871A JP4821014B2 (ja) 2005-03-22 2005-03-22 銅粉の製造法

Publications (2)

Publication Number Publication Date
TW200637673A true TW200637673A (en) 2006-11-01
TWI309590B TWI309590B (en) 2009-05-11

Family

ID=37033869

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108088A TWI309590B (en) 2005-03-22 2006-03-10 Method of producing copper powder and copper powder

Country Status (5)

Country Link
US (1) US7534283B2 (zh)
JP (1) JP4821014B2 (zh)
KR (1) KR101236253B1 (zh)
CN (1) CN101011747B (zh)
TW (1) TWI309590B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI696509B (zh) * 2015-02-27 2020-06-21 日商日立化成股份有限公司 含銅粒子、導體形成組成物、導體的製造方法、導體以及電子零件
TWI791829B (zh) * 2018-05-16 2023-02-11 日商日本化學工業股份有限公司 光燒結型組成物及使用其的導電膜的形成方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2443412A (en) * 2006-11-06 2008-05-07 Nanotecture Ltd Using liquid crystals in the preparation of metals
WO2013008505A1 (ja) * 2011-07-14 2013-01-17 株式会社村田製作所 亜酸化銅粒子の還元方法、導体、配線パターン形成方法、電子部品及び配線基板
JP5724801B2 (ja) * 2011-09-29 2015-05-27 Jsr株式会社 組成物、銅膜および銅膜形成方法
JP5926644B2 (ja) 2011-09-30 2016-05-25 Ｄｏｗａエレクトロニクス株式会社 亜酸化銅粉末およびその製造方法
US10141082B2 (en) * 2012-11-02 2018-11-27 Korea Institute Of Science And Technology Oxidation resistant copper nanoparticles and method for producing same
CN105026079B (zh) * 2012-12-25 2017-12-26 户田工业株式会社 铜粉的制造方法以及铜粉、铜膏
JP6627228B2 (ja) * 2015-02-27 2020-01-08 日立化成株式会社 銅含有粒子、導体形成組成物、導体の製造方法、導体及び装置
JP6407850B2 (ja) * 2015-12-22 2018-10-17 石福金属興業株式会社 白金粉末の製造方法
JP6451679B2 (ja) * 2016-03-24 2019-01-16 カシオ計算機株式会社 銅ナノ粒子の製造方法
US10870587B2 (en) * 2016-11-17 2020-12-22 Nippon Chemical Industrial Co., Ltd. Cuprous oxide particle, method of producing the same, photosintering composition, method of forming conductive film using the same and paste of cuprous oxide particles
CN111957986B (zh) * 2020-08-20 2023-04-18 湖南泽宇新材料有限公司 一种球形纳米铜粉及其制备方法和应用
JP7412714B1 (ja) * 2022-10-31 2024-01-15 田中貴金属工業株式会社 金属粉末及び該金属粉末の製造方法並びに金属ペースト

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6415309A (en) * 1987-07-08 1989-01-19 Agency Ind Science Techn Production of metal fine powder
JPH0784605B2 (ja) 1988-05-17 1995-09-13 福田金属箔粉工業株式会社 銅微粉末の製造方法
JPH04235205A (ja) * 1991-01-09 1992-08-24 Sumitomo Metal Ind Ltd 銅粉の製造方法
JPH0557324A (ja) 1991-08-29 1993-03-09 Nippon Steel Corp 圧延材の加熱装置
JP3570591B2 (ja) * 1996-03-22 2004-09-29 株式会社村田製作所 銅粉末の製造方法
CN1060108C (zh) * 1997-01-21 2001-01-03 北京化工大学 超细铜粉的制备方法
JPH10317022A (ja) * 1997-05-22 1998-12-02 Daiken Kagaku Kogyo Kk 金属微粒子粉末の製造方法
JP2911429B2 (ja) 1997-06-04 1999-06-23 三井金属鉱業株式会社 銅微粉末の製造方法
JP4406738B2 (ja) * 2000-03-01 2010-02-03 Ｄｏｗａエレクトロニクス株式会社 粒度分布の小さい銅粉の製造法
JP4352121B2 (ja) * 2003-04-02 2009-10-28 Ｄｏｗａエレクトロニクス株式会社 銅粉の製造法
CN1191142C (zh) * 2003-08-12 2005-03-02 北京科技大学 一种纳米铜粉的制造方法
CN1238144C (zh) * 2003-11-05 2006-01-25 华南理工大学 一种结晶铜粉的制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI696509B (zh) * 2015-02-27 2020-06-21 日商日立化成股份有限公司 含銅粒子、導體形成組成物、導體的製造方法、導體以及電子零件
TWI791829B (zh) * 2018-05-16 2023-02-11 日商日本化學工業股份有限公司 光燒結型組成物及使用其的導電膜的形成方法

Also Published As

Publication number Publication date
US20060213328A1 (en) 2006-09-28
JP2006265585A (ja) 2006-10-05
US7534283B2 (en) 2009-05-19
CN101011747A (zh) 2007-08-08
KR20060102277A (ko) 2006-09-27
KR101236253B1 (ko) 2013-02-22
JP4821014B2 (ja) 2011-11-24
CN101011747B (zh) 2011-04-27
TWI309590B (en) 2009-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees