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TW200636409A - Substrate inspecting device - Google Patents

Substrate inspecting device

Info

Publication number
TW200636409A
TW200636409A TW095112092A TW95112092A TW200636409A TW 200636409 A TW200636409 A TW 200636409A TW 095112092 A TW095112092 A TW 095112092A TW 95112092 A TW95112092 A TW 95112092A TW 200636409 A TW200636409 A TW 200636409A
Authority
TW
Taiwan
Prior art keywords
substrate
inspecting
coordinate data
scan image
inspection
Prior art date
Application number
TW095112092A
Other languages
Chinese (zh)
Other versions
TWI321709B (en
Inventor
Daisuke Imai
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of TW200636409A publication Critical patent/TW200636409A/en
Application granted granted Critical
Publication of TWI321709B publication Critical patent/TWI321709B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/282—Determination of microscope properties
    • H01J2237/2826—Calibration

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Nonlinear Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Liquid Crystal (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Thin Film Transistor (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)

Abstract

A substrate inspecting device is provided for eliminating position errors during the manufacturing processes, so as to increase position accuracy and inspection accuracy. In this manner, correct positions in inspecting area on the substrate can be obtained. The inspecting device 1 uses charged particle beams to carry out a two-dimensional scan against the substrate, and thus obtains a scan image to inspect the substrate. The device 1 further includes a device 7 for acquiring coordinate data, and the device 7 obtains coordinate data of particular positions in the inspecting area on the substrate from the scan image. During the substrate inspection, inspecting positions on the scan image can be specified based on the coordinate data obtained by the device 7. Therefore, the substrate inspection can be performed without being affected by position shift of errors.
TW095112092A 2005-04-14 2006-04-06 Substrate inspecting device TWI321709B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005117364 2005-04-14

Publications (2)

Publication Number Publication Date
TW200636409A true TW200636409A (en) 2006-10-16
TWI321709B TWI321709B (en) 2010-03-11

Family

ID=37114973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112092A TWI321709B (en) 2005-04-14 2006-04-06 Substrate inspecting device

Country Status (5)

Country Link
JP (2) JPWO2006112242A1 (en)
KR (1) KR20070107760A (en)
CN (1) CN101156061A (en)
TW (1) TWI321709B (en)
WO (1) WO2006112242A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104317079A (en) * 2014-10-29 2015-01-28 京东方科技集团股份有限公司 Display panel identification system, detection system, identification method and detection method
TWI694537B (en) * 2018-07-08 2020-05-21 香港商康代影像技術方案香港有限公司 System and method for misalignment compensation

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5158388B2 (en) * 2008-06-02 2013-03-06 株式会社島津製作所 Liquid crystal array inspection apparatus and imaging range correction method
JP2010232295A (en) * 2009-03-26 2010-10-14 Hitachi High-Technologies Corp Work processing apparatus or ACF attachment state inspection method, display substrate module assembly line, or display substrate module assembly method
JP2010251415A (en) * 2009-04-13 2010-11-04 Hitachi High-Technologies Corp Work processing apparatus, display substrate module assembly line, or display substrate module assembly method
CN102023161B (en) * 2009-09-09 2012-05-30 中芯国际集成电路制造(上海)有限公司 Method for acquiring defect image
JP5472636B2 (en) * 2010-12-17 2014-04-16 株式会社島津製作所 TFT array inspection apparatus and TFT array inspection method
JP5708164B2 (en) * 2011-04-04 2015-04-30 株式会社島津製作所 Array inspection apparatus and array inspection method
CN104024837B (en) * 2011-11-02 2016-08-31 株式会社岛津制作所 Liquid crystal array inspecting apparatus and the signal processing method of liquid crystal array inspecting apparatus
JP5865734B2 (en) * 2012-03-01 2016-02-17 株式会社Ｓｃｒｅｅｎホールディングス Area classification apparatus, program therefor, board inspection apparatus, and area classification method
JP2017044671A (en) * 2015-08-28 2017-03-02 三重富士通セミコンダクター株式会社 Inspection system and inspection method
JP2018054464A (en) * 2016-09-29 2018-04-05 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122217A (en) * 1986-11-12 1988-05-26 Jeol Ltd Inspection of fine pattern
JP2910706B2 (en) * 1996-11-27 1999-06-23 日本電気株式会社 LSI image alignment method
JP4014379B2 (en) * 2001-02-21 2007-11-28 株式会社日立製作所 Defect review apparatus and method
JP4510327B2 (en) * 2001-05-29 2010-07-21 エスアイアイ・ナノテクノロジー株式会社 Layer misalignment evaluation method and apparatus based on CAD information
JP2003031629A (en) * 2001-07-17 2003-01-31 Hitachi Ltd Pattern inspection method and apparatus
JP4097255B2 (en) * 2002-12-13 2008-06-11 大日本スクリーン製造株式会社 Pattern matching apparatus, pattern matching method and program
JP2004228394A (en) * 2003-01-24 2004-08-12 Hitachi High-Technologies Corp Semiconductor wafer pattern shape evaluation system
US6873175B2 (en) * 2003-03-04 2005-03-29 Shimadzu Corporation Apparatus and method for testing pixels arranged in a matrix array

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104317079A (en) * 2014-10-29 2015-01-28 京东方科技集团股份有限公司 Display panel identification system, detection system, identification method and detection method
CN104317079B (en) * 2014-10-29 2017-12-01 京东方科技集团股份有限公司 A kind of display panel identifying system, detecting system, recognition methods and detection method
TWI694537B (en) * 2018-07-08 2020-05-21 香港商康代影像技術方案香港有限公司 System and method for misalignment compensation

Also Published As

Publication number Publication date
TWI321709B (en) 2010-03-11
JPWO2006112242A1 (en) 2008-12-11
JP2011180136A (en) 2011-09-15
KR20070107760A (en) 2007-11-07
CN101156061A (en) 2008-04-02
WO2006112242A1 (en) 2006-10-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees