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TW200634127A - An electrically conductive adhesive, electrical part and electrical part module were made of it - Google Patents

An electrically conductive adhesive, electrical part and electrical part module were made of it

Info

Publication number
TW200634127A
TW200634127A TW094144365A TW94144365A TW200634127A TW 200634127 A TW200634127 A TW 200634127A TW 094144365 A TW094144365 A TW 094144365A TW 94144365 A TW94144365 A TW 94144365A TW 200634127 A TW200634127 A TW 200634127A
Authority
TW
Taiwan
Prior art keywords
electrically conductive
electrical part
adhesive
conductive adhesive
base
Prior art date
Application number
TW094144365A
Other languages
Chinese (zh)
Inventor
Takao Ono
Yoshiyuki Takahashi
Shuji Ito
Yukihiro Isogai
Original Assignee
Tamurakaken Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamurakaken Corp filed Critical Tamurakaken Corp
Publication of TW200634127A publication Critical patent/TW200634127A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

This invention relates to an electrically conductive adhesive that enables soldering for mounting a part module or other electronic part to be carried out at low temperatures, so that both the conductivity of soldered circuit connections and the soldering strength by the adhesive can be improved by one operation. The invention provides an electrically conductive adhesive comprising a mixture of an epoxy-base adhesive having flux action with SnBi-base solder powders, wherein the epoxy-base adhesive having flux action is a soldering flux containing at least an epoxy resin, a curing agent and an organic acid, and the SnBi-base solder powders are lead-free solder powders having a melting point of 150 to 170 DEG C, or the organic acid is a dibasic acid having an alkyl group on the side chain.
TW094144365A 2004-12-15 2005-12-14 An electrically conductive adhesive, electrical part and electrical part module were made of it TW200634127A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004362572 2004-12-15

Publications (1)

Publication Number Publication Date
TW200634127A true TW200634127A (en) 2006-10-01

Family

ID=36587904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144365A TW200634127A (en) 2004-12-15 2005-12-14 An electrically conductive adhesive, electrical part and electrical part module were made of it

Country Status (2)

Country Link
TW (1) TW200634127A (en)
WO (1) WO2006064849A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102737752A (en) * 2011-03-30 2012-10-17 株式会社田村制作所 Anisotropic conducting paste and connecting method of electronic part using same
CN113695782A (en) * 2021-09-18 2021-11-26 江苏芯德半导体科技有限公司 Solder for welding ultra-small-spacing element, preparation method and welding method
TWI860363B (en) * 2019-05-23 2024-11-01 美商阿爾發金屬化工公司 Solar module comprising interconnect photovoltaic (pv) cells and method of fabricating the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5052857B2 (en) * 2006-10-13 2012-10-17 株式会社フジクラ Conductive composition, conductor using the same, and method for forming conductive circuit
WO2009001448A1 (en) * 2007-06-27 2008-12-31 Panasonic Electric Works Co., Ltd. Thermosetting resin composition and process for producing the same
CN103328596A (en) * 2011-01-27 2013-09-25 日立化成株式会社 Electrically conductive adhesive composition, connector and solar cell module
WO2014189028A1 (en) * 2013-05-23 2014-11-27 積水化学工業株式会社 Conductive material and connected structure
JP5952849B2 (en) * 2014-03-25 2016-07-13 岡村製油株式会社 Flux and solder paste
CN110853794B (en) * 2019-10-30 2021-12-03 上海润势科技有限公司 Conductive paste

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
JP3254981B2 (en) * 1995-09-11 2002-02-12 日立エーアイシー株式会社 Electrolyte for electrolytic capacitors
JP2000309773A (en) * 1998-11-30 2000-11-07 Nippon Handa Kk Conductive adhesive and bonding method using the same
JP2001143529A (en) * 1999-11-12 2001-05-25 Nippon Handa Kk Conductive bonding agent by blending cream solder and bonding method using the same
JP2003163139A (en) * 2001-11-26 2003-06-06 Daicel Chem Ind Ltd Electrolyte for electrolytic capacitors
JP2005194306A (en) * 2003-12-26 2005-07-21 Togo Seisakusho Corp Current-carrying adhesive and window plate member using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102737752A (en) * 2011-03-30 2012-10-17 株式会社田村制作所 Anisotropic conducting paste and connecting method of electronic part using same
CN102737752B (en) * 2011-03-30 2016-06-29 株式会社田村制作所 Anisotropic conductive is stuck with paste and uses the method for attachment of electronic unit of this electroconductive paste
TWI860363B (en) * 2019-05-23 2024-11-01 美商阿爾發金屬化工公司 Solar module comprising interconnect photovoltaic (pv) cells and method of fabricating the same
CN113695782A (en) * 2021-09-18 2021-11-26 江苏芯德半导体科技有限公司 Solder for welding ultra-small-spacing element, preparation method and welding method

Also Published As

Publication number Publication date
WO2006064849A1 (en) 2006-06-22

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