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TW200634121A - Curable liquid resin adhesive composition - Google Patents

Curable liquid resin adhesive composition

Info

Publication number
TW200634121A
TW200634121A TW094108627A TW94108627A TW200634121A TW 200634121 A TW200634121 A TW 200634121A TW 094108627 A TW094108627 A TW 094108627A TW 94108627 A TW94108627 A TW 94108627A TW 200634121 A TW200634121 A TW 200634121A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
liquid resin
resin adhesive
curable liquid
group
Prior art date
Application number
TW094108627A
Other languages
Chinese (zh)
Inventor
Keiichi Yamamoto
Shinji Tonsho
Zen Komiya
Original Assignee
Dsm Ip Assets Bv
Jsr Corp
Japan Fine Coatings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Assets Bv, Jsr Corp, Japan Fine Coatings Co Ltd filed Critical Dsm Ip Assets Bv
Publication of TW200634121A publication Critical patent/TW200634121A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67Unsaturated compounds having active hydrogen
    • C08G18/671Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/524Esters of phosphorous acids, e.g. of H3PO3
    • C08K5/526Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005Stabilisers against oxidation, heat, light, ozone
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28Non-macromolecular organic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

A curable liquid resin adhesive composition, comprising (A) a urethane (meth)acrylate obtained from at least one diol component selected from the group consisting of polypropylene glycol, polybutylene glycol, a copolymer of 1,2-butylene oxide and ethylene oxide, and a copolymer of propylene oxide and ethylene oxide, a diisocyanate, and a hydroxyl group-containing (meth)acrylate, (B) a radically polymerizable compound, (C) a compound including a phosphite group and a phenolic hydroxyl group, and (D) a phenolic compound including a partial structure shown by the formula (1). wherein R1 represents a hydrocarbon group having 1 to 8 carbon atoms.
TW094108627A 2004-03-23 2005-03-21 Curable liquid resin adhesive composition TW200634121A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004084007A JP4590893B2 (en) 2004-03-23 2004-03-23 Liquid curable resin composition for adhesives

Publications (1)

Publication Number Publication Date
TW200634121A true TW200634121A (en) 2006-10-01

Family

ID=34961301

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094108627A TW200634121A (en) 2004-03-23 2005-03-21 Curable liquid resin adhesive composition

Country Status (3)

Country Link
JP (1) JP4590893B2 (en)
TW (1) TW200634121A (en)
WO (1) WO2005090507A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399419B (en) * 2008-04-21 2013-06-21 Lg Chemical Ltd Pressure-sensitive adhesive compositions, polarizers and liquid crystal displays comprising the same
CN104011100A (en) * 2011-12-27 2014-08-27 昭和电工株式会社 Polymerizable Composition, Polymer, Image-Display Device, And Manufacturing Method Therefor
CN104011099A (en) * 2011-12-13 2014-08-27 日立化成株式会社 Liquid curable resin composition, method for manufacturing image display device using same, and image display device
TWI632163B (en) * 2013-02-04 2018-08-11 日商日本傑恩股份有限公司 Radiation-sensitive resin composition and electronic component

