TW200633807A - Laser machining apparatus - Google Patents
Laser machining apparatusInfo
- Publication number
- TW200633807A TW200633807A TW095105909A TW95105909A TW200633807A TW 200633807 A TW200633807 A TW 200633807A TW 095105909 A TW095105909 A TW 095105909A TW 95105909 A TW95105909 A TW 95105909A TW 200633807 A TW200633807 A TW 200633807A
- Authority
- TW
- Taiwan
- Prior art keywords
- total reflection
- reflection mirror
- laser beam
- reflected
- laser
- Prior art date
Links
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Laser Beam Processing (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
Abstract
There is provided a laser machining apparatus capable of effectively utilizing a laser oscillator and of machining various workpieces. A beam splitter may be positioned at operative position where it interferes with a laser beam and standby position where it does not interfere with the laser beam. A total reflection mirror may be positioned at reflective position where an optical axis of a reflected laser beam becomes coaxial with another reflected beam incident on another total reflection mirror when reflected by still other total reflection mirror and shunting position where it does not interfere with the reflected beam. The beam splitter is positioned at the standby position and the total reflection mirror is positioned at the reflective position in feeding the laser beam to either one of machining heads. The beam splitter is disposed at the operative position and the total reflection mirror is positioned at the shunting position in feeding the laser beam to the both of the machining heads in the same time.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005104326A JP2006281268A (en) | 2005-03-31 | 2005-03-31 | Laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200633807A true TW200633807A (en) | 2006-10-01 |
Family
ID=37029564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095105909A TW200633807A (en) | 2005-03-31 | 2006-02-22 | Laser machining apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006281268A (en) |
| KR (1) | KR20060105577A (en) |
| CN (1) | CN1840278A (en) |
| TW (1) | TW200633807A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642970B (en) * | 2016-08-30 | 2018-12-01 | 日商佳能股份有限公司 | Optical apparatus, machining apparatus, and article manufacturing method |
| TWI746853B (en) * | 2017-05-26 | 2021-11-21 | 日商迪思科股份有限公司 | Laser processing device and laser processing method |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4765474B2 (en) * | 2005-08-16 | 2011-09-07 | パナソニック株式会社 | Laser processing equipment |
| JP4490410B2 (en) * | 2006-11-28 | 2010-06-23 | 住友重機械工業株式会社 | Laser irradiation apparatus and laser processing method |
| DE102007056254B4 (en) * | 2007-11-21 | 2009-10-29 | Lpkf Laser & Electronics Ag | Device for processing a workpiece by means of parallel laser beams |
| ATE477876T1 (en) * | 2008-05-02 | 2010-09-15 | Leister Process Tech | METHOD AND LASER DEVICE FOR PROCESSING AND/OR CONNECTING WORKPIECES USING LASER RADIATION WITH POWERFUL AND PILOT LASER AND AT LEAST ONE DIFFRACTIVE OPTICAL ELEMENT |
| KR101134937B1 (en) * | 2009-10-14 | 2012-04-17 | 주식회사 한광옵토 | Laser irradiation apparatus |
| JP6430790B2 (en) * | 2014-11-25 | 2018-11-28 | 株式会社ディスコ | Laser processing equipment |
| TW202434378A (en) * | 2019-01-31 | 2024-09-01 | 美商伊雷克托科學工業股份有限公司 | Laser-processing apparatus, a controller and a non-transitory computer-readable medium for use with the laser-processing apparatus |
| JP7462219B2 (en) * | 2020-05-08 | 2024-04-05 | パナソニックＩｐマネジメント株式会社 | Laser Processing Equipment |
| CN112538566B (en) * | 2020-11-25 | 2022-07-29 | 中国科学院宁波材料技术与工程研究所 | A laser shock strengthening processing system |
| WO2024241936A1 (en) * | 2023-05-25 | 2024-11-28 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing device |
-
2005
- 2005-03-31 JP JP2005104326A patent/JP2006281268A/en active Pending
-
2006
- 2006-02-22 TW TW095105909A patent/TW200633807A/en unknown
- 2006-03-08 CN CNA2006100573189A patent/CN1840278A/en active Pending
- 2006-03-30 KR KR1020060028939A patent/KR20060105577A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642970B (en) * | 2016-08-30 | 2018-12-01 | 日商佳能股份有限公司 | Optical apparatus, machining apparatus, and article manufacturing method |
| US10845589B2 (en) | 2016-08-30 | 2020-11-24 | Canon Kabushiki Kaisha | Optical apparatus, machining apparatus, and article manufacturing method |
| TWI746853B (en) * | 2017-05-26 | 2021-11-21 | 日商迪思科股份有限公司 | Laser processing device and laser processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006281268A (en) | 2006-10-19 |
| KR20060105577A (en) | 2006-10-11 |
| CN1840278A (en) | 2006-10-04 |
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