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008063433A (en) * 2006-09-07 2008-03-21 Hitachi Kasei Polymer Co Ltd Transparent film for sticking on display
TW200837167A (en) * 2006-11-09 2008-09-16 Toagosei Co Ltd Active energy line curing type adhesive composition
TWI418603B (en) * 2007-03-16 2013-12-11 Mitsubishi Gas Chemical Co Optical-transparent electromagnetic shielding laminated body and manufacturing method thereof, optical-transparent wave absorber, and adhesive composition
JP5356661B2 (en) * 2007-06-21 2013-12-04 日本化薬株式会社 Photo-curable transparent adhesive composition
JP5697448B2 (en) 2007-09-17 2015-04-08 エムディーエックスヘルス エスエー A novel marker for detection of bladder cancer
TW201009035A (en) * 2008-06-30 2010-03-01 Toagosei Co Ltd Actinic ray curable adhesive composition
EP2406393B1 (en) 2009-03-13 2016-05-04 MDxHealth SA Novel markers for bladder cancer detection
JP5677727B2 (en) * 2009-04-20 2015-02-25 株式会社ブリヂストン Thiol group-containing adhesive resin composition
KR101389367B1 (en) * 2009-09-18 2014-04-28 디아이씨 가부시끼가이샤 Actinic-radiation-curable resin composition, and cured products and films thereof
US8604096B2 (en) * 2009-11-30 2013-12-10 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, and photosensitive resin cured product
KR101362869B1 (en) * 2010-12-29 2014-02-14 제일모직주식회사 Adhesive composition for optical film
TWI484013B (en) * 2012-03-12 2015-05-11 Showa Denko Kk A polymerizable composition, a polymer, an image display device, and a method for manufacturing the same
CN104169316B (en) * 2012-03-28 2016-08-24 昭和电工株式会社 Polymerizable composition, polymerizable composition, polymerizate, stick together plate, the manufacture method of image display device and image display device
WO2013187508A1 (en) * 2012-06-15 2013-12-19 昭和電工株式会社 Polymerizable composition, polymer, optical adhesive sheet, image display device, and method for manufacturing image display device
KR101968510B1 (en) * 2013-02-06 2019-04-12 동우 화인켐 주식회사 Photosensitive resin composition for forming red pixel pattern
KR101852509B1 (en) * 2013-03-15 2018-04-26 동우 화인켐 주식회사 Colored photosensitive resin composition
JP6135243B2 (en) * 2013-03-29 2017-05-31 東洋インキScホールディングス株式会社 Adhesive and adhesive sheet using the same
JP5997405B1 (en) * 2016-04-06 2016-09-28 大日精化工業株式会社 Adhesive composition and laminate
JP6907922B2 (en) * 2016-12-20 2021-07-21 荒川化学工業株式会社 UV curable adhesives, cured products, and adhesive sheets

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3605848B2 (en) * 1994-05-17 2004-12-22 Jsr株式会社 Liquid curable adhesive / adhesive composition
JPH08157795A (en) * 1994-12-02 1996-06-18 Sekisui Chem Co Ltd Acrylic pressure-sensitive adhesive composition
JP4344970B2 (en) * 1998-12-21 2009-10-14 東洋紡績株式会社 Polyurethane composition, polyurethane fiber, and method for producing polyurethane fiber
WO2002055574A2 (en) * 2001-01-11 2002-07-18 Dsm Nv Radiation curable coating composition
JP4782294B2 (en) * 2001-03-02 2011-09-28 ディーエスエム アイピー アセッツ ビー.ブイ. Multilayer coating
JP2003292764A (en) * 2002-04-01 2003-10-15 Sumitomo Chem Co Ltd Stabilized thermoplastic resin composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399419B (en) * 2008-04-21 2013-06-21 Lg Chemical Ltd Pressure-sensitive adhesive compositions, polarizers and liquid crystal displays comprising the same
US9487680B2 (en) 2008-04-21 2016-11-08 Lg Chem, Ltd. Pressure sensitive adhesive compositions, polarizers and liquid crystal displays comprising the same
CN104011099A (en) * 2011-12-13 2014-08-27 日立化成株式会社 Liquid curable resin composition, method for manufacturing image display device using same, and image display device
CN104011100A (en) * 2011-12-27 2014-08-27 昭和电工株式会社 Polymerizable Composition, Polymer, Image-Display Device, And Manufacturing Method Therefor
CN104011100B (en) * 2011-12-27 2016-04-13 昭和电工株式会社 Polymerizable composition, polymkeric substance, image display device and manufacture method thereof
TWI632163B (en) * 2013-02-04 2018-08-11 日商日本傑恩股份有限公司 Radiation-sensitive resin composition and electronic component

Also Published As

Publication number Publication date
JP2005272495A (en) 2005-10-06
WO2005090507A1 (en) 2005-09-29
JP4590893B2 (en) 2010-12-01

